Strap connectors

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CPC
H01L24/34

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HELECTRICITY H01Electric elements H01LSEMICONDUCTOR DEVICES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR H01L24/00Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto

Current Industry

H01L24/34Strap connectors

Industries

Patents Grantslast 30 patents

Information Patent Grant
Package including multiple semiconductor devices
- Patent number 12,142,551
- Issue date Nov 12, 2024
- SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC
- Jerome Teysseyre
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for producing a semiconductor arrangement
- Patent number 11,955,450
- Issue date Apr 9, 2024
- Infineon Technologies AG
- Olaf Hohlfeld
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for forming hermetic package for a power semiconductor
- Patent number 11,721,600
- Issue date Aug 8, 2023
- Microsemi Corporation
- Saeed Shafiyan-Rad
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor arrangement and method for producing the same
- Patent number 11,688,712
- Issue date Jun 27, 2023
- Infineon Technologies AG
- Olaf Hohlfeld
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Clip bond semiconductor packages and assembly tools
- Patent number 11,676,934
- Issue date Jun 13, 2023
- UTAC HEADQUARTERS PTE. LTD.
- Albert Louis Bove
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Package including multiple semiconductor devices
- Patent number 11,545,421
- Issue date Jan 3, 2023
- Semiconductor Components Industries, LLC
- Jerome Teysseyre
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Package including multiple semiconductor devices
- Patent number 11,502,027
- Issue date Nov 15, 2022
- Semiconductor Components Industries, LLC
- Jerome Teysseyre
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Power semiconductor device and power conversion device
- Patent number 11,432,419
- Issue date Aug 30, 2022
- Hitachi Astemo, Ltd.
- Tokihito Suwa
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Package including multiple semiconductor devices
- Patent number 10,910,297
- Issue date Feb 2, 2021
- Semiconductor Components Industries, LLC
- Jerome Teysseyre
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Hermetic package for power semiconductor
- Patent number 10,903,128
- Issue date Jan 26, 2021
- Microsemi Corporation
- Saeed Shafiyan-Rad
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Resiliently mounted sensor system with damping
- Patent number 10,683,201
- Issue date Jun 16, 2020
- TDK Corporation
- Pirmin Hermann Otto Rombach
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Semiconductor device manufacturing method including forming a wide...
- Patent number 10,651,121
- Issue date May 12, 2020
- Mitsubishi Electric Corporation
- Daisuke Oya
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and power converter
- Patent number 10,593,609
- Issue date Mar 17, 2020
- Toyota Jidosha Kabushiki Kaisha
- Yuji Nishibe
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Power semiconductor device and power conversion device
- Patent number 10,512,181
- Issue date Dec 17, 2019
- Hitachi Automotive Systems, Ltd.
- Tokihito Suwa
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Light emitting apparatus, illumination apparatus and display apparatus
- Patent number 10,490,533
- Issue date Nov 26, 2019
- Sony Corporation
- Naoki Hirao
- G09 - EDUCATION CRYPTOGRAPHY DISPLAY ADVERTISING SEALS
Information Patent Grant
Semiconductor module with reinforcing board
- Patent number 10,461,012
- Issue date Oct 29, 2019
- Fuji Electric Co., Ltd.
- Akira Morozumi
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Method for manufacturing semiconductor device
- Patent number 10,395,967
- Issue date Aug 27, 2019
- Renesas Electronics Corporation
- Takamitsu Yoshihara
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device including a cylindrical electrode inserted int...
- Patent number 10,340,217
- Issue date Jul 2, 2019
- Mitsubishi Electric Corporation
- Daisuke Oya
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Clip-bonded semiconductor chip package using metal bumps and method...
- Patent number 10,256,207
- Issue date Apr 9, 2019
- JMJ KOREA CO., LTD.
- Yunhwa Choi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electronic part mounting heat-dissipating substrate
- Patent number 10,249,558
- Issue date Apr 2, 2019
- NSK Ltd.
- Shigeru Shimakawa
- B62 - LAND VEHICLES FOR TRAVELLING OTHERWISE THAN ON RAILS
Information Patent Grant
Light emitting apparatus, illumination apparatus and display apparatus
- Patent number 10,249,600
- Issue date Apr 2, 2019
- Sony Corporation
- Naoki Hirao
- G09 - EDUCATION CRYPTOGRAPHY DISPLAY ADVERTISING SEALS
Information Patent Grant
Dual lead frame semiconductor package and method of manufacture
- Patent number 10,229,893
- Issue date Mar 12, 2019
- Vishay-Siliconix
- Frank Kuo
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Power module and power conversion apparatus having a warpage suppre...
- Patent number 10,204,872
- Issue date Feb 12, 2019
- Hitachi Automotive Systems, Ltd.
- Toshiyuki Kobayashi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Power semiconductor device
- Patent number 10,141,247
- Issue date Nov 27, 2018
- Semikron Elektronik GmbH & Co. KG
- Christian Walter
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Semiconductor device manufacturing method
- Patent number 10,079,155
- Issue date Sep 18, 2018
- Fuji Electric Co., Ltd.
- Tsunehiro Nakajima
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Detection of current change in an integrated circuit
- Patent number 10,048,296
- Issue date Aug 14, 2018
- Infineon Technologies AG
- Franz Jost
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Power semiconductor device and power conversion device
- Patent number 10,034,401
- Issue date Jul 24, 2018
- Hitachi Automotive Systems, Ltd.
- Tokihito Suwa
- H02 - GENERATION CONVERSION OR DISTRIBUTION OF ELECTRIC POWER
Information Patent Grant
Semiconductor component having inner and outer semiconductor compon...
- Patent number 9,991,183
- Issue date Jun 5, 2018
- Infineon Technologies Austria AG
- Josef Hoeglauer
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Stack die package
- Patent number 9,966,330
- Issue date May 8, 2018
- Vishay Siliconix
- Kyle Terrill
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Power module for electric power steering and electric power steerin...
- Patent number 9,888,613
- Issue date Feb 6, 2018
- Mitsubishi Electric Corporation
- Katsuhiko Omae
- H02 - GENERATION CONVERSION OR DISTRIBUTION OF ELECTRIC POWER

