Spraying delaminating means [e.g., atomizer, etc.

Industry

CPC
Y10T156/1933

This industry / category may be too specific. Please go to a parent level for more data

Parent Industries

YGENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS Y10USPC classification Y10TTECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION Y10T156/00Adhesive bonding and miscellaneous chemical manufacture

Current Industry

Y10T156/1933Spraying delaminating means [e.g., atomizer, etc.

Industries

Patents Grantslast 30 patents

Information Patent Grant
Carrier plate removing method
- Patent number 11,538,710
- Issue date Dec 27, 2022
- Disco Corporation
- Takatoshi Sakurai
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of removing carrier plate
- Patent number 11,222,808
- Issue date Jan 11, 2022
- Disco Corporation
- Katsuhiko Suzuki
- B32 - LAYERED PRODUCTS
Information Patent Grant
Method and apparatus for display screen shield replacement
- Patent number 11,097,439
- Issue date Aug 24, 2021
- SAXUM, LLC
- Teo Chong Teck
- B32 - LAYERED PRODUCTS
Information Patent Grant
Carrier plate removing method
- Patent number 10,933,618
- Issue date Mar 2, 2021
- Disco Corporation
- Katsuhiko Suzuki
- B32 - LAYERED PRODUCTS
Information Patent Grant
Removal method of carrier plate
- Patent number 10,926,524
- Issue date Feb 23, 2021
- Disco Corporation
- Katsuhiko Suzuki
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Peeling bar for peeling polarizing film from panel, peeling apparat...
- Patent number 10,870,267
- Issue date Dec 22, 2020
- LG Chem, Ltd.
- San Park
- B32 - LAYERED PRODUCTS
Information Patent Grant
Display laminate formed as a continuous web
- Patent number 10,661,547
- Issue date May 26, 2020
- MARIELLA LABELS OY
- Esa Hämäläinen
- Y10 - TECHNICAL SUBJECTS COVERED BY FORMER USPC
Information Patent Grant
Device and method for at least partly dissolving a connecting layer...
- Patent number 10,475,672
- Issue date Nov 12, 2019
- EV Group E. Thallner GmbH
- Andreas Fehkuhrer
- B26 - HAND CUTTING TOOLS CUTTING SEVERING
Information Patent Grant
Processing apparatus and processing method of stack
- Patent number 10,442,172
- Issue date Oct 15, 2019
- Semiconductor Energy Laboratory Co., Ltd.
- Kayo Kumakura
- G02 - OPTICS
Information Patent Grant
Temporary carrier debond initiation, and associated systems and met...
- Patent number 10,446,431
- Issue date Oct 15, 2019
- Micron Technology, Inc.
- Jonathan S. Hacker
- Y10 - TECHNICAL SUBJECTS COVERED BY FORMER USPC
Information Patent Grant
Method for forming separation starting point and separation method
- Patent number 10,259,207
- Issue date Apr 16, 2019
- Semiconductor Energy Laboratory Co., Ltd.
- Masakatsu Ohno
- B32 - LAYERED PRODUCTS
Information Patent Grant
Method and apparatus for display screen shield replacement
- Patent number 10,220,537
- Issue date Mar 5, 2019
- SAXUM, LLC
- Teo Chong Teck
- B26 - HAND CUTTING TOOLS CUTTING SEVERING
Information Patent Grant
Method for debonding temporarily adhesive-bonded carrier-workpiece...
- Patent number 10,211,077
- Issue date Feb 19, 2019
- DIDREW TECHNOLOGY (BVI) LIMITED
- Chunbin Zhang
- B32 - LAYERED PRODUCTS
Information Patent Grant
Separation method, separation apparatus, and separation system
- Patent number 9,956,755
- Issue date May 1, 2018
- Tokyo Electron Limited
- Osamu Hirakawa
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method and apparatus for processing display laminate
