Stacked capacitors

Industry

CPC
H01G4/30

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Parent Industries

HELECTRICITY H01Electric elements H01GCAPACITORS CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES OR LIGHT-SENSITIVE DEVICES, OF THE ELECTROLYTIC TYPE H01G4/00Fixed capacitors Processes of their manufacture

Current Industry

H01G4/30Stacked capacitors

Industries

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Patents Grantslast 30 patents

Information Patent Grant
Chip ceramic electronic component and method for manufacturing the...
- Patent number 12,243,689
- Issue date Mar 4, 2025
- Murata Manufacturing Co., Ltd.
- Kota Zenzai
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Ceramic electronic device
- Patent number 12,243,691
- Issue date Mar 4, 2025
- Taiyo Yuden Co., Ltd.
- Kotaro Mizuno
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Multilayer ceramic capacitor
- Patent number 12,243,692
- Issue date Mar 4, 2025
- Murata Manufacturing Co., Ltd.
- Hikaru Okuda
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Component array including one or more heat sink layers
- Patent number 12,243,687
- Issue date Mar 4, 2025
- KYOCERA AVX Components Corporation
- Ronald S. Demcko
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Multilayer ceramic capacitor
- Patent number 12,237,111
- Issue date Feb 25, 2025
- Murata Manufacturing Co., Ltd.
- Masato Kimura
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Ferroelectric capacitor, ferroelectric field effect transistor, and...
- Patent number 12,237,112
- Issue date Feb 25, 2025
- Micron Technology, Inc.
- Manuj Nahar
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Multilayer ceramic capacitor
- Patent number 12,237,113
- Issue date Feb 25, 2025
- Murata Manufacturing Co., Ltd.
- Satoshi Muramatsu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electronic component
- Patent number 12,237,110
- Issue date Feb 25, 2025
- Murata Manufacturing Co., Ltd.
- Mitsuru Ikeda
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Multilayer ceramic capacitor
- Patent number 12,237,114
- Issue date Feb 25, 2025
- Murata Manufacturing Co., Ltd.
- Yuta Kurosu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Dielectric material, device including the same, and method of prepa...
- Patent number 12,230,444
- Issue date Feb 18, 2025
- Samsung Electronics Co., Ltd.
- Hyeon Cheol Park
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electronic component with metal terminal, connection structure, and...
- Patent number 12,230,448
- Issue date Feb 18, 2025
- TDK Corporation
- Hisashi Kobayashi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Stacked capacitor structure and manufacturing method thereof
- Patent number 12,230,670
- Issue date Feb 18, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd
- Hsin-Yu Lai
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Dielectric material, multilayer ceramic electronic device, and manu...
- Patent number 12,230,446
- Issue date Feb 18, 2025
- Taiyo Yuden Co., Ltd.
- Kana Tamura
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Multilayer electronic component
- Patent number 12,230,449
- Issue date Feb 18, 2025
- SAMSUNG ELECTRO-MECHANICS CO., LTD.
- Sung Soo Kim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor structure
- Patent number 12,230,450
- Issue date Feb 18, 2025
- NANYA TECHNOLOGY CORPORATION
- Mao-Ying Wang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Multilayer electronic component
- Patent number 12,230,443
- Issue date Feb 18, 2025
- SAMSUNG ELECTRO-MECHANICS CO., LTD.
- Min Jung Cho
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Multilayer electronic component
- Patent number 12,230,445
- Issue date Feb 18, 2025
- SAMSUNG ELECTRO-MECHANICS CO., LTD.
- Bon Hyeong Koo
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for manufacturing a multilayer ceramic capacitor
- Patent number 12,227,672
- Issue date Feb 18, 2025
- SAMSUNG ELECTRO-MECHANICS CO., LTD.
- Tae Gyun Kwon
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Multilayer capacitor and board having the same mounted thereon
- Patent number 12,224,121
- Issue date Feb 11, 2025
