Structure of the conductor

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CPC
H05K2201/0332

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HELECTRICITY H05Electric techniques H05KPRINTED CIRCUITS CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS H05K2201/00Indexing scheme relating to printed circuits covered by H05K1/00

Current Industry

H05K2201/0332Structure of the conductor

Industries

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Patents Grantslast 30 patents

Information Patent Grant
Conductive structure including copper-phosphorous alloy and a metho...
- Patent number 12,293,966
- Issue date May 6, 2025
- Chun-Ming Lin
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Conductive structure including copper-phosphorous alloy and a metho...
- Patent number 11,842,958
- Issue date Dec 12, 2023
- Chun-Ming Lin
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Grant
Method for manufacturing flexible display device
- Patent number 11,645,953
- Issue date May 9, 2023
- Innolux Corporation
- Hsin-Hao Huang
- G02 - OPTICS
Information Patent Grant
Plated laminate and printed circuit board
- Patent number 11,499,233
- Issue date Nov 15, 2022
- YMT CO., LTD.
- Sung Wook Chun
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Conductive pattern
- Patent number 11,360,612
- Issue date Jun 14, 2022
- Dongwoo Fine-Chem Co., Ltd.
- Byung Hoon Song
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Flexible display device and method for manufacturing thereof
- Patent number 11,348,489
- Issue date May 31, 2022
- Innolux Corporation
- Hsin-Hao Huang
- G09 - EDUCATION CRYPTOGRAPHY DISPLAY ADVERTISING SEALS
Information Patent Grant
Connecting method, connecting structure and connection terminal ass...
- Patent number 11,024,993
- Issue date Jun 1, 2021
- Japan Aviation Electronics Industry, Limited
- Keisuke Nakamura
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Multilayer wiring substrate
- Patent number 10,959,327
- Issue date Mar 23, 2021
- Murata Manufacturing Co., Ltd.
- Shinichi Araki
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Conductive pattern
- Patent number 10,884,555
- Issue date Jan 5, 2021
- Dongwoo Fine-Chem Co., Ltd.
- Byung Hoon Song
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Printed wiring board
- Patent number 10,492,294
- Issue date Nov 26, 2019
- Fujikura Ltd.
- Yasuo Fukuda
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Tamper detection circuits
- Patent number 10,383,216
- Issue date Aug 13, 2019
- International Business Machines Corporation
- Matthew S. Doyle
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Tamper detection circuits
- Patent number 10,299,366
- Issue date May 21, 2019
- International Business Machines Corporation
- Matthew S. Doyle
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
FLEXIBLE DISPLAY DEVICE AND METHOD FOR MANUFACTURING THEREOF
- Publication number 20220254282
- Publication date Aug 11, 2022
- InnoLux Corporation
- Hsin-Hao Huang
- G02 - OPTICS
Information Patent Application
Flexible display device and method for manufacturing thereof
- Publication number 20210192985
- Publication date Jun 24, 2021
- InnoLux Corporation
- Hsin-Hao Huang
- G02 - OPTICS
Information Patent Application
CONNECTING METHOD, CONNECTING STRUCTURE AND CONNECTION TERMINAL ASS...
- Publication number 20200366011
- Publication date Nov 19, 2020
- Japan Aviation Electronics Industry, Limited
- Keisuke Nakamura
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MULTILAYER WIRING SUBSTRATE
- Publication number 20190269010
- Publication date Aug 29, 2019
- Murata Manufacturing Co., Ltd.
- Shinichi ARAKI
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
PRINTED WIRING BOARD
- Publication number 20180324943
- Publication date Nov 8, 2018
- FUJIKURA LTD.
- Yasuo Fukuda
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
TAMPER DETECTION CIRCUITS
- Publication number 20170042023
- Publication date Feb 9, 2017
- International Business Machines Corporation
- Matthew S. Doyle
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Printed Circuit Board And Method For Fabricating The Same, And Appa...
- Publication number 20150382459
- Publication date Dec 31, 2015
- Shih-Chuan Tsai
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
PRINTED CIRCUIT BOARD AND MANUFACTURING METHOD THEREOF
- Publication number 20150382472
- Publication date Dec 31, 2015
- BOARDTEK ELECTRONICS CORPORATION
- CHIEN-CHENG LEE
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Anode Array
- Publication number 20150237722
- Publication date Aug 20, 2015
- Ruey-Jen Hwu
- H01 - BASIC ELECTRIC ELEMENTS

Structure of the conductor

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Conductive structure including copper-phosphorous alloy and a metho...

Conductive structure including copper-phosphorous alloy and a metho...

Method for manufacturing flexible display device

Plated laminate and printed circuit board

Conductive pattern

Flexible display device and method for manufacturing thereof

Connecting method, connecting structure and connection terminal ass...

Multilayer wiring substrate

Conductive pattern

Printed wiring board

Tamper detection circuits

Tamper detection circuits

Patents Applicationslast 30 patents

FLEXIBLE DISPLAY DEVICE AND METHOD FOR MANUFACTURING THEREOF

Flexible display device and method for manufacturing thereof

CONNECTING METHOD, CONNECTING STRUCTURE AND CONNECTION TERMINAL ASS...

MULTILAYER WIRING SUBSTRATE

PRINTED WIRING BOARD

TAMPER DETECTION CIRCUITS

Printed Circuit Board And Method For Fabricating The Same, And Appa...

PRINTED CIRCUIT BOARD AND MANUFACTURING METHOD THEREOF

Anode Array