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GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
Y10
USPC classification
Y10S
TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
Current Industry
Y10S148/00
Metal treatment
Sub Industries
Y10S148/001
Amorphous semiconductor
Y10S148/002
Amphoteric doping
Y10S148/003
Anneal
Y10S148/004
Annealing, incoherent light
Y10S148/005
Antimonides of gallium or indium
Y10S148/006
Apparatus
Y10S148/007
Autodoping
Y10S148/008
Bi-level fabrication
Y10S148/009
Bi-MOS
Y10S148/01
Bipolar transistors-ion implantation
Y10S148/011
Bipolar transistors
Y10S148/012
Bonding
Y10S148/013
Breakdown voltage
Y10S148/014
Capacitor
Y10S148/015
Capping layer
Y10S148/016
Catalyst
Y10S148/017
Clean surfaces
Y10S148/018
Compensation doping
Y10S148/019
Contacts of silicides
Y10S148/02
Contacts, special
Y10S148/021
Continuous process
Y10S148/022
Controlled atmosphere
Y10S148/023
Deep level dopants
Y10S148/024
Defect control-gettering and annealing
Y10S148/025
Deposition multi-step
Y10S148/026
Deposition thru hole in mask
Y10S148/027
Dichlorosilane
Y10S148/028
Dicing
Y10S148/029
Differential crystal growth rates
Y10S148/03
Diffusion
Y10S148/031
Diffusion at an edge
Y10S148/032
Diffusion length
Y10S148/033
Diffusion of aluminum
Y10S148/034
Diffusion of boron or silicon
Y10S148/035
Diffusion through a layer
Y10S148/036
Diffusion, nonselective
Y10S148/037
Diffusion-deposition
Y10S148/038
Diffusions-staged
Y10S148/039
Displace P-N junction
Y10S148/04
Dopants, special
Y10S148/041
Doping control in crystal growth
Y10S148/042
Doping, graded, for tapered etching
Y10S148/043
Dual dielectric
Y10S148/044
Edge diffusion under mask
Y10S148/045
Electric field
Y10S148/046
Electron beam treatment of devices
Y10S148/047
Emitter dip
Y10S148/048
Energy beam assisted EPI growth
Y10S148/049
Equivalence and options
Y10S148/05
Etch and refill
Y10S148/051
Etching
Y10S148/052
Face to face deposition
Y10S148/053
Field effect transistors fets
Y10S148/054
Flat sheets-substrates
Y10S148/055
Fuse
Y10S148/056
Gallium arsenide
Y10S148/057
Gas flow control
Y10S148/058
Ge germanium
Y10S148/059
Germanium on silicon or Ge-Si on III-V
Y10S148/06
Gettering
Y10S148/061
Gettering-armorphous layers
Y10S148/062
Gold diffusion
Y10S148/063
Gp II-IV-VI compounds
Y10S148/064
Gp II-VI compounds
Y10S148/065
Gp III-V generic compounds-processing
Y10S148/066
Gp III-V liquid phase epitaxy
Y10S148/067
Graded energy gap
Y10S148/068
Graphite masking
Y10S148/069
Green sheets
Y10S148/07
Guard rings and cmos
Y10S148/071
Heating, selective
Y10S148/072
Heterojunctions
Y10S148/073
Hollow body
Y10S148/074
Horizontal melt solidification
Y10S148/075
Imide resists
Y10S148/076
Implant
Y10S148/077
Implantation of silicon on sapphire
Y10S148/078
Impurity redistribution by oxidation
Y10S148/079
Inert carrier gas
Y10S148/08
Infra-red
Y10S148/081
Insulators
Y10S148/082
Ion implantation FETs/COMs
Y10S148/083
Ion implantation, general
Y10S148/084
Ion implantation of compound devices
Y10S148/085
Isolated-integrated
Y10S148/086
Isolated zones
Y10S148/087
I2L integrated injection logic
Y10S148/088
J-Fet, i.e.junction field effect transistor
Y10S148/089
Josephson devices
Y10S148/09
Laser anneal
Y10S148/091
Laser beam processing of fets
Y10S148/092
