specially adapted for mounting on a printed-circuit support

Industry

CPC
H01G2/06

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Parent Industries

HELECTRICITY H01Electric elements H01GCAPACITORS CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES OR LIGHT-SENSITIVE DEVICES, OF THE ELECTROLYTIC TYPE H01G2/00Details of capacitors not covered by a single one of groups H01G4/00-H01G11/00

Current Industry

H01G2/06specially adapted for mounting on a printed-circuit support

Industries

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Patents Grantslast 30 patents

Information Patent Grant
Multilayer ceramic capacitor
- Patent number 12,170,173
- Issue date Dec 17, 2024
- Murata Manufacturing Co., Ltd.
- Shinichi Kokawa
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Multi-layer ceramic electronic component, multi-layer ceramic elect...
- Patent number 12,170,174
- Issue date Dec 17, 2024
- Taiyo Yuden Co., Ltd.
- Hiroaki Sato
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Mutilayer electronic component
- Patent number 12,148,571
- Issue date Nov 19, 2024
- SAMSUNG ELECTRO-MECHANICS CO., LTD.
- SoEun Choi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Multilayer capacitor and board having the same mounted thereon
- Patent number 12,148,574
- Issue date Nov 19, 2024
- SAMSUNG ELECTRO-MECHANICS CO., LTD.
- San Kyeong
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Multi-layer ceramic electronic component and circuit board
- Patent number 12,142,436
- Issue date Nov 12, 2024
- Taiyo Yuden Co., Ltd.
- Tomohiko Zaima
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electronic component and electronic component device
- Patent number 12,142,438
- Issue date Nov 12, 2024
- TDK Corporation
- Shinya Onodera
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Multi-layer ceramic electronic component, and circuit board
- Patent number 12,131,870
- Issue date Oct 29, 2024
- Taiyo Yuden Co., Ltd.
- Tomoki Sakai
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Multi-layer ceramic electronic component and circuit board
- Patent number 12,131,869
- Issue date Oct 29, 2024
- Taiyo Yuden Co., Ltd.
- Kiyoshiro Yatagawa
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Thin film capacitor and electronic circuit substrate having the same
- Patent number 12,132,078
- Issue date Oct 29, 2024
- TDK Corporation
- Yoshihiko Yano
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Multilayer electronic component
- Patent number 12,125,643
- Issue date Oct 22, 2024
- SAMSUNG ELECTRO-MECHANICS CO., LTD.
- Jeong Bong Park
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electronic component and board having the same
- Patent number 12,087,512
- Issue date Sep 10, 2024
- SAMSUNG ELECTRO-MECHANICS CO., LTD.
- Gyeong Ju Song
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electronic component including solder layer with solder unfilled re...
- Patent number 12,073,994
- Issue date Aug 27, 2024
- Murata Manufacturing Co., Ltd.
- Satoshi Yokomizo
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Packaged electrical device
- Patent number 12,074,628
- Issue date Aug 27, 2024
- Skyworks Solutions, Inc.
- Andrew Martin Kay
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Board terminal electrode component
- Patent number 12,068,114
- Issue date Aug 20, 2024
- Murata Manufacturing Co., Ltd.
- Motonori Takeda
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Multilayer capacitor and board having the same mounted thereon
- Patent number 12,062,491
- Issue date Aug 13, 2024
- SAMSUNG ELECTRO-MECHANICS CO., LTD.
- Hyung Joon Kim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Multilayer ceramic electronic component
- Patent number 12,062,498
- Issue date Aug 13, 2024
- Murata Manufacturing Co., Ltd.
- Takeshi Itamochi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electronic component
- Patent number 12,057,268
- Issue date Aug 6, 2024
- Murata Manufacturing Co., Ltd.
- Mitsuru Ikeda
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Multilayer capacitor
- Patent number 12,033,803
- Issue date Jul 9, 2024
- SAMSUNG ELECTRO-MECHANICS CO., LTD.
- Man Su Byun
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Circuit having a printed circuit board and vehicle having at least...
- Patent number 12,027,320