- SAMSUNG ELECTRO-MECHANICS CO., LTD.
- A Ra Cho
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Multilayer electronic component
- Patent number 12,224,126
- Issue date Feb 11, 2025
- SAMSUNG ELECTRO-MECHANICS CO., LTD.
- Hyung Jong Choi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Multilayer electronic component
- Patent number 12,224,128
- Issue date Feb 11, 2025
- SAMSUNG ELECTRO-MECHANICS CO., LTD.
- Hyo Sung Choi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electronic component, circuit board, and method of mounting electro...
- Patent number 12,224,122
- Issue date Feb 11, 2025
- Murata Manufacturing Co., Ltd.
- Eiji Teraoka
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Film capacitor, connected capacitor, inverter, and electric vehicle
- Patent number 12,224,129
- Issue date Feb 11, 2025
- Kyocera Corporation
- Kazuki Imagawa
- B60 - VEHICLES IN GENERAL
Information Patent Grant
Multilayer electronic component
- Patent number 12,224,124
- Issue date Feb 11, 2025
- SAMSUNG ELECTRO-MECHANICS CO., LTD.
- Young Joon Oh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electronic component
- Patent number 12,224,119
- Issue date Feb 11, 2025
- Murata Manufacturing Co., Ltd.
- Satoshi Yokomizo
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electronic component
- Patent number 12,224,120
- Issue date Feb 11, 2025
- Murata Manufacturing Co., Ltd.
- Satoshi Yokomizo
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Multilayer electronic component
- Patent number 12,224,123
- Issue date Feb 11, 2025
- SAMSUNG ELECTRO-MECHANICS CO., LTD.
- Ho In Jun
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Multilayer electronic component
- Patent number 12,224,127
- Issue date Feb 11, 2025
- SAMSUNG ELECTRO-MECHANICS CO., LTD.
- Chung Yeol Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Chip parts
- Patent number 12,217,913
- Issue date Feb 4, 2025
- Rohm Co., Ltd.
- Keisuke Fukae
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Ceramic electronic component with openings in electrode
- Patent number 12,217,914
- Issue date Feb 4, 2025
- SAMSUNG ELECTRO-MECHANICS CO., LTD.
- Seung Hyun Park
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
MULTILAYER ELECTRONIC COMPONENT
- Publication number 20250069804
- Publication date Feb 27, 2025
- Samsung Electro-Mechanics Co., Ltd.
- Han Sol YUN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELECTRONIC COMPONENT
- Publication number 20250069812
- Publication date Feb 27, 2025
- TDK Corporation
- Shinya ONODERA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PACKAGED ELECTRICAL DEVICES AND RELATED METHODS
- Publication number 20250070814
- Publication date Feb 27, 2025
- Skyworks Solutions, Inc.
- Andrew Martin KAY
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
THIN FILM LAMINATE STRUCTURE, INTEGRATED DEVICE INCLUDING THE SAME,...
- Publication number 20250072016
- Publication date Feb 27, 2025
- Samsung Electronics Co., Ltd.
- Kiyoung LEE
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MULTILAYER CERAMIC ELECTRONIC COMPONENT
- Publication number 20250069806
- Publication date Feb 27, 2025
- Samsung Electro-Mechanics Co., Ltd.
- Sehun Park
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MULTI-LAYER CERAMIC CAPACITOR
- Publication number 20250069813
- Publication date Feb 27, 2025
- Taiyo Yuden Co., Ltd.
- Kotaro Mizuno
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
THREE-TERMINAL MULTILAYER CERAMIC CAPACITOR
- Publication number 20250069807
- Publication date Feb 27, 2025
- Murata Manufacturing Co., Ltd.
- Mitsuhiro OKUBO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MULTILAYER CERAMIC CAPACITOR
- Publication number 20250069811
- Publication date Feb 27, 2025
- Murata Manufacturing Co., Ltd.
- Kazuhisa UCHIDA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SILICON CAPACITOR WITH THIN FILM DEPOSITION ON 3D STRUCTURE AND ITS...
- Publication number 20250069815
- Publication date Feb 27, 2025
- ELSPES INC.
- Ji Hwan AN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MULTILAYERED CAPACITOR
- Publication number 20250069809
- Publication date Feb 27, 2025
- Samsung Electro-Mechanics Co., Ltd.
- Kimyoung Yun
