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CPC
C25D17/08

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CCHEMISTRY METALLURGY C25Electrolytic processing C25DPROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS ELECTROFORMING APPARATUS THEREFOR C25D17/00Constructional parts, or assemblies thereof, of cells for electrolytic coating

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C25D17/08Supporting racks

Industries

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Patents Grantslast 30 patents

Information Patent Grant
Plating apparatus for plating semiconductor wafer and plating method
- Patent number 12,227,867
- Issue date Feb 18, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd
- Chen-Yu Tsai
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Grant
Method of adjusting plating module
- Patent number 12,163,244
- Issue date Dec 10, 2024
- Ebara Corporation
- Yasuyuki Masuda
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Grant
Silver electrolyte for depositing dispersion silver layers and cont...
- Patent number 12,110,606
- Issue date Oct 8, 2024
- Rosenberger Hochfrequenztechnik GmbH & Co. KG
- Andreas Stadler
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Grant
Air bubble removing method of plating apparatus and plating apparatus
- Patent number 12,077,875
- Issue date Sep 3, 2024
- Ebara Corporation
- Kazuhito Tsuji
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Grant
Electroplating apparatus and electroplating method
- Patent number 12,054,846
- Issue date Aug 6, 2024
- Samsung Electronics Co., Ltd.
- Taiseung Cha
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Grant
Dual wafer plating fixture for a continuous plating line
- Patent number 12,024,785
- Issue date Jul 2, 2024
- Maxeon Solar Pte. Ltd.
- Hung-Ming Wang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Systems and methods for manufacturing electrical components using e...
- Patent number 11,970,783
- Issue date Apr 30, 2024
- FABRIC8LABS, INC.
- David Pain
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Grant
Portable and modular production electroplating system
- Patent number 11,939,690
- Issue date Mar 26, 2024
- Snap-on Incorporated
- Kraig A. Tabor
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Grant
Method for plating of tubular workpiece
- Patent number 11,905,612
- Issue date Feb 20, 2024
- Japan Aviation Electronics Industry, Limited
- Takeharu Naito
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Grant
Support devices for supporting implants or prostheses
- Patent number 11,793,615
- Issue date Oct 24, 2023
- LES LABORATOIRES OSTEAL MEDICAL
- Daniel Bouchot
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Grant
Holder for holding substrate and system for plating
- Patent number 11,718,925
- Issue date Aug 8, 2023
- Ebara Corporation
- Shota Moriyama
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Grant
Carrier liquid leakage preventing device and electrochemical deposi...
- Patent number 11,686,010
- Issue date Jun 27, 2023
- BOE Technology Group Co., Ltd.
- Chengfei Wang
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Grant
Dual wafer plating fixture for a continuous plating line
- Patent number 11,598,018
- Issue date Mar 7, 2023
- SunPower Corporation
- Hung-Ming Wang
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Grant
Plating apparatus for plating semiconductor wafer and plating method
- Patent number 11,585,008
- Issue date Feb 21, 2023
- Taiwan Semiconductor Manufacturing Company, Ltd
- Chen-Yu Tsai
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Grant
Assemblies and methods for anodizing a workpiece selectively using...
- Patent number 11,535,948
- Issue date Dec 27, 2022
- Michael Fuschetti
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Grant
Substrate holder and plating apparatus
- Patent number 11,535,949
- Issue date Dec 27, 2022
- Ebara Corporation
- Masaya Seki
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Grant
Apparatuses, systems, and methods for producing a plurality of arti...
- Patent number 11,519,093
- Issue date Dec 6, 2022
- Modumetal, Inc.
- Christina A. Lomasney
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Grant
Plating apparatus
- Patent number 11,434,580
- Issue date Sep 6, 2022
- Ebara Corporation
- Tomonori Hirao
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Grant
Power supply system for a vertical continuous electroplating frame
- Patent number 11,414,775
- Issue date Aug 16, 2022
- U-Pro Machines Co., Ltd.
- Hsin-Chi Iou
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Grant
Surface treatment apparatus and surface treatment method
- Patent number 11,389,818
- Issue date Jul 19, 2022
- C. Uyemura & Co., Ltd.
- Tomoji Okuda
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Grant
Making a flat no-lead package with exposed electroplated side lead...
- Patent number 11,348,806
- Issue date May 31, 2022
- Texas Instruments Incorporated
- Lee Han Meng@ Eugene Lee
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Grant
Holder for holding substrate and system for plating
- Patent number 11,299,817
- Issue date Apr 12, 2022
- Ebara Corporation
- Shota Moriyama
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Grant
Electrode frame
- Patent number 11,293,112
- Issue date Apr 5, 2022
- U-Pro Machines Co., Ltd.
- Hsin-Chi Iou
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Grant
Tubular articles with electrodeposited coatings, and systems and me...
- Patent number 11,286,575
- Issue date Mar 29, 2022
- Modumetal, Inc.
- Christina A. Lomasney
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Grant
Non-permeable substrate carrier for electroplating
- Patent number 11,280,019
- Issue date Mar 22, 2022
- SunPower Corporation
- Emmanuel Chua Abas
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Grant
Substrate holder and plating device
- Patent number 11,280,020
- Issue date Mar 22, 2022
- Ebara Corporation
- Naoki Shimomura
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Grant
Adaptive apparatus for release of trapped gas bubbles and enhanced...
- Patent number 11,274,378
- Issue date Mar 15, 2022
- Engineering and Software System Solutions, Inc.
- Kelly V. Smith
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Grant
Substrate holder and plating apparatus with substrate holder
- Patent number 11,248,308
- Issue date Feb 15, 2022
- Ebara Corporation
- Shoichiro Ogata
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Grant
Plating hanger device having shock-absorbing structure
- Patent number 11,219,131
- Issue date Jan 4, 2022
- NEOPMC CO., LTD.
- Min-Su Bae
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Grant
Masking jig and electroplating apparatus
- Patent number 11,155,929
- Issue date Oct 26, 2021
- Showa Corporation
- Yuki Koike
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR

