Special relation between the location or dimension of a pad or land and the location or dimension of a terminal

Industry

CPC
H05K2201/09427

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Parent Industries

HELECTRICITY H05Electric techniques H05KPRINTED CIRCUITS CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS H05K2201/00Indexing scheme relating to printed circuits covered by H05K1/00

Current Industry

H05K2201/09427Special relation between the location or dimension of a pad or land and the location or dimension of a terminal

Industries

Patents Grantslast 30 patents

Information Patent Grant
Flexible printed circuit board including terminal, wiring module, a...
- Patent number 12,114,429
- Issue date Oct 8, 2024
- Autonetworks Technologies, Ltd.
- Hideo Takahashi
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Flexible printed circuit board, wiring module, flexible printed cir...
- Patent number 12,101,888
- Issue date Sep 24, 2024
- Autonetworks Technologies, Ltd.
- Hideo Takahashi
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Semiconductor device and memory system
- Patent number 12,082,340
- Issue date Sep 3, 2024
- Kioxia Corporation
- Yuta Tsubouchi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Mounting structure for inductors
- Patent number 12,035,460
- Issue date Jul 9, 2024
- Murata Manufacturing Co., Ltd.
- Tarou Higuchi
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Array substrate and method of mounting integrated circuit using the...
- Patent number 11,967,597
- Issue date Apr 23, 2024
- Samsung Display Co., Ltd.
- Dae Geun Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Edge connector, circuit board, and connector component
- Patent number 11,909,134
- Issue date Feb 20, 2024
- Huawei Technologies Co., Ltd.
- Fei Yu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Display device
- Patent number 11,874,569
- Issue date Jan 16, 2024
- Samsung Display Co., Ltd.
- Han Ho Park
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Connector attached multi-conductor cable
- Patent number 11,784,438
- Issue date Oct 10, 2023
- Sumitomo Electric Industries, Ltd.
- Naoshige Yokota
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Wiring board, composite substrate, and electric device
- Patent number 11,778,747
- Issue date Oct 3, 2023
- Kyocera Corporation
- Toshifumi Higashi
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Edge connector, circuit board, and connector component
- Patent number 11,626,673
- Issue date Apr 11, 2023
- Huawei Technologies Co., Ltd.
- Fei Yu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Board including multiple conductive pads corresponding to one conta...
- Patent number 11,464,107
- Issue date Oct 4, 2022
- Samsung Electronics Co., Ltd.
- Chihwei Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Display device
- Patent number 11,347,120
- Issue date May 31, 2022
- Samsung Display Co., Ltd.
- Han Ho Park
- G09 - EDUCATION CRYPTOGRAPHY DISPLAY ADVERTISING SEALS
Information Patent Grant
Printed wiring board and method for manufacturing printed wiring board
- Patent number 11,083,086
- Issue date Aug 3, 2021
- Ibiden Co., Ltd.
- Youhong Wu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Array substrate and method of mounting integrated circuit using the...
- Patent number 11,081,503
- Issue date Aug 3, 2021
- Samsung Display Co., Ltd.
- Dae Geun Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Printed circuit board and communications device
- Patent number 11,019,724
- Issue date May 25, 2021
- Huawei Technologies Co., Ltd.
- Feng Gao
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Edge connector, circuit board, and connector component
- Patent number 10,998,653
- Issue date May 4, 2021
- Huawei Technologies Co., Ltd.
- Fei Yu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Printed circuit board
- Patent number 10,959,322
- Issue date Mar 23, 2021
- Tyco Electronics Japan G.K.
- Kenta Sato
- B60 - VEHICLES IN GENERAL
Information Patent Grant
Display device
- Patent number 10,782,573
- Issue date Sep 22, 2020
- Samsung Display Co., Ltd.
- Han Ho Park
- G02 - OPTICS
Information Patent Grant
Semiconductor device and method of forming high routing density int...
- Patent number 10,580,749
- Issue date Mar 3, 2020
- STATS ChipPAC Pte. Ltd.
- Rajendra D. Pendse