- Issue date Jul 2, 2024
- HANON SYSTEMS EFP DEUTSCHLAND GMBH
- Luigi Aulisio
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electronic component including interposer board with CU fired layer
- Patent number 12,020,865
- Issue date Jun 25, 2024
- Murata Manufacturing Co., Ltd.
- Satoshi Yokomizo
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Conductive paste including metal portions having different melting...
- Patent number 12,014,878
- Issue date Jun 18, 2024
- SAMSUNG ELECTRO-MECHANICS CO., LTD.
- Chung Hyeon Ryu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Multilayer ceramic capacitor
- Patent number 12,009,155
- Issue date Jun 11, 2024
- Murata Manufacturing Co., Ltd.
- Satoshi Yokomizo
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of manufacturing multilayer ceramic capacitor
- Patent number 12,009,156
- Issue date Jun 11, 2024
- Murata Manufacturing Co., Ltd.
- Satoshi Yokomizo
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Ceramic electronic component and circuit board
- Patent number 11,996,245
- Issue date May 28, 2024
- Taiyo Yuden Co., Ltd.
- Eriko Numata
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Ceramic electronic component, substrate arrangement and method of m...
- Patent number 11,996,241
- Issue date May 28, 2024
- Taiyo Yuden Co., Ltd.
- Shigeto Takei
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Ceramic electronic component and substrate arrangement
- Patent number 11,996,243
- Issue date May 28, 2024
- Taiyo Yuden Co., Ltd.
- Yasutomo Suga
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Multi-layer ceramic electronic component
- Patent number 11,996,246
- Issue date May 28, 2024
- Murata Manufacturing Co., Ltd.
- Satoshi Miyauchi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Ceramic electronic component, substrate arrangement and method of m...
- Patent number 11,990,283
- Issue date May 21, 2024
- Taiyo Yuden Co., Ltd.
- Yoshiyuki Motomiya
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Multilayer ceramic capacitor having ultra-broadband performance
- Patent number 11,984,268
- Issue date May 14, 2024
- KYOCERA AVX Components Corporation
- Marianne Berolini
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electronic device including chip component and case
- Patent number 11,984,260
- Issue date May 14, 2024
- TDK Corporation
- Akihiro Masuda
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
VERTICALLY MOUNTABLE SNAP FIT BRACKET FOR ELECTROLYTIC CAPACITORS
- Publication number 20240413573
- Publication date Dec 12, 2024
- Western Digital Technologies, Inc.
- Shiqiang Sun
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SNAP FIT BRACKET FOR ELECTROLYTIC CAPACITORS
- Publication number 20240412922
- Publication date Dec 12, 2024
- Western Digital Technologies, Inc.
- Shiqiang Sun
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
LAYERED CERAMIC ELECTRONIC COMPONENT MOUNTING STRUCTURE
- Publication number 20240407101
- Publication date Dec 5, 2024
- Murata Manufacturing Co., Ltd.
- Toshihiro HARADA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MULTILAYER CERAMIC CAPACITOR
- Publication number 20240395464
- Publication date Nov 28, 2024
- Murata Manufacturing Co., Ltd.
- Ryo NISHIMURA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELECTRONIC COMPONENT AND MOUNTING STRUCTURE FOR ELECTRONIC COMPONENT
- Publication number 20240387105
- Publication date Nov 21, 2024
- Murata Manufacturing Co., Ltd.
- Motonori TAKEDA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MULTILAYER CERAMIC CAPACITOR
- Publication number 20240355546
- Publication date Oct 24, 2024
- Murata Manufacturing Co., Ltd.
- Shinobu CHIKUMA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MULTILAYER CERAMIC CAPACITOR
- Publication number 20240355551
- Publication date Oct 24, 2024
- Murata Manufacturing Co., Ltd.
- Hikaru OKUDA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MULTILAYER CERAMIC CAPACITOR
- Publication number 20240355552
- Publication date Oct 24, 2024
- Murata Manufacturing Co., Ltd.
- Keita KITAHARA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CAPACITOR
- Publication number 20240331949
- Publication date Oct 3, 2024
- Murata Manufacturing Co., Ltd.
- Haruki Kobayashi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELECTRONIC COMPONENT
