Soldering or other types of metallurgic bonding

Industry

CPC
H05K2203/04

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Parent Industries

HELECTRICITY H05Electric techniques H05KPRINTED CIRCUITS CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS H05K2203/00Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00

Current Industry

H05K2203/04Soldering or other types of metallurgic bonding

Industries

Patents Grantslast 30 patents

Information Patent Grant
Fine pitch copper pillar package and method
- Patent number 12,191,241
- Issue date Jan 7, 2025
- Amkor Technology Singapore Holding Pte Ltd.
- Robert Francis Darveaux
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method and apparatus for flexible circuit cable attachment
- Patent number 12,185,476
- Issue date Dec 31, 2024
- Jabil Inc.
- Wenlu Wang
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Method for processing memory device
- Patent number 12,174,737
- Issue date Dec 24, 2024
- ESSENCORE LIMITED
- Chan Ho Sohn
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Bonded body, ceramic copper circuit board, method for manufacturing...
- Patent number 12,160,959
- Issue date Dec 3, 2024
- Kabushiki Kaisha Toshiba
- Maki Yonetsu
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Circuit board structure and manufacturing method thereof
- Patent number 12,160,953
- Issue date Dec 3, 2024
- Unimicron Technology Corp.
- Kai-Ming Yang
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Semiconductor device including semiconductor chip having elongated...
- Patent number 12,154,847
- Issue date Nov 26, 2024
- Murata Manufacturing Co., Ltd.
- Mizuho Ishikawa
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Printed circuit board and method of producing printed circuit board
- Patent number 12,144,111
- Issue date Nov 12, 2024
- Denso Corporation
- Hirokazu Saito
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Printed circuit board
- Patent number 12,120,818
- Issue date Oct 15, 2024
- LG Innotek Co., Ltd
- Myung Gu Kang
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Chip package positioning and fixing structure
- Patent number 12,119,287
- Issue date Oct 15, 2024
- Hitachi Astemo, Ltd.
- Binti Haridan Fatin Farhanah
- G01 - MEASURING TESTING
Information Patent Grant
Welding structure and display module
- Patent number 12,108,541
- Issue date Oct 1, 2024
- GUANGZHOU GOVISIONOX TECHNOLOGY CO., LTD.
- Yangchun Lin
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Ceramic substrate manufacturing method
- Patent number 12,108,540
- Issue date Oct 1, 2024
- AMOSENSE CO., LTD.
- Kyung Whan Woo
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Semiconductor device, printed circuit board (PCB), and method of in...
- Patent number 12,080,634
- Issue date Sep 3, 2024
- The Noco Company
- James P. McBride
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
On-demand method of making PCB pallets using additive manufacturing
- Patent number 12,041,723
- Issue date Jul 16, 2024
- JABIL INC.
- Luke Rodgers
- B29 - WORKING OF PLASTICS WORKING OF SUBSTANCES IN A PLASTIC STATE, IN GENERAL
Information Patent Grant
Method of forming a top plane connection in an electro-optic device
- Patent number 12,038,666
- Issue date Jul 16, 2024
- E Ink Corporation
- Matthew Joseph Kayal
- C09 - DYES PAINTS POLISHES NATURAL RESINS ADHESIVES MISCELLANEOUS COMPOSITION...
Information Patent Grant
Electronic module and method for producing an electronic module
- Patent number 12,035,477
- Issue date Jul 9, 2024
- Rogers Germany GmbH
- Andreas Meyer
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Stackable via package and method
- Patent number 12,035,472
- Issue date Jul 9, 2024
- Amkor Technology Singapore Holding Ptd. Ltd.
- Akito Yoshida
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Composite solder balls metallised on the surface and calibrated for...
- Patent number 12,030,138
- Issue date Jul 9, 2024
- LIPCO INDUSTRIE
- Constantin Iacob
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Method for soldering an electronic component to a circuit board by...
- Patent number 12,028,987
- Issue date Jul 2, 2024
- PAC Tech-Packaging Technologies GmbH
- Matthias Fettke
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Impedance controlled electrical interconnection employing meta-mate...
- Patent number 12,027,465
- Issue date Jul 2, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd
- Christopher Wyland
