Soldering by means of radiant energy

Industry

CPC
B23K1/005

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Parent Industries

BPERFORMING OPERATIONS TRANSPORTING B23Machine tools B23KSOLDERING OR UNSOLDERING WELDING CLADDING OR PLATING BY SOLDERING OR WELDING CUTTING BY APPLYING HEAT LOCALLY B23K1/00Soldering

Current Industry

B23K1/005Soldering by means of radiant energy

Industries

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Patents Grantslast 30 patents

Information Patent Grant
Bonding head and bonding apparatus
- Patent number 12,358,084
- Issue date Jul 15, 2025
- PAC Tech-Packaging Technologies GmbH
- Matthias Fettke
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Method for soldering an electronic component to a circuit board by...
- Patent number 12,349,287
- Issue date Jul 1, 2025
- PAC Tech-Packaging Technologies GmbH
- Matthias Fettke
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Circuit board assembly soldering apparatus and circuit board assemb...
- Patent number 12,303,990
- Issue date May 20, 2025
- HONOR DEVICE CO., LTD.
- Jianqiang Guo
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Laser soldering system using dynamic light spot and method thereof
- Patent number 12,269,118
- Issue date Apr 8, 2025
- Delta Electronics, Inc.
- Chun-Lien Huang
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Joined solid production method
- Patent number 12,263,525
- Issue date Apr 1, 2025
- K.K. SUN METALON
- Kazuhiko Nishioka
- B22 - CASTING POWDER METALLURGY
Information Patent Grant
Space-based circuit-replacing robotic system
- Patent number 12,263,959
- Issue date Apr 1, 2025
- The United States of America as represented by the Secretary of the Navy
- Daniel H. Muhleman
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Reprint apparatus for circuit board and reprint method using the same
- Patent number 12,262,477
- Issue date Mar 25, 2025
- SAMSUNG ELECTRO-MECHANICS CO., LTD.
- Do Jae Yoo
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Metal solid production method
- Patent number 12,246,378
- Issue date Mar 11, 2025
- K.K. SUN METALON
- Kazuhiko Nishioka
- B22 - CASTING POWDER METALLURGY
Information Patent Grant
System for laser bonding of flip chip
- Patent number 12,237,296
- Issue date Feb 25, 2025
- PROTEC CO., LTD.
- Youn Sung Ko
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Method for transferring electronic device
- Patent number 12,224,263
- Issue date Feb 11, 2025
- MICRAFT SYSTEM PLUS CO., LTD.
- Yu-Min Huang
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Laser soldering system and light shaping method thereof
- Patent number 12,214,436
- Issue date Feb 4, 2025
- Delta Electronics, Inc.
- Yu-Chen Chang
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Method for producing a joining connection between metal sheets
- Patent number 12,179,279
- Issue date Dec 31, 2024
- Magna International Inc.
- Jörg Lerch
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Method for attaching parts by spraying a powder of a ductile materi...
- Patent number 12,138,704
- Issue date Nov 12, 2024
- LISI Automotive
- David Mercs
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Metal solid production method
- Patent number 12,115,579
- Issue date Oct 15, 2024
- K.K. SUN METALON
- Kazuhiko Nishioka
- B22 - CASTING POWDER METALLURGY
Information Patent Grant
System and apparatus for sequential transient liquid phase bonding
- Patent number 12,113,331
- Issue date Oct 8, 2024
- Aeva, Inc.
- Zhizhong Tang
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Laser reflow method
- Patent number 12,090,563
- Issue date Sep 17, 2024
- Disco Corporation
- Yuta Mizumoto
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Method and device including laser heating of gripper for repairing...
- Patent number 12,048,972
- Issue date Jul 30, 2024
- PAC Tech-Packaging Technologies GmbH
- Thorsten Krause
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Method for soldering electronic component and method for manufactur...
- Patent number 12,051,887
- Issue date Jul 30, 2024
- MICRAFT SYSTEM PLUS CO., LTD.
- Chien-Shou Liao
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Laser brazing process
- Patent number 11,986,898
- Issue date May 21, 2024
- NINGBO GEELY AUTOMOBILE RESEARCH & DEV. CO., LTD.
- Niklas Malmberg
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Solder device and system controller thereof
- Patent number 11,980,960
- Issue date May 14, 2024
- Delta Electronics, Inc.
- Ren-Feng Ding
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Laser bonding system and laser bonding apparatus
- Patent number 11,973,053
- Issue date Apr 30, 2024
- Samsung Electronics Co., Ltd.
- Geun Woo Kim
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Method for transferring electronic device
- Patent number 11,973,054
- Issue date Apr 30, 2024
- Stroke Precision Advanced Engineering Co., Ltd.
- Yu-Min Huang
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Systems for thermally treating conductive elements on semiconductor...
- Patent number 11,967,576
- Issue date Apr 23, 2024
- Micron Technology, Inc.
- James M. Derderian
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Laser reflow apparatus and laser reflow method
- Patent number 11,935,863
- Issue date Mar 19, 2024
- Disco Corporation
- Satoshi Kobayashi
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Die-beam alignment for laser-assisted bonding
- Patent number 11,929,334
- Issue date Mar 12, 2024
- STATS ChipPAC Pte. Ltd.
- Wagno Alves Braganca
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Photovoltaic module and manufacturing method thereof
- Patent number 11,908,971
- Issue date Feb 20, 2024
- SHANGHAI JINKO GREEN ENERGY ENTERPRISE MANAGEMENT CO., LTD.
- Zhiqiu Guo
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Laser brazed component and method therefor
- Patent number 11,878,371
- Issue date Jan 23, 2024
- Greatbatch Ltd.
- Jordan A. Hartwig
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Brazing using localized heating
- Patent number 11,852,076
- Issue date Dec 26, 2023
- Collins Engine Nozzles, Inc.
- Jason Ryon
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Component produced by welding and method of producing same
- Patent number 11,827,282
- Issue date Nov 28, 2023
- Hyundai Motor Company
- Ki Eun Kim
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Apparatus for attaching semiconductor parts
- Patent number 11,823,920
- Issue date Nov 21, 2023
- JMJ KOREA CO., LTD.
- Yun Hwa Choi
- B22 - CASTING POWDER METALLURGY

