Stepped hole, via, edge, bump or conductor

Industry

CPC
H05K2201/09845

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Parent Industries

HELECTRICITY H05Electric techniques H05KPRINTED CIRCUITS CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS H05K2201/00Indexing scheme relating to printed circuits covered by H05K1/00

Current Industry

H05K2201/09845Stepped hole, via, edge, bump or conductor

Industries

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Patents Grantslast 30 patents

Information Patent Grant
Printed circuit board and method for manufacturing the same
- Patent number 12,022,621
- Issue date Jun 25, 2024
- SAMSUNG ELECTRO-MECHANICS CO., LTD.
- Mi Jeong Jeon
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Display apparatus having grooved terminals
- Patent number 11,997,901
- Issue date May 28, 2024
- Samsung Display Co., Ltd.
- Byoungyong Kim
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Laminated circuit board
- Patent number 11,985,768
- Issue date May 14, 2024
- Pi-Crystal Incorporation
- Junichi Takeya
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Mating backplane for high speed, high density electrical connector
- Patent number 11,950,356
- Issue date Apr 2, 2024
- Amphenol Corporation
- Mark W. Gailus
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Multilayer wiring board and method of producing the same
- Patent number 11,917,751
- Issue date Feb 27, 2024
- TOPPAN INC.
- Masao Aratani
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Plated metallization structures
- Patent number 11,862,518
- Issue date Jan 2, 2024
- Analog Devices International Unlimited Company
- Jan Kubik
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Backplane footprint for high speed, high density electrical connectors
- Patent number 11,805,595
- Issue date Oct 31, 2023
- Amphenol Corporation
- Marc Robert Charbonneau
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Backplane footprint for high speed, high density electrical connectors
- Patent number 11,765,813
- Issue date Sep 19, 2023
- Amphenol Corporation
- Marc Robert Charbonneau
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Flexible display device
- Patent number 11,740,661
- Issue date Aug 29, 2023
- Samsung Display Co., Ltd.
- Jun Namkung
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Display apparatus having grooved terminals
- Patent number 11,605,697
- Issue date Mar 14, 2023
- Samsung Display Co., Ltd.
- Byoungyong Kim
- G02 - OPTICS
Information Patent Grant
Ultra-thin embedded semiconductor device package and method of manu...
- Patent number 11,605,609
- Issue date Mar 14, 2023
- General Electric Company
- Arun Virupaksha Gowda
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semi-flexible component carrier with stepped layer structure
- Patent number 11,589,462
- Issue date Feb 21, 2023
- AT&S(China) Co. Ltd.
- Nick Xin
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Backplane footprint for high speed, high density electrical connectors
- Patent number 11,553,589
- Issue date Jan 10, 2023
- Amphenol Corporation
- Marc Robert Charbonneau
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Mating backplane for high speed, high density electrical connector
- Patent number 11,546,983
- Issue date Jan 3, 2023
- Amphenol Corporation
- Mark W. Gailus
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Display device and method of manufacturing the same
- Patent number 11,528,805
- Issue date Dec 13, 2022
- Samsung Display Co., Ltd.
- Chang Woo Byun
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Camera module and molded circuit board assembly and manufacturing m...
- Patent number 11,477,354
- Issue date Oct 18, 2022
- NINGBO SUNNY OPOTECH CO., LTD.
- Mingzhu Wang
- H04 - ELECTRIC COMMUNICATION TECHNIQUE
Information Patent Grant
PCB structure for embedding electronic components
- Patent number 11,477,892
- Issue date Oct 18, 2022
- University Of Limerick
- John Harris
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Electric module with a planar transformer
- Patent number 11,476,030
- Issue date Oct 18, 2022
- Phoenix Contact GmbH & Co. KG
- Peter Scholz
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of forming an electronic device
- Patent number 11,432,448
- Issue date Aug 30, 2022
- KEMET Electronics Corporation
- John E. McConnell