- Publication number 20240331947
- Publication date Oct 3, 2024
- Samsung Electro-Mechanics Co., Ltd.
- Beomjoon Cho
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELECTRONIC COMPONENT AND ELECTRONIC COMPONENT STRUCTURE
- Publication number 20240321518
- Publication date Sep 26, 2024
- TDK Corporation
- Tomohisa FUKUOKA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELECTRONIC COMPONENT
- Publication number 20240312719
- Publication date Sep 19, 2024
- Samsung Electro-Mechanics Co., Ltd.
- Beomjoon Cho
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MULTILAYER CERAMIC CAPACITOR
- Publication number 20240312721
- Publication date Sep 19, 2024
- Murata Manufacturing Co., Ltd.
- Satoshi YOKOMIZO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD OF MANUFACTURING MULTILAYER CERAMIC CAPACITOR
- Publication number 20240312723
- Publication date Sep 19, 2024
- Murata Manufacturing Co., Ltd.
- Satoshi YOKOMIZO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELECTRONIC COMPONENT
- Publication number 20240312706
- Publication date Sep 19, 2024
- Samsung Electro-Mechanics Co., Ltd.
- Beomjoon Cho
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MULTILAYER CERAMIC CAPACITOR
- Publication number 20240312717
- Publication date Sep 19, 2024
- Samsung Electro-Mechanics Co., Ltd.
- Youngjun Cha
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELECTRONIC COMPONENT
- Publication number 20240304382
- Publication date Sep 12, 2024
- Samsung Electro-Mechanics Co., Ltd.
- Sangyeop Kim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CERAMIC ELECTRONIC COMPONENT AND CIRCUIT BOARD
- Publication number 20240274367
- Publication date Aug 15, 2024
- Taiyo Yuden Co., Ltd.
- Eriko NUMATA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MULTILAYER CERAMIC CAPACITOR AND MOUNTING STRUCTURE FOR MULTILAYER...
- Publication number 20240266109
- Publication date Aug 8, 2024
- Murata Manufacturing Co., Ltd.
- Tomoki KITAGAWA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
COMPOSITE ELECTRONIC COMPONENT DEVICE
- Publication number 20240266116
- Publication date Aug 8, 2024
- Samsung Electro-Mechanics Co., Ltd.
- Jeong Pil Jhun
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MULTILAYER CERAMIC CAPACITOR AND BUMP-PRODUCING PASTE
- Publication number 20240258037
- Publication date Aug 1, 2024
- Murata Manufacturing Co., Ltd.
- Kota ZENZAI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MULTILAYER CERAMIC ELECTRONIC COMPONENT
- Publication number 20240249889
- Publication date Jul 25, 2024
- Murata Manufacturing Co., Ltd.
- Yasuhiro MISHIMA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELECTRIC ELEMENT ASSEMBLY
- Publication number 20240249879
- Publication date Jul 25, 2024
- JOINSET CO., LTD.
- Sun-Ki Kim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELECTRONIC COMPONENT
- Publication number 20240234029
- Publication date Jul 11, 2024
- Murata Manufacturing Co., Ltd.
- Satoshi YOKOMIZO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MULTILAYER CERAMIC ELECTRONIC COMPONENT
- Publication number 20240212943
- Publication date Jun 27, 2024
- Murata Manufacturing Co., Ltd.
- Masaki FUKUDA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELECTRONIC COMPONENT AND MOUNTING METHOD AND MOUNTING STRUCTURE THE...
- Publication number 20240212929
- Publication date Jun 27, 2024
- Murata Manufacturing Co., Ltd.
- Chiaki YAMAMOTO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELECTRONIC COMPONENT
- Publication number 20240203643
- Publication date Jun 20, 2024
- Murata Manufacturing Co., Ltd.
- Satoshi YOKOMIZO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELECTRONIC COMPONENT AND BOARD HAVING ELECTRONIC COMPONENT MOUNTED...
- Publication number 20240196523
- Publication date Jun 13, 2024
- Samsung Electro-Mechanics Co., Ltd.
- Heung Kil PARK
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CERAMIC ELECTRONIC COMPONENT, TAPED PACKAGE, CIRCUIT BOARD, AND MET...
- Publication number 20240194406
- Publication date Jun 13, 2024
- Taiyo Yuden Co., Ltd.
- Yusuke KOWASE
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELECTRONIC COMPONENT
- Publication number 20240186065
- Publication date Jun 6, 2024
- Murata Manufacturing Co., Ltd.
- Satoshi YOKOMIZO
- H01 - BASIC ELECTRIC ELEMENTS