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Assembly structure for vehicle camera module using solder-jet
- Patent number 12,025,848
- Issue date Jul 2, 2024
- Hyundai Mobis Co., Ltd.
- SangHwan Oh
- H04 - ELECTRIC COMMUNICATION TECHNIQUE
Information Patent Grant
Reflow furnace
- Patent number 12,013,185
- Issue date Jun 18, 2024
- Illinois Tool Works Inc.
- Yuwei Wang
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Liquid metal infiltration rework of electronic assembly
- Patent number 12,016,127
- Issue date Jun 18, 2024
- International Business Machines Corporation
- Mark K. Hoffmeyer
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Printed wiring board and method for manufacturing the same
- Patent number 12,010,794
- Issue date Jun 11, 2024
- Ibiden Co., Ltd.
- Satoru Kawai
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Advanced device assembly structures and methods
- Patent number 11,999,001
- Issue date Jun 4, 2024
- ADEIA SEMICONDUCTOR TECHNOLOGIES LLC
- Cyprian Emeka Uzoh
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Electrical devices with electrodes on softening polymers and method...
- Patent number 11,991,836
- Issue date May 21, 2024
- Board of Regents, The University of Texas System
- Romil Modi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Methods and heat distribution devices for thermal management of chi...
- Patent number 11,990,386
- Issue date May 21, 2024
- Google LLC
- Madhusudan K. Iyengar
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electronic component, electric device including the same, and bondi...
- Patent number 11,979,987
- Issue date May 7, 2024
- Samsung Display Co., Ltd.
- Han-Sung Bae
- Y02 - TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMA...
Information Patent Grant
Vacuum-assisted BGA joint formation
- Patent number 11,963,307
- Issue date Apr 16, 2024
- International Business Machines Corporation
- Matthew Doyle
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Solder recovery device
- Patent number 11,956,902
- Issue date Apr 9, 2024
- FUJI CORPORATION
- Naoki Matsuzaki
- B41 - PRINTING LINING MACHINES TYPEWRITERS STAMPS
Information Patent Grant
Feature selection through solder-ball population
- Patent number 11,948,807
- Issue date Apr 2, 2024
- International Business Machines Corporation
- Matthew Doyle
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
CIRCUIT MODULE AND MANUFACTURING METHOD THEREFOR
- Publication number 20250048542
- Publication date Feb 6, 2025
- Murata Manufacturing Co., Ltd.
- Nobuo IKEMOTO
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
BONDED BODY, CERAMIC COPPER CIRCUIT BOARD, METHOD FOR MANUFACTURING...
- Publication number 20250048563
- Publication date Feb 6, 2025
- Kabushiki Kaisha Toshiba
- Maki YONETSU
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Advanced Device Assembly Structures And Methods
- Publication number 20250033138
- Publication date Jan 30, 2025
- ADEIA SEMICONDUCTOR TECHNOLOGIES LLC
- Cyprian Emeka Uzoh
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
HIGH-PRECISION MULTILAYER PRINTED CIRCUIT BOARD AND 3D PRINTING PRE...
- Publication number 20250040060
- Publication date Jan 30, 2025
- enovate3D (Hangzhou) Technology Development Co., Ltd.
- Wangcan Cai
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
WIRING BOARD AND MOUNTING STRUCTURE USING SAME
- Publication number 20250040047
- Publication date Jan 30, 2025
- Kyocera Corporation
- Masashi OHMURA
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
SMALL FORM FACTOR SHUNTED SOCKET PINS AND CONFIGURATION FOR IMPROVE...
- Publication number 20250015527
- Publication date Jan 9, 2025
- Intel Corporation
- Landon HANKS
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
LASER WELDING APPARATUS AND WELDING METHOD USING THE SAME
- Publication number 20240408699
- Publication date Dec 12, 2024
- LG ENERGY SOLUTION, LTD.
- Jae Young JANG
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
MATERIALS FOR SEMICONDUCTOR PACKAGE MOUNT APPLICATIONS AND METHODS...
- Publication number 20240389240
- Publication date Nov 21, 2024
- Taiwan Semiconductor Manufacturing Company Limited
- Chao-Wei Chiu
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
Method for Soldering an Electronic Component to a Circuit Board by...
- Publication number 20240373563
- Publication date Nov 7, 2024
- Pac Tech - Packaging Technologies GmbH
- Matthias Fettke
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
Lead-Free Solder Ball
- Publication number 20240363571
- Publication date Oct 31, 2024
