Special connections between adjacent vias, not for grounding vias

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CPC
H05K2201/09627

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HELECTRICITY H05Electric techniques H05KPRINTED CIRCUITS CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS H05K2201/00Indexing scheme relating to printed circuits covered by H05K1/00

Current Industry

H05K2201/09627Special connections between adjacent vias, not for grounding vias

Industries

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Patents Grantslast 30 patents

Information Patent Grant
Techniques for high-speed signal layer transition
- Patent number 11,889,617
- Issue date Jan 30, 2024
- BAIDU USA LLC
- Zhenwei Yu
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Method and circuit for controlling quality of metallization of a mu...
- Patent number 11,678,434
- Issue date Jun 13, 2023
- Continental Automotive France
- Daniel Guerra
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Printed circuit board, optical module, and optical transmission equ...
- Patent number 11,234,326
- Issue date Jan 25, 2022
- Lumentum Japan, Inc.
- Osamu Kagaya
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for producing a printed circuit board having thermal through...
- Patent number 11,116,071
- Issue date Sep 7, 2021
- ZKW GROUP GMBH
- Erik Edlinger
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Printed wiring board and method for manufacturing same
- Patent number 10,952,320
- Issue date Mar 16, 2021
- Kyocera Corporation
- Tadashi Watanabe
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Printed circuit board, optical module, and optical transmission equ...
- Patent number 10,904,997
- Issue date Jan 26, 2021
- Lumentum Japan, Inc.
- Osamu Kagaya
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Measuring effective dielectric constant using via-stub resonance
- Patent number 10,674,598
- Issue date Jun 2, 2020
- Cisco Technology, Inc.
- David Nozadze
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Polymer frame for a chip, such that the frame comprises at least on...
- Patent number 10,446,335
- Issue date Oct 15, 2019
- Zhuhai ACCESS Semiconductor Co., Ltd.
- Dror Hurwitz
- H03 - BASIC ELECTRONIC CIRCUITRY
Information Patent Grant
Circuit structure
- Patent number 10,448,501
- Issue date Oct 15, 2019
- Industrial Technology Research Institute
- Shih-Hsien Wu
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Printed wiring board, printed circuit board, and electronic apparatus
- Patent number 10,306,761
- Issue date May 28, 2019
- Canon Kabushiki Kaisha
- Takashi Numagi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Multilayer wiring substrate
- Patent number 10,237,973
- Issue date Mar 19, 2019
- Canon Kabushiki Kaisha
- Takashi Tokoro
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Wiring board assembly and method for producing same
- Patent number 10,237,971
- Issue date Mar 19, 2019
- Fujikura Ltd.
- Ryotaro Takagi
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Anti-pad for signal and power vias in printed circuit board
- Patent number 10,194,524
- Issue date Jan 29, 2019
- Cisco Technology, Inc.
- Il-Young Park
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Multi-layer circuit structure
- Patent number 10,129,974
- Issue date Nov 13, 2018
- Industrial Technology Research Institute
- Chien-Min Hsu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Systems and methods for controlled effective series resistance comp...
- Patent number 9,992,871
- Issue date Jun 5, 2018
- Intel Corporation
- William J. Lambert
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Method for manufacturing printed wiring board and printed wiring board
- Patent number 9,986,642
- Issue date May 29, 2018
- Ibiden Co., Ltd.
- Masatoshi Kunieda
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Multilayer wiring substrate, manufacturing method therefor, and sub...
- Patent number 9,961,768
- Issue date May 1, 2018
- Murata Manufacturing Co., Ltd.
- Yoshihito Otsubo
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Printed wiring board and printed circuit board
- Patent number 9,907,155
- Issue date Feb 27, 2018
- Canon Kabushiki Kaisha
- Takashi Numagi
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Wiring substrate and semiconductor device
- Patent number 9,681,546
- Issue date Jun 13, 2017
- Shinko Electric Industries Co., Ltd.
- Satoshi Sunohara
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and circuit board
- Patent number 9,560,762
- Issue date Jan 31, 2017
- Renesas Electronics Corporation
- Ryuichi Oikawa
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Printed circuit board, design method thereof and mainboard of termi...
- Patent number 9,519,308
- Issue date Dec 13, 2016
- Huawei Technologies Co., Ltd.
- Xiaolan Shen
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Element housing package and mounting structure body
- Patent number 9,462,709
- Issue date Oct 4, 2016
- KYOCERA Corporation
- Yoshiki Kawazu
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Suspension board assembly sheet with circuits and method for manufa...
- Patent number 9,451,704
- Issue date Sep 20, 2016
- Nitto Denko Corporation
- Terukazu Ihara
- G11 - INFORMATION STORAGE
Information Patent Grant
Printed wiring board and electric tool switch provided therewith
- Patent number 9,414,492
- Issue date Aug 9, 2016
- Omron Corporation
- Akihiro Hozumi
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Using time-domain reflectometry to identify manufacturing informati...
- Patent number 9,310,417
- Issue date Apr 12, 2016
- Lenovo Enterprise Solutions (Singapore) Pte. Ltd.
- Jordan HP Chin
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Diplexer design using through glass via technology
- Patent number 9,203,373
- Issue date Dec 1, 2015
- QUALCOMM Incorporated
- Chengjie Zuo
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Printed circuit board
- Patent number 9,173,283
- Issue date Oct 27, 2015
- ShenZhen Goldsun Network Intelligence Technology Co., Ltd.
- Shao-You Tang
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Multilayer printed wiring board
- Patent number 9,040,843
- Issue date May 26, 2015
- Ibiden Co., Ltd.
- Yukihiko Toyoda
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Optimizing application specific integrated circuit pinouts for high...
- Patent number 8,990,754
- Issue date Mar 24, 2015
- Cisco Technology, Inc.
- Steven C. Bird
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Filter based on a combined via structure
- Patent number 8,970,327
- Issue date Mar 3, 2015
- NEC Corporation
- Taras Kushta
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR

Patents Applicationslast 30 patents

Information Patent Application
POWER SUPPLY UNIT OF AEROSOL GENERATING DEVICE
- Publication number 20240324104
- Publication date Sep 26, 2024
- Japan Tobacco Inc.
- Keiji MARUBASHI
- A24 - TOBACCO CIGARS CIGARETTES SMOKERS' REQUISITES
Information Patent Application
ELECTRONIC DEVICE HAVING MULTILAYERED SUBSTRATE AND MANUFACTURING M...
- Publication number 20230300984
- Publication date Sep 21, 2023
- Samsung Electronics Co., Ltd.
- Seungjin LEE
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Magnetic Inlay With Electrically Conductive Vertical Through Connec...
- Publication number 20220377897
- Publication date Nov 24, 2022
- AT&S Austria Technologie & Systemtechnik Aktiengesellschaft
- Ivan SALKOVIC
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD AND CIRCUIT FOR CONTROLLING QUALITY OF METALLIZATION OF A MU...
- Publication number 20220240377
- Publication date Jul 28, 2022
- Daniel Guerra
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
PRINTED CIRCUIT BOARD
- Publication number 20200196444
- Publication date Jun 18, 2020
- Samsung Electro-Mechanics Co., Ltd.
- Ju-Ho JIN
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
PRINTED CIRCUIT BOARD USING TWO-VIA GEOMETRY
- Publication number 20200187352
- Publication date Jun 11, 2020
- Intel Corporation
- Wei Jern Tan
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
PRINTED CIRCUIT BOARD, OPTICAL MODULE, AND OPTICAL TRANSMISSION EQU...
- Publication number 20200045808
- Publication date Feb 6, 2020
- Lumentum Japan, Inc.
- Osamu KAGAYA
- G02 - OPTICS
Information Patent Application
PRINTED WIRING BOARD AND METHOD FOR MANUFACTURING SAME
- Publication number 20190098755
- Publication date Mar 28, 2019
- KYOCERA CORPORATION
- Tadashi WATANABE
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
ANTI-PAD FOR SIGNAL AND POWER VIAS IN PRINTED CIRCUIT BOARD
- Publication number 20190037684
- Publication date Jan 31, 2019
- Cisco Technology, Inc.
- Il-Young Park
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
MULTILAYER WIRING SUBSTRATE
- Publication number 20180295721
- Publication date Oct 11, 2018
- Canon Kabushiki Kaisha
- Takashi Tokoro
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SYSTEMS AND METHODS FOR CONTROLLED EFFECTIVE SERIES RESISTANCE COMP...
- Publication number 20170135211
- Publication date May 11, 2017
- Intel Corporation
- William J. Lambert
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
WIRING SUBSTRATE AND SEMICONDUCTOR DEVICE
- Publication number 20140301058
- Publication date Oct 9, 2014
- Shinko Electric Industries Co., LTD.
- Satoshi SUNOHARA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
DIPLEXER DESIGN USING THROUGH GLASS VIA TECHNOLOGY
- Publication number 20140197902
- Publication date Jul 17, 2014
- QUALCOMM Incorporated
- Chengjie Zuo
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PRINTED CIRCUIT BOARD, DESIGN METHOD THEREOF AND MAINBOARD OF TERMI...
- Publication number 20140185217
- Publication date Jul 3, 2014
- Huawei Technologies Co., Ltd
- Xiaolan SHEN
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
PRINTED CIRCUIT BOARD
- Publication number 20140182893
- Publication date Jul 3, 2014
- HON HAI PRECISION INDUSTRY CO., LTD.
- SHAO-YOU TANG
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
SUSPENSION BOARD ASSEMBLY SHEET WITH CIRCUITS AND METHOD FOR MANUFA...