Patents Applicationslast 30 patents

Information Patent Application
METHOD FOR PRODUCING A SEMICONDUCTOR ARRANGEMENT
- Publication number 20230275059
- Publication date Aug 31, 2023
- INFINEON TECHNOLOGIES AG
- Olaf Hohlfeld
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
STRESS ARREST LIP ON COPPER PAD FOR LOW ROUGHNESS COPPER
- Publication number 20230207503
- Publication date Jun 29, 2023
- Intel Corporation
- Jieying KONG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PACKAGE INCLUDING MULTIPLE SEMICONDUCTOR DEVICES
- Publication number 20230075519
- Publication date Mar 9, 2023
- Semiconductor Components Industries, LLC
- Jerome TEYSSEYRE
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Method for forming hermetic package for a power semiconductor
- Publication number 20210159130
- Publication date May 27, 2021
- Microsemi Corporation
- Saeed Shafiyan-Rad
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PACKAGE INCLUDING MULTIPLE SEMICONDUCTOR DEVICES
- Publication number 20210151367
- Publication date May 20, 2021
- Semiconductor Components Industries, LLC
- Jerome TEYSSEYRE
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor Arrangement and Method for Producing the Same
- Publication number 20200266171
- Publication date Aug 20, 2020
- INFINEON TECHNOLOGIES AG
- Olaf Hohlfeld
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Power Semiconductor Device and Power Conversion Device
- Publication number 20200068735
- Publication date Feb 27, 2020
- Hitachi Automotive Systems, Ltd.
- Tokihito SUWA
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
PACKAGE INCLUDING MULTIPLE SEMICONDUCTOR DEVICES
- Publication number 20190287886
- Publication date Sep 19, 2019
- Semiconductor Components Industries, LLC
- Jerome TEYSSEYRE
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND SEMICONDUCTOR DEVICE MANUFACTURING METHOD
- Publication number 20190244889
- Publication date Aug 8, 2019
- Mitsubishi Electric Corporation
- Daisuke OYA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
LIGHT EMITTING APPARATUS, ILLUMINATION APPARATUS AND DISPLAY APPARATUS
- Publication number 20190221551
- Publication date Jul 18, 2019
- SONY CORPORATION
- Naoki Hirao
- G09 - EDUCATION CRYPTOGRAPHY DISPLAY ADVERTISING SEALS
Information Patent Application
Power Semiconductor Device and Power Conversion Device
- Publication number 20180303001
- Publication date Oct 18, 2018
- Hitachi Automotive Systems, Ltd.
- Tokihito SUWA
- H02 - GENERATION CONVERSION OR DISTRIBUTION OF ELECTRIC POWER
Information Patent Application
RESILIENTLY MOUNTED SENSOR SYSTEM WITH DAMPING
- Publication number 20180244515
- Publication date Aug 30, 2018
- TDK Corporation
- Pirmin Hermann Otto Rombach
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
CLIP-BONDED SEMICONDUCTOR CHIP PACKAGE USING METAL BUMPS AND METHOD...
- Publication number 20180240770
- Publication date Aug 23, 2018
- JMJ KOREA CO., LTD.
- YUNHWA CHOI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
POWER SEMICONDUCTOR DEVICE
- Publication number 20180019190
- Publication date Jan 18, 2018
- SEMIKRON ELEKTRONIK GMBH & CO. KG
- CHRISTIAN WALTER
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE WITH CONDUCTIVE CLIP
