Substrate and well contacts

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CPC
H01L2027/11861

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HELECTRICITY H01Electric elements H01LSEMICONDUCTOR DEVICES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR

Current Industry

H01L2027/11861Substrate and well contacts

Industries

Patents Grantslast 30 patents

Information Patent Grant
Dual power structure with efficient layout
- Patent number 12,142,563
- Issue date Nov 12, 2024
- Taiwan Semiconductor Manufacturing Company Limited
- Shih-Wei Peng
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Semiconductor device and method of manufacturing the same
- Patent number 12,068,326
- Issue date Aug 20, 2024
- Samsung Electronics Co., Ltd.
- Young-Hun Kim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Power distribution network
- Patent number 11,984,443
- Issue date May 14, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd
- Kam-Tou Sio
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Integrated circuit device and method of forming the same
- Patent number 11,955,486
- Issue date Apr 9, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd
- Jhon Jhy Liaw
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device
- Patent number 11,824,059
- Issue date Nov 21, 2023
- Samsung Electronics Co., Ltd.
- Keun Hwi Cho
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Integrated circuits including integrated standard cell structure
- Patent number 11,810,920
- Issue date Nov 7, 2023
- Samsung Electronics Co., Ltd.
- Ji Su Yu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor integrated circuit device
- Patent number 11,764,224
- Issue date Sep 19, 2023
- SOCIONEXT INC.
- Hiroyuki Shimbo
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Integrated circuit
- Patent number 11,710,743
- Issue date Jul 25, 2023
- Taiwan Semiconductor Manufacturing Co., Ltd
- Guo-Huei Wu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Coaxial contacts for 3D logic and memory
- Patent number 11,676,968
- Issue date Jun 13, 2023
- Tokyo Electron Limited
- Lars Liebmann
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device
- Patent number 11,658,075
- Issue date May 23, 2023
- Samsung Electronics Co., Ltd.
- Sangmin Yoo
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Integrated circuit device, method, and system
- Patent number 11,646,317
- Issue date May 9, 2023
- Taiwan Semiconductor Manufacturing Company, Ltd
- Chien Yao Huang
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Semiconductor device and method of manufacturing the same
- Patent number 11,600,639
- Issue date Mar 7, 2023
- Samsung Electronics Co., Ltd.
- Young-Hun Kim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Image sensor including a first and a second isolation layer
- Patent number 11,469,266
- Issue date Oct 11, 2022
- Samsung Electronics Co., Ltd.
- Eun Sub Shim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor integrated circuit device
- Patent number 11,450,688
- Issue date Sep 20, 2022
- SOCIONEXT INC.
- Hiroyuki Shimbo
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Power distribution network
- Patent number 11,444,073
- Issue date Sep 13, 2022
- Taiwan Semiconductor Manufacturing Co., Ltd
- Kam-Tou Sio
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Chip and method for manufacturing a chip
- Patent number 11,410,987
- Issue date Aug 9, 2022
- Infineon Technologies AG
- Thomas Kuenemund
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Integrated circuit cells and related methods
- Patent number 11,302,631
- Issue date Apr 12, 2022
- Taiwan Semiconductor Manufacturing Company Ltd.
- Te-Hsin Chiu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Coaxial contacts for 3D logic and memory
- Patent number 11,251,200
- Issue date Feb 15, 2022
- Tokyo Electron Limited
- Lars Liebmann
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Integrated circuit including interconnection and method of fabricat...
- Patent number 11,189,639
- Issue date Nov 30, 2021
- Samsung Electronics Co., Ltd.
- Ha-young Kim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Integrated circuit including asymmetric ending cells and system-on-...
- Patent number 11,189,640
- Issue date Nov 30, 2021
- Samsung Electronics Co., Ltd.
- Jong-kyu Ryu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Integrated circuit device and method of forming the same
- Patent number 11,094,695
- Issue date Aug 17, 2021
- Taiwan Semiconductor Manufacturing Co., Ltd
- Jhon Jhy Liaw
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device
- Patent number 11,062,961
- Issue date Jul 13, 2021
- Samsung Electronics Co., Ltd.
- Sangmin Yoo
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Integrated device and method of forming the same
- Patent number 10,977,415
- Issue date Apr 13, 2021
- Taiwan Semiconductor Manufacturing Company Ltd.
- Hiranmay Biswas
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Semiconductor integrated circuit device
- Patent number 10,879,270
- Issue date Dec 29, 2020
- SOCIONEXT INC.
- Hiroyuki Shimbo
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Image sensor including a first and a second isolation layer
- Patent number 10,833,117
- Issue date Nov 10, 2020
- Samsung Electronics Co., Ltd.
- Eun Sub Shim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Three-dimensional device and method of forming the same
- Patent number 10,770,479
- Issue date Sep 8, 2020
- Tokyo Electron Limited
- Jeffrey Smith
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Integrated circuit including asymmetric ending cells and system-on-...
- Patent number 10,680,014
- Issue date Jun 9, 2020
- Samsung Electronics Co., Ltd.
- Jong-kyu Ryu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Integrated device and method of forming the same
- Patent number 10,664,641
- Issue date May 26, 2020
- Taiwan Semiconductor Manufacturing Company Ltd.
- Hiranmay Biswas
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Integrated circuit including interconnection and method of fabricat...
- Patent number 10,651,201
- Issue date May 12, 2020
- Samsung Electronics Co., Ltd.
- Ha-young Kim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device