- Publication number 20140126169
- Publication date May 8, 2014
- Nitto Denko Corporation
- Terukazu IHARA
- G11 - INFORMATION STORAGE
Information Patent Application
SEMICONDUCTOR DEVICE AND CIRCUIT BOARD
- Publication number 20140104802
- Publication date Apr 17, 2014
- RENESAS ELECTRONICS CORPORATION
- Ryuichi Oikawa
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MULTI-LAYER CIRCUIT SUBSTRATE FABRICATION METHOD PROVIDING IMPROVED...
- Publication number 20140080300
- Publication date Mar 20, 2014
- International Business Machines Corporation
- Sungjun Chun
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Printed Circuit Board and Optical Transmission Device
- Publication number 20130163996
- Publication date Jun 27, 2013
- Oclaro Japan, Inc.
- Osamu Kagaya
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELECTROMAGNETIC BANDGAP STRUCTURE AND PRINTED CIRCUIT BOARD
- Publication number 20130141191
- Publication date Jun 6, 2013
- Samsung Electro-Mechanics Co., Ltd.
- Han KIM
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SYSTEMS AND METHODS FOR PROVIDING VIAS THROUGH A MODULAR COMPONENT
- Publication number 20130063914
- Publication date Mar 14, 2013
- Apple Inc.
- Gloria Lin
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
MULTILAYER PRINTED WIRING BOARD
- Publication number 20130008701
- Publication date Jan 10, 2013
- IBIDEN CO., LTD.
- Yukihiko TOYODA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor Package with Embedded Spiral Inductor
- Publication number 20120267756
- Publication date Oct 25, 2012
- Hao Shi
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
CAPACITOR-INCORPORATED SUBSTRATE AND COMPONENT-INCORPORATED WIRING...
- Publication number 20120241906
- Publication date Sep 27, 2012
- NGK Spark Plug Co., Ltd.
- Naoya Nakanishi
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
ELECTROMAGNETIC BANDGAP STRUCTURE AND PRINTED CIRCUIT BOARD
- Publication number 20120234591
- Publication date Sep 20, 2012
- Samsung Electro-Mechanics Co., Ltd.
- Han Kim
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
SPLIT WAVE COMPENSATION FOR OPEN STUBS
- Publication number 20120055016
- Publication date Mar 8, 2012
- Flextronics AP LLC
- Dan Gorcea
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
PRINTED WIRING BOARD AND MANUFACTURING METHOD OF PRINTED WIRING BOARD
- Publication number 20110290544
- Publication date Dec 1, 2011
- IBIDEN CO., LTD.
- Naohiro Hirose
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
NON-CONTACT POWER RECEIVING APPARATUS
- Publication number 20110278951
- Publication date Nov 17, 2011
- Murata Manufacturing Co., Ltd.
- Takeshi KURIHARA
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
FILTER BASED ON A COMBINED VIA STRUCTURE
- Publication number 20110248800
- Publication date Oct 13, 2011
- Taras Kushta
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
MULTILAYER PRINTED WIRING BOARD AND MANUFACTURING METHOD THEREOF
- Publication number 20110232086
- Publication date Sep 29, 2011
- IBIDEN CO., LTD.
- Youhong Wu
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR

Special connections between adjacent vias, not for grounding vias

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Techniques for high-speed signal layer transition

Method and circuit for controlling quality of metallization of a mu...

