Surface mounted metallic pins

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CPC
H05K2201/10318

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HELECTRICITY H05Electric techniques H05KPRINTED CIRCUITS CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS H05K2201/00Indexing scheme relating to printed circuits covered by H05K1/00

Current Industry

H05K2201/10318Surface mounted metallic pins

Industries

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Patents Grantslast 30 patents

Information Patent Grant
Module
- Patent number 12,193,162
- Issue date Jan 7, 2025
- Murata Manufacturing Co., Ltd.
- Yoshihito Otsubo
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Interconnect and method for manufacturing the same
- Patent number 12,171,064
- Issue date Dec 17, 2024
- Raytheon Company
- Brandon W. Pillans
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Heater control circuitry for vaporizer device
- Patent number 12,156,536
- Issue date Dec 3, 2024
- PAX LABS, INC.
- Joshua Fu
- A24 - TOBACCO CIGARS CIGARETTES SMOKERS' REQUISITES
Information Patent Grant
Vaporizer device body
- Patent number 12,108,785
- Issue date Oct 8, 2024
- PAX LABS, INC.
- Joshua Fu
- A24 - TOBACCO CIGARS CIGARETTES SMOKERS' REQUISITES
Information Patent Grant
Vaporizer device with differential pressure sensor
- Patent number 12,102,117
- Issue date Oct 1, 2024
- PAX LABS, INC.
- Joshua Fu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electronic assembly including cable modules
- Patent number 12,089,357
- Issue date Sep 10, 2024
- TE CONNECTIVITY SOLUTIONS GmbH
- Christopher William Blackburn
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Identification of a cartridge for a vaporizer device
- Patent number 12,029,237
- Issue date Jul 9, 2024
- PAX LABS, INC.
- Joshua Fu
- G08 - SIGNALLING
Information Patent Grant
Power electronics unit comprising a circuit board and a power modul...
- Patent number 11,990,697
- Issue date May 21, 2024
- Audi AG
- Andreas Apelsmeier
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Surface mount pads for next generation speeds
- Patent number 11,882,655
- Issue date Jan 23, 2024
- Dell Products L.P.
- Umesh Chandra
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Gantry for thermal management
- Patent number 11,849,536
- Issue date Dec 19, 2023
- Lunar Energy, Inc.
- Charles Ingalz
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Circuit board assembly, display apparatus, terminal, and signal pro...
- Patent number 11,839,026
- Issue date Dec 5, 2023
- Chengdu BOE Optoelectronics Technology Co., Ltd.
- Zhongjie Wang
- G09 - EDUCATION CRYPTOGRAPHY DISPLAY ADVERTISING SEALS
Information Patent Grant
Thermal dissipation and shielding improvement using merged PCB bott...
- Patent number 11,723,143
- Issue date Aug 8, 2023
- Avago Technologies International Sales Pte. Limited
- Chang Kyu Choi
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Vaporizer cartridge for a vaporizer
- Patent number 11,666,086
- Issue date Jun 6, 2023
- JUUL Labs, Inc.
- Joshua Fu
- A24 - TOBACCO CIGARS CIGARETTES SMOKERS' REQUISITES
Information Patