specially adapted for mounting on a printed-circuit support

Industry

CPC
H01G2/06

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Parent Industries

HELECTRICITY H01Electric elements H01GCAPACITORS CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES OR LIGHT-SENSITIVE DEVICES, OF THE ELECTROLYTIC TYPE H01G2/00Details of capacitors not covered by a single one of groups H01G4/00-H01G11/00

Current Industry

H01G2/06specially adapted for mounting on a printed-circuit support

Industries

Patents Grantslast 30 patents

Information Patent Grant
Electronic apparatus with a metal terminal having portions of diffe...
- Patent number 11,972,902
- Issue date Apr 30, 2024
- TDK Corporation
- Kosuke Yazawa
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Capacitor assembly
- Patent number 11,968,784
- Issue date Apr 23, 2024
- PRODRIVE TECHNOLOGIES INNOVATION SERVICES B.V.
- Michel Alexander Hagenaar
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Multi-layer ceramic electronic component and circuit board includin...
- Patent number 11,967,467
- Issue date Apr 23, 2024
- Taiyo Yuden Co., Ltd.
- Fumi Mori
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Multilayer capacitor and board having the same mounted thereon
- Patent number 11,961,682
- Issue date Apr 16, 2024
- SAMSUNG ELECTRO-MECHANICS CO., LTD.
- Sim Chung Kang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
System including a bent capacitor bus bar
- Patent number 11,961,670
- Issue date Apr 16, 2024
- DELPHI TECHNOLOGIES IP LIMITED
- Rajesh Mittu Ram Yadav
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Ceramic electronic component without external electrodes on top sur...
- Patent number 11,961,680
- Issue date Apr 16, 2024
- Taiyo Yuden Co., Ltd.
- Takashi Shimada
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Multilayer capacitor including internal electrodes having pores on...
- Patent number 11,961,681
- Issue date Apr 16, 2024
- SAMSUNG ELECTRO-MECHANICS CO., LTD.
- Yu Kwang Seo
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electronic component and board for mounting the same
- Patent number 11,955,281
- Issue date Apr 9, 2024
- SAMSUNG ELECTRO-MECHANICS CO., LTD.
- Jae Hoon Kim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electronic component
- Patent number 11,948,743
- Issue date Apr 2, 2024
- Murata Manufacturing Co., Ltd.
- Mitsuru Ikeda
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Multilayer capacitor
- Patent number 11,948,745
- Issue date Apr 2, 2024
- SAMSUNG ELECTRO-MECHANICS CO., LTD.
- Won Chul Sim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electronic component
- Patent number 11,948,750
- Issue date Apr 2, 2024
- SAMSUNG ELECTRO-MECHANICS CO., LTD.
- Beom Joon Cho
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Busbar structure for capacitor
- Patent number 11,942,275
- Issue date Mar 26, 2024
- Nichicon Corporation
- Takashi Mori
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electronic component
- Patent number 11,942,273
- Issue date Mar 26, 2024
- Murata Manufacturing Co., Ltd.
- Satoshi Yokomizo
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Temperature-dependent capacitor
- Patent number 11,929,390
- Issue date Mar 12, 2024
- International Business Machines Corporation
- Kyle Schoneck
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electronic component
- Patent number 11,923,141
- Issue date Mar 5, 2024
- Murata Manufacturing Co., Ltd.
- Satoshi Yokomizo
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Multilayer ceramic capacitor and method of manufacturing multilayer...
- Patent number 11,923,142
- Issue date Mar 5, 2024
- Murata Manufacturing Co., Ltd.
- Shinobu Chikuma
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Ceramic electronic component without external electrodes on top sur...
- Patent number 11,915,881
- Issue date Feb 27, 2024
- Taiyo Yuden Co., Ltd.
- Takashi Shimada
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Multilayer ceramic electronic component and method of manufacturing...
- Patent number 11,908,626
- Issue date Feb 20, 2024
- SAMSUNG ELECTRO-MECHANICS CO., LTD.
- Jung Eun Noh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Multilayer electronic component
- Patent number 11,908,627
- Issue date Feb 20, 2024
- SAMSUNG ELECTRO-MECHANICS CO., LTD.
- Young Ghyu Ahn
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Capacitor and method for producing same, and capacitor-mounting method
- Patent number 11,908,635
- Issue date Feb 20, 2024
- Nippon Chemi-Con Corporation
- Kentaro Kobayashi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Multilayer ceramic electronic component including metal terminals w...
- Patent number 11,887,787
- Issue date Jan 30, 2024
- Murata Manufacturing Co., Ltd.
- Satoshi Miyauchi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Multilayer electronic component
- Patent number 11,887,789
- Issue date Jan 30, 2024
- SAMSUNG ELECTRO-MECHANICS CO., LTD.
- Won Kuen Oh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Multilayer capacitor and board having the same
- Patent number 11,887,790
- Issue date Jan 30, 2024
- SAMSUNG ELECTRO-MECHANICS CO., LTD.
- Su Hyoung Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electronic component
- Patent number 11,881,353
- Issue date Jan 23, 2024
- Murata Manufacturing Co., Ltd.
- Satoshi Yokomizo
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Capacitor
- Patent number 11,875,941
- Issue date Jan 16, 2024
- TDK ELECTRONICS AG
- Fabio Augusto Bueno De Camargo Mello
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electronic component
- Patent number 11,869,716
- Issue date Jan 9, 2024
- Murata Manufacturing Co., Ltd.
- Mitsuru Ikeda
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Creating inductors, resistors, capacitors and other structures in p...
- Patent number 11,864,327
- Issue date Jan 2, 2024
- International Business Machines Corporation
- Gerald Bartley
- G03 - PHOTOGRAPHY CINEMATOGRAPHY ELECTROGRAPHY HOLOGRAPHY
Information Patent Grant
Multilayer capacitor and board having the same mounted thereon
- Patent number 11,862,401
- Issue date Jan 2, 2024
- SAMSUNG ELECTRO-MECHANICS CO., LTD.
- Tae Hoon Kim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electronic component and electronic device
- Patent number 11,862,400
- Issue date Jan 2, 2024
- Kabushiki Kaisha Toshiba
- Takahiro Shimizu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Capacitor intergated structure.capacitor unit and manufacturing pro...
- Patent number 11,854,742
- Issue date Dec 26, 2023
- Powerchip Semiconductor Manufacturing Corporation
- Wei-Yu Lin
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
ELECTRONIC COMPONENT
- Publication number 20240136122
- Publication date Apr 25, 2024
- Murata Manufacturing Co., Ltd.
- Satoshi YOKOMIZO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SURFACE-MOUNT CAPACITOR
- Publication number 20240120150
- Publication date Apr 11, 2024
- ELNA CO., LTD.
- Tadahiro NAKAMURA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SYSTEM INCLUDING A BENT CAPACITOR BUS BAR
- Publication number 20240120151
- Publication date Apr 11, 2024
- DELPHI TECHNOLOGIES IP LIMITED
- Rajesh Mittu Ram YADAV
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
HYBRID BONDED PASSIVE INTEGRATED DEVICES ON GLASS CORE
- Publication number 20240114623
- Publication date Apr 4, 2024
- Intel Corporation
- Kristof Darmawikarta
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELECTRONIC COMPONENT
- Publication number 20240105386
- Publication date Mar 28, 2024
- Murata Manufacturing Co., Ltd.
- Mitsuru IKEDA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MULTILAYER CERAMIC CAPACITOR
- Publication number 20240087808
- Publication date Mar 14, 2024
- Murata Manufacturing Co., Ltd.
- Masato KIMURA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD OF MANUFACTURING MULTILAYER ELECTRONIC COMPONENT
- Publication number 20240071689
- Publication date Feb 29, 2024
- Samsung Electro-Mechanics Co., Ltd.
- Myung Chan SON
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
STACKED CAPACITORS FOR SEMICONDUCTOR DEVICES AND ASSOCIATED SYSTEMS...
- Publication number 20240072022
- Publication date Feb 29, 2024
- Micron Technology, Inc.
- Seng Kim Ye
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CAPACITOR INTEGRATED STRUCTURE AND CAPACITOR UNIT
- Publication number 20240062957
- Publication date Feb 22, 2024
- Powerchip Semiconductor Manufacturing Corporation
- WEI-YU LIN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CAPACITOR, ELECTRIC CIRCUIT, CIRCUIT BOARD, AND APPARATUS
- Publication number 20240055184
- Publication date Feb 15, 2024
- Panasonic Intellectual Property Management Co., Ltd.
- Manabu KANOU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MULTILAYERED CAPACITOR AND METHOD FOR MANUFACTURING THE SAME
- Publication number 20240055188
- Publication date Feb 15, 2024
- Samsung Electro-Mechanics Co., Ltd.
- Kyeongjun Kim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CAPACITOR WIRE AND ELECTRONIC DEVICE INCLUDING THE SAME
- Publication number 20240006122
- Publication date Jan 4, 2024
- Samsung Electronics Co., Ltd.
- SOOJAE PARK
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MULTILAYER CAPACITOR AND BOARD HAVING THE SAME MOUNTED THEREON
- Publication number 20230411073
- Publication date Dec 21, 2023
- Samsung Electro-Mechanics Co., Ltd.
- Hyung Joon KIM
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MULTILAYER CAPACITOR AND BOARD HAVING THE SAME MOUNTED THEREON
- Publication number 20230402229
- Publication date Dec 14, 2023
- Samsung Electro-Mechanics Co., Ltd.
- San Kyeong
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MULTILAYER CERAMIC CAPACITOR AND MULTILAYER CERAMIC CAPACITOR MOUNT...
- Publication number 20230395322
- Publication date Dec 7, 2023
- Samsung Electro-Mechanics Co., Ltd.
- Soohwan Son
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PACKAGED ELECTRICAL DEVICE
- Publication number 20230387957
- Publication date Nov 30, 2023
- Skyworks Solutions, Inc.
- Andrew Martin KAY
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELECTRONIC COMPONENT AND ELECTRONIC COMPONENT DEVICE
- Publication number 20230377802
- Publication date Nov 23, 2023
- TDK Corporation
- Shinya ONODERA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Multilayer Ceramic Capacitor Having Ultra-Broadband Performance
- Publication number 20230368977
- Publication date Nov 16, 2023
- KYOCERA AVX Components Corporation
- Marianne Berolini
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MULTILAYER CERAMIC CAPACITOR
- Publication number 20230360857
- Publication date Nov 9, 2023
- Murata Manufacturing Co., Ltd.
- Satoshi YOKOMIZO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MULTILAYER CERAMIC CAPACITOR
- Publication number 20230352242
- Publication date Nov 2, 2023
- Murata Manufacturing Co., Ltd.
- Suguru NAKANO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MULTI-LAYER CERAMIC ELECTRONIC COMPONENT
- Publication number 20230352244
- Publication date Nov 2, 2023
- MURATA MANUFACTURING CO., LTD.
- Satoshi MIYAUCHI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CAPACITOR COMPONENT AND CAPACITOR-EMBEDDED SUBSTRATE
- Publication number 20230343519
- Publication date Oct 26, 2023
- Samsung Electro-Mechanics Co., Ltd.
- Sang Jong LEE
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MULTILAYER CERAMIC ELECTRONIC COMPONENT, CIRCUIT BOARD, AND METHOD...
- Publication number 20230335340
- Publication date Oct 19, 2023
- Taiyo Yuden Co., Ltd.
- Yuji TOMIZAWA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MULTILAYER CERAMIC ELECTRONIC COMPONENT AND CIRCUIT BOARD
- Publication number 20230326676
- Publication date Oct 12, 2023
- Taiyo Yuden Co., Ltd.
- Tomoki SAKAI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MULTILAYER ELECTRONIC COMPONENT
- Publication number 20230326677
- Publication date Oct 12, 2023
- Samsung Electro-Mechanics Co., Ltd.
- Young Ghyu AHN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MULTI-LAYER CERAMIC ELECTRONIC COMPONENT, AND CIRCUIT BOARD
- Publication number 20230326681
- Publication date Oct 12, 2023
- Taiyo Yuden Co., Ltd.
- Tomoki SAKAI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
THREE-TERMINAL MULTILAYER CERAMIC CAPACITOR
- Publication number 20230317375
- Publication date Oct 5, 2023
- Murata Manufacturing Co., Ltd.
- Yuichiro MORIMOTO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MULTILAYER CERAMIC CAPACITOR AND CIRCUIT BOARD
- Publication number 20230307181
- Publication date Sep 28, 2023
- Taiyo Yuden Co., Ltd.
- Mina AMANO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MULTILAYER CAPACITOR AND BOARD HAVING THE SAME MOUNTED THEREON
- Publication number 20230298824
- Publication date Sep 21, 2023
- Samsung Electro-Mechanics Co., Ltd.
- Sim Chung Kang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MOUNTING STRUCTURE AND MOUNTING METHOD OF ELECTRONIC COMPONENT
- Publication number 20230298814
- Publication date Sep 21, 2023
- Murata Manufacturing Co., Ltd.
- Daichi SATOU
- H01 - BASIC ELECTRIC ELEMENTS