- SENJU METAL INDUSTRY CO., LTD.
- Yoshie Yamanaka
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
WIRING SUBSTRATE FOR ELECTRONIC CONTROL DEVICE, AND METHOD FOR MANU...
- Publication number 20240357736
- Publication date Oct 24, 2024
- Hitachi Astemo, Ltd.
- Takanori SEKIGUCHI
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Methods And Heat Distribution Devices For Thermal Management Of Chi...
- Publication number 20240347414
- Publication date Oct 17, 2024
- Google LLC
- Madhusudan K. Iyengar
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
REFLOW FURNACE
- Publication number 20240344771
- Publication date Oct 17, 2024
- Illinois Tool Works Inc.
- Yuwei WANG
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
ELECTRONIC SYSTEM ASSEMBLY
- Publication number 20240341041
- Publication date Oct 10, 2024
- EPIRUS, INC.
- Meletios Mastrodemos
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
SOLDER BARRIER CONTACT FOR AN INTEGRATED CIRCUIT
- Publication number 20240324109
- Publication date Sep 26, 2024
- Western Digital Technologies, Inc.
- Uthayarajan A/L Rasalingam
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
SACRIFICIAL SOLDER LAYER FOR BROACHING CLINCH NUT ASSEMBLY
- Publication number 20240292546
- Publication date Aug 29, 2024
- Nokia Solutions and Networks Oy
- Daniel Fazari
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
ELECTRONIC COMPONENT, ELECTRIC DEVICE INCLUDING THE SAME, AND BONDI...
- Publication number 20240284594
- Publication date Aug 22, 2024
- SAMSUNG DISPLAY CO., LTD.
- Han-Sung BAE
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
BONDING SHEET AND METHOD FOR PRODUCING SAME
- Publication number 20240269780
- Publication date Aug 15, 2024
- NITTO DENKO CORPORATION
- Masatoshi KATO
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
METHOD FOR PRODUCING ELECTRONIC COMPONENT MOUNTED SUBSTRATE
- Publication number 20240268036
- Publication date Aug 8, 2024
- Panasonic Intellectual Property Management Co., Ltd.
- Shingo OKAMURA
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
Method and System for Generating Spray Patterns, Electronic Device,...
- Publication number 20240244759
- Publication date Jul 18, 2024
- VAYO (SHANGHAI) TECHNOLOGY CO., LTD.
- Yongjian QU
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
CIRCUIT BOARD STRUCTURE AND MANUFACTURING METHOD THEREOF
- Publication number 20240237202
- Publication date Jul 11, 2024
- Unimicron Technology Corp.
- Kai-Ming Yang
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
CIRCUIT BOARD STRUCTURE AND MANUFACTURING METHOD THEREOF
- Publication number 20240237209
- Publication date Jul 11, 2024
- Unimicron Technology Corp.
- Ping-Tsung Lin
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
NON-ELECTROCONDUCTIVE FLUX, CONNECTED STRUCTURE, AND METHOD FOR PRO...
- Publication number 20240227089
- Publication date Jul 11, 2024
- Sekisui Chemical Co., Ltd.
- Hidefumi YASUI
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
CIRCUIT BOARD AND METHOD OF FABRICATING CIRCUIT BOARD
- Publication number 20240206063
- Publication date Jun 20, 2024
- Samsung Electro-Mechanics Co., Ltd.
- Seong Ho Choi
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
LIGHT-EMITTING DIODE ARRAY WITH PRECISE POSITION ASSEMBLY FOR AUTOM...
- Publication number 20240206072
- Publication date Jun 20, 2024
- Lumileds LLC
- Say Chun OOI
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
ELECTRICAL DEVICES WITH ELECTRODES ON SOFTENING POLYMERS AND METHOD...
- Publication number 20240188224
- Publication date Jun 6, 2024
- Board of Regents, The University of Texas System
- Romil Modi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CIRCUIT BOARD ASSEMBLY, MANUFACTURING METHOD, AND ELECTRONIC DEVICE
- Publication number 20240179845
- Publication date May 30, 2024
- Honor Device Co., Ltd.
- Fan YANG
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
CIRCUIT BOARD STRUCTURE AND MANUFACTURING METHOD THEREOF
- Publication number 20240179829
- Publication date May 30, 2024
- Unimicron Technology Corp.
- Chun Hung KUO
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
SYSTEMS AND METHODS FOR ADDITIVE MANUFACTURING OF ELECTRONICS
- Publication number 20240164016
- Publication date May 16, 2024
- Aviv Mordechai RONEN
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
CONNECTING ARRANGEMENT
- Publication number 20240155766
- Publication date May 9, 2024
- ROBERT BOSCH GmbH
- Guenter Gera
- H01 - BASIC ELECTRIC ELEMENTS