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Power signal transmission structure and design method thereof
- Patent number 10,470,299
- Issue date Nov 5, 2019
- Pegatron Corporation
- Ching Ou Yang
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Method of enhancing fatigue life of grid arrays
- Patent number 10,433,429
- Issue date Oct 1, 2019
- Massachusetts Institute of Technology
- James H. Kelly
- Y02 - TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMA...
Information Patent Grant
Array substrate and method of mounting integrated circuit using the...
- Patent number 10,373,987
- Issue date Aug 6, 2019
- Samsung Display Co., Ltd.
- Dae Geun Lee
- G02 - OPTICS
Information Patent Grant
Display device
- Patent number 10,303,017
- Issue date May 28, 2019
- Samsung Display Co., Ltd.
- Han Ho Park
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electrical contact pad for electrically contacting a connector
- Patent number 10,263,352
- Issue date Apr 16, 2019
- TE Connectivity Corporation
- Graham Harry Smith
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electronic control device
- Patent number 10,154,589
- Issue date Dec 11, 2018
- Hitachi Automotive Systems, Ltd.
- Miki Hiraoka
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Circuit board and electronic device provided with same
- Patent number 10,147,662
- Issue date Dec 4, 2018
- Kyocera Corporation
- Yuuichi Abe
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Semiconductor device mounting structure, backlight device, and moun...
- Patent number 10,129,977
- Issue date Nov 13, 2018
- Nichia Corporation
- Takuya Nakabayashi
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Ceramic multilayer wiring substrate and module including the same
- Patent number 10,002,710
- Issue date Jun 19, 2018
- Murata Manufacturing Co., Ltd.
- Hiromichi Kitajima
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
LED lamp using ultra-small LED electrode assembly
- Patent number 9,978,725
- Issue date May 22, 2018
- PSI CO., LTD.
- Young Rag Do
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and manufacturing method thereof
- Patent number 9,837,369
- Issue date Dec 5, 2017
- RENESAS ELECTRONICS CORPORATION
- Yoshikazu Shimote
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
FLEXIBLE PRINTED CIRCUIT BOARD, WIRING MODULE, FLEXIBLE PRINTED CIR...
- Publication number 20240414848
- Publication date Dec 12, 2024
- AUTONETWORKS TECHNOLOGIES, LTD.
- Hideo TAKAHASHI
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
DISPLAY DEVICE
- Publication number 20240397617
- Publication date Nov 28, 2024
- SAMSUNG DISPLAY CO., LTD.
- JOO-NYUNG JANG
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
ARRAY SUBSTRATE AND METHOD OF MOUNTING INTEGRATED CIRCUIT USING THE...
- Publication number 20240234443
- Publication date Jul 11, 2024
- SAMSUNG DISPLAY CO., LTD.
- Dae Geun LEE
- Y02 - TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMA...
Information Patent Application
SEMICONDUCTOR PACKAGES HAVING CIRCUIT BOARDS
- Publication number 20230254975
- Publication date Aug 10, 2023
- Samsung Electronics Co., Ltd.
- Sunjae KIM
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
ELECTRONIC DEVICE
- Publication number 20230156916
- Publication date May 18, 2023
- InnoLux Corporation
- Shang-Ru WU
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
MOUNTING STRUCTURE FOR INDUCTORS
- Publication number 20230097690
- Publication date Mar 30, 2023
- Murata Manufacturing Co., Ltd.
- Tarou HIGUCHI
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
SEMICONDUCTOR DEVICE AND MEMORY SYSTEM
- Publication number 20230090795
- Publication date Mar 23, 2023
- KIOXIA Corporation
- Yuta TSUBOUCHI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELECTRONIC DEVICE COMPRISING INTERPOSER
- Publication number 20230069694
- Publication date Mar 2, 2023
- Samsung Electronics Co., Ltd.
- Eunseok HONG
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
FLEXIBLE PRINTED CIRCUIT BOARD, WIRING MODULE, FLEXIBLE PRINTED CIR...
- Publication number 20220394855
- Publication date Dec 8, 2022
- AUTONETWORKS TECHNOLOGIES, LTD.
- Hideo TAKAHASHI
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
FLEXIBLE PRINTED CIRCUIT BOARD INCLUDING TERMINAL, WIRING MODULE, A...
- Publication number 20220394856
- Publication date Dec 8, 2022