- Publication number 20180012859
- Publication date Jan 11, 2018
- Infineon Technologies Americas Corp.
- Martin Standing
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE MANUFACTURING METHOD
- Publication number 20170309496
- Publication date Oct 26, 2017
- FUJI ELECTRIC CO., LTD.
- Tsunehiro NAKAJIMA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD FOR MANUFACTURING SEMICONDUCTOR DEVICE
- Publication number 20170287765
- Publication date Oct 5, 2017
- RENESAS ELECTRONICS CORPORATION
- Takamitsu YOSHIHARA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Dual Lead Frame Semiconductor Package and Method of Manufacture
- Publication number 20170271304
- Publication date Sep 21, 2017
- Frank Kuo
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE
- Publication number 20140374926
- Publication date Dec 25, 2014
- Kabushiki Kaisha Toshiba
- Takeshi MIYAKAWA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
POWER MODULE FOR HIGH/LOW VOLTAGE INSULATION
- Publication number 20140374629
- Publication date Dec 25, 2014
- Industrial Technology Research Institute
- Shin-Yi Huang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Dual Lead Frame Semiconductor Package and Method of Manufacture
- Publication number 20140370661
- Publication date Dec 18, 2014
- SILICONIX ELECTRONIC CO., LTD.
- Frank Kuo
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
POWER CONTROL DEVICE AND PREPARATION METHOD THEREOF
- Publication number 20140361419
- Publication date Dec 11, 2014
- Yan Xun Xue
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Dual Lead Frame Semiconductor Package and Method of Manufacture
- Publication number 20140332939
- Publication date Nov 13, 2014
- SILICONIX ELECTRONIC CO., LTD.
- Frank Kuo
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor Power Device Having a Heat Sink
- Publication number 20140312360
- Publication date Oct 23, 2014
- Ralf Otremba
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Integrating Multi-Output Power Converters Having Vertically Stacked...
- Publication number 20140306332
- Publication date Oct 16, 2014
- TEXAS INSTRUMENTS INCORPORATED
- Marie Denison
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
DETECTION OF CURRENT CHANGE IN AN INTEGRATED CIRCUIT
- Publication number 20140306551
- Publication date Oct 16, 2014
- Franz JOST
- G01 - MEASURING TESTING
Information Patent Application
SEMICONDUCTOR DEVICE AND A METHOD FOR MANUFACTURING A SEMICONDUCTOR...
- Publication number 20140299979
- Publication date Oct 9, 2014
- RENESAS ELECTRONICS CORPORATION
- Tadatoshi DANNO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
BUS BAR, ELECTRONIC COMPONENT, AND MANUFACTURING METHOD OF ELECTRON...
- Publication number 20140284077
- Publication date Sep 25, 2014
- KABUSHIKI KAISHA TOSHIBA
- Tetsuo SAKAI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE AND FABRICATION METHOD THEREOF
- Publication number 20140284803
- Publication date Sep 25, 2014
- Pang-Chun Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE
- Publication number 20140284786
- Publication date Sep 25, 2014
- KABUSHIKI KAISHA TOSHIBA
- Hiroshi Fukuyoshi
- H01 - BASIC ELECTRIC ELEMENTS

