Solder used for other purposes than connections between PCB or components

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CPC
H05K2201/0305

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Parent Industries

HELECTRICITY H05Electric techniques H05KPRINTED CIRCUITS CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS H05K2201/00Indexing scheme relating to printed circuits covered by H05K1/00

Current Industry

H05K2201/0305Solder used for other purposes than connections between PCB or components

Industries

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Patents Grantslast 30 patents

Information Patent Grant
Wiring substrate
- Patent number 11,864,316
- Issue date Jan 2, 2024
- Fujikura Ltd.
- Naoki Oyaizu
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Vertical embedded component in a printed circuit board blind hole
- Patent number 11,696,409
- Issue date Jul 4, 2023
- Intel Corporation
- Tin Poay Chuah
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Circuit board heat sink structure and method therefor
- Patent number 11,523,498
- Issue date Dec 6, 2022
- HELLA GMBH & CO. KGAA
- Frank Grueter
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Apparatus and method relating to electrochemical migration
- Patent number 11,470,727
- Issue date Oct 11, 2022
- Jaguar Land Rover Limited
- Thomas Liedtke
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Circuit board
- Patent number 11,291,123
- Issue date Mar 29, 2022
- SAMWON ACT CO., LTD.
- Kyung Yul Lee
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Printed wiring board and method for manufacturing printed wiring board
- Patent number 11,089,679
- Issue date Aug 10, 2021
- Mitsubishi Electric Corporation
- Shunsuke Sasaki
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Cooling package and power module
- Patent number 10,959,319
- Issue date Mar 23, 2021
- Telefonaktiebolaget LM Ericsson (publ)
- Tai Ma
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Systems and methods for breadboard-style printed circuit board
- Patent number 10,905,003
- Issue date Jan 26, 2021
- Samuel P. Kho
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Film for a package substrate
- Patent number 10,903,127
- Issue date Jan 26, 2021
- Samsung Electronics Co., Ltd.
- So Young Lim
- G09 - EDUCATION CRYPTOGRAPHY DISPLAY ADVERTISING SEALS
Information Patent Grant
Printed wiring board and method for manufacturing printed wiring board
- Patent number 10,757,807
- Issue date Aug 25, 2020
- Mitsubishi Electric Corporation
- Shunsuke Sasaki
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Film for package substrate, semiconductor package, display device,...
- Patent number 10,699,974
- Issue date Jun 30, 2020
- Samsung Electronics Co., Ltd.
- So Young Lim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Connection of multilayer printed conductive ink through filled micr...
- Patent number 10,653,010
- Issue date May 12, 2020
- Flex Ltd.
- Weifeng Liu
- C09 - DYES PAINTS POLISHES NATURAL RESINS ADHESIVES MISCELLANEOUS COMPOSITION...
Information Patent Grant
Module component
- Patent number 10,595,406
- Issue date Mar 17, 2020
- Murata Manufacturing Co., Ltd.
- Hiroshi Nishikawa
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
System including a conductive textile and an electronic circuit uni...
- Patent number 10,412,830
- Issue date Sep 10, 2019
- Imec VZW
- Riet Labie
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Via and trench filling using injection molded soldering
- Patent number 10,383,572
- Issue date Aug 20, 2019
- International Business Machines Corporation
- John U. Knickerbocker
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Systems and methods for breadboard style printed circuit board
- Patent number 10,368,435
- Issue date Jul 30, 2019
- Samuel P. Kho
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Printed circuit board and method for producing a printed circuit board
- Patent number 10,327,325
- Issue date Jun 18, 2019
- ZK W Group GmbH
- Erik Edlinger
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Via and trench filling using injection molded soldering
- Patent number 10,258,279
- Issue date Apr 16, 2019
- International Business Machines Corporation
- John U. Knickerbocker
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Wiring board assembly and method for producing same
- Patent number 10,237,971
- Issue date Mar 19, 2019
- Fujikura Ltd.
- Ryotaro Takagi
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Apparatus for interconnecting circuitry
- Patent number 10,212,827
- Issue date Feb 19, 2019
- Intel Corporation
- John J. Browne
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Via and trench filling using injection molded soldering
- Patent number 10,130,302
- Issue date Nov 20, 2018
- International Business Machines Corporation
- John U. Knickerbocker
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Stencil set and system for printing solder paste for printed circui...
- Patent number 10,028,392
- Issue date Jul 17, 2018
- General Electric Company
- John Andrew Trelford
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Method for forming functional part in minute space
- Patent number 9,950,925
- Issue date Apr 24, 2018
- Napra Co., Ltd
- Shigenobu Sekine
- B29 - WORKING OF PLASTICS WORKING OF SUBSTANCES IN A PLASTIC STATE, IN GENERAL
Information Patent Grant
Tin or tin alloy plating liquid
- Patent number 9,926,637
- Issue date Mar 27, 2018
- Rohm and Haas Electronic Materials LLC
- Hiroki Okada
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Flexible printed circuit cable with multi-layer interconnection and...
- Patent number 9,930,789
- Issue date Mar 27, 2018
- Seagate Technology LLC
- Chau-Chin Low
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Combination underfill-dam and electrical-interconnect structure for...
- Patent number 9,917,647
- Issue date Mar 13, 2018
- Hewlett Packard Enterprise Development LP
- Sagi Varghese Mathai
- G02 - OPTICS
Information Patent Grant
Flexible printed circuits with bend retention structures
- Patent number 9,769,920
- Issue date Sep 19, 2017
- Apple Inc.
- Colin M. Ely
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Position indicator and manufacturing method thereof
- Patent number 9,665,190
- Issue date May 30, 2017
- Wacom Co., Ltd.
- Hiromichi Kanzaki
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Electronic device
- Patent number 9,633,873
- Issue date Apr 25, 2017
- Taiyo Yuden Co., Ltd.
- Motoi Yamauchi
- H03 - BASIC ELECTRONIC CIRCUITRY
Information Patent Grant
Heat dissipating substrate
- Patent number 9,603,236
- Issue date Mar 21, 2017
- SAMSUNG ELECTRO-MECHANICS CO., LTD.
- Hyoung Kim
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR

Patents Applicationslast 30 patents

Information Patent Application
Printed Circuit Board And Method For Soldering A Chip Housing In A...
- Publication number 20240292514
- Publication date Aug 29, 2024
- LISA DRAXLMAIER GMBH
- Andreas Brinkmann
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
ELECTRONIC PACKAGE WITH THROUGH-MOLD CONNECTIONS AND RELATED ELECTR...
- Publication number 20230402338
- Publication date Dec 14, 2023
- Skyworks Solutions, Inc.
- Anthony James LoBianco
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
WIRING SUBSTRATE
- Publication number 20220361330
- Publication date Nov 10, 2022
- FUJIKURA LTD.
- Naoki Oyaizu
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
APPARATUS AND METHOD RELATING TO ELECTROCHEMICAL MIGRATION
- Publication number 20210289636
- Publication date Sep 16, 2021
- Jaguar Land Rover Limited
- Thomas LIEDTKE
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
PRINTED WIRING BOARD AND METHOD FOR MANUFACTURING PRINTED WIRING BOARD
- Publication number 20200323079
- Publication date Oct 8, 2020
- Mitsubishi Electric Corporation
- Shunsuke SASAKI
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
FILM FOR A PACKAGE SUBSTRATE
- Publication number 20200303270
- Publication date Sep 24, 2020
- Samsung Electronics Co., Ltd.
- So Young LIM
- G09 - EDUCATION CRYPTOGRAPHY DISPLAY ADVERTISING SEALS
Information Patent Application
COOLING PACKAGE AND POWER MODULE
- Publication number 20200068700
- Publication date Feb 27, 2020
- Telefonaktiebolaget LM Ericsson (publ)
- Tai MA
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
PIN ASSEMBLIES FOR PLATED VIAS
- Publication number 20200006233
- Publication date Jan 2, 2020
- International Business Machines Corporation
- Kyle I. GIESEN
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
PRINTED WIRING BOARD AND METHOD FOR MANUFACTURING PRINTED WIRING BOARD
- Publication number 20190380202
- Publication date Dec 12, 2019
- MITSUBISHI ELECTRIC CORPORATION
- Shunsuke SASAKI
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
SYSTEMS AND METHODS FOR BREADBOARD-STYLE PRINTED CIRCUIT BOARD
- Publication number 20190306975
- Publication date Oct 3, 2019
- Samuel P. Kho
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
FILM FOR PACKAGE SUBSTRATE, SEMICONDUCTOR PACKAGE, DISPLAY DEVICE,...
- Publication number 20190122943
- Publication date Apr 25, 2019
- Samsung Electronics Co., Ltd.
- So Young LIM
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
VIA AND TRENCH FILLING USING INJECTION MOLDED SOLDERING
- Publication number 20180344245
- Publication date Dec 6, 2018
- International Business Machines Corporation
- John U. Knickerbocker
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
METHOD FOR FORMING FUNCTIONAL PART IN MINUTE SPACE
- Publication number 20170305743
- Publication date Oct 26, 2017
- NAPRA CO., LTD.
- Shigenobu Sekine
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
STENCIL SET AND SYSTEM FOR PRINTING SOLDER PASTE FOR PRINTED CIRCUI...
- Publication number 20160345443
- Publication date Nov 24, 2016
- GENERAL ELECTRIC COMPANY
- John Andrew Trelford
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
SUBSTRATE STRUCTURE AND METHOD OF MANUIFACTURING THE SAME
- Publication number 20160050761
- Publication date Feb 18, 2016
- Subtron Technology Co., Ltd.
