Stacked PCBs with their backs attached to each other without electrical connection

Industry

CPC
H05K2201/043

This industry / category may be too specific. Please go to a parent level for more data

Parent Industries

HELECTRICITY H05Electric techniques H05KPRINTED CIRCUITS CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS H05K2201/00Indexing scheme relating to printed circuits covered by H05K1/00

Current Industry

H05K2201/043Stacked PCBs with their backs attached to each other without electrical connection

Industries

Patents Grantslast 30 patents

Information Patent Grant
Circuit board and electronic device
- Patent number 12,058,807
- Issue date Aug 6, 2024
- Chengdu BOE Optoelectronics Technology Co., Ltd.
- Qianlin Pu
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Circuit board
- Patent number 11,291,123
- Issue date Mar 29, 2022
- SAMWON ACT CO., LTD.
- Kyung Yul Lee
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Cooling module and circuit board
- Patent number 11,284,533
- Issue date Mar 22, 2022
- Murata Manufacturing Co., Ltd.
- Shuichi Kawata
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Microwave wireless charger with focusing of microwave field
- Patent number 11,025,096
- Issue date Jun 1, 2021
- Samsung Electronics Co., Ltd.
- Artem Rudolfovitch Vilenskiy
- H02 - GENERATION CONVERSION OR DISTRIBUTION OF ELECTRIC POWER
Information Patent Grant
Microwave wireless charger with focusing of microwave field
- Patent number 10,763,704
- Issue date Sep 1, 2020
- Samsung Electronics Co., Ltd.
- Artem Rudolfovitch Vilenskiy
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Systems with electrical isolation between signal and power domains
- Patent number 10,707,600
- Issue date Jul 7, 2020
- Arista Networks, Inc.
- Robert Wilcox
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Flexible display device with reduced bend stress wires and manufact...
- Patent number 10,582,612
- Issue date Mar 3, 2020
- LG Display Co., Ltd.
- SeYeoul Kwon
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Dual printed circuit board
- Patent number 10,436,403
- Issue date Oct 8, 2019
- Valeo North America, Inc.
- Gavin Warner
- B60 - VEHICLES IN GENERAL
Information Patent Grant
Modularly expandable enclosure
- Patent number 10,320,112
- Issue date Jun 11, 2019
- Multilink Inc.
- Steve E. Kaplan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Fluid control apparatus
- Patent number 10,165,684
- Issue date Dec 25, 2018
- HORIBA STEC, Co., Ltd.
- Katsuya Ohtani
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Modules and connections for modules to couple to a computing device
- Patent number 10,162,388
- Issue date Dec 25, 2018
- Google LLC
- Paul Eremenko
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Electronic device module and method of manufacturing the same
- Patent number 9,997,504
- Issue date Jun 12, 2018
- SAMSUNG ELECTRO-MECHANICS CO., LTD.
- Jae Hyun Lim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method and apparatus for intrinsically safe circuit board arrangeme...
- Patent number 9,980,381
- Issue date May 22, 2018
- MOTOROLA SOLUTIONS, INC.
- Seng Huan Chuah
- H04 - ELECTRIC COMMUNICATION TECHNIQUE
Information Patent Grant
Modules and connections for modules to couple to a computing device
- Patent number 9,823,703
- Issue date Nov 21, 2017