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Packaging photon building blocks with top side connections and inte...
- Patent number 11,411,152
- Issue date Aug 9, 2022
- Bridgelux, Inc.
- R. Scott West
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Methods of forming high aspect ratio plated through holes and high...
- Patent number 11,399,439
- Issue date Jul 26, 2022
- Sanmina Corporation
- Douglas Ward Thomas
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Board to board interconnect
- Patent number 11,304,299
- Issue date Apr 12, 2022
- Intel Corporation
- Chee Ling Wong
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Method for forming laminated circuit board
- Patent number 11,122,693
- Issue date Sep 14, 2021
- Pi-Crystal Incorporation
- Junichi Takeya
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Backplane footprint for high speed, high density electrical connectors
- Patent number 11,096,270
- Issue date Aug 17, 2021
- Amphenol Corporation
- Marc Robert Charbonneau
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
High-speed hybrid circuit
- Patent number 11,057,984
- Issue date Jul 6, 2021
- II-VI DELAWARE, INC.
- Steven C. Bird
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Display device
- Patent number 11,038,294
- Issue date Jun 15, 2021
- LG Electronics Inc.
- Seunghak Ryu
- H02 - GENERATION CONVERSION OR DISTRIBUTION OF ELECTRIC POWER
Information Patent Grant
Display device
- Patent number 11,038,295
- Issue date Jun 15, 2021
- LG Electronics Inc.
- Seunghak Ryu
- H02 - GENERATION CONVERSION OR DISTRIBUTION OF ELECTRIC POWER
Information Patent Grant
Package substrate having copper alloy sputter seed layer and high d...
- Patent number 11,037,802
- Issue date Jun 15, 2021
- Intel Corporation
- Robert Alan May
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Method of wire bonding a first and second circuit card
- Patent number 10,999,938
- Issue date May 4, 2021
- Raytheon Company
- Mikhail Pevzner
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Backplane footprint for high speed, high density electrical connectors
- Patent number 10,993,314
- Issue date Apr 27, 2021
- Amphenol Corporation
- Marc Robert Charbonneau
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
PRINTED WIRING BOARD
- Publication number 20240407094
- Publication date Dec 5, 2024
- IBIDEN CO., LTD.
- Masashi KUWABARA
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
WIRING SUBSTRATE
- Publication number 20240341033
- Publication date Oct 10, 2024
- IBIDEN CO., LTD.
- Masashi KUWABARA
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
MATING BACKPLANE FOR HIGH SPEED, HIGH DENSITY ELECTRICAL CONNECTOR
- Publication number 20240196518
- Publication date Jun 13, 2024
- Amphenol Corporation
- Mark W. Gailus
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SYSTEMS AND METHODS FOR FORMING STUBLESS PLATED THROUGH HOLES HAVIN...
- Publication number 20240188217
- Publication date Jun 6, 2024
- TTM TECHNOLOGIES INC.
- Matthew Douglas Neely
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
CIRCUIT BOARD ASSEMBLY, MANUFACTURING METHOD, AND ELECTRONIC DEVICE
- Publication number 20240179845
- Publication date May 30, 2024
- Honor Device Co., Ltd.
- Fan YANG
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
BACKPLANE FOOTPRINT FOR HIGH SPEED, HIGH DENSITY ELECTRICAL CONNECTORS
- Publication number 20240023232
- Publication date Jan 18, 2024
- Amphenol Corporation
- Marc Robert Charbonneau
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
FLEXIBLE DISPLAY DEVICE
- Publication number 20240004431
- Publication date Jan 4, 2024
- SAMSUNG DISPLAY CO., LTD.
- Jun Namkung
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
BEVELED OVERBURDEN FOR VIAS AND METHOD OF MAKING THE SAME
- Publication number 20230380062
- Publication date Nov 23, 2023
- Corning Incorporated
- DHANANJAY JOSHI
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
PRINTED CIRCUIT BOARD AND METHOD FOR MANUFACTURING THE SAME
- Publication number 20230337367
- Publication date Oct 19, 2023
- Samsung Electro-Mechanics Co., Ltd.
- Mi Jeong JEON
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
PRINTED WIRING BOARD
- Publication number 20230328882
- Publication date Oct 12, 2023
- IBIDEN CO., LTD.
- Susumu KAGOHASHI
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Component Carrier
- Publication number 20230180383