- Patent number 10,403,644
- Issue date Sep 3, 2019
- SOCIONEXT INC.
- Masaki Tamaru
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
INTEGRATED CIRCUIT DEVICE MANUFACTURING METHOD
- Publication number 20240387554
- Publication date Nov 21, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chien Yao HUANG
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
Integrated Circuit Device and Method of Forming the Same
- Publication number 20240274605
- Publication date Aug 15, 2024
- Taiwan Semiconductor Manufacturing Co., LTD
- Jhon Jhy Liaw
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Power Distribution Network
- Publication number 20240266346
- Publication date Aug 8, 2024
- Taiean Semiconductor Manufacturing Company, Ltd.
- Kam-Tou SIO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE
- Publication number 20240038763
- Publication date Feb 1, 2024
- Samsung Electronics Co., Ltd.
- Keun Hwi CHO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTEGRATED CIRCUIT
- Publication number 20230317730
- Publication date Oct 5, 2023
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Guo-Huei WU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE
- Publication number 20230253264
- Publication date Aug 10, 2023
- Samsung Electronics Co., Ltd.
- SANGMIN YOO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING THE SAME
- Publication number 20230215868
- Publication date Jul 6, 2023
- Samsung Electronics Co., Ltd.
- YOUNG-HUN KIM
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTEGRATED CIRCUIT
- Publication number 20220367519
- Publication date Nov 17, 2022
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Guo-Huei WU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE
- Publication number 20220157853
- Publication date May 19, 2022
- Samsung Electronics Co., Ltd.
- Keun Hwi CHO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTEGRATED CIRCUIT
- Publication number 20220093646
- Publication date Mar 24, 2022
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Guo-Huei WU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTEGRATED CIRCUIT INCLUDING ASYMMETRIC ENDING CELLS AND SYSTEM-ON-...
- Publication number 20220059572
- Publication date Feb 24, 2022
- Samsung Electronics Co., Ltd.
- Jong-kyu RYU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTEGRATED CIRCUIT CELLS AND RELATED METHODS
- Publication number 20220037252
- Publication date Feb 3, 2022
- Taiwan Semiconductor Manufacturing company Ltd.
- TE-HSIN CHIU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR INTEGRATED CIRCUIT DEVICE
- Publication number 20210305278
- Publication date Sep 30, 2021
- SOCIONEXT INC.
- Yoko SHIRAKI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTEGRATED CIRCUIT DEVICE, METHOD, AND SYSTEM
- Publication number 20210272984
- Publication date Sep 2, 2021
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Chien Yao HUANG
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
SEMICONDUCTOR DEVICE
- Publication number 20210257264
- Publication date Aug 19, 2021
- Samsung Electronics Co., Ltd.
- SANGMIN YOO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
DUAL POWER STRUCTURE WITH EFFICIENT LAYOUT
- Publication number 20210202384
- Publication date Jul 1, 2021
- Taiwan Semiconductor Manufacturing Company Limited
- Shin-Wei Peng
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
INTEGRATED CIRCUITS INCLUDING INTEGRATED STANDARD CELL STRUCTURE
- Publication number 20210167090
- Publication date Jun 3, 2021
- Samsung Electronics Co., Ltd.
- Ji Su YU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR INTEGRATED CIRCUIT DEVICE
- Publication number 20210104552
- Publication date Apr 8, 2021
- SOCIONEXT INC.
- Hiroyuki SHIMBO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING THE SAME
- Publication number 20210074729
- Publication date Mar 11, 2021
- SAMSUNG SEMICONDUCTOR CO, LTD.
- Young-Hun Kim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
IMAGE SENSOR INCLUDING A FIRST AND A SECOND ISOLATION LAYER
- Publication number 20210013250
- Publication date Jan 14, 2021
- Samsung Electronics Co., Ltd.
- EUN SUB SHIM
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
COAXIAL CONTACTS FOR 3D LOGIC AND MEMORY
- Publication number 20200373330
- Publication date Nov 26, 2020
- Lars Liebmann
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTEGRATED DEVICE AND METHOD OF FORMING THE SAME
- Publication number 20200272782
- Publication date Aug 27, 2020
- Taiwan Semiconductor Manufacturing company Ltd.
- HIRANMAY BISWAS
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
INTEGRATED CIRCUIT INCLUDING INTERCONNECTION AND METHOD OF FABRICAT...
- Publication number 20200235126
- Publication date Jul 23, 2020
- Samsung Electronics Co., Ltd.
- Ha-young KIM
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
IMAGE SENSOR INCLUDING A FIRST AND A SECOND ISOLATION LAYER
- Publication number 20200219910
- Publication date Jul 9, 2020
- Samsung Electronics Co., Ltd.
- EUN SUB SHIM
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE
- Publication number 20200105625
- Publication date Apr 2, 2020
- Samsung Electronics Co., Ltd.
- SANGMIN YOO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING THE SAME
- Publication number 20200043945
- Publication date Feb 6, 2020
- Samsung Electronics Co., Ltd.
- YOUNG-HUN KIM
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
THREE-DIMENSIONAL DEVICE AND METHOD OF FORMING THE SAME
- Publication number 20190288004
- Publication date Sep 19, 2019
- TOKYO ELECTRON LIMITED
- Jeffrey SMITH
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR INTEGRATED CIRCUIT DEVICE
- Publication number 20190172841
- Publication date Jun 6, 2019
- SOCIONEXT INC.
- Keisuke KISHISHITA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTEGRATED DEVICE AND METHOD OF FORMING THE SAME
- Publication number 20190163861
- Publication date May 30, 2019
- Taiwan Semiconductor Manufacturing company Ltd.
- HIRANMAY BISWAS
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
SEMICONDUCTOR INTEGRATED CIRCUIT DEVICE
- Publication number 20190164993
- Publication date May 30, 2019
- SOCIONEXT INC.
- Hiroyuki SHIMBO
- H01 - BASIC ELECTRIC ELEMENTS

