Industry
-
CPC
-
Y10S148/00
This industry / category may be too specific. Please go to a parent level for more data
Sub Industries
Y10S148/001Amorphous semiconductor
Y10S148/002Amphoteric doping
Y10S148/003Anneal
Y10S148/004Annealing, incoherent light
Y10S148/005Antimonides of gallium or indium
Y10S148/006Apparatus
Y10S148/007Autodoping
Y10S148/008Bi-level fabrication
Y10S148/009Bi-MOS
Y10S148/01Bipolar transistors-ion implantation
Y10S148/011Bipolar transistors
Y10S148/012Bonding
Y10S148/013Breakdown voltage
Y10S148/014Capacitor
Y10S148/015Capping layer
Y10S148/016Catalyst
Y10S148/017Clean surfaces
Y10S148/018Compensation doping
Y10S148/019Contacts of silicides
Y10S148/02Contacts, special
Y10S148/021Continuous process
Y10S148/022Controlled atmosphere
Y10S148/023Deep level dopants
Y10S148/024Defect control-gettering and annealing
Y10S148/025Deposition multi-step
Y10S148/026Deposition thru hole in mask
Y10S148/027Dichlorosilane
Y10S148/028Dicing
Y10S148/029Differential crystal growth rates
Y10S148/03Diffusion
Y10S148/031Diffusion at an edge
Y10S148/032Diffusion length
Y10S148/033Diffusion of aluminum
Y10S148/034Diffusion of boron or silicon
Y10S148/035Diffusion through a layer
Y10S148/036Diffusion, nonselective
Y10S148/037Diffusion-deposition
Y10S148/038Diffusions-staged
Y10S148/039Displace P-N junction
Y10S148/04Dopants, special
Y10S148/041Doping control in crystal growth
Y10S148/042Doping, graded, for tapered etching
Y10S148/043Dual dielectric
Y10S148/044Edge diffusion under mask
Y10S148/045Electric field
Y10S148/046Electron beam treatment of devices
Y10S148/047Emitter dip
Y10S148/048Energy beam assisted EPI growth
Y10S148/049Equivalence and options
Y10S148/05Etch and refill
Y10S148/051Etching
Y10S148/052Face to face deposition
Y10S148/053Field effect transistors fets
Y10S148/054Flat sheets-substrates
Y10S148/055Fuse
Y10S148/056Gallium arsenide
Y10S148/057Gas flow control
Y10S148/058Ge germanium
Y10S148/059Germanium on silicon or Ge-Si on III-V
Y10S148/06Gettering
Y10S148/061Gettering-armorphous layers
Y10S148/062Gold diffusion
Y10S148/063Gp II-IV-VI compounds
Y10S148/064Gp II-VI compounds
Y10S148/065Gp III-V generic compounds-processing
Y10S148/066Gp III-V liquid phase epitaxy
Y10S148/067Graded energy gap
Y10S148/068Graphite masking
Y10S148/069Green sheets
Y10S148/07Guard rings and cmos
Y10S148/071Heating, selective
Y10S148/072Heterojunctions
Y10S148/073Hollow body
Y10S148/074Horizontal melt solidification
Y10S148/075Imide resists
Y10S148/076Implant
Y10S148/077Implantation of silicon on sapphire
Y10S148/078Impurity redistribution by oxidation
Y10S148/079Inert carrier gas
Y10S148/08Infra-red
Y10S148/081Insulators
Y10S148/082Ion implantation FETs/COMs
Y10S148/083Ion implantation, general
Y10S148/084Ion implantation of compound devices
Y10S148/085Isolated-integrated
Y10S148/086Isolated zones
Y10S148/087I2L integrated injection logic
Y10S148/088J-Fet, i.e.junction field effect transistor
Y10S148/089Josephson devices
Y10S148/09Laser anneal
Y10S148/091Laser beam processing of fets
Y10S148/092Laser beam processing-diodes or transistor
Y10S148/093Laser beam treatment in general
Y10S148/094Laser beam treatment of compound devices
Y10S148/095Laser devices
Y10S148/096Lateral transistor
Y10S148/097Lattice strain and defects
Y10S148/098Layer conversion
Y10S148/099LED, multicolor
Y10S148/10Lift-off masking
Y10S148/101Liquid Phase Epitaxy, LPE
Y10S148/102Mask alignment
Y10S148/103Mask, dual function
Y10S148/104Mask, movable
Y10S148/105Masks, metal
Y10S148/106Masks, special
Y10S148/107Melt
Y10S148/108Melt back
Y10S148/109Memory devices
Y10S148/11Metal-organic CVD, ruehrwein type
Y10S148/111Narrow masking
Y10S148/112Nitridation, direct, of silicon
Y10S148/113Nitrides of boron or aluminum or gallium
Y10S148/114Nitrides of silicon
Y10S148/115Orientation
Y10S148/116Oxidation, differential
Y10S148/117Oxidation, selective
Y10S148/118Oxide films
Y10S148/119Phosphides of gallium or indium
Y10S148/12Photocathodes-Cs coated and solar cell
Y10S148/121Plastic temperature
Y10S148/122Polycrystalline
Y10S148/123Polycrystalline diffuse anneal
Y10S148/124Polycrystalline emitter
Y10S148/125Polycrystalline passivation
Y10S148/126Power FETs
Y10S148/127Process induced defects
Y10S148/128Proton bombardment of silicon
Y10S148/129Pulse doping
Y10S148/13Purification
Y10S148/131Reactive ion etching rie
Y10S148/132Recoil implantation
Y10S148/133Reflow oxides and glasses
Y10S148/134Remelt
Y10S148/135Removal of substrate
Y10S148/136Resistors
Y10S148/137Resists
Y10S148/138Roughened surface
Y10S148/139Schottky barrier
Y10S148/14Schottky barrier contacts
Y10S148/141Self-alignment coat gate
Y10S148/142Semiconductor-metal-semiconductor
Y10S148/143Shadow masking
Y10S148/144Shallow diffusion
Y10S148/145Shaped junctions
Y10S148/146Sheet resistance, dopant parameters
Y10S148/147Silicides
Y10S148/148Silicon carbide
Y10S148/149Silicon on III-V
Y10S148/15Silicon on sapphire SOS
Y10S148/151Simultaneous diffusion
Y10S148/152Single crystal on amorphous substrate
Y10S148/153Solar cells-implantations-laser beam
Y10S148/154Solid phase epitaxy
Y10S148/155Solid solubility
Y10S148/156Sonos
Y10S148/157Special diffusion and profiles
Y10S148/158Sputtering
Y10S148/159Strain gauges
Y10S148/16Superlattice
Y10S148/161Tapered edges
Y10S148/162Testing steps
Y10S148/163Thick-thin oxides
Y10S148/164Three dimensional processing
Y10S148/165Transmutation doping
Y10S148/166Traveling solvent method
Y10S148/167Two diffusions in one hole
Y10S148/168V-Grooves
Y10S148/169Vacuum deposition
Y10S148/17Vapor-liquid-solid
Y10S148/171Varistor
Y10S148/172Vidicons
Y10S148/173Washed emitter
Y10S148/174Zener diodes
Y10S148/90Ion implanted
Y10S148/901Surface depleted in an alloy component
Y10S148/902having portions of differing metallurgical properties or characteristics
Y10S148/903Directly treated with high energy electromagnetic waves or particles
Y10S148/904Crankshaft
Y10S148/905Cutting tool
Y10S148/906Roller bearing element
Y10S148/907Threaded or headed fastener
Y10S148/908Spring
Y10S148/909Tube
Y10S148/91in pattern discontinuous in two dimensions