Structure, shape, material or disposition of the layer connectors after the connecting process

Industry

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HELECTRICITY H01Electric elements H01LSEMICONDUCTOR DEVICES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR H01L24/00Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto

Current Industry

H01L24/31Structure, shape, material or disposition of the layer connectors after the connecting process

Industries

Patents Grantslast 30 patents

Information Patent Grant
Electronic device
- Patent number 12,107,066
- Issue date Oct 1, 2024
- Innolux Corporation
- Tzu-Min Yan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Thermal interface material layer and use thereof
- Patent number 12,074,087
- Issue date Aug 27, 2024
- Ningbo S J Electronics Co., Ltd.
- Fay Hua
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Manufacturing method and electronic module with new routing possibi...
- Patent number RE49970
- Issue date May 14, 2024
- IMBERATEK, LLC
- Antti Kivikero
Information Patent Grant
Semiconductor package structure on a PCB and semiconductor module i...
- Patent number 11,848,255
- Issue date Dec 19, 2023
- Samsung Electronics Co., Ltd.
- YoungJoon Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electronic device
- Patent number 11,688,710
- Issue date Jun 27, 2023
- Innolux Corporation
- Tzu-Min Yan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Integrated fan-out package and method of fabricating the same
- Patent number 11,282,796
- Issue date Mar 22, 2022
- Taiwan Semiconductor Manufacturing Company, Ltd
- Ming-Yen Chiu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Structure with controlled capillary coverage
- Patent number 11,152,226
- Issue date Oct 19, 2021
- International Business Machines Corporation
- Kevin Drummond
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device including semiconductor chip transmitting sign...
- Patent number 11,049,806
- Issue date Jun 29, 2021
- Renesas Electronics Corporation
- Kazuyuki Nakagawa
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor packages with an intermetallic layer
- Patent number 11,049,833
- Issue date Jun 29, 2021
- Semiconductor Components Industries, LLC
- Michael J. Seddon
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and method of manufacturing the same
- Patent number 11,024,566
- Issue date Jun 1, 2021
- Renesas Electronics Corporation
- Shinichi Uchida
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Manufacturing method and electronic module with new routing possibi...
- Patent number RE48539
- Issue date Apr 27, 2021
- IMBERATEK, LLC
- Antti Kivikero
Information Patent Grant
Integrated fan-out package and method of fabricating the same
- Patent number 10,790,235
- Issue date Sep 29, 2020
- Taiwan Semiconductor Manufacturing Co., Ltd
- Ming-Yen Chiu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package structure and semiconductor module including...
- Patent number 10,720,382
- Issue date Jul 21, 2020
- Samsung Electronics Co., Ltd.
- YoungJoon Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Improving mechanical and thermal reliability in varying form factors
- Patent number 10,629,557
- Issue date Apr 21, 2020
- Veronica A Strong
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Liquid crystal panel, method for fabricating thereof and display ap...
- Patent number 10,606,135
- Issue date Mar 31, 2020
- HUIZHOU CHINA STAR OPTOELECTRONICS TECHNOLOGY CO., LTD.
- Yung-jui Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Methods of forming joint structures for surface mount packages
- Patent number 10,573,622
- Issue date Feb 25, 2020
- Intel Corporation
- Lilia May
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Assembly of printed circuit board and card edge connector for memor...
- Patent number 10,492,298
- Issue date Nov 26, 2019
- Sung-Yu Chen
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Power semiconductor device and method for manufacturing same
- Patent number 10,475,721
- Issue date Nov 12, 2019
- Mitsubishi Electric Corporation
- Yasunari Hino
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Systems, methods, and apparatuses for implementing an organic stiff...
- Patent number 10,475,750
- Issue date Nov 12, 2019
- Intel Corporation
- Vijay K. Nair