- AUTONETWORKS TECHNOLOGIES, LTD.
- Hideo TAKAHASHI
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
CONNECTOR ATTACHED MULTI-CONDUCTOR CABLE
- Publication number 20220311189
- Publication date Sep 29, 2022
- Sumitomo Electric Industries, Ltd.
- Naoshige YOKOTA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
WIRING BOARD, COMPOSITE SUBSTRATE, AND ELECTRIC DEVICE
- Publication number 20210410286
- Publication date Dec 30, 2021
- KYOCERA CORPORATION
- Toshifumi HIGASHI
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
PRINTED CIRCUIT BOARD AND COMMUNICATIONS DEVICE
- Publication number 20200137887
- Publication date Apr 30, 2020
- Huawei Technologies Co., Ltd
- Feng GAO
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
BOARD INCLUDING MULTIPLE CONDUCTIVE PADS CORRESPONDING TO ONE CONTA...
- Publication number 20200107434
- Publication date Apr 2, 2020
- Samsung Electronics Co., Ltd.
- Chihwei LEE
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ARRAY SUBSTRATE AND METHOD OF MOUNTING INTEGRATED CIRCUIT USING THE...
- Publication number 20190333939
- Publication date Oct 31, 2019
- SAMSUNG DISPLAY CO., LTD.
- Dae Geun LEE
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
BREAD BOARD, BREAD BOARD SYSTEM AND NON-TRANSITORY COMPUTER READABL...
- Publication number 20190008048
- Publication date Jan 3, 2019
- Kabushiki Kaisha Toshiba
- Hajime Sano
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
METAL ELECTRODE LEADLESS FACE (MELF) DEVICE CRADLE
- Publication number 20180359864
- Publication date Dec 13, 2018
- PITYU CONTROLS INC.
- Stevan DOBI
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
PRINTED CIRCUIT BOARD
- Publication number 20180332699
- Publication date Nov 15, 2018
- Unlimiter MFA Co., Ltd.
- KUO-PING YANG
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD THEREOF
- Publication number 20180047695
- Publication date Feb 15, 2018
- RENESAS ELECTRONICS CORPORATION
- Yoshikazu SHIMOTE
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Grid Arrays With Enhanced Fatigue Life
- Publication number 20170013725
- Publication date Jan 12, 2017
- Massachusetts Institute of Technology
- Dmitry Tolpin
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
PRINTED CIRCUIT BOARD ASSEMBLY
- Publication number 20160286649
- Publication date Sep 29, 2016
- SAMSUNG DISPLAY CO., LTD.
- Dongwan CHOI
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
CHIP COMPONENT MOUNTING STRUCTURE, AND MODULE COMPONENT
- Publication number 20150257266
- Publication date Sep 10, 2015
- Murata Manufacturing Co., Ltd.
- Hiromi MURAYAMA
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
WIRING BOARD AND METHOD FOR MANUFACTURING SAME
- Publication number 20150208501
- Publication date Jul 23, 2015
- NGK Spark Plug Co., Ltd.
- Takahiro Hayashi
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
MULTILAYER CERAMIC CAPACITOR AND BOARD HAVING THE SAME MOUNTED THEREON
- Publication number 20140368968
- Publication date Dec 18, 2014
- Samsung Electro-Mechanics Co., Ltd.
- Kyo Kwang LEE
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SUSPENSION BOARD WITH CIRCUIT AND METHOD OF MANUFACTURING THE SAME
- Publication number 20140345920
- Publication date Nov 27, 2014
- Nitto Denko Corporation
- Terukazu IHARA
- G11 - INFORMATION STORAGE
Information Patent Application
Semiconductor Device and Method of Forming High Routing Density Int...
- Publication number 20140319692
- Publication date Oct 30, 2014
- Rajendra D. Pendse
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CERAMIC MULTILAYER WIRING SUBSTRATE AND MODULE INCLUDING THE SAME
- Publication number 20140307406
- Publication date Oct 16, 2014
- Murata Manufacturing Co., Ltd.
- Hiromichi KITAJIMA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PRINTED CIRCUIT BOARD MODULE
- Publication number 20140291002
- Publication date Oct 2, 2014
- HON HAI PRECISION INDUSTRY CO., LTD.
- PO-YUAN LIN
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
LIGHT-EMITTING MODULE
- Publication number 20140138732
- Publication date May 22, 2014
- TOSHIBA LIGHTING & TECHNOLOGY CORPORATION
- Akihiro SASAKI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CONNECTOR ASSEMBLY AND FEMALE CONNECTOR USED FOR THE SAME
- Publication number 20140017938
- Publication date Jan 16, 2014
- Hiroshi IWANO
- H01 - BASIC ELECTRIC ELEMENTS

