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H01L21/67271

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HELECTRICITY H01Electric elements H01LSEMICONDUCTOR DEVICES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR H01L21/00Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof

Current Industry

H01L21/67271Sorting devices

Industries

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Patents Grantslast 30 patents

Information Patent Grant
Semiconductor storage apparatus with integrated sorter
- Patent number 12,198,956
- Issue date Jan 14, 2025
- Taiwan Semiconductor Manufacturing Company Limited
- Tsung-Sheng Kuo
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Manufacturing and measuring system for semiconductor structures
- Patent number 12,191,215
- Issue date Jan 7, 2025
- NANYA TECHNOLOGY CORPORATION
- Cheng-Ta Cheng
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Stocker system for wafer cassette
- Patent number 12,176,232
- Issue date Dec 24, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd
- Guancyun Li
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Inspection system
- Patent number 12,131,930
- Issue date Oct 29, 2024
- Applied Materials, Inc.
- Asaf Schlezinger
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Alignment platform and electronic component transmission apparatus
- Patent number 12,131,935
- Issue date Oct 29, 2024
- HON. PRECISION, INC.
- Yuan-Long Chang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Chip matching system and method thereof
- Patent number 12,046,494
- Issue date Jul 23, 2024
- Siliconware Precision Industries Co., Ltd.
- Wu-Hung Yen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Apparatus and method for orientation of semiconductor device die
- Patent number 12,040,207
- Issue date Jul 16, 2024
- Rohinni, Inc.
- Cody Peterson
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Methods and systems for component analysis, sorting, and sequencing...
- Patent number 12,002,720
- Issue date Jun 4, 2024
- Wolfspeed, Inc.
- Zach Cole
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Multi-flip semiconductor die sorter tool
- Patent number 11,915,954
- Issue date Feb 27, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd
- Chih-Hung Huang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of processing wafer, and chip measuring apparatus
- Patent number 11,901,234
- Issue date Feb 13, 2024
- Disco Corporation
- Takashi Mori
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of controlling the placement of micro-objects
- Patent number 11,891,299
- Issue date Feb 6, 2024
- Xerox Corporation
- Anne Plochowietz
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Optimizating semiconductor binning by feed-forward process adjustment
- Patent number 11,869,783
- Issue date Jan 9, 2024
- International Business Machines Corporation
- Benjamin D. Briggs
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Stacked substrate manufacturing method, stacked substrate manufactu...
- Patent number 11,842,905
- Issue date Dec 12, 2023
- Nikon Corporation
- Isao Sugaya
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Systems and methods for die transfer
- Patent number 11,820,607
- Issue date Nov 21, 2023
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Tsung-Sheng Kuo
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Wafer-measuring apparatus and wafer-transferring method thereof
- Patent number 11,798,826
- Issue date Oct 24, 2023
- NANYA TECHNOLOGY CORPORATION
- Jih-Cheng Huang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method and apparatus for IC unit singulation and sorting
- Patent number 11,791,183
- Issue date Oct 17, 2023
- Rokko Systems Pte Ltd.
- Jong Jae Jung
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of controlling the placement of micro-objects on a micro-ass...
- Patent number 11,772,964
- Issue date Oct 3, 2023
- Xerox Corporation
- Anne Plochowietz
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Stocker system for wafer cassette
- Patent number 11,735,451
- Issue date Aug 22, 2023
- Taiwan Semiconductor Manufacturing Co., Ltd
- Guancyun Li
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
High registration particles-transferring system
- Patent number 11,732,362
- Issue date Aug 22, 2023
- Xerox Corporation
- Yunda Wang
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Front surface and back surface orientation detection of transparent...
- Patent number 11,728,191
