Strain gauges

Industry

CPC
Y10S148/159

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YGENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS Y10USPC classification Y10STECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS Y10S148/00Metal treatment

Current Industry

Y10S148/159Strain gauges

Industries

Patents Grantslast 30 patents

Information Patent Grant
Method of producing a complex structure by assembling stressed stru...
- Patent number 7,550,052
- Issue date Jun 23, 2009
- Commissariat a l'Energie Atomique
- Franck Fournel
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of manufacturing external force detection sensor
- Patent number 7,393,714
- Issue date Jul 1, 2008
- Murata Manufacturing Co., Ltd.
- Takahiro Oguchi
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Method of manufacturing an external force detection sensor
- Patent number 7,067,344
- Issue date Jun 27, 2006
- Murata Manufacturing Co., Ltd.
- Takahiro Oguchi
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Method of manufacturing an external force detection sensor
- Patent number 7,049,165
- Issue date May 23, 2006
- Murata Manufacturing Co., Ltd.
- Takahiro Oguchi
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Microfabrication using germanium-based release masks
- Patent number 6,440,766
- Issue date Aug 27, 2002
- Analog Devices IMI, Inc.
- William A. Clark
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Acceleration sensor
- Patent number 6,055,858
- Issue date May 2, 2000
- Robert Bosch GmbH
- Horst Muenzel
- G01 - MEASURING TESTING
Information Patent Grant
Manufacturing process of strain gauge sensor using the piezoresisti...
- Patent number 6,001,666
- Issue date Dec 14, 1999
- Commissariat a l'Energie Atomique
- Bernard Diem
- G01 - MEASURING TESTING
Information Patent Grant
Acceleration sensor
- Patent number 5,959,208
- Issue date Sep 28, 1999
- GmbH; Robert Bosch
- Horst Muenzel
- G01 - MEASURING TESTING
Information Patent Grant
Method of fabricating direct-bonded semiconductor wafers
- Patent number 5,932,048
- Issue date Aug 3, 1999
- Komatsu Electronic Metals Co., Ltd.
- Hiroshi Furukawa
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Pressure transducer comprising a sealed transducer with a rigid dia...
- Patent number 5,912,499
- Issue date Jun 15, 1999
- Commissariat a l'Energie Atomique
- Bernard Diem
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Method for manufacturing a force sensor
- Patent number 5,804,457
- Issue date Sep 8, 1998
- Gerhard Benz
- G01 - MEASURING TESTING
Information Patent Grant
Process for manufacturing a sensor
- Patent number 5,723,353
- Issue date Mar 3, 1998
- Robert Bosch GmbH
- Horst Muenzel
- G01 - MEASURING TESTING
Information Patent Grant
Method of manufacturing cantilever drive mechanism and probe drive...
- Patent number 5,648,300
- Issue date Jul 15, 1997
- Canon Kabushiki Kaisha
- Masaru Nakayama
- B82 - NANO-TECHNOLOGY
Information Patent Grant
Force sensor and a method for manufacturing a force sensor
- Patent number 5,553,506
- Issue date Sep 10, 1996
- Robert Bosch GmbH
- Gerhard Benz
- G01 - MEASURING TESTING
Information Patent Grant
Process for producing a pressure transducer using silicon-on-insula...
- Patent number 5,510,276
- Issue date Apr 23, 1996
- Commissariat a l'Energie Atomique
- Bernard Diem
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Method of manufacturing cantilever drive mechanism, method of manuf...
- Patent number 5,398,229
- Issue date Mar 14, 1995
- Canon Kabushiki Kaisha
- Masaru Nakayama
- B82 - NANO-TECHNOLOGY
Information Patent Grant
Method of bonding semiconductor substrates
- Patent number 5,383,993
- Issue date Jan 24, 1995
- Nippon Soken Inc.
- Mitsutaka Katada
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Probe drive mechanism and electronic device which uses the same
- Patent number 5,334,835
- Issue date Aug 2, 1994
- Canon Kabushiki Kaisha
- Masaru Nakayama
- B82 - NANO-TECHNOLOGY
Information Patent Grant
Method of making an acceleration sensor
- Patent number 5,310,450
- Issue date May 10, 1994
- Robert Bosch GmbH
- Michael Offenberg
- G01 - MEASURING TESTING
Information Patent Grant
Method of making a multi-layer silicon structure
- Patent number 5,169,472
- Issue date Dec 8, 1992
- Robert Bosch GmbH
- Herbert Goebel
- G01 - MEASURING TESTING
Information Patent Grant
Fabrication of oxynitride frontside microstructures
- Patent number 5,164,339
- Issue date Nov 17, 1992
- Siemens-Bendix Automotive Electronics L.P.
- George E. Gimpelson
- G01 - MEASURING TESTING
Information Patent Grant
Method for fabricating a silicon pressure sensor incorporating sili...
- Patent number 5,155,061
- Issue date Oct 13, 1992
- Allied-Signal Inc.
- James M. O'Connor
- G01 - MEASURING TESTING
Information Patent Grant
Silicon membrane with controlled stress
- Patent number 5,110,373
- Issue date May 5, 1992
- Nanostructures, Inc.
- Philip E. Mauger
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Low stress polysilicon microstructures
- Patent number 5,059,556
- Issue date Oct 22, 1991
- Siemens-Bendix Automotive Electronics, L.P.
- Duane T. Wilcoxen
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Dielectrically isolated semiconductor substrate
- Patent number 4,878,957
- Issue date Nov 7, 1989
- Kabushiki Kaisha Toshiba
- Yoshihiro Yamaguchi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of manufacturing compound semiconductor apparatus
- Patent number 4,738,935
- Issue date Apr 19, 1988
- Kabushiki Kaisha Toshiba
- Masaru Shimbo
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Recessed oxide method for making a silicon-on-insulator substrate
- Patent number 4,704,186
- Issue date Nov 3, 1987
- RCA Corporation
- Lubomir L. Jastrzebski
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of making silicon diaphragm pressure sensor
- Patent number 4,670,969
- Issue date Jun 9, 1987
- Hitachi, Ltd.
- Kazuji Yamada
- G01 - MEASURING TESTING
Information Patent Grant
Method of making a semiconductor transducer having multiple level d...
- Patent number 4,665,610
- Issue date May 19, 1987
- Stanford University
- Phillip W. Barth
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Method of manufacturing semiconductor substrate
- Patent number 4,638,552
- Issue date Jan 27, 1987
- Kabushiki Kaisha Toshiba
- Masaru Shimbo
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
Method of producing a complex structure by assembling stressed stru...
- Publication number 20060141742
- Publication date Jun 29, 2006
- Franck Fournel
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Method of manufacturing an external force detection sensor
- Publication number 20060110843
- Publication date May 25, 2006
- Takahiro Oguchi
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
Method of manufacturing an external force detection sensor
- Publication number 20040110318
- Publication date Jun 10, 2004
- Murata Manufacturing Co., Ltd.
- Takahiro Oguchi
- B81 - MICRO-STRUCTURAL TECHNOLOGY