Printed circuit board, optical module, and optical transmission equ...

Method for producing a printed circuit board having thermal through...

Printed wiring board and method for manufacturing same

Printed circuit board, optical module, and optical transmission equ...

Measuring effective dielectric constant using via-stub resonance

Polymer frame for a chip, such that the frame comprises at least on...

Circuit structure

Printed wiring board, printed circuit board, and electronic apparatus

Multilayer wiring substrate

Wiring board assembly and method for producing same

Anti-pad for signal and power vias in printed circuit board

Multi-layer circuit structure

Systems and methods for controlled effective series resistance comp...

Method for manufacturing printed wiring board and printed wiring board

Multilayer wiring substrate, manufacturing method therefor, and sub...

Printed wiring board and printed circuit board

Wiring substrate and semiconductor device

Semiconductor device and circuit board

Printed circuit board, design method thereof and mainboard of termi...

Element housing package and mounting structure body

Suspension board assembly sheet with circuits and method for manufa...

Printed wiring board and electric tool switch provided therewith

Using time-domain reflectometry to identify manufacturing informati...

Diplexer design using through glass via technology

Printed circuit board

Multilayer printed wiring board

Optimizing application specific integrated circuit pinouts for high...

Filter based on a combined via structure

Patents Applicationslast 30 patents

POWER SUPPLY UNIT OF AEROSOL GENERATING DEVICE

ELECTRONIC DEVICE HAVING MULTILAYERED SUBSTRATE AND MANUFACTURING M...

Magnetic Inlay With Electrically Conductive Vertical Through Connec...

METHOD AND CIRCUIT FOR CONTROLLING QUALITY OF METALLIZATION OF A MU...

PRINTED CIRCUIT BOARD

PRINTED CIRCUIT BOARD USING TWO-VIA GEOMETRY

PRINTED CIRCUIT BOARD, OPTICAL MODULE, AND OPTICAL TRANSMISSION EQU...

PRINTED WIRING BOARD AND METHOD FOR MANUFACTURING SAME

ANTI-PAD FOR SIGNAL AND POWER VIAS IN PRINTED CIRCUIT BOARD

MULTILAYER WIRING SUBSTRATE

SYSTEMS AND METHODS FOR CONTROLLED EFFECTIVE SERIES RESISTANCE COMP...

WIRING SUBSTRATE AND SEMICONDUCTOR DEVICE

DIPLEXER DESIGN USING THROUGH GLASS VIA TECHNOLOGY

PRINTED CIRCUIT BOARD, DESIGN METHOD THEREOF AND MAINBOARD OF TERMI...

PRINTED CIRCUIT BOARD

SUSPENSION BOARD ASSEMBLY SHEET WITH CIRCUITS AND METHOD FOR MANUFA...

SEMICONDUCTOR DEVICE AND CIRCUIT BOARD

MULTI-LAYER CIRCUIT SUBSTRATE FABRICATION METHOD PROVIDING IMPROVED...

Printed Circuit Board and Optical Transmission Device

ELECTROMAGNETIC BANDGAP STRUCTURE AND PRINTED CIRCUIT BOARD

SYSTEMS AND METHODS FOR PROVIDING VIAS THROUGH A MODULAR COMPONENT

MULTILAYER PRINTED WIRING BOARD

Semiconductor Package with Embedded Spiral Inductor

CAPACITOR-INCORPORATED SUBSTRATE AND COMPONENT-INCORPORATED WIRING...

ELECTROMAGNETIC BANDGAP STRUCTURE AND PRINTED CIRCUIT BOARD

SPLIT WAVE COMPENSATION FOR OPEN STUBS

PRINTED WIRING BOARD AND MANUFACTURING METHOD OF PRINTED WIRING BOARD

NON-CONTACT POWER RECEIVING APPARATUS

FILTER BASED ON A COMBINED VIA STRUCTURE

MULTILAYER PRINTED WIRING BOARD AND MANUFACTURING METHOD THEREOF