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MULTILAYER CERAMIC CAPACITOR AND METHOD FOR MANUFACTURING MULTILAYE...
- Publication number 20250062070
- Publication date Feb 20, 2025
- Murata Manufacturing Co., Ltd.
- Kazunori USUI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CAPACITOR AND METHOD FOR MANUFACTURING THE SAME
- Publication number 20250062071
- Publication date Feb 20, 2025
- Samsung Electro-Mechanics Co., Ltd.
- Kwangmook Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CAPACITOR AND METHOD FOR MANUFACTURING THE SAME
- Publication number 20250062075
- Publication date Feb 20, 2025
- Samsung Electro-Mechanics Co., Ltd.
- Jihoon Park
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CERAMIC CAPACITOR AND METHOD FOR MANUFACTURING SAME
- Publication number 20250062072
- Publication date Feb 20, 2025
- AMOTECH CO., LTD.
- Byungguk LIM
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MULTILAYER CERAMIC CAPACITOR
- Publication number 20250062073
- Publication date Feb 20, 2025
- Murata Manufacturing Co., Ltd.
- Hiroaki SUGITA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
DIELECTRIC COMPOSITION AND ELECTRONIC COMPONENT
- Publication number 20250059095
- Publication date Feb 20, 2025
- TDK Corporation
- Toshihiro IGUCHI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MULTILAYER CERAMIC ELECTRONIC COMPONENT
- Publication number 20250054698
- Publication date Feb 13, 2025
- Murata Manufacturing Co., Ltd.
- Yasuhiro MISHIMA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MULTILAYER CERAMIC CAPACITOR
- Publication number 20250054695
- Publication date Feb 13, 2025
- Murata Manufacturing Co., Ltd.
- Takahiro KOJIMA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MULTILAYER ELECTRONIC COMPONENT
- Publication number 20250054700
- Publication date Feb 13, 2025
- Samsung Electro-Mechanics Co., Ltd.
- Hwi Dae KIM
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MULTILAYER CERAMIC ELECTRONIC COMPONENT AND METHOD FOR MANUFACTURIN...
- Publication number 20250054701
- Publication date Feb 13, 2025
- KYOCERA CORPORATION
- Hisashi SATO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MULTILAYER CERAMIC ELECTRONIC COMPONENT AND MOUNTING STRUCTURE OF M...
- Publication number 20250054704
- Publication date Feb 13, 2025
- Murata Manufacturing Co., Ltd.
- Kazunori USUI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MULTILAYER CERAMIC ELECTRONIC COMPONENT
- Publication number 20250054694
- Publication date Feb 13, 2025
- Murata Manufacturing Co., Ltd.
- Kazunori USUI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MULTILAYER ELECTRONIC COMPONENT
- Publication number 20250054697
- Publication date Feb 13, 2025
- Samsung Electro-Mechanics Co., Ltd.
- Hong Gi Kim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MULTILAYERED ELECTRONIC COMPONENT
- Publication number 20250054702
- Publication date Feb 13, 2025
- Samsung Electro-Mechanics Co., Ltd.
- Byung Hun Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MULTILAYER ELECTRONIC COMPONENT
- Publication number 20250054692
- Publication date Feb 13, 2025
- Samsung Electro-Mechanics Co., Ltd.
- Dongseuk KIM
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MULTILAYER ELECTRONIC COMPONENT
- Publication number 20250054693
- Publication date Feb 13, 2025
- Samsung Electro-Mechanics Co., Ltd.
- Dongseuk KIM
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
THROUGH-TYPE MULTILAYER CERAMIC CAPACITOR
- Publication number 20250054703
- Publication date Feb 13, 2025
- Murata Manufacturing Co., Ltd.
- Takashi SAWADA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CERAMIC CAPACITOR
- Publication number 20250046519
- Publication date Feb 6, 2025
- AMOTECH CO., LTD.
- Byungguk LIM
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD FOR MEASURING DC BIAS AGING CHARACTERISTICS OF MULTILAYER CA...
- Publication number 20250044375
- Publication date Feb 6, 2025
- Samsung Electro-Mechanics Co., Ltd.
- Dong Seuk Kim
- G01 - MEASURING TESTING
Information Patent Application
CERAMIC STRUCTURE
- Publication number 20250046517
- Publication date Feb 6, 2025
- MURATA MANUFACTURING CO., LTD.
- Takehito TAGUCHI
- H01 - BASIC ELECTRIC ELEMENTS