- Issue date Aug 15, 2023
- Applied Materials, Inc.
- Michelle Alejandra Wong
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for sorting optoelectronic semiconductor components and devi...
- Patent number 11,710,650
- Issue date Jul 25, 2023
- Osram Opto Semiconductors GmbH
- Tobias Meyer
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Dynamic routing method and apparatus for overhead hoist transport s...
- Patent number 11,705,353
- Issue date Jul 18, 2023
- Korea Advanced Institute of Science and Technology
- Young Jae Jang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Apparatus for controlling the placement of micro-objects on a micro...
- Patent number 11,673,800
- Issue date Jun 13, 2023
- Palo Alto Research Center Incorporated
- Anne Plochowietz
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Method of processing wafer, and chip measuring apparatus
- Patent number 11,637,039
- Issue date Apr 25, 2023
- Disco Corporation
- Takashi Mori
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Transfer device and transfer method for micro light-emitting diode...
- Patent number 11,621,183
- Issue date Apr 4, 2023
- TCL China Star Optoelectronics Technology Co., Ltd.
- Wei Zhang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Detecting damaged semiconductor wafers utilizing a semiconductor wa...
- Patent number 11,600,504
- Issue date Mar 7, 2023
- Taiwan Semiconductor Manufacturing Company, Ltd
- Chen Min Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Multi-flip semiconductor die sorter tool
- Patent number 11,569,105
- Issue date Jan 31, 2023
- Taiwan Semiconductor Manufacturing Company, Ltd
- Chih-Hung Huang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Chip matching system and method thereof
- Patent number 11,532,495
- Issue date Dec 20, 2022
- Siliconware Precision Industries Co., Ltd.
- Wu-Hung Yen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Systems and methods for tray cassette warehousing
- Patent number 11,527,425
- Issue date Dec 13, 2022
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Tsung-Sheng Kuo
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Wafer profiling for etching system
- Patent number 11,501,986
- Issue date Nov 15, 2022
- Applied Materials, Inc.
- Jeffrey Chi Cheung
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
METHOD OF PREPARING SEMICONDUCTOR CHIP, SEMICONDUCTOR CHIP, AND APP...
- Publication number 20250054813
- Publication date Feb 13, 2025
- Samsung Electronics Co., Ltd.
- Kyungwook HWANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CHIP TURRET SORTING APPARATUS AND FORMATION METHOD THEREOF
- Publication number 20250051104
- Publication date Feb 13, 2025
- SEMIGHT INSTRUMENTS CO., LTD
- Renwei TANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MAPPING APPARATUS AND LOAD PORT APPARATUS
- Publication number 20250054790
- Publication date Feb 13, 2025
- TDK Corporation
- Tatsuhiro KOTSUGAI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INSPECTION SYSTEM
- Publication number 20240429078
- Publication date Dec 26, 2024
- Applied Materials, Inc.
- Asaf SCHLEZINGER
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
TOOL CHANGING APPARATUS AND METHOD
- Publication number 20240316709
- Publication date Sep 26, 2024
- SEMES CO., LTD.
- Changhoon OK
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
METHODS AND SYSTEMS FOR COMPONENT ANALYSIS, SORTING, AND SEQUENCING...
- Publication number 20240282645
- Publication date Aug 22, 2024
- Wolfspeed, Inc.
- Zachary COLE
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PROCESSING APPARATUS FOR ELECTRONIC COMPONENT
- Publication number 20240222170
- Publication date Jul 4, 2024
- UENO SEIKI CO., LTD.
- Hiroyuki KIMURA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
DEVICE AND METHOD FOR SORTING SEMICONDUCTOR CHIP WITH POTENTIAL FAI...
- Publication number 20240222199
- Publication date Jul 4, 2024
- Samsung Electronics Co., Ltd.
- Gooyoung Kim
- G01 - MEASURING TESTING
Information Patent Application
LED-CHIP SORTING DEVICE AND LED CHIP MANUFACTURING METHOD
- Publication number 20240213062
- Publication date Jun 27, 2024
- Samsung Electronics Co., Ltd.
- Jongha Hwang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MULTI-FLIP SEMICONDUCTOR DIE SORTER TOOL
- Publication number 20240162064
- Publication date May 16, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chih-Hung HUANG
- B07 - SEPARATING SOLIDS FROM SOLIDS SORTING