- Patent number 9,956,754
- Issue date May 1, 2018
- MARIELLA LABELS OY
- Esa Hämäläinen
- G02 - OPTICS
Information Patent Grant
Masking removal system and method
- Patent number 9,849,659
- Issue date Dec 26, 2017
- Cardinal IG Company
- Curtis Lee Queck
- Y10 - TECHNICAL SUBJECTS COVERED BY FORMER USPC
Information Patent Grant
Device for forming separation starting point, stack manufacturing a...
- Patent number 9,764,488
- Issue date Sep 19, 2017
- Semiconductor Energy Laboratory Co., Ltd.
- Ryu Komatsu
- B26 - HAND CUTTING TOOLS CUTTING SEVERING
Information Patent Grant
Processing apparatus and processing method of stack
- Patent number 9,682,544
- Issue date Jun 20, 2017
- Semiconductor Energy Laboratory Co., Ltd.
- Kayo Kumakura
- B26 - HAND CUTTING TOOLS CUTTING SEVERING
Information Patent Grant
Devices for methodologies related to wafer carriers
- Patent number 9,576,838
- Issue date Feb 21, 2017
- Skyworks Solutions, Inc.
- Elena Becerra Woodard
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Handling of epoxy resins
- Patent number 9,545,783
- Issue date Jan 17, 2017
- COEXPAIR
- Marc Gillard
- B29 - WORKING OF PLASTICS WORKING OF SUBSTANCES IN A PLASTIC STATE, IN GENERAL
Information Patent Grant
Debonders with a recess and a side wall opening for semiconductor f...
- Patent number 9,539,801
- Issue date Jan 10, 2017
- Skyworks Solutions, Inc.
- Steve Canale
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Debonders with a recess and a heater for semiconductor fabrication
- Patent number 9,533,484
- Issue date Jan 3, 2017
- Skyworks Solutions, Inc.
- Steve Canale
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Processing apparatus and processing method of stack
- Patent number 9,333,736
- Issue date May 10, 2016
- Semiconductor Energy Laboratory Co., Ltd.
- Kayo Kumakura
- B26 - HAND CUTTING TOOLS CUTTING SEVERING
Information Patent Grant
Debonders and related devices and methods for semiconductor fabrica...
- Patent number 9,296,194
- Issue date Mar 29, 2016
- Skyworks Solutions, Inc.
- Steve Canale
- B32 - LAYERED PRODUCTS
Information Patent Grant
Polarizing sheet removing tool and removing method
- Patent number 9,272,430
- Issue date Mar 1, 2016
- Shenzhen China Star Optoelectronics Technology Co., Ltd.
- Yizhuang Zhuang
- B26 - HAND CUTTING TOOLS CUTTING SEVERING
Information Patent Grant
Polarizing sheet removing tool and removing method
- Patent number 9,272,431
- Issue date Mar 1, 2016
- Shenzhen China Star Optoelectronics Technology Co., Ltd.
- Yizhuang Zhuang
- B26 - HAND CUTTING TOOLS CUTTING SEVERING
Information Patent Grant
Wafer separating apparatus and wafer separating method
- Patent number 9,190,301
- Issue date Nov 17, 2015
- PANASONIC INTELLECTUAL PROPERTY MANAGEMENT CO., LTD.
- Michirou Yoshino
- B32 - LAYERED PRODUCTS
Information Patent Grant
Debonders and related devices and methods for semiconductor fabrica...
- Patent number 8,758,552
- Issue date Jun 24, 2014
- Skyworks Solutions, Inc.
- Steve Canale
- B32 - LAYERED PRODUCTS
Information Patent Grant
Chip sorting apparatus
- Patent number 8,714,227
- Issue date May 6, 2014
- Epistar Corporation
- Chen-Ke Hsu
- Y10 - TECHNICAL SUBJECTS COVERED BY FORMER USPC
Information Patent Grant
Die bonder, pickup method, and pickup device
- Patent number 8,561,664
- Issue date Oct 22, 2013
- Hitachi High-Tech Instruments Co., Ltd.
- Hiroshi Maki
- Y10 - TECHNICAL SUBJECTS COVERED BY FORMER USPC

Patents Applicationslast 30 patents

Information Patent Application
Method and Apparatus for Display Screen Shield Replacement
- Publication number 20200391399
- Publication date Dec 17, 2020
- SAXUM LLC
- Teo Chong Teck
- B32 - LAYERED PRODUCTS
Information Patent Application
Method and Apparatus for Display Screen Shield Replacement
- Publication number 20190270212
- Publication date Sep 5, 2019
- SAXUM, LLC
- Teo Chong Teck
- B26 - HAND CUTTING TOOLS CUTTING SEVERING
Information Patent Application
PROCESSING APPARATUS AND PROCESSING METHOD OF STACK
- Publication number 20170334187
- Publication date Nov 23, 2017
- Semiconductor Energy Laboratory Co., Ltd.
- Kayo KUMAKURA
- B26 - HAND CUTTING TOOLS CUTTING SEVERING
Information Patent Application
DEBONDERS AND RELATED DEVICES AND METHODS FOR SEMICONDUCTOR FABRICA...
- Publication number 20140262053
- Publication date Sep 18, 2014
- SKYWORKS SOLUTIONS, INC.
- Steve Canale
- B32 - LAYERED PRODUCTS
Information Patent Application
CHIP SORTING APPARATUS
- Publication number 20140202627
- Publication date Jul 24, 2014
- EPISTAR CORPORATION
- Chen-Ke HSU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Polarizing Sheet Removing Tool and Removing Method
- Publication number 20140144302
- Publication date May 29, 2014
- Shenzhen China Star Optoelectronics Technology Co., Ltd.
- Yizhuang Zhuang
- B26 - HAND CUTTING TOOLS CUTTING SEVERING
Information Patent Application
FILM STRIPPING MECHANISM
- Publication number 20140130987
- Publication date May 15, 2014
- BOE (HEBEI) MOBILE DISPLAY TECHNOLOGY CO., LTD.
- Peng LI
- B32 - LAYERED PRODUCTS
Information Patent Application
WAFER SEPARATING APPARATUS AND WAFER SEPARATING METHOD
- Publication number 20140130986
- Publication date May 15, 2014
- PANASONIC CORPORATION
- MICHIROU YOSHINO
- B32 - LAYERED PRODUCTS
Information Patent Application
Method and Apparatus for Display Screen Shield Replacement
- Publication number 20140103022
- Publication date Apr 17, 2014
- Saxum LLC
- Teo Chong Teck
- B26 - HAND CUTTING TOOLS CUTTING SEVERING
Information Patent Application
Method and Apparatus for Display Screen Shield Replacement
- Publication number 20140102145
- Publication date Apr 17, 2014
- Saxum LLC
- Teo Chong Teck
- B26 - HAND CUTTING TOOLS CUTTING SEVERING
Information Patent Application
Method and Apparatus for Display Screen Shield Replacement
- Publication number 20140102270
- Publication date Apr 17, 2014
- Saxum LLC
- Teo Chong Teck
- B26 - HAND CUTTING TOOLS CUTTING SEVERING
Information Patent Application
SEPARATION METHOD, SEPARATION APPARATUS, AND SEPARATION SYSTEM
- Publication number 20130327484
- Publication date Dec 12, 2013
- TOKYO ELECTRON LIMITED
- Osamu Hirakawa
- B32 - LAYERED PRODUCTS
Information Patent Application
DIE BONDER, PICKUP METHOD, AND PICKUP DEVICE
- Publication number 20110308738
- Publication date Dec 22, 2011
- Hiroshi Maki
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
DEBONDERS AND RELATED DEVICES AND METHODS FOR SEMICONDUCTOR FABRICA...
- Publication number 20110297329
- Publication date Dec 8, 2011
- SKYWORKS SOLUTIONS, INC.
- Steve Canale
- B32 - LAYERED PRODUCTS
Information Patent Application
METHOD AND APPARATUS FOR PRODUCING COMBINED OPTICAL FILM, COMBINED...
- Publication number 20110132532
- Publication date Jun 9, 2011
- Nitto Denko Corporation
- Taku Yamada
- B29 - WORKING OF PLASTICS WORKING OF SUBSTANCES IN A PLASTIC STATE, IN GENERAL
Information Patent Application
CHIP SORTING APPARATUS
- Publication number 20110017407
- Publication date Jan 27, 2011
- Chen-Ke Hsu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEPARATING DEVICE AND METHOD THEREOF
- Publication number 20100084093
- Publication date Apr 8, 2010
- Yuan-Hsin LI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
RFID SYSTEMS AND GRAPHIC IMAGE FUSION
- Publication number 20080173405
- Publication date Jul 24, 2008
- Robert Frank Freund
- B29 - WORKING OF PLASTICS WORKING OF SUBSTANCES IN A PLASTIC STATE, IN GENERAL
Information Patent Application
METHOD AND APPARATUS FOR PRODUCING COMBINED OPTICAL FILM, COMBINED...
- Publication number 20080099128
- Publication date May 1, 2008
- Nitto Denko Corporation
- Taku Yamada
- B29 - WORKING OF PLASTICS WORKING OF SUBSTANCES IN A PLASTIC STATE, IN GENERAL
Information Patent Application
RFID systems and graphic image fusion
- Publication number 20060176180
- Publication date Aug 10, 2006
- Robert Frank Freund
- B29 - WORKING OF PLASTICS WORKING OF SUBSTANCES IN A PLASTIC STATE, IN GENERAL
Information Patent Application
Method and apparatus for separating composite member using fluid
- Publication number 20040171233
- Publication date Sep 2, 2004
- Canon Kabushiki Kaisha
- Kazuaki Ohmi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Sample separating apparatus and method, and substrate manufacturing...
- Publication number 20030102082
- Publication date Jun 5, 2003
- Kazutaka Yanagita
- B26 - HAND CUTTING TOOLS CUTTING SEVERING
Information Patent Application
Method and apparatus for separating composite member using fluid
- Publication number 20020179243
- Publication date Dec 5, 2002
- Canon Kabushiki Kaisha
- Kazuaki Ohmi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Sample separating apparatus and method, and substrate manufacturing...
- Publication number 20020134504
- Publication date Sep 26, 2002
- Kazutaka Yanagita
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Method and apparatus for separating composite member using fluid
- Publication number 20020088558
- Publication date Jul 11, 2002
- KAZUAKI OHMI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD AND APPARATUS FOR SEPARATING COMPOSITE MEMBER USING FLUID
- Publication number 20020029849
- Publication date Mar 14, 2002
- KAZUAKI OHMI
- H01 - BASIC ELECTRIC ELEMENTS

Spraying delaminating means [e.g., atomizer, etc.

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Carrier plate removing method

Method of removing carrier plate

Method and apparatus for display screen shield replacement

Carrier plate removing method

Removal method of carrier plate

Peeling bar for peeling polarizing film from panel, peeling apparat...

Display laminate formed as a continuous web

Device and method for at least partly dissolving a connecting layer...

Processing apparatus and processing method of stack

Temporary carrier debond initiation, and associated systems and met...

Method for forming separation starting point and separation method

Method and apparatus for display screen shield replacement

Method for debonding temporarily adhesive-bonded carrier-workpiece...

Separation method, separation apparatus, and separation system

Method and apparatus for processing display laminate

Masking removal system and method

Device for forming separation starting point, stack manufacturing a...

Processing apparatus and processing method of stack

Devices for methodologies related to wafer carriers

Handling of epoxy resins

Debonders with a recess and a side wall opening for semiconductor f...

Debonders with a recess and a heater for semiconductor fabrication

Processing apparatus and processing method of stack

Debonders and related devices and methods for semiconductor fabrica...

Polarizing sheet removing tool and removing method

Polarizing sheet removing tool and removing method

Wafer separating apparatus and wafer separating method

Debonders and related devices and methods for semiconductor fabrica...

Chip sorting apparatus

Die bonder, pickup method, and pickup device

Patents Applicationslast 30 patents

Method and Apparatus for Display Screen Shield Replacement

Method and Apparatus for Display Screen Shield Replacement

PROCESSING APPARATUS AND PROCESSING METHOD OF STACK

DEBONDERS AND RELATED DEVICES AND METHODS FOR SEMICONDUCTOR FABRICA...

CHIP SORTING APPARATUS

Polarizing Sheet Removing Tool and Removing Method

FILM STRIPPING MECHANISM

WAFER SEPARATING APPARATUS AND WAFER SEPARATING METHOD

Method and Apparatus for Display Screen Shield Replacement

Method and Apparatus for Display Screen Shield Replacement

Method and Apparatus for Display Screen Shield Replacement

SEPARATION METHOD, SEPARATION APPARATUS, AND SEPARATION SYSTEM

DIE BONDER, PICKUP METHOD, AND PICKUP DEVICE

DEBONDERS AND RELATED DEVICES AND METHODS FOR SEMICONDUCTOR FABRICA...

METHOD AND APPARATUS FOR PRODUCING COMBINED OPTICAL FILM, COMBINED...

CHIP SORTING APPARATUS

SEPARATING DEVICE AND METHOD THEREOF

RFID SYSTEMS AND GRAPHIC IMAGE FUSION

METHOD AND APPARATUS FOR PRODUCING COMBINED OPTICAL FILM, COMBINED...

RFID systems and graphic image fusion

Method and apparatus for separating composite member using fluid

Sample separating apparatus and method, and substrate manufacturing...

Method and apparatus for separating composite member using fluid

Sample separating apparatus and method, and substrate manufacturing...

Method and apparatus for separating composite member using fluid

METHOD AND APPARATUS FOR SEPARATING COMPOSITE MEMBER USING FLUID