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Thermal management devices and systems without a separate wicking s...
- Patent number 10,453,768
- Issue date Oct 22, 2019
- Microsoft Technology Licensing, LLC
- Lincoln Matthew Ghioni
- F28 - HEAT EXCHANGE IN GENERAL
Information Patent Grant
Mounting component, semiconductor device using same, and manufactur...
- Patent number 10,424,555
- Issue date Sep 24, 2019
- Nichia Corporation
- Masatoshi Nakagaki
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electronic device
- Patent number 10,386,398
- Issue date Aug 20, 2019
- NXP B.V.
- Thomas Suwald
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Power semiconductor device and method for manufacturing same
- Patent number 10,283,430
- Issue date May 7, 2019
- Mitsubishi Electric Corporation
- Yasunari Hino
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of manufacturing mounting substrate and mounting substrate m...
- Patent number 10,237,981
- Issue date Mar 19, 2019
- SHARP KABUSHIKI KAISHA
- Katsuhiro Yamaguchi
- G02 - OPTICS
Information Patent Grant
Thermal management devices, systems and methods
- Patent number 10,203,169
- Issue date Feb 12, 2019
- Microsoft Technology Licensing, LLC
- Lincoln Matthew Ghioni
- B82 - NANO-TECHNOLOGY
Information Patent Grant
Semiconductor device and a method of manufacturing the same
- Patent number 10,199,338
- Issue date Feb 5, 2019
- Renesas Electronics Corporation
- Taku Kanaoka
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electronic document such as a chip card with reduced metallization
- Patent number 10,127,490
- Issue date Nov 13, 2018
- IDEMIA FRANCE
- Elodie Gragnic
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Demountable interconnect structure
- Patent number 9,953,910
- Issue date Apr 24, 2018
- General Electric Company
- Charles Gerard Woychik
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package with integrated semiconductor devices and pas...
- Patent number 9,837,393
- Issue date Dec 5, 2017
- Infineon Technologies Americas Corp.
- Martin Standing
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor laser device
- Patent number 9,780,523
- Issue date Oct 3, 2017
- Nichia Corporation
- Hideyuki Fujimoto
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
ELECTRONIC DEVICE
- Publication number 20240429195
- Publication date Dec 26, 2024
- InnoLux Corporation
- Tzu-Min YAN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
LIQUID PHASE BONDING FOR ELECTRICAL INTERCONNECTS IN SEMICONDUCTOR...
- Publication number 20230369277
- Publication date Nov 16, 2023
- SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC
- Michael J. SEDDON
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELECTRONIC DEVICE
- Publication number 20230282606
- Publication date Sep 7, 2023
- InnoLux Corporation
- Tzu-Min YAN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELECTRONIC DOCUMENT MODULE COMPRISING A CHIP AND A CONTACT INTERFAC...
- Publication number 20220318587
- Publication date Oct 6, 2022
- IDEMIA France
- Franck BRICOUT
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
SEMICONDUCTOR PACKAGES WITH AN INTERMETALLIC LAYER
- Publication number 20210327843
- Publication date Oct 21, 2021
- Semiconductor Components Industries, LLC
- Michael J. Seddon
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
STRUCTURE WITH CONTROLLED CAPILLARY COVERAGE
- Publication number 20210111039
- Publication date Apr 15, 2021
- International Business Machines Corporation
- Kevin Drummond
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
THERMOSETTING RESIN COMPOSITION, THERMOSETTING SHEET, SEMICONDUCTOR...
- Publication number 20200172666
- Publication date Jun 4, 2020
- Panasonic Intellectual Property Management Co., Ltd.
- Yasuo FUKUHARA
- C08 - ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-...
Information Patent Application
SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING THE SAME
- Publication number 20200168545
- Publication date May 28, 2020
- RENESAS ELECTRONICS CORPORATION
- Shinichi UCHIDA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ASSEMBLY OF PRINTED CIRCUIT BOARD AND CARD EDGE CONNECTOR FOR MEMOR...
- Publication number 20190350079
- Publication date Nov 14, 2019
- SUNG-YU CHEN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
POWER SEMICONDUCTOR DEVICE AND METHOD FOR MANUFACTURING SAME
- Publication number 20190214326
- Publication date Jul 11, 2019
- Mitsubishi Electric Corporation
- Yasunari HINO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHODS OF FORMING JOINT STRUCTURES FOR SURFACE MOUNT PACKAGES
- Publication number 20190103377
- Publication date Apr 4, 2019
- Lilia May
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SYSTEMS, METHODS, AND APPARATUSES FOR IMPLEMENTING AN ORGANIC STIFF...
- Publication number 20190051615
- Publication date Feb 14, 2019
- Intel Corporation
- Vijay K. NAIR
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MOUNTING COMPONENT, SEMICONDUCTOR DEVICE USING SAME, AND MANUFACTUR...
- Publication number 20190006310
- Publication date Jan 3, 2019
- Nichia Corporation.
- Masatoshi NAKAGAKI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
THERMAL MANAGEMENT DEVICES, SYSTEMS AND METHODS
- Publication number 20180356168
- Publication date Dec 13, 2018
- Microsoft Technology Licensing, LLC
- Lincoln Matthew GHIONI
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Application
THERMAL MANAGEMENT DEVICES AND SYSTEMS WITHOUT A SEPARATE WICKING S...
- Publication number 20180358278
- Publication date Dec 13, 2018
- Microsoft Technology Licensing, LLC
- Lincoln Matthew GHIONI
- F28 - HEAT EXCHANGE IN GENERAL
Information Patent Application
ELECTRONIC DOCUMENT SUCH AS A CHIP CARD WITH REDUCED METALLIZATION
- Publication number 20180189625
- Publication date Jul 5, 2018
- OBERTHUR TECHNOLOGIES
- Elodie GRAGNIC
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
METHOD OF MANUFACTURING MOUNTING SUBSTRATE AND MOUNTING SUBSTRATE M...
- Publication number 20170354041
- Publication date Dec 7, 2017
- SHARP KABUSHIKI KAISHA
- KATSUHIRO YAMAGUCHI
- G02 - OPTICS
Information Patent Application
SEMICONDUCTOR DEVICE AND METHOD FOR MANUFACTURING A SEMICONDUCTOR D...
- Publication number 20150115458
- Publication date Apr 30, 2015
- INFINEON TECHNOLOGIES AG
- Petteri Palm
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Connecting and Bonding Adjacent Layers with Nanostructures
- Publication number 20140360661
- Publication date Dec 11, 2014
- Mohammad Shafiqul Kabir
- B82 - NANO-TECHNOLOGY
Information Patent Application
Power Semiconductor Package
- Publication number 20140319665
- Publication date Oct 30, 2014
- International Rectifier Corporation
- Martin Standing
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Molding Material and Method for Packaging Semiconductor Chips
- Publication number 20140312497
- Publication date Oct 23, 2014
- INFINEON TECHNOLOGIES AG
- Kok Chai Goh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
COMBINING CUT MASK LITHOGRAPHY AND CONVENTIONAL LITHOGRAPHY TO ACHI...
- Publication number 20140312500
- Publication date Oct 23, 2014
- QUALCOMM Incorporated
- John J. Zhu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE AND METHOD OF FORMING THE SAME
- Publication number 20140235017
- Publication date Aug 21, 2014
- Tae-Joo Hwang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
STACKED DIE PACKAGE
- Publication number 20140175670
- Publication date Jun 26, 2014
- Bok Eng Cheah
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND A METHOD OF MANUFACTURING THE SAME
- Publication number 20140159245
- Publication date Jun 12, 2014
- RENESAS ELECTRONICS CORPORATION
- Taku KANAOKA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD OF MANUFACTURING FLIP CHIP PACKAGE
- Publication number 20140030855
- Publication date Jan 30, 2014
- Samsung Electro-Mechanics Co., Ltd.
- Ey Yong KIM
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ASSEMBLY AND PRODUCTION OF AN ASSEMBLY
- Publication number 20140001244
- Publication date Jan 2, 2014
- ROBERT BOSCH GmbH
- Daniel WOLDE-GIORGIS
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
EPOXY-THIOL COMPOSITIONS WITH IMPROVED STABILITY
- Publication number 20130313693
- Publication date Nov 28, 2013
- Henkel Ireland Limited
- Barry N. Burns
- C09 - DYES PAINTS POLISHES NATURAL RESINS ADHESIVES MISCELLANEOUS COMPOSITION...
Information Patent Application
DEVICE AND DEVICE MANUFACTURE METHOD
- Publication number 20130213561
- Publication date Aug 22, 2013
- Jun UTSUMI
- C03 - GLASS MINERAL OR SLAG WOOL
Information Patent Application
SEMICONDUCTOR PACKAGE AND METHOD OF FORMING THE SAME
- Publication number 20130200515
- Publication date Aug 8, 2013
- Tae-Joo Hwang
- H01 - BASIC ELECTRIC ELEMENTS