Information Patent Application
A METHOD FOR FABRICATING SEMICONDUCTOR ARTICLES AND SYSTEM THEREOF
- Publication number 20240038525
- Publication date Feb 1, 2024
- Inari Technology Sdn Bhd
- BOON SENG TEOH
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
STACKED SUBSTRATE MANUFACTURING METHOD, STACKED SUBSTRATE MANUFACTU...
- Publication number 20240021447
- Publication date Jan 18, 2024
- Nikon Corporation
- Isao SUGAYA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
HIGH REGISTRATION PARTICLES-TRANSFERRING SYSTEM
- Publication number 20230366093
- Publication date Nov 16, 2023
- Xerox Corporation
- Yunda Wang
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
STOCKER SYSTEM FOR WAFER CASSETTE
- Publication number 20230335422
- Publication date Oct 19, 2023
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Guancyun LI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CHIP GRADING METHOD AND PACKAGING METHOD, AND CHIP GRADING SYSTEM A...
- Publication number 20230290692
- Publication date Sep 14, 2023
- CHANGXIN MEMORY TECHNOLOGIES, INC
- CHIA-SHENG LIN
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
METHOD OF PROCESSING WAFER, AND CHIP MEASURING APPARATUS
- Publication number 20230223303
- Publication date Jul 13, 2023
- Disco Corporation
- Takashi MORI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
DETECTING DAMAGED SEMICONDUCTOR WAFERS UTILIZING A SEMICONDUCTOR WA...
- Publication number 20230207357
- Publication date Jun 29, 2023
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chen Min LIN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MULTI-FLIP SEMICONDUCTOR DIE SORTER TOOL
- Publication number 20230170234
- Publication date Jun 1, 2023
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chih-Hung HUANG
- B07 - SEPARATING SOLIDS FROM SOLIDS SORTING
Information Patent Application
MANUFACTURING AND MEASURING SYSTEM FOR SEMICONDUCTOR STRUCTURES
- Publication number 20230128335
- Publication date Apr 27, 2023
- NANYA TECHNOLOGY CORPORATION
- CHENG-TA CHENG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CHIP MATCHING SYSTEM AND METHOD THEREOF
- Publication number 20230076941
- Publication date Mar 9, 2023
- Siliconware Precision Industries Co., Ltd.
- Wu-Hung Yen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INSPECTION SYSTEM
- Publication number 20230075394
- Publication date Mar 9, 2023
- Applied Materials, Inc.
- Asaf SCHLEZINGER
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
WAFER PROFILING FOR ETCHING SYSTEM
- Publication number 20230065641
- Publication date Mar 2, 2023
- Applied Materials, Inc.
- Jeffrey Chi Cheung
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR CHIP CONTAINER AND FIXTURE
- Publication number 20230056554
- Publication date Feb 23, 2023
- CHANGXIN MEMORY TECHNOLOGIES, INC.
- Jiabao CHEN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
APPARATUS AND METHOD FOR CHARACTERIZATION AND OPTIONAL SORTING AND...
- Publication number 20220392792
- Publication date Dec 8, 2022
- MicronTechnology, Inc.
- Kuan Wei Tseng
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SYSTEMS AND METHODS FOR DIE TRANSFER
- Publication number 20220384222
- Publication date Dec 1, 2022
- Taiwan Semiconductor Manufacturing Co., LTD
- Tsung-Sheng KUO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD AND APPARATUS FOR IC UNIT SINGULATION AND SORTING
- Publication number 20220189805
- Publication date Jun 16, 2022
- ROKKO SYSTEMS PTE LTD
- Jong Jae JUNG
- B07 - SEPARATING SOLIDS FROM SOLIDS SORTING
Information Patent Application
METHODS AND SYSTEMS FOR COMPONENT ANALYSIS, SORTING, AND SEQUENCING...
- Publication number 20220165627
- Publication date May 26, 2022
- Cree Fayetteville, Inc.
- Zach COLE
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD OF CONTROLLING THE PLACEMENT OF MICRO-OBJECTS ON A MICRO-ASS...
- Publication number 20220153575
- Publication date May 19, 2022
- Palo Alto Research Center Incorporated
- Anne Plochowietz
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
METHOD OF CONTROLLING THE PLACEMENT OF MICRO-OBJECTS ON A MICRO-ASS...
- Publication number 20220153576
- Publication date May 19, 2022
- Palo Alto Research Center Incorporated
- Anne Plochowietz
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
METHOD FOR SORTING OPTOELECTRONIC SEMICONDUCTOR COMPONENTS AND DEVI...
- Publication number 20220148897
- Publication date May 12, 2022
- Osram Opto Semiconductors GmbH
- Tobias MEYER
- H01 - BASIC ELECTRIC ELEMENTS