Substrate and well contacts

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Dual power structure with efficient layout

Semiconductor device and method of manufacturing the same

Power distribution network

Integrated circuit device and method of forming the same

Semiconductor device

Integrated circuits including integrated standard cell structure

Semiconductor integrated circuit device

Integrated circuit

Coaxial contacts for 3D logic and memory

Semiconductor device

Integrated circuit device, method, and system

Semiconductor device and method of manufacturing the same

Image sensor including a first and a second isolation layer

Semiconductor integrated circuit device

Power distribution network

Chip and method for manufacturing a chip

Integrated circuit cells and related methods

Coaxial contacts for 3D logic and memory

Integrated circuit including interconnection and method of fabricat...

Integrated circuit including asymmetric ending cells and system-on-...

Integrated circuit device and method of forming the same

Semiconductor device

Integrated device and method of forming the same

Semiconductor integrated circuit device

Image sensor including a first and a second isolation layer

Three-dimensional device and method of forming the same

Integrated circuit including asymmetric ending cells and system-on-...

Integrated device and method of forming the same

Integrated circuit including interconnection and method of fabricat...

Semiconductor device

Patents Applicationslast 30 patents

INTEGRATED CIRCUIT DEVICE MANUFACTURING METHOD

Integrated Circuit Device and Method of Forming the Same

Power Distribution Network

SEMICONDUCTOR DEVICE

INTEGRATED CIRCUIT

SEMICONDUCTOR DEVICE

SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING THE SAME

INTEGRATED CIRCUIT

SEMICONDUCTOR DEVICE

INTEGRATED CIRCUIT

INTEGRATED CIRCUIT INCLUDING ASYMMETRIC ENDING CELLS AND SYSTEM-ON-...

INTEGRATED CIRCUIT CELLS AND RELATED METHODS

SEMICONDUCTOR INTEGRATED CIRCUIT DEVICE

INTEGRATED CIRCUIT DEVICE, METHOD, AND SYSTEM

SEMICONDUCTOR DEVICE

DUAL POWER STRUCTURE WITH EFFICIENT LAYOUT

INTEGRATED CIRCUITS INCLUDING INTEGRATED STANDARD CELL STRUCTURE

SEMICONDUCTOR INTEGRATED CIRCUIT DEVICE

SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING THE SAME

IMAGE SENSOR INCLUDING A FIRST AND A SECOND ISOLATION LAYER

COAXIAL CONTACTS FOR 3D LOGIC AND MEMORY

INTEGRATED DEVICE AND METHOD OF FORMING THE SAME

INTEGRATED CIRCUIT INCLUDING INTERCONNECTION AND METHOD OF FABRICAT...

IMAGE SENSOR INCLUDING A FIRST AND A SECOND ISOLATION LAYER

SEMICONDUCTOR DEVICE

SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING THE SAME

THREE-DIMENSIONAL DEVICE AND METHOD OF FORMING THE SAME

SEMICONDUCTOR INTEGRATED CIRCUIT DEVICE

INTEGRATED DEVICE AND METHOD OF FORMING THE SAME

SEMICONDUCTOR INTEGRATED CIRCUIT DEVICE