- Tzyy-Jang Tseng
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
CAPACITOR ARRANGEMENT STRUCTURE AND METHOD OF MOUNTING CAPACITOR
- Publication number 20140367154
- Publication date Dec 18, 2014
- Jun Muto
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
COMBINATION UNDERFILL-DAM AND ELECTRICAL-INTERCONNECT STRUCTURE FOR...
- Publication number 20140328596
- Publication date Nov 6, 2014
- Sagi Varghese Mathai
- G02 - OPTICS
Information Patent Application
CIRCUIT BOARD, AND MANUFACTURING METHOD FOR CIRCUIT BOARD
- Publication number 20140251659
- Publication date Sep 11, 2014
- Kabushiki Kaisha Toyota Jidoshokki
- Hiroaki Asano
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
ELECTRONIC DEVICE, BONDING MATERIAL, AND METHOD FOR PRODUCING ELECT...
- Publication number 20140218886
- Publication date Aug 7, 2014
- Murata Manufacturing Co., Ltd.
- Akihiro Nomura
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
THROUGH MOLD VIA RELIEF GUTTER ON MOLDED LASER PACKAGE (MLP) PACKAGES
- Publication number 20140196940
- Publication date Jul 17, 2014
- QUALCOMM Incorporated
- Christopher J. Healy
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
TIN OR TIN ALLOY PLATING LIQUID
- Publication number 20140183050
- Publication date Jul 3, 2014
- Hiroki OKADA
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Application
WIRING BOARD AND METHOD FOR MANUFACTURING WIRING BOARD
- Publication number 20140151106
- Publication date Jun 5, 2014
- Kabushiki Kaisha Toyota Jidoshokki
- Kiminori Ozaki
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Light Emitting Device and Luminaire
- Publication number 20140153238
- Publication date Jun 5, 2014
- Toshiba Lighting & Technology Corporation
- Kiyoshi Nishimura
- F21 - LIGHTING
Information Patent Application
WIRING BOARD
- Publication number 20140139310
- Publication date May 22, 2014
- Kabushiki Kaisha Toyota Jidoshokki
- Hiroaki Asano
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MOLDED INSULATOR IN PACKAGE ASSEMBLY
- Publication number 20140138825
- Publication date May 22, 2014
- Yueli Liu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
WIRING BOARD AND METHOD FOR MANUFACTURING SAME
- Publication number 20140124250
- Publication date May 8, 2014
- PANASONIC CORPORATION
- Akito Iwasaki
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
FLEXIBLE WIRING BOARD, METHOD FOR MANUFACTURING SAME, MOUNTED PRODU...
- Publication number 20140071639
- Publication date Mar 13, 2014
- PANASONIC CORPORATION
- Kazuhiko Honjo
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
PHOTONIC SINTERING OF POLYMER THICK FILM CONDUCTOR COMPOSITIONS
- Publication number 20140048751
- Publication date Feb 20, 2014
- E I DU PONT DE NEMOURS AND COMPANY
- VINCE ARANCIO
- C22 - METALLURGY FERROUS OR NON-FERROUS ALLOYS TREATMENT OF ALLOYS OR NON-FER...
Information Patent Application
METHOD FOR PRODUCING WIRING BOARD HAVING THROUGH HOLE OR NON-THROUG...
- Publication number 20140023777
- Publication date Jan 23, 2014
- NAPRA CO., LTD.
- Shigenobu Sekine
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
POLYMER THICK FILM SOLDER ALLOY/METAL CONDUCTOR COMPOSITIONS
- Publication number 20140018482
- Publication date Jan 16, 2014
- E I DU PONT DE NEMOURS AND COMPANY
- JAY ROBERT DORFMAN
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR

Solder used for other purposes than connections between PCB or components

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Wiring substrate

Vertical embedded component in a printed circuit board blind hole

Circuit board heat sink structure and method therefor

Apparatus and method relating to electrochemical migration

Circuit board

Printed wiring board and method for manufacturing printed wiring board

Cooling package and power module

Systems and methods for breadboard-style printed circuit board

Film for a package substrate

Printed wiring board and method for manufacturing printed wiring board

Film for package substrate, semiconductor package, display device,...

Connection of multilayer printed conductive ink through filled micr...

Module component

System including a conductive textile and an electronic circuit uni...

Via and trench filling using injection molded soldering

Systems and methods for breadboard style printed circuit board

Printed circuit board and method for producing a printed circuit board

Via and trench filling using injection molded soldering

Wiring board assembly and method for producing same

Apparatus for interconnecting circuitry

Via and trench filling using injection molded soldering

Stencil set and system for printing solder paste for printed circui...

Method for forming functional part in minute space

Tin or tin alloy plating liquid

Flexible printed circuit cable with multi-layer interconnection and...

Combination underfill-dam and electrical-interconnect structure for...

Flexible printed circuits with bend retention structures

Position indicator and manufacturing method thereof

Electronic device

Heat dissipating substrate

Patents Applicationslast 30 patents

Printed Circuit Board And Method For Soldering A Chip Housing In A...

ELECTRONIC PACKAGE WITH THROUGH-MOLD CONNECTIONS AND RELATED ELECTR...

WIRING SUBSTRATE

APPARATUS AND METHOD RELATING TO ELECTROCHEMICAL MIGRATION

PRINTED WIRING BOARD AND METHOD FOR MANUFACTURING PRINTED WIRING BOARD

FILM FOR A PACKAGE SUBSTRATE

COOLING PACKAGE AND POWER MODULE

PIN ASSEMBLIES FOR PLATED VIAS

PRINTED WIRING BOARD AND METHOD FOR MANUFACTURING PRINTED WIRING BOARD

SYSTEMS AND METHODS FOR BREADBOARD-STYLE PRINTED CIRCUIT BOARD

FILM FOR PACKAGE SUBSTRATE, SEMICONDUCTOR PACKAGE, DISPLAY DEVICE,...

VIA AND TRENCH FILLING USING INJECTION MOLDED SOLDERING

METHOD FOR FORMING FUNCTIONAL PART IN MINUTE SPACE

STENCIL SET AND SYSTEM FOR PRINTING SOLDER PASTE FOR PRINTED CIRCUI...

SUBSTRATE STRUCTURE AND METHOD OF MANUIFACTURING THE SAME

CAPACITOR ARRANGEMENT STRUCTURE AND METHOD OF MOUNTING CAPACITOR

COMBINATION UNDERFILL-DAM AND ELECTRICAL-INTERCONNECT STRUCTURE FOR...

CIRCUIT BOARD, AND MANUFACTURING METHOD FOR CIRCUIT BOARD

ELECTRONIC DEVICE, BONDING MATERIAL, AND METHOD FOR PRODUCING ELECT...

THROUGH MOLD VIA RELIEF GUTTER ON MOLDED LASER PACKAGE (MLP) PACKAGES

TIN OR TIN ALLOY PLATING LIQUID

WIRING BOARD AND METHOD FOR MANUFACTURING WIRING BOARD

Light Emitting Device and Luminaire

WIRING BOARD

MOLDED INSULATOR IN PACKAGE ASSEMBLY

WIRING BOARD AND METHOD FOR MANUFACTURING SAME

FLEXIBLE WIRING BOARD, METHOD FOR MANUFACTURING SAME, MOUNTED PRODU...

PHOTONIC SINTERING OF POLYMER THICK FILM CONDUCTOR COMPOSITIONS

METHOD FOR PRODUCING WIRING BOARD HAVING THROUGH HOLE OR NON-THROUG...

POLYMER THICK FILM SOLDER ALLOY/METAL CONDUCTOR COMPOSITIONS