specially adapted for mounting on a printed-circuit support

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Electronic apparatus with a metal terminal having portions of diffe...

Capacitor assembly

Multi-layer ceramic electronic component and circuit board includin...

Multilayer capacitor and board having the same mounted thereon

System including a bent capacitor bus bar

Ceramic electronic component without external electrodes on top sur...

Multilayer capacitor including internal electrodes having pores on...

Electronic component and board for mounting the same

Electronic component

Multilayer capacitor

Electronic component

Busbar structure for capacitor

Electronic component

Temperature-dependent capacitor

Electronic component

Multilayer ceramic capacitor and method of manufacturing multilayer...

Ceramic electronic component without external electrodes on top sur...

Multilayer ceramic electronic component and method of manufacturing...

Multilayer electronic component

Capacitor and method for producing same, and capacitor-mounting method

Multilayer ceramic electronic component including metal terminals w...

Multilayer electronic component

Multilayer capacitor and board having the same

Electronic component

Capacitor

Electronic component

Creating inductors, resistors, capacitors and other structures in p...

Multilayer capacitor and board having the same mounted thereon

Electronic component and electronic device

Capacitor intergated structure.capacitor unit and manufacturing pro...

Patents Applicationslast 30 patents

ELECTRONIC COMPONENT

SURFACE-MOUNT CAPACITOR

SYSTEM INCLUDING A BENT CAPACITOR BUS BAR

HYBRID BONDED PASSIVE INTEGRATED DEVICES ON GLASS CORE

ELECTRONIC COMPONENT

MULTILAYER CERAMIC CAPACITOR

METHOD OF MANUFACTURING MULTILAYER ELECTRONIC COMPONENT

STACKED CAPACITORS FOR SEMICONDUCTOR DEVICES AND ASSOCIATED SYSTEMS...

CAPACITOR INTEGRATED STRUCTURE AND CAPACITOR UNIT

CAPACITOR, ELECTRIC CIRCUIT, CIRCUIT BOARD, AND APPARATUS

MULTILAYERED CAPACITOR AND METHOD FOR MANUFACTURING THE SAME

CAPACITOR WIRE AND ELECTRONIC DEVICE INCLUDING THE SAME

MULTILAYER CAPACITOR AND BOARD HAVING THE SAME MOUNTED THEREON

MULTILAYER CAPACITOR AND BOARD HAVING THE SAME MOUNTED THEREON

MULTILAYER CERAMIC CAPACITOR AND MULTILAYER CERAMIC CAPACITOR MOUNT...

PACKAGED ELECTRICAL DEVICE

ELECTRONIC COMPONENT AND ELECTRONIC COMPONENT DEVICE

Multilayer Ceramic Capacitor Having Ultra-Broadband Performance

MULTILAYER CERAMIC CAPACITOR

MULTILAYER CERAMIC CAPACITOR

MULTI-LAYER CERAMIC ELECTRONIC COMPONENT

CAPACITOR COMPONENT AND CAPACITOR-EMBEDDED SUBSTRATE

MULTILAYER CERAMIC ELECTRONIC COMPONENT, CIRCUIT BOARD, AND METHOD...

MULTILAYER CERAMIC ELECTRONIC COMPONENT AND CIRCUIT BOARD

MULTILAYER ELECTRONIC COMPONENT

MULTI-LAYER CERAMIC ELECTRONIC COMPONENT, AND CIRCUIT BOARD

THREE-TERMINAL MULTILAYER CERAMIC CAPACITOR

MULTILAYER CERAMIC CAPACITOR AND CIRCUIT BOARD

MULTILAYER CAPACITOR AND BOARD HAVING THE SAME MOUNTED THEREON

MOUNTING STRUCTURE AND MOUNTING METHOD OF ELECTRONIC COMPONENT