Patents Applicationslast 30 patents

Information Patent Application
METHOD OF ADJUSTING PLATING MODULE
- Publication number 20250051955
- Publication date Feb 13, 2025
- EBARA CORPORATION
- Yasuyuki Masuda
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Application
Workpiece Holding Jig
- Publication number 20240401222
- Publication date Dec 5, 2024
- C. Uyemura & Co., Ltd.
- Kazuyoshi NISHIMOTO
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Application
Workpiece Holding Jig
- Publication number 20240401221
- Publication date Dec 5, 2024
- C. Uyemura & Co., Ltd.
- Kazuyoshi NISHIMOTO
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Application
ELECTROPLATING APPARATUS AND ELECTROPLATING METHOD
- Publication number 20240368795
- Publication date Nov 7, 2024
- Samsung Electronics Co., Ltd.
- Taiseung Cha
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Application
ELECTROPLATING APPARATUS FOR SURFACE MODIFICATION OF PIPES
- Publication number 20240254650
- Publication date Aug 1, 2024
- DONG-A UNIVERSITY RESEARCH FOUNDATION FOR INDUSTRY ACADEMY COOPERATION
- Jung Han KIM
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Application
SYSTEMS AND METHODS FOR MANUFACTURING ELECTRICAL COMPONENTS USING E...
- Publication number 20240240347
- Publication date Jul 18, 2024
- FABRIC8LABS, INC.
- David Pain
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Application
FILM FORMING METHOD FOR FORMING METAL FILM
- Publication number 20240229278
- Publication date Jul 11, 2024
- Toyota Jidosha Kabushiki Kaisha
- Haruki KONDOH
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Application
PORTABLE AND MODULAR PRODUCTION ELECTROPLATING SYSTEM
- Publication number 20240209541
- Publication date Jun 27, 2024
- Snap-on Incorporated
- Kraig A. Tabor
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Application
METHOD OF ADJUSTING PLATING MODULE
- Publication number 20240183059
- Publication date Jun 6, 2024
- EBARA CORPORATION
- Yasuyuki Masuda
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Application
METHOD, HOLDER AND ADAPTER FOR TREATING MICROCHIP SUBSTRATES
- Publication number 20240150923
- Publication date May 9, 2024
- MTI GmbH
- Markus HACKSTEINER
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Application
FILM FORMING METHOD FOR FORMING METAL FILM
- Publication number 20240133068
- Publication date Apr 25, 2024
- Toyota Jidosha Kabushiki Kaisha
- Haruki KONDOH
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Application
SUBSTRATE HOLDER, APPARATUS FOR PLATING, METHOD OF PLATING AND STOR...
- Publication number 20240035190
- Publication date Feb 1, 2024
- EBARA CORPORATION
- NAOTO TAKAHASHI
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Application
PLATING APPARATUS AND PLATING METHOD
- Publication number 20230399766
- Publication date Dec 14, 2023
- EBARA CORPORATION
- NAOTO TAKAHASHI
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Application
METHOD AND SYSTEM FOR FORMING A MULTILAYERED ZINC ALLOY COATING AND...
- Publication number 20230203698
- Publication date Jun 29, 2023
- Parker Hannifin EMEA S.à.r.l
- Philipp WAGENER
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
DUAL WAFER PLATING FIXTURE FOR A CONTINUOUS PLATING LINE
- Publication number 20230193502
- Publication date Jun 22, 2023
- Maxeon Solar Pte. Ltd
- Hung-Ming Wang
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Application
PLATING APPARATUS FOR PLATING SEMICONDUCTOR WAFER AND PLATING METHOD
- Publication number 20230142163
- Publication date May 11, 2023
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chen-Yu Tsai
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Application
METHOD FOR A CHEMICAL AND/OR ELECTROLYTIC SURFACE TREATMENT OF A SU...
- Publication number 20230095518
- Publication date Mar 30, 2023
- Semsysco GmbH
- Aljbert LJATIFI
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Application
SYSTEMS AND METHODS FOR MANUFACTURING ELECTRICAL COMPONENTS USING E...
- Publication number 20230088962
- Publication date Mar 23, 2023
- FABRIC8LABS, INC.
- David Pain
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Application
ELECTROPLATING APPARATUS AND ELECTROPLATING METHOD
- Publication number 20230083395
- Publication date Mar 16, 2023
- Samsung Electronics Co., Ltd.
- Taiseung Cha
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Application
TSV PROCESS WINDOW AND FILL PERFORMANCE ENHANCEMENT BY LONG PULSING...
- Publication number 20230026818
- Publication date Jan 26, 2023
- LAM RESEARCH CORPORATION
- Jae Shin
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Application
TUBULAR ARTICLES WITH ELECTRODEPOSITED COATINGS, AND SYSTEMS AND ME...
- Publication number 20220396893
- Publication date Dec 15, 2022
- Modumetal, Inc.
- Christina A. LOMASNEY
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Application
PLATING APPARATUS AND PLATING PROCESS METHOD
- Publication number 20220356595
- Publication date Nov 10, 2022
- EBARA CORPORATION
- Shao Hua Chang
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Application
PLATING MACHINE WITH TREATMENT UNITS ARRANGED ON CIRCUMFERENCE
- Publication number 20220341053
- Publication date Oct 27, 2022
- NATIONAL INSTITUTE OF ADVANCED INDUSTRIAL SCIENCE AND TECHNOLOGY
- Shiro HARA
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Application
SUBSTRATE HOLDER AND SUBSTRATE TREATMENT APPARATUS
- Publication number 20220325430
- Publication date Oct 13, 2022
- EBARA CORPORATION
- Masaya SEKI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
LOW ANGLE MEMBRANE FRAME FOR AN ELECTROPLATING CELL
- Publication number 20220298667
- Publication date Sep 22, 2022
- LAM RESEARCH CORPORATION
- Frederick Dean WILMOT
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Application
PLATING APPARATUS FOR PLATING SEMICONDUCTOR WAFER AND PLATING METHOD
- Publication number 20220205126
- Publication date Jun 30, 2022
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chen-Yu Tsai
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Application
HOLDER FOR HOLDING SUBSTRATE AND SYSTEM FOR PLATING
- Publication number 20220186395
- Publication date Jun 16, 2022
- EBARA CORPORATION
- Shota Moriyama
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Application
PRETREATMENT METHOD FOR PRETREATING COMPONENTS PRIOR TO ELECTROPLATING
- Publication number 20220190562
- Publication date Jun 16, 2022
- Christoph Roland Hoelzl
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
CARRIER LIQUID LEAKAGE PREVENTING DEVICE AND ELECTROCHEMICAL DEPOSI...
- Publication number 20220170174
- Publication date Jun 2, 2022
- BOE TECHNOLOGY GROUP CO., LTD.
- Chengfei WANG
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Application
Workpiece Holding Jig and Electroplating Apparatus
- Publication number 20220119980
- Publication date Apr 21, 2022
- C. UYEMURA & CO., LTD
- Masahiro MURAKOSHI
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR

Supporting racks

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Plating apparatus for plating semiconductor wafer and plating method

Method of adjusting plating module

Silver electrolyte for depositing dispersion silver layers and cont...