Laser beam processing-diodes or transistor
Y10S148/093
Laser beam treatment in general
Y10S148/094
Laser beam treatment of compound devices
Y10S148/095
Laser devices
Y10S148/096
Lateral transistor
Y10S148/097
Lattice strain and defects
Y10S148/098
Layer conversion
Y10S148/099
LED, multicolor
Y10S148/10
Lift-off masking
Y10S148/101
Liquid Phase Epitaxy, LPE
Y10S148/102
Mask alignment
Y10S148/103
Mask, dual function
Y10S148/104
Mask, movable
Y10S148/105
Masks, metal
Y10S148/106
Masks, special
Y10S148/107
Melt
Y10S148/108
Melt back
Y10S148/109
Memory devices
Y10S148/11
Metal-organic CVD, ruehrwein type
Y10S148/111
Narrow masking
Y10S148/112
Nitridation, direct, of silicon
Y10S148/113
Nitrides of boron or aluminum or gallium
Y10S148/114
Nitrides of silicon
Y10S148/115
Orientation
Y10S148/116
Oxidation, differential
Y10S148/117
Oxidation, selective
Y10S148/118
Oxide films
Y10S148/119
Phosphides of gallium or indium
Y10S148/12
Photocathodes-Cs coated and solar cell
Y10S148/121
Plastic temperature
Y10S148/122
Polycrystalline
Y10S148/123
Polycrystalline diffuse anneal
Y10S148/124
Polycrystalline emitter
Y10S148/125
Polycrystalline passivation
Y10S148/126
Power FETs
Y10S148/127
Process induced defects
Y10S148/128
Proton bombardment of silicon
Y10S148/129
Pulse doping
Y10S148/13
Purification
Y10S148/131
Reactive ion etching rie
Y10S148/132
Recoil implantation
Y10S148/133
Reflow oxides and glasses
Y10S148/134
Remelt
Y10S148/135
Removal of substrate
Y10S148/136
Resistors
Y10S148/137
Resists
Y10S148/138
Roughened surface
Y10S148/139
Schottky barrier
Y10S148/14
Schottky barrier contacts
Y10S148/141
Self-alignment coat gate
Y10S148/142
Semiconductor-metal-semiconductor
Y10S148/143
Shadow masking
Y10S148/144
Shallow diffusion
Y10S148/145
Shaped junctions
Y10S148/146
Sheet resistance, dopant parameters
Y10S148/147
Silicides
Y10S148/148
Silicon carbide
Y10S148/149
Silicon on III-V
Y10S148/15
Silicon on sapphire SOS
Y10S148/151
Simultaneous diffusion
Y10S148/152
Single crystal on amorphous substrate
Y10S148/153
Solar cells-implantations-laser beam
Y10S148/154
Solid phase epitaxy
Y10S148/155
Solid solubility
Y10S148/156
Sonos
Y10S148/157
Special diffusion and profiles
Y10S148/158
Sputtering
Y10S148/159
Strain gauges
Y10S148/16
Superlattice
Y10S148/161
Tapered edges
Y10S148/162
Testing steps
Y10S148/163
Thick-thin oxides
Y10S148/164
Three dimensional processing
Y10S148/165
Transmutation doping
Y10S148/166
Traveling solvent method
Y10S148/167
Two diffusions in one hole
Y10S148/168
V-Grooves
Y10S148/169
Vacuum deposition
Y10S148/17
Vapor-liquid-solid
Y10S148/171
Varistor
Y10S148/172
Vidicons
Y10S148/173
Washed emitter
Y10S148/174
Zener diodes
Y10S148/90
Ion implanted
Y10S148/901
Surface depleted in an alloy component
Y10S148/902
having portions of differing metallurgical properties or characteristics
Y10S148/903
Directly treated with high energy electromagnetic waves or particles
Y10S148/904
Crankshaft
Y10S148/905
Cutting tool
Y10S148/906
Roller bearing element
Y10S148/907
Threaded or headed fastener
Y10S148/908
Spring
Y10S148/909
Tube
Y10S148/91
in pattern discontinuous in two dimensions
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H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
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