Patents Applicationslast 30 patents

Information Patent Application
Apparatus and Method for Establishing a Contact Connection
- Publication number 20250235961
- Publication date Jul 24, 2025
- Pac Tech - Packaging Technologies GmbH
- Matthias Fettke
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
COMPONENT PROCESSING APPARATUS
- Publication number 20250218830
- Publication date Jul 3, 2025
- PlayNitride Display Co., Ltd.
- Yen-Mu Chen
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
METHOD OF SOLDERING ELECTRONIC DEVICES AND METHOD OF MANUFACTURING...
- Publication number 20250205797
- Publication date Jun 26, 2025
- Samsung Electronics Co., Ltd.
- KYUNGDEUK MIN
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
JOINING WORK MACHINE
- Publication number 20250212375
- Publication date Jun 26, 2025
- FUJI CORPORATION
- Hiromitsu OKA
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
LASER SOLDERING METHOD USING DYNAMIC LIGHT SPOT
- Publication number 20250196260
- Publication date Jun 19, 2025
- Delta Electronics, Inc.
- Chun-Lien HUANG
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
METHOD AND LASER ARRANGEMENT FOR ELECTRICALLY CONTACTING TERMINAL F...
- Publication number 20250196244
- Publication date Jun 19, 2025
- Pac Tech - Packaging Technologies GmbH
- Matthias Fettke
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
BRAZED COMPONENTS AND IMPROVED METHOD OF MANUFACTURING THEM
- Publication number 20250187093
- Publication date Jun 12, 2025
- HANON SYSTEMS
- Brian Laurain
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
JOINED SOLID PRODUCTION METHOD
- Publication number 20250187074
- Publication date Jun 12, 2025
- K.K. SUN METALON
- Kazuhiko NISHIOKA
- B22 - CASTING POWDER METALLURGY
Information Patent Application
BONDING METHOD
- Publication number 20250178123
- Publication date Jun 5, 2025
- Mitsubishi Electric Corporation
- Shohei OGAWA
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
DEVICE FOR TRANSFERRING AND METHOD
- Publication number 20250135568
- Publication date May 1, 2025
- ams-OSRAM International GmbH
- Thomas Schwarz
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
SOLDERING APPARATUS, METHOD FOR MANUFACTURING SEMICONDUCTOR PACKAGE...
- Publication number 20250105203
- Publication date Mar 27, 2025
- Samsung Electronics Co., Ltd.
- Kyung Deuk MIN
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
METHOD FOR MANUFACTURING PACKAGE STRUCTURE
- Publication number 20250069901
- Publication date Feb 27, 2025
- Advanced Semiconductor Engineering, Inc.
- Tung Yao LIN
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
LASER SOLDERING DEVICE WITH ADJUSTABLE LASER IRRADIATION POSITION A...
- Publication number 20250033130
- Publication date Jan 30, 2025
- LASERVALL TECHNOLOGY CO., LTD
- Byoung Chan CHOI
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
LASER PROCESSING APPARATUS METHOD INCLUDING SAME AND PROCESSED OBJE...
- Publication number 20250033142
- Publication date Jan 30, 2025
- LASERVALL TECHNOLOGY CO., LTD
- Jin Ha KIM
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
TABBING DEVICE FOR MANUFACTURING SOLAR CELL MODULE PREVENTING OVERS...
- Publication number 20250031480
- Publication date Jan 23, 2025
- Hanwha Solutions Corporation
- Min Su LEE