Special relation between the location or dimension of a pad or land and the location or dimension of a terminal

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Flexible printed circuit board including terminal, wiring module, a...

Flexible printed circuit board, wiring module, flexible printed cir...

Semiconductor device and memory system

Mounting structure for inductors

Array substrate and method of mounting integrated circuit using the...

Edge connector, circuit board, and connector component

Display device

Connector attached multi-conductor cable

Wiring board, composite substrate, and electric device

Edge connector, circuit board, and connector component

Board including multiple conductive pads corresponding to one conta...

Display device

Printed wiring board and method for manufacturing printed wiring board

Array substrate and method of mounting integrated circuit using the...

Printed circuit board and communications device

Edge connector, circuit board, and connector component

Printed circuit board

Display device

Semiconductor device and method of forming high routing density int...

Power signal transmission structure and design method thereof

Method of enhancing fatigue life of grid arrays

Array substrate and method of mounting integrated circuit using the...

Display device

Electrical contact pad for electrically contacting a connector

Electronic control device

Circuit board and electronic device provided with same

Semiconductor device mounting structure, backlight device, and moun...

Ceramic multilayer wiring substrate and module including the same

LED lamp using ultra-small LED electrode assembly

Semiconductor device and manufacturing method thereof

Patents Applicationslast 30 patents

FLEXIBLE PRINTED CIRCUIT BOARD, WIRING MODULE, FLEXIBLE PRINTED CIR...

DISPLAY DEVICE

ARRAY SUBSTRATE AND METHOD OF MOUNTING INTEGRATED CIRCUIT USING THE...

SEMICONDUCTOR PACKAGES HAVING CIRCUIT BOARDS

ELECTRONIC DEVICE

MOUNTING STRUCTURE FOR INDUCTORS

SEMICONDUCTOR DEVICE AND MEMORY SYSTEM

ELECTRONIC DEVICE COMPRISING INTERPOSER

FLEXIBLE PRINTED CIRCUIT BOARD, WIRING MODULE, FLEXIBLE PRINTED CIR...

FLEXIBLE PRINTED CIRCUIT BOARD INCLUDING TERMINAL, WIRING MODULE, A...

CONNECTOR ATTACHED MULTI-CONDUCTOR CABLE

WIRING BOARD, COMPOSITE SUBSTRATE, AND ELECTRIC DEVICE

PRINTED CIRCUIT BOARD AND COMMUNICATIONS DEVICE

BOARD INCLUDING MULTIPLE CONDUCTIVE PADS CORRESPONDING TO ONE CONTA...

ARRAY SUBSTRATE AND METHOD OF MOUNTING INTEGRATED CIRCUIT USING THE...

BREAD BOARD, BREAD BOARD SYSTEM AND NON-TRANSITORY COMPUTER READABL...

METAL ELECTRODE LEADLESS FACE (MELF) DEVICE CRADLE

PRINTED CIRCUIT BOARD

SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD THEREOF

Grid Arrays With Enhanced Fatigue Life

PRINTED CIRCUIT BOARD ASSEMBLY

CHIP COMPONENT MOUNTING STRUCTURE, AND MODULE COMPONENT

WIRING BOARD AND METHOD FOR MANUFACTURING SAME

MULTILAYER CERAMIC CAPACITOR AND BOARD HAVING THE SAME MOUNTED THEREON

SUSPENSION BOARD WITH CIRCUIT AND METHOD OF MANUFACTURING THE SAME

Semiconductor Device and Method of Forming High Routing Density Int...

CERAMIC MULTILAYER WIRING SUBSTRATE AND MODULE INCLUDING THE SAME

PRINTED CIRCUIT BOARD MODULE

LIGHT-EMITTING MODULE

CONNECTOR ASSEMBLY AND FEMALE CONNECTOR USED FOR THE SAME