Strap connectors

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Package including multiple semiconductor devices

Method for producing a semiconductor arrangement

Method for forming hermetic package for a power semiconductor

Semiconductor arrangement and method for producing the same

Clip bond semiconductor packages and assembly tools

Package including multiple semiconductor devices

Package including multiple semiconductor devices

Power semiconductor device and power conversion device

Package including multiple semiconductor devices

Hermetic package for power semiconductor

Resiliently mounted sensor system with damping

Semiconductor device manufacturing method including forming a wide...

Semiconductor device and power converter

Power semiconductor device and power conversion device

Light emitting apparatus, illumination apparatus and display apparatus

Semiconductor module with reinforcing board

Method for manufacturing semiconductor device

Semiconductor device including a cylindrical electrode inserted int...

Clip-bonded semiconductor chip package using metal bumps and method...

Electronic part mounting heat-dissipating substrate

Light emitting apparatus, illumination apparatus and display apparatus

Dual lead frame semiconductor package and method of manufacture

Power module and power conversion apparatus having a warpage suppre...

Power semiconductor device

Semiconductor device manufacturing method

Detection of current change in an integrated circuit

Power semiconductor device and power conversion device

Semiconductor component having inner and outer semiconductor compon...

Stack die package

Power module for electric power steering and electric power steerin...

Patents Applicationslast 30 patents

METHOD FOR PRODUCING A SEMICONDUCTOR ARRANGEMENT

STRESS ARREST LIP ON COPPER PAD FOR LOW ROUGHNESS COPPER

PACKAGE INCLUDING MULTIPLE SEMICONDUCTOR DEVICES

Method for forming hermetic package for a power semiconductor

PACKAGE INCLUDING MULTIPLE SEMICONDUCTOR DEVICES

Semiconductor Arrangement and Method for Producing the Same

Power Semiconductor Device and Power Conversion Device

PACKAGE INCLUDING MULTIPLE SEMICONDUCTOR DEVICES

SEMICONDUCTOR DEVICE AND SEMICONDUCTOR DEVICE MANUFACTURING METHOD

LIGHT EMITTING APPARATUS, ILLUMINATION APPARATUS AND DISPLAY APPARATUS

Power Semiconductor Device and Power Conversion Device

RESILIENTLY MOUNTED SENSOR SYSTEM WITH DAMPING

CLIP-BONDED SEMICONDUCTOR CHIP PACKAGE USING METAL BUMPS AND METHOD...

POWER SEMICONDUCTOR DEVICE

SEMICONDUCTOR PACKAGE WITH CONDUCTIVE CLIP

SEMICONDUCTOR DEVICE MANUFACTURING METHOD

METHOD FOR MANUFACTURING SEMICONDUCTOR DEVICE

Dual Lead Frame Semiconductor Package and Method of Manufacture

SEMICONDUCTOR DEVICE

POWER MODULE FOR HIGH/LOW VOLTAGE INSULATION

Dual Lead Frame Semiconductor Package and Method of Manufacture

POWER CONTROL DEVICE AND PREPARATION METHOD THEREOF

Dual Lead Frame Semiconductor Package and Method of Manufacture

Semiconductor Power Device Having a Heat Sink

Integrating Multi-Output Power Converters Having Vertically Stacked...

DETECTION OF CURRENT CHANGE IN AN INTEGRATED CIRCUIT

SEMICONDUCTOR DEVICE AND A METHOD FOR MANUFACTURING A SEMICONDUCTOR...

BUS BAR, ELECTRONIC COMPONENT, AND MANUFACTURING METHOD OF ELECTRON...

SEMICONDUCTOR PACKAGE AND FABRICATION METHOD THEREOF

SEMICONDUCTOR DEVICE