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
METAL SOLID PRODUCTION METHOD
- Publication number 20250018473
- Publication date Jan 16, 2025
- K.K. SUN METALON
- Kazuhiko NISHIOKA
- B22 - CASTING POWDER METALLURGY
Information Patent Application
ELECTRON BEAM BRAZING TO REPAIR COMPONENT
- Publication number 20250001511
- Publication date Jan 2, 2025
- Pratt & Whitney Canada Corp.
- Kevin M. Tracy
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
METHOD FOR BRAZE FILLER METAL PREPARATION
- Publication number 20240408686
- Publication date Dec 12, 2024
- HONEYWELL FEDERAL MANUFACTURING & TECHNOLOGIES, LLC
- Lucas Charles Jaster
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
SOLDER SOLDERING METHOD USING LASER
- Publication number 20240408687
- Publication date Dec 12, 2024
- S.S.P. INC.
- Heui Jong JU
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
TEMPORARY CARRYING SUBSTRATE, CHIP TRANSFERRING DEVICE AND CHIP TRA...
- Publication number 20240371663
- Publication date Nov 7, 2024
- ASTI GLOBAL INC., TAIWAN
- CHIEN-SHOU LIAO
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
REPRINT APPARATUS FOR CIRCUIT BOARD AND REPRINT METHOD USING THE SAME
- Publication number 20240365475
- Publication date Oct 31, 2024
- Samsung Electro-Mechanics Co., Ltd.
- Do Jae YOO
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
SOLDERING APPARATUS AND SOLDERING METHOD USING SAME
- Publication number 20240293893
- Publication date Sep 5, 2024
- HCP TECHNOLOGY CO., LTD.
- Wenrong ZHUANG
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
CIRCUIT BOARD ASSEMBLY SOLDERING APPARATUS AND CIRCUIT BOARD ASSEMB...
- Publication number 20240269759
- Publication date Aug 15, 2024
- Honor Device Co., Ltd.
- Jianqiang GUO
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
LASER SOLDERING APPARATUS, CONTROL APPARATUS, AND LASER SOLDERING M...
- Publication number 20240253142
- Publication date Aug 1, 2024
- SONY GROUP CORPORATION
- HIROYUKI HOSONO
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
COOLING STRUCTURE, BATTERY UNIT, AND MANUFACTURING METHOD OF COOLIN...
- Publication number 20240250336
- Publication date Jul 25, 2024
- NIPPON STEEL CORPORATION
- Shinji KODAMA
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
RADIANT CURTAIN HEATING ASSEMBLY FOR WAVE SOLDERING MACHINE
- Publication number 20240246162
- Publication date Jul 25, 2024
- Illinois Tool Works Inc.
- Jonathan M. Dautenhahn
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
REPAIR OF SOLDER BUMPS
- Publication number 20240222302
- Publication date Jul 4, 2024
- ORBOTECH LTD.
- Zvi KOTLER
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
METHOD FOR TRANSFERRING ELECTRONIC DEVICE
- Publication number 20240213209
- Publication date Jun 27, 2024
- Stroke Precision Advanced Engineering Co., Ltd.
- Yu-Min Huang
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
Die-Beam Alignment for Laser-Assisted Bonding
- Publication number 20240170422
- Publication date May 23, 2024
- STATS ChipPAC Pte Ltd.
- Wagno Alves Braganca
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
PROCESS FOR HIGH DENSITY SOLDER INTERCONNECT
- Publication number 20240157457
- Publication date May 16, 2024
- SEAGATE TECHNOLOGY LLC
- Daniel Glen Hardy
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR

Soldering by means of radiant energy

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Bonding head and bonding apparatus

Method for soldering an electronic component to a circuit board by...

Circuit board assembly soldering apparatus and circuit board assemb...

Laser soldering system using dynamic light spot and method thereof

Joined solid production method

Space-based circuit-replacing robotic system

Reprint apparatus for circuit board and reprint method using the same

Metal solid production method

System for laser bonding of flip chip

Method for transferring electronic device

Laser soldering system and light shaping method thereof

Method for producing a joining connection between metal sheets

Method for attaching parts by spraying a powder of a ductile materi...

Metal solid production method

System and apparatus for sequential transient liquid phase bonding

Laser reflow method

Method and device including laser heating of gripper for repairing...

Method for soldering electronic component and method for manufactur...

Laser brazing process

Solder device and system controller thereof

Laser bonding system and laser bonding apparatus

Method for transferring electronic device

Systems for thermally treating conductive elements on semiconductor...

Laser reflow apparatus and laser reflow method

Die-beam alignment for laser-assisted bonding

Photovoltaic module and manufacturing method thereof

Laser brazed component and method therefor

Brazing using localized heating

Component produced by welding and method of producing same

Apparatus for attaching semiconductor parts

Patents Applicationslast 30 patents

Apparatus and Method for Establishing a Contact Connection

COMPONENT PROCESSING APPARATUS

METHOD OF SOLDERING ELECTRONIC DEVICES AND METHOD OF MANUFACTURING...

JOINING WORK MACHINE

LASER SOLDERING METHOD USING DYNAMIC LIGHT SPOT

METHOD AND LASER ARRANGEMENT FOR ELECTRICALLY CONTACTING TERMINAL F...

BRAZED COMPONENTS AND IMPROVED METHOD OF MANUFACTURING THEM

JOINED SOLID PRODUCTION METHOD

BONDING METHOD

DEVICE FOR TRANSFERRING AND METHOD

SOLDERING APPARATUS, METHOD FOR MANUFACTURING SEMICONDUCTOR PACKAGE...

METHOD FOR MANUFACTURING PACKAGE STRUCTURE

LASER SOLDERING DEVICE WITH ADJUSTABLE LASER IRRADIATION POSITION A...

LASER PROCESSING APPARATUS METHOD INCLUDING SAME AND PROCESSED OBJE...

TABBING DEVICE FOR MANUFACTURING SOLAR CELL MODULE PREVENTING OVERS...

METAL SOLID PRODUCTION METHOD

ELECTRON BEAM BRAZING TO REPAIR COMPONENT

METHOD FOR BRAZE FILLER METAL PREPARATION

SOLDER SOLDERING METHOD USING LASER

TEMPORARY CARRYING SUBSTRATE, CHIP TRANSFERRING DEVICE AND CHIP TRA...

REPRINT APPARATUS FOR CIRCUIT BOARD AND REPRINT METHOD USING THE SAME

SOLDERING APPARATUS AND SOLDERING METHOD USING SAME

CIRCUIT BOARD ASSEMBLY SOLDERING APPARATUS AND CIRCUIT BOARD ASSEMB...

LASER SOLDERING APPARATUS, CONTROL APPARATUS, AND LASER SOLDERING M...

COOLING STRUCTURE, BATTERY UNIT, AND MANUFACTURING METHOD OF COOLIN...

RADIANT CURTAIN HEATING ASSEMBLY FOR WAVE SOLDERING MACHINE

REPAIR OF SOLDER BUMPS

METHOD FOR TRANSFERRING ELECTRONIC DEVICE

Die-Beam Alignment for Laser-Assisted Bonding

PROCESS FOR HIGH DENSITY SOLDER INTERCONNECT