- Publication date Jun 8, 2023
- AT&S (China) Co. Ltd.
- Nick Xin
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
DISPLAY APPARATUS HAVING GROOVED TERMINALS AND METHOD OF MANUFACTUR...
- Publication number 20230172021
- Publication date Jun 1, 2023
- SAMSUNG DISPLAY CO., LTD.
- Byoungyong Kim
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
MATING BACKPLANE FOR HIGH SPEED, HIGH DENSITY ELECTRICAL CONNECTOR
- Publication number 20230113153
- Publication date Apr 13, 2023
- Amphenol Corporation
- Mark W. Gailus
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
BACKPLANE FOOTPRINT FOR HIGH SPEED, HIGH DENSITY ELECTRICAL CONNECTORS
- Publication number 20220361320
- Publication date Nov 10, 2022
- Amphenol Corporation
- Marc Robert Charbonneau
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semi-Flexible Component Carrier With Stepped Layer Structure
- Publication number 20220039259
- Publication date Feb 3, 2022
- AT&S (China) Co. Ltd.
- Nick Xin
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
BACKPLANE FOOTPRINT FOR HIGH SPEED, HIGH DENSITY ELECTRICAL CONNECTORS
- Publication number 20210329775
- Publication date Oct 21, 2021
- Amphenol Corporation
- Marc Robert Charbonneau
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
A PCB STRUCTURE FOR EMBEDDING ELECTRONIC COMPONENTS
- Publication number 20210243899
- Publication date Aug 5, 2021
- University of Limerick
- John Harris
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
BACKPLANE FOOTPRINT FOR HIGH SPEED, HIGH DENSITY ELECTRICAL CONNECTORS
- Publication number 20210219420
- Publication date Jul 15, 2021
- Amphenol Corporation
- Marc Robert Charbonneau
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
FLEXIBLE DISPLAY DEVICE
- Publication number 20210165459
- Publication date Jun 3, 2021
- SAMSUNG DISPLAY CO., LTD.
- Jun Namkung
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
DISPLAY APPARATUS HAVING GROOVED TERMINALS AND METHOD OF MANUFACTUR...
- Publication number 20210118973
- Publication date Apr 22, 2021
- SAMSUNG DISPLAY CO., LTD.
- Byoungyong Kim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MATING BACKPLANE FOR HIGH SPEED, HIGH DENSITY ELECTRICAL CONNECTOR
- Publication number 20210076486
- Publication date Mar 11, 2021
- Amphenol Corporation
- Mark W. Gailus
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Camera Module and Molded Circuit Board Assembly and Manufacturing M...
- Publication number 20200336627
- Publication date Oct 22, 2020
- NINGBO SUNNY OPOTECH CO., LTD.
- Mingzhu WANG
- H04 - ELECTRIC COMMUNICATION TECHNIQUE
Information Patent Application
BACKPLANE FOOTPRINT FOR HIGH SPEED, HIGH DENSITY ELECTRICAL CONNECTORS
- Publication number 20200229299
- Publication date Jul 16, 2020
- Amphenol Corporation
- Marc Robert Charbonneau
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
ELECTRIC MODULE WITH A PLANAR TRANSFORMER
- Publication number 20200203053
- Publication date Jun 25, 2020
- Phoenix Contact GmbH & Co. KG
- Peter Scholz
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
ULTRA-THIN EMBEDDED SEMICONDUCTOR DEVICE PACKAGE AND METHOD OF MANU...
- Publication number 20200185349
- Publication date Jun 11, 2020
- GENERAL ELECTRIC COMPANY
- Arun Virupaksha Gowda
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
INTEGRATED CIRCUIT CHIP PACKAGING
- Publication number 20200168524
- Publication date May 28, 2020
- International Business Machines Corporation
- Young Hoon Kwark
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTEGRATED CIRCUIT CHIP PACKAGING
- Publication number 20200168525
- Publication date May 28, 2020
- International Business Machines Corporation
- Young Hoon Kwark
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
DISPLAY DEVICE
- Publication number 20200144750
- Publication date May 7, 2020
- LG ELECTRONICS INC.
- Seunghak RYU
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
BACKPLANE FOOTPRINT FOR HIGH SPEED, HIGH DENSITY ELECTRICAL CONNECTORS
- Publication number 20200068705
- Publication date Feb 27, 2020
- Amphenol Corporation
- Marc Robert Charbonneau
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
MATING BACKPLANE FOR HIGH SPEED, HIGH DENSITY ELECTRICAL CONNECTOR
- Publication number 20200022252
- Publication date Jan 16, 2020
- Amphenol Corporation
- Mark W. Gailus
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR

Stepped hole, via, edge, bump or conductor

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Printed circuit board and method for manufacturing the same

Display apparatus having grooved terminals

Laminated circuit board

Mating backplane for high speed, high density electrical connector

Multilayer wiring board and method of producing the same

Plated metallization structures

Backplane footprint for high speed, high density electrical connectors

Backplane footprint for high speed, high density electrical connectors

Flexible display device

Display apparatus having grooved terminals

Ultra-thin embedded semiconductor device package and method of manu...

Semi-flexible component carrier with stepped layer structure

Backplane footprint for high speed, high density electrical connectors

Mating backplane for high speed, high density electrical connector

Display device and method of manufacturing the same

Camera module and molded circuit board assembly and manufacturing m...

PCB structure for embedding electronic components

Electric module with a planar transformer

Method of forming an electronic device

Packaging photon building blocks with top side connections and inte...

Methods of forming high aspect ratio plated through holes and high...

Board to board interconnect

Method for forming laminated circuit board

Backplane footprint for high speed, high density electrical connectors

High-speed hybrid circuit

Display device

Display device

Package substrate having copper alloy sputter seed layer and high d...

Method of wire bonding a first and second circuit card

Backplane footprint for high speed, high density electrical connectors

Patents Applicationslast 30 patents

PRINTED WIRING BOARD

WIRING SUBSTRATE

MATING BACKPLANE FOR HIGH SPEED, HIGH DENSITY ELECTRICAL CONNECTOR

SYSTEMS AND METHODS FOR FORMING STUBLESS PLATED THROUGH HOLES HAVIN...

CIRCUIT BOARD ASSEMBLY, MANUFACTURING METHOD, AND ELECTRONIC DEVICE

BACKPLANE FOOTPRINT FOR HIGH SPEED, HIGH DENSITY ELECTRICAL CONNECTORS

FLEXIBLE DISPLAY DEVICE

BEVELED OVERBURDEN FOR VIAS AND METHOD OF MAKING THE SAME

PRINTED CIRCUIT BOARD AND METHOD FOR MANUFACTURING THE SAME

PRINTED WIRING BOARD

Component Carrier

DISPLAY APPARATUS HAVING GROOVED TERMINALS AND METHOD OF MANUFACTUR...

MATING BACKPLANE FOR HIGH SPEED, HIGH DENSITY ELECTRICAL CONNECTOR

BACKPLANE FOOTPRINT FOR HIGH SPEED, HIGH DENSITY ELECTRICAL CONNECTORS

Semi-Flexible Component Carrier With Stepped Layer Structure

BACKPLANE FOOTPRINT FOR HIGH SPEED, HIGH DENSITY ELECTRICAL CONNECTORS

A PCB STRUCTURE FOR EMBEDDING ELECTRONIC COMPONENTS

BACKPLANE FOOTPRINT FOR HIGH SPEED, HIGH DENSITY ELECTRICAL CONNECTORS

FLEXIBLE DISPLAY DEVICE

DISPLAY APPARATUS HAVING GROOVED TERMINALS AND METHOD OF MANUFACTUR...

MATING BACKPLANE FOR HIGH SPEED, HIGH DENSITY ELECTRICAL CONNECTOR

Camera Module and Molded Circuit Board Assembly and Manufacturing M...

BACKPLANE FOOTPRINT FOR HIGH SPEED, HIGH DENSITY ELECTRICAL CONNECTORS

ELECTRIC MODULE WITH A PLANAR TRANSFORMER

ULTRA-THIN EMBEDDED SEMICONDUCTOR DEVICE PACKAGE AND METHOD OF MANU...

INTEGRATED CIRCUIT CHIP PACKAGING

INTEGRATED CIRCUIT CHIP PACKAGING

DISPLAY DEVICE

BACKPLANE FOOTPRINT FOR HIGH SPEED, HIGH DENSITY ELECTRICAL CONNECTORS

MATING BACKPLANE FOR HIGH SPEED, HIGH DENSITY ELECTRICAL CONNECTOR