- Google Inc.
- Paul Eremenko
- H04 - ELECTRIC COMMUNICATION TECHNIQUE
Information Patent Grant
Printed circuit board comprising an electronic component integrated...
- Patent number 9,674,960
- Issue date Jun 6, 2017
- AT & S AUSTRIA TECHNOLOGIE & SYSTEMTECHNIK AKTIENGESELLSCHAFT
- Johannes Stahr
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Thin multi-chip flex module
- Patent number 8,559,181
- Issue date Oct 15, 2013
- Microelectronics Assembly Technologies, Inc.
- James E. Clayton
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Thin multi-chip flex module
- Patent number 8,345,431
- Issue date Jan 1, 2013
- Microelectronics Assembly Technologies, Inc.
- James E. Clayton
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Electronic apparatus
- Patent number 8,289,720
- Issue date Oct 16, 2012
- Canon Kabushiki Kaisha
- Koji Ishikawa
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Flexible flat circuit cable with gapped section
- Patent number 8,273,990
- Issue date Sep 25, 2012
- Advanced Flexible Circuits Co., Ltd.
- Gwun-Jin Lin
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Mold compounds in improved embedded-die coreless substrates, and pr...
- Patent number 8,264,849
- Issue date Sep 11, 2012
- Intel Corporation
- John S. Guzek
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Fabricating method of circuit board
- Patent number 8,191,244
- Issue date Jun 5, 2012
- Unimicron Technology Corp.
- Shang-Lin Sung
- B32 - LAYERED PRODUCTS
Information Patent Grant
Electronic elements carrier
- Patent number 8,085,547
- Issue date Dec 27, 2011
- Hon Hai Precision Industry Co., Ltd.
- Ying-Cheng Wu
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Printed circuit board provided with heat circulating medium and met...
- Patent number 8,044,301
- Issue date Oct 25, 2011
- Hynix Semiconductor Inc.
- Jae Hyun Son
- B32 - LAYERED PRODUCTS
Information Patent Grant
Semiconductor chip module with stacked flip-chip unit
- Patent number 8,026,598
- Issue date Sep 27, 2011
- Gigno Technology Co., Ltd.
- Wen-Jyh Sah
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Method of making a flexible printed circuit board
- Patent number 7,992,290
- Issue date Aug 9, 2011
- Hon Hai Precision Industry Co., Ltd.
- Ying-Lin Chen
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Multi-layer flexible printed circuit board and method for manufactu...
- Patent number 7,977,577
- Issue date Jul 12, 2011
- LG Innotek Co., Ltd
- Hyung Wook Lee
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Circuit board unit and method for production thereof
- Patent number 7,948,758
- Issue date May 24, 2011
- Agie Charmilles SA
- Ernst Bühler
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Semiconductor device and method of manufacturing the same
- Patent number 7,850,087
- Issue date Dec 14, 2010
- Samsung Electronics Co. Ltd.
- Yi-sung Hwang
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Thin multi-chip flex module
- Patent number 7,796,399
- Issue date Sep 14, 2010
- Microelectronics Assembly Technologies, Inc.
- James E. Clayton
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Card type information device and method for manufacturing same
- Patent number 7,775,446
- Issue date Aug 17, 2010
- Panasonic Corporation
- Shozo Ochi
- G06 - COMPUTING CALCULATING COUNTING

Patents Applicationslast 30 patents

Information Patent Application
Circuit Board and Electronic Device
- Publication number 20230345619
- Publication date Oct 26, 2023
- CHENGDU BOE OPTOELECTRONICS TECHNOLOGY CO., LTD.
- Qianlin PU
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
MICROWAVE WIRELESS CHARGER WITH FOCUSING OF MICROWAVE FIELD
- Publication number 20200395790
- Publication date Dec 17, 2020
- Samsung Electronics Co., Ltd.
- Artem Rudolfovitch Vilenskiy
- H02 - GENERATION CONVERSION OR DISTRIBUTION OF ELECTRIC POWER
Information Patent Application
COOLING MODULE AND CIRCUIT BOARD
- Publication number 20200359526
- Publication date Nov 12, 2020
- Murata Manufacturing Co., Ltd.
- Shuichi KAWATA
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
MICROWAVE WIRELESS CHARGER WITH FOCUSING OF MICROWAVE FIELD
- Publication number 20180166926
- Publication date Jun 14, 2018
- Samsung Electronics Co., Ltd.
- Artem Rudolfovitch Vilenskiy
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Modules and Connections for Modules to Couple to a Computing Device
- Publication number 20180107251
- Publication date Apr 19, 2018
- Google LLC
- Paul Eremenko
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
TWO-SIDED LASER PATTERNING ON THIN FILM SUBSTRATES
- Publication number 20140202742
- Publication date Jul 24, 2014
- CAMBRIOS TECHNOLOGIES CORPORATION
- David Jones
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
FABRICATING METHOD OF CIRCUIT BOARD
- Publication number 20120006478
- Publication date Jan 12, 2012
- Unimicron Technology Corp.
- SHANG-LIN SUNG
- B32 - LAYERED PRODUCTS
Information Patent Application
MOLD COMPOUNDS IN IMPROVED EMBEDDED-DIE CORELESS SUBSTRATES, AND PR...
- Publication number 20110317383
- Publication date Dec 29, 2011
- John S. Guzek
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Thin multi-chip flex module
- Publication number 20110139329
- Publication date Jun 16, 2011
- James E. Clayton
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Thin multi-chip flex module
- Publication number 20110138617
- Publication date Jun 16, 2011
- James E. Clayton
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Electronic Assemblies without Solder and Methods for their Manufacture
- Publication number 20110127080
- Publication date Jun 2, 2011
- OCCAM PORTFOLIO LLC
- Joseph C. Fjelstad
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Thin multi-chip flex module
- Publication number 20110116244
- Publication date May 19, 2011
- James E. Clayton
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
FLEXIBLE FLAT CIRCUIT CABLE WITH GAPPED SECTION
- Publication number 20110094790
- Publication date Apr 28, 2011
- ADVANCED FLEXIBLE CIRCUITS CO., LTD.
- GWUN-JIN LIN
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
SEMICONDUCTOR DEVICE MODULE AND METHOD OF MANUFACTURING SEMICONDUCT...
- Publication number 20110031628
- Publication date Feb 10, 2011
- Fujitsu Limited
- Rie TAKADA
- G11 - INFORMATION STORAGE
Information Patent Application
ELECTRONIC APPARATUS
- Publication number 20100195303
- Publication date Aug 5, 2010
- Canon Kabushiki Kaisha
- Koji Ishikawa
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
SEMICONDUCTOR CHIP MODULE AND MANUFACTURING METHOD THEREOF
- Publication number 20100001398
- Publication date Jan 7, 2010
- Wen-Jyh SAH
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
CARD TYPE INFORMATION DEVICE AND METHOD FOR MANUFACTURING SAME
- Publication number 20090173795
- Publication date Jul 9, 2009
- Shozo Ochi
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
Thin multi-chip flex module
- Publication number 20090168362
- Publication date Jul 2, 2009
- James E. Clayton
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Thin multi-chip flex module
- Publication number 20090168374
- Publication date Jul 2, 2009
- James E. Clayton
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Thin multi-chip flex module
- Publication number 20090166065
- Publication date Jul 2, 2009
- James E. Clayton
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Thin multi-chip flex module
- Publication number 20090168363
- Publication date Jul 2, 2009
- James E. Clayton
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Thin multi-chip flex module
- Publication number 20090168366
- Publication date Jul 2, 2009
- James E. Clayton
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Stripline Arrangement and a Method for Production Thereof
- Publication number 20090009270
- Publication date Jan 8, 2009
- Telefonaktiebolaget LM Ericsson (publ)
- Patrik Rivas
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
METHOD OF MAKING A FLEXIBLE PRINTED CIRCUIT BOARD
- Publication number 20090011184
- Publication date Jan 8, 2009
- HON HAI Precision Industry CO., LTD.
- YING-LIN CHEN
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Multi-Layer Flexible Printed Circuit Board and Method For Manufactu...
- Publication number 20080289861
- Publication date Nov 27, 2008
- Hyung Wook Lee
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
PRINTED CIRCUIT BOARD PROVIDED WITH HEAT CIRCULATING MEDIUM AND MET...
- Publication number 20080286531
- Publication date Nov 20, 2008
- Jae Hyun SON
- B32 - LAYERED PRODUCTS
Information Patent Application
ELECTRONIC ELEMENTS CARRIER AND MANUFACTURING METHOD THEREOF
- Publication number 20080266822
- Publication date Oct 30, 2008
- HON HAI Precision Industry CO., LTD.
- YING-CHENG WU
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Circuit Card Assembly Including Individually Testable Layers
- Publication number 20080232074
- Publication date Sep 25, 2008
- ViaSat, Inc.
- Robert Lee Schutz
- Y02 - TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMA...
Information Patent Application
Circuit board unit and method for production thereof
- Publication number 20080160246
- Publication date Jul 3, 2008
- Ernst Buhler
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
MODULE
- Publication number 20080158834
- Publication date Jul 3, 2008
- Tomohide Ogura
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR

Stacked PCBs with their backs attached to each other without electrical connection

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Circuit board and electronic device

Circuit board

Cooling module and circuit board

Microwave wireless charger with focusing of microwave field

Microwave wireless charger with focusing of microwave field

Systems with electrical isolation between signal and power domains

Flexible display device with reduced bend stress wires and manufact...

Dual printed circuit board

Modularly expandable enclosure

Fluid control apparatus

Modules and connections for modules to couple to a computing device

Electronic device module and method of manufacturing the same

Method and apparatus for intrinsically safe circuit board arrangeme...

Modules and connections for modules to couple to a computing device

Printed circuit board comprising an electronic component integrated...

Thin multi-chip flex module

Thin multi-chip flex module

Electronic apparatus

Flexible flat circuit cable with gapped section

Mold compounds in improved embedded-die coreless substrates, and pr...

Fabricating method of circuit board

Electronic elements carrier

Printed circuit board provided with heat circulating medium and met...

Semiconductor chip module with stacked flip-chip unit

Method of making a flexible printed circuit board

Multi-layer flexible printed circuit board and method for manufactu...

Circuit board unit and method for production thereof

Semiconductor device and method of manufacturing the same

Thin multi-chip flex module

Card type information device and method for manufacturing same

Patents Applicationslast 30 patents

Circuit Board and Electronic Device

MICROWAVE WIRELESS CHARGER WITH FOCUSING OF MICROWAVE FIELD

COOLING MODULE AND CIRCUIT BOARD

MICROWAVE WIRELESS CHARGER WITH FOCUSING OF MICROWAVE FIELD

Modules and Connections for Modules to Couple to a Computing Device

TWO-SIDED LASER PATTERNING ON THIN FILM SUBSTRATES

FABRICATING METHOD OF CIRCUIT BOARD

MOLD COMPOUNDS IN IMPROVED EMBEDDED-DIE CORELESS SUBSTRATES, AND PR...

Thin multi-chip flex module

Thin multi-chip flex module

Electronic Assemblies without Solder and Methods for their Manufacture

Thin multi-chip flex module

FLEXIBLE FLAT CIRCUIT CABLE WITH GAPPED SECTION

SEMICONDUCTOR DEVICE MODULE AND METHOD OF MANUFACTURING SEMICONDUCT...

ELECTRONIC APPARATUS

SEMICONDUCTOR CHIP MODULE AND MANUFACTURING METHOD THEREOF

CARD TYPE INFORMATION DEVICE AND METHOD FOR MANUFACTURING SAME

Thin multi-chip flex module

Thin multi-chip flex module

Thin multi-chip flex module

Thin multi-chip flex module

Thin multi-chip flex module

Stripline Arrangement and a Method for Production Thereof

METHOD OF MAKING A FLEXIBLE PRINTED CIRCUIT BOARD

Multi-Layer Flexible Printed Circuit Board and Method For Manufactu...

PRINTED CIRCUIT BOARD PROVIDED WITH HEAT CIRCULATING MEDIUM AND MET...

ELECTRONIC ELEMENTS CARRIER AND MANUFACTURING METHOD THEREOF

Circuit Card Assembly Including Individually Testable Layers

Circuit board unit and method for production thereof

MODULE