Soldering or other types of metallurgic bonding

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Fine pitch copper pillar package and method

Method and apparatus for flexible circuit cable attachment

Method for processing memory device

Bonded body, ceramic copper circuit board, method for manufacturing...

Circuit board structure and manufacturing method thereof

Semiconductor device including semiconductor chip having elongated...

Printed circuit board and method of producing printed circuit board

Printed circuit board

Chip package positioning and fixing structure

Welding structure and display module

Ceramic substrate manufacturing method

Semiconductor device, printed circuit board (PCB), and method of in...

On-demand method of making PCB pallets using additive manufacturing

Method of forming a top plane connection in an electro-optic device

Electronic module and method for producing an electronic module

Stackable via package and method

Composite solder balls metallised on the surface and calibrated for...

Method for soldering an electronic component to a circuit board by...

Impedance controlled electrical interconnection employing meta-mate...

Assembly structure for vehicle camera module using solder-jet

Reflow furnace

Liquid metal infiltration rework of electronic assembly

Printed wiring board and method for manufacturing the same

Advanced device assembly structures and methods

Electrical devices with electrodes on softening polymers and method...

Methods and heat distribution devices for thermal management of chi...

Electronic component, electric device including the same, and bondi...

Vacuum-assisted BGA joint formation

Solder recovery device

Feature selection through solder-ball population

Patents Applicationslast 30 patents

CIRCUIT MODULE AND MANUFACTURING METHOD THEREFOR

BONDED BODY, CERAMIC COPPER CIRCUIT BOARD, METHOD FOR MANUFACTURING...

Advanced Device Assembly Structures And Methods

HIGH-PRECISION MULTILAYER PRINTED CIRCUIT BOARD AND 3D PRINTING PRE...

WIRING BOARD AND MOUNTING STRUCTURE USING SAME

SMALL FORM FACTOR SHUNTED SOCKET PINS AND CONFIGURATION FOR IMPROVE...

LASER WELDING APPARATUS AND WELDING METHOD USING THE SAME

MATERIALS FOR SEMICONDUCTOR PACKAGE MOUNT APPLICATIONS AND METHODS...

Method for Soldering an Electronic Component to a Circuit Board by...

Lead-Free Solder Ball

WIRING SUBSTRATE FOR ELECTRONIC CONTROL DEVICE, AND METHOD FOR MANU...

Methods And Heat Distribution Devices For Thermal Management Of Chi...

REFLOW FURNACE

ELECTRONIC SYSTEM ASSEMBLY

SOLDER BARRIER CONTACT FOR AN INTEGRATED CIRCUIT

SACRIFICIAL SOLDER LAYER FOR BROACHING CLINCH NUT ASSEMBLY

ELECTRONIC COMPONENT, ELECTRIC DEVICE INCLUDING THE SAME, AND BONDI...

BONDING SHEET AND METHOD FOR PRODUCING SAME

METHOD FOR PRODUCING ELECTRONIC COMPONENT MOUNTED SUBSTRATE

Method and System for Generating Spray Patterns, Electronic Device,...

CIRCUIT BOARD STRUCTURE AND MANUFACTURING METHOD THEREOF

CIRCUIT BOARD STRUCTURE AND MANUFACTURING METHOD THEREOF

NON-ELECTROCONDUCTIVE FLUX, CONNECTED STRUCTURE, AND METHOD FOR PRO...

CIRCUIT BOARD AND METHOD OF FABRICATING CIRCUIT BOARD

LIGHT-EMITTING DIODE ARRAY WITH PRECISE POSITION ASSEMBLY FOR AUTOM...

ELECTRICAL DEVICES WITH ELECTRODES ON SOFTENING POLYMERS AND METHOD...

CIRCUIT BOARD ASSEMBLY, MANUFACTURING METHOD, AND ELECTRONIC DEVICE

CIRCUIT BOARD STRUCTURE AND MANUFACTURING METHOD THEREOF

SYSTEMS AND METHODS FOR ADDITIVE MANUFACTURING OF ELECTRONICS

CONNECTING ARRANGEMENT