Sorting devices

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Semiconductor storage apparatus with integrated sorter

Manufacturing and measuring system for semiconductor structures

Stocker system for wafer cassette

Inspection system

Alignment platform and electronic component transmission apparatus

Chip matching system and method thereof

Apparatus and method for orientation of semiconductor device die

Methods and systems for component analysis, sorting, and sequencing...

Multi-flip semiconductor die sorter tool

Method of processing wafer, and chip measuring apparatus

Method of controlling the placement of micro-objects

Optimizating semiconductor binning by feed-forward process adjustment

Stacked substrate manufacturing method, stacked substrate manufactu...

Systems and methods for die transfer

Wafer-measuring apparatus and wafer-transferring method thereof

Method and apparatus for IC unit singulation and sorting

Method of controlling the placement of micro-objects on a micro-ass...

Stocker system for wafer cassette

High registration particles-transferring system

Front surface and back surface orientation detection of transparent...

Method for sorting optoelectronic semiconductor components and devi...

Dynamic routing method and apparatus for overhead hoist transport s...

Apparatus for controlling the placement of micro-objects on a micro...

Method of processing wafer, and chip measuring apparatus

Transfer device and transfer method for micro light-emitting diode...

Detecting damaged semiconductor wafers utilizing a semiconductor wa...

Multi-flip semiconductor die sorter tool

Chip matching system and method thereof

Systems and methods for tray cassette warehousing

Wafer profiling for etching system

Patents Applicationslast 30 patents

METHOD OF PREPARING SEMICONDUCTOR CHIP, SEMICONDUCTOR CHIP, AND APP...

CHIP TURRET SORTING APPARATUS AND FORMATION METHOD THEREOF

MAPPING APPARATUS AND LOAD PORT APPARATUS

INSPECTION SYSTEM

TOOL CHANGING APPARATUS AND METHOD

METHODS AND SYSTEMS FOR COMPONENT ANALYSIS, SORTING, AND SEQUENCING...

PROCESSING APPARATUS FOR ELECTRONIC COMPONENT

DEVICE AND METHOD FOR SORTING SEMICONDUCTOR CHIP WITH POTENTIAL FAI...

LED-CHIP SORTING DEVICE AND LED CHIP MANUFACTURING METHOD

MULTI-FLIP SEMICONDUCTOR DIE SORTER TOOL

A METHOD FOR FABRICATING SEMICONDUCTOR ARTICLES AND SYSTEM THEREOF

STACKED SUBSTRATE MANUFACTURING METHOD, STACKED SUBSTRATE MANUFACTU...

HIGH REGISTRATION PARTICLES-TRANSFERRING SYSTEM

STOCKER SYSTEM FOR WAFER CASSETTE

CHIP GRADING METHOD AND PACKAGING METHOD, AND CHIP GRADING SYSTEM A...

METHOD OF PROCESSING WAFER, AND CHIP MEASURING APPARATUS

DETECTING DAMAGED SEMICONDUCTOR WAFERS UTILIZING A SEMICONDUCTOR WA...

MULTI-FLIP SEMICONDUCTOR DIE SORTER TOOL

MANUFACTURING AND MEASURING SYSTEM FOR SEMICONDUCTOR STRUCTURES

CHIP MATCHING SYSTEM AND METHOD THEREOF

INSPECTION SYSTEM

WAFER PROFILING FOR ETCHING SYSTEM

SEMICONDUCTOR CHIP CONTAINER AND FIXTURE

APPARATUS AND METHOD FOR CHARACTERIZATION AND OPTIONAL SORTING AND...

SYSTEMS AND METHODS FOR DIE TRANSFER

METHOD AND APPARATUS FOR IC UNIT SINGULATION AND SORTING

METHODS AND SYSTEMS FOR COMPONENT ANALYSIS, SORTING, AND SEQUENCING...

METHOD OF CONTROLLING THE PLACEMENT OF MICRO-OBJECTS ON A MICRO-ASS...

METHOD OF CONTROLLING THE PLACEMENT OF MICRO-OBJECTS ON A MICRO-ASS...

METHOD FOR SORTING OPTOELECTRONIC SEMICONDUCTOR COMPONENTS AND DEVI...