specially adapted for mounting on a printed-circuit support

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Multilayer ceramic capacitor

Multi-layer ceramic electronic component, multi-layer ceramic elect...

Mutilayer electronic component

Multilayer capacitor and board having the same mounted thereon

Multi-layer ceramic electronic component and circuit board

Electronic component and electronic component device

Multi-layer ceramic electronic component, and circuit board

Multi-layer ceramic electronic component and circuit board

Thin film capacitor and electronic circuit substrate having the same

Multilayer electronic component

Electronic component and board having the same

Electronic component including solder layer with solder unfilled re...

Packaged electrical device

Board terminal electrode component

Multilayer capacitor and board having the same mounted thereon

Multilayer ceramic electronic component

Electronic component

Multilayer capacitor

Circuit having a printed circuit board and vehicle having at least...

Electronic component including interposer board with CU fired layer

Conductive paste including metal portions having different melting...

Multilayer ceramic capacitor

Method of manufacturing multilayer ceramic capacitor

Ceramic electronic component and circuit board

Ceramic electronic component, substrate arrangement and method of m...

Ceramic electronic component and substrate arrangement

Multi-layer ceramic electronic component

Ceramic electronic component, substrate arrangement and method of m...

Multilayer ceramic capacitor having ultra-broadband performance

Electronic device including chip component and case

Patents Applicationslast 30 patents

VERTICALLY MOUNTABLE SNAP FIT BRACKET FOR ELECTROLYTIC CAPACITORS

SNAP FIT BRACKET FOR ELECTROLYTIC CAPACITORS

LAYERED CERAMIC ELECTRONIC COMPONENT MOUNTING STRUCTURE

MULTILAYER CERAMIC CAPACITOR

ELECTRONIC COMPONENT AND MOUNTING STRUCTURE FOR ELECTRONIC COMPONENT

MULTILAYER CERAMIC CAPACITOR

MULTILAYER CERAMIC CAPACITOR

MULTILAYER CERAMIC CAPACITOR

CAPACITOR

ELECTRONIC COMPONENT

ELECTRONIC COMPONENT AND ELECTRONIC COMPONENT STRUCTURE

ELECTRONIC COMPONENT

MULTILAYER CERAMIC CAPACITOR

METHOD OF MANUFACTURING MULTILAYER CERAMIC CAPACITOR

ELECTRONIC COMPONENT

MULTILAYER CERAMIC CAPACITOR

ELECTRONIC COMPONENT

CERAMIC ELECTRONIC COMPONENT AND CIRCUIT BOARD

MULTILAYER CERAMIC CAPACITOR AND MOUNTING STRUCTURE FOR MULTILAYER...

COMPOSITE ELECTRONIC COMPONENT DEVICE

MULTILAYER CERAMIC CAPACITOR AND BUMP-PRODUCING PASTE

MULTILAYER CERAMIC ELECTRONIC COMPONENT

ELECTRIC ELEMENT ASSEMBLY

ELECTRONIC COMPONENT

MULTILAYER CERAMIC ELECTRONIC COMPONENT

ELECTRONIC COMPONENT AND MOUNTING METHOD AND MOUNTING STRUCTURE THE...

ELECTRONIC COMPONENT

ELECTRONIC COMPONENT AND BOARD HAVING ELECTRONIC COMPONENT MOUNTED...

CERAMIC ELECTRONIC COMPONENT, TAPED PACKAGE, CIRCUIT BOARD, AND MET...

ELECTRONIC COMPONENT