Structure, shape, material or disposition of the layer connectors after the connecting process

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Electronic device

Thermal interface material layer and use thereof

Manufacturing method and electronic module with new routing possibi...

Semiconductor package structure on a PCB and semiconductor module i...

Electronic device

Integrated fan-out package and method of fabricating the same

Structure with controlled capillary coverage

Semiconductor device including semiconductor chip transmitting sign...

Semiconductor packages with an intermetallic layer

Semiconductor device and method of manufacturing the same

Manufacturing method and electronic module with new routing possibi...

Integrated fan-out package and method of fabricating the same

Semiconductor package structure and semiconductor module including...

Improving mechanical and thermal reliability in varying form factors

Liquid crystal panel, method for fabricating thereof and display ap...

Methods of forming joint structures for surface mount packages

Assembly of printed circuit board and card edge connector for memor...

Power semiconductor device and method for manufacturing same

Systems, methods, and apparatuses for implementing an organic stiff...

Thermal management devices and systems without a separate wicking s...

Mounting component, semiconductor device using same, and manufactur...

Electronic device

Power semiconductor device and method for manufacturing same

Method of manufacturing mounting substrate and mounting substrate m...

Thermal management devices, systems and methods

Semiconductor device and a method of manufacturing the same

Electronic document such as a chip card with reduced metallization

Demountable interconnect structure

Semiconductor package with integrated semiconductor devices and pas...

Semiconductor laser device

Patents Applicationslast 30 patents

ELECTRONIC DEVICE

LIQUID PHASE BONDING FOR ELECTRICAL INTERCONNECTS IN SEMICONDUCTOR...

ELECTRONIC DEVICE

ELECTRONIC DOCUMENT MODULE COMPRISING A CHIP AND A CONTACT INTERFAC...

SEMICONDUCTOR PACKAGES WITH AN INTERMETALLIC LAYER

STRUCTURE WITH CONTROLLED CAPILLARY COVERAGE

THERMOSETTING RESIN COMPOSITION, THERMOSETTING SHEET, SEMICONDUCTOR...

SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING THE SAME

ASSEMBLY OF PRINTED CIRCUIT BOARD AND CARD EDGE CONNECTOR FOR MEMOR...

POWER SEMICONDUCTOR DEVICE AND METHOD FOR MANUFACTURING SAME

METHODS OF FORMING JOINT STRUCTURES FOR SURFACE MOUNT PACKAGES

SYSTEMS, METHODS, AND APPARATUSES FOR IMPLEMENTING AN ORGANIC STIFF...

MOUNTING COMPONENT, SEMICONDUCTOR DEVICE USING SAME, AND MANUFACTUR...

THERMAL MANAGEMENT DEVICES, SYSTEMS AND METHODS

THERMAL MANAGEMENT DEVICES AND SYSTEMS WITHOUT A SEPARATE WICKING S...

ELECTRONIC DOCUMENT SUCH AS A CHIP CARD WITH REDUCED METALLIZATION

METHOD OF MANUFACTURING MOUNTING SUBSTRATE AND MOUNTING SUBSTRATE M...

SEMICONDUCTOR DEVICE AND METHOD FOR MANUFACTURING A SEMICONDUCTOR D...

Connecting and Bonding Adjacent Layers with Nanostructures

Power Semiconductor Package

Molding Material and Method for Packaging Semiconductor Chips

COMBINING CUT MASK LITHOGRAPHY AND CONVENTIONAL LITHOGRAPHY TO ACHI...

SEMICONDUCTOR PACKAGE AND METHOD OF FORMING THE SAME

STACKED DIE PACKAGE

SEMICONDUCTOR DEVICE AND A METHOD OF MANUFACTURING THE SAME

METHOD OF MANUFACTURING FLIP CHIP PACKAGE

ASSEMBLY AND PRODUCTION OF AN ASSEMBLY

EPOXY-THIOL COMPOSITIONS WITH IMPROVED STABILITY

DEVICE AND DEVICE MANUFACTURE METHOD

SEMICONDUCTOR PACKAGE AND METHOD OF FORMING THE SAME