Strain gauges

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Method of producing a complex structure by assembling stressed stru...

Method of manufacturing external force detection sensor

Method of manufacturing an external force detection sensor

Method of manufacturing an external force detection sensor

Microfabrication using germanium-based release masks

Acceleration sensor

Manufacturing process of strain gauge sensor using the piezoresisti...

Acceleration sensor

Method of fabricating direct-bonded semiconductor wafers

Pressure transducer comprising a sealed transducer with a rigid dia...

Method for manufacturing a force sensor

Process for manufacturing a sensor

Method of manufacturing cantilever drive mechanism and probe drive...

Force sensor and a method for manufacturing a force sensor

Process for producing a pressure transducer using silicon-on-insula...

Method of manufacturing cantilever drive mechanism, method of manuf...

Method of bonding semiconductor substrates

Probe drive mechanism and electronic device which uses the same

Method of making an acceleration sensor

Method of making a multi-layer silicon structure

Fabrication of oxynitride frontside microstructures

Method for fabricating a silicon pressure sensor incorporating sili...

Silicon membrane with controlled stress

Low stress polysilicon microstructures

Dielectrically isolated semiconductor substrate

Method of manufacturing compound semiconductor apparatus

Recessed oxide method for making a silicon-on-insulator substrate

Method of making silicon diaphragm pressure sensor

Method of making a semiconductor transducer having multiple level d...

Method of manufacturing semiconductor substrate

Patents Applicationslast 30 patents

Method of producing a complex structure by assembling stressed stru...

Method of manufacturing an external force detection sensor

Method of manufacturing an external force detection sensor