Air bubble removing method of plating apparatus and plating apparatus

Electroplating apparatus and electroplating method

Dual wafer plating fixture for a continuous plating line

Systems and methods for manufacturing electrical components using e...

Portable and modular production electroplating system

Method for plating of tubular workpiece

Support devices for supporting implants or prostheses

Holder for holding substrate and system for plating

Carrier liquid leakage preventing device and electrochemical deposi...

Dual wafer plating fixture for a continuous plating line

Plating apparatus for plating semiconductor wafer and plating method

Assemblies and methods for anodizing a workpiece selectively using...

Substrate holder and plating apparatus

Apparatuses, systems, and methods for producing a plurality of arti...

Plating apparatus

Power supply system for a vertical continuous electroplating frame

Surface treatment apparatus and surface treatment method

Making a flat no-lead package with exposed electroplated side lead...

Holder for holding substrate and system for plating

Electrode frame

Tubular articles with electrodeposited coatings, and systems and me...

Non-permeable substrate carrier for electroplating

Substrate holder and plating device

Adaptive apparatus for release of trapped gas bubbles and enhanced...

Substrate holder and plating apparatus with substrate holder

Plating hanger device having shock-absorbing structure

Masking jig and electroplating apparatus

Patents Applicationslast 30 patents

METHOD OF ADJUSTING PLATING MODULE

Workpiece Holding Jig

Workpiece Holding Jig

ELECTROPLATING APPARATUS AND ELECTROPLATING METHOD

ELECTROPLATING APPARATUS FOR SURFACE MODIFICATION OF PIPES

SYSTEMS AND METHODS FOR MANUFACTURING ELECTRICAL COMPONENTS USING E...

FILM FORMING METHOD FOR FORMING METAL FILM

PORTABLE AND MODULAR PRODUCTION ELECTROPLATING SYSTEM

METHOD OF ADJUSTING PLATING MODULE

METHOD, HOLDER AND ADAPTER FOR TREATING MICROCHIP SUBSTRATES

FILM FORMING METHOD FOR FORMING METAL FILM

SUBSTRATE HOLDER, APPARATUS FOR PLATING, METHOD OF PLATING AND STOR...

PLATING APPARATUS AND PLATING METHOD

METHOD AND SYSTEM FOR FORMING A MULTILAYERED ZINC ALLOY COATING AND...

DUAL WAFER PLATING FIXTURE FOR A CONTINUOUS PLATING LINE

PLATING APPARATUS FOR PLATING SEMICONDUCTOR WAFER AND PLATING METHOD

METHOD FOR A CHEMICAL AND/OR ELECTROLYTIC SURFACE TREATMENT OF A SU...

SYSTEMS AND METHODS FOR MANUFACTURING ELECTRICAL COMPONENTS USING E...

ELECTROPLATING APPARATUS AND ELECTROPLATING METHOD

TSV PROCESS WINDOW AND FILL PERFORMANCE ENHANCEMENT BY LONG PULSING...

TUBULAR ARTICLES WITH ELECTRODEPOSITED COATINGS, AND SYSTEMS AND ME...

PLATING APPARATUS AND PLATING PROCESS METHOD

PLATING MACHINE WITH TREATMENT UNITS ARRANGED ON CIRCUMFERENCE

SUBSTRATE HOLDER AND SUBSTRATE TREATMENT APPARATUS

LOW ANGLE MEMBRANE FRAME FOR AN ELECTROPLATING CELL

PLATING APPARATUS FOR PLATING SEMICONDUCTOR WAFER AND PLATING METHOD

HOLDER FOR HOLDING SUBSTRATE AND SYSTEM FOR PLATING

PRETREATMENT METHOD FOR PRETREATING COMPONENTS PRIOR TO ELECTROPLATING

CARRIER LIQUID LEAKAGE PREVENTING DEVICE AND ELECTROCHEMICAL DEPOSI...

Workpiece Holding Jig and Electroplating Apparatus