Stacked capacitors

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Chip ceramic electronic component and method for manufacturing the...

Ceramic electronic device

Multilayer ceramic capacitor

Component array including one or more heat sink layers

Multilayer ceramic capacitor

Ferroelectric capacitor, ferroelectric field effect transistor, and...

Multilayer ceramic capacitor

Electronic component

Multilayer ceramic capacitor

Dielectric material, device including the same, and method of prepa...

Electronic component with metal terminal, connection structure, and...

Stacked capacitor structure and manufacturing method thereof

Dielectric material, multilayer ceramic electronic device, and manu...

Multilayer electronic component

Semiconductor structure

Multilayer electronic component

Multilayer electronic component

Method for manufacturing a multilayer ceramic capacitor

Multilayer capacitor and board having the same mounted thereon

Multilayer electronic component

Multilayer electronic component

Electronic component, circuit board, and method of mounting electro...

Film capacitor, connected capacitor, inverter, and electric vehicle

Multilayer electronic component

Electronic component

Electronic component

Multilayer electronic component

Multilayer electronic component

Chip parts

Ceramic electronic component with openings in electrode

Patents Applicationslast 30 patents

MULTILAYER ELECTRONIC COMPONENT

ELECTRONIC COMPONENT

PACKAGED ELECTRICAL DEVICES AND RELATED METHODS

THIN FILM LAMINATE STRUCTURE, INTEGRATED DEVICE INCLUDING THE SAME,...

MULTILAYER CERAMIC ELECTRONIC COMPONENT

MULTI-LAYER CERAMIC CAPACITOR

THREE-TERMINAL MULTILAYER CERAMIC CAPACITOR

MULTILAYER CERAMIC CAPACITOR

SILICON CAPACITOR WITH THIN FILM DEPOSITION ON 3D STRUCTURE AND ITS...

MULTILAYERED CAPACITOR

MULTILAYER CERAMIC CAPACITOR AND METHOD FOR MANUFACTURING MULTILAYE...

CAPACITOR AND METHOD FOR MANUFACTURING THE SAME

CAPACITOR AND METHOD FOR MANUFACTURING THE SAME

CERAMIC CAPACITOR AND METHOD FOR MANUFACTURING SAME

MULTILAYER CERAMIC CAPACITOR

DIELECTRIC COMPOSITION AND ELECTRONIC COMPONENT

MULTILAYER CERAMIC ELECTRONIC COMPONENT

MULTILAYER CERAMIC CAPACITOR

MULTILAYER ELECTRONIC COMPONENT

MULTILAYER CERAMIC ELECTRONIC COMPONENT AND METHOD FOR MANUFACTURIN...

MULTILAYER CERAMIC ELECTRONIC COMPONENT AND MOUNTING STRUCTURE OF M...

MULTILAYER CERAMIC ELECTRONIC COMPONENT

MULTILAYER ELECTRONIC COMPONENT

MULTILAYERED ELECTRONIC COMPONENT

MULTILAYER ELECTRONIC COMPONENT

MULTILAYER ELECTRONIC COMPONENT

THROUGH-TYPE MULTILAYER CERAMIC CAPACITOR

CERAMIC CAPACITOR

METHOD FOR MEASURING DC BIAS AGING CHARACTERISTICS OF MULTILAYER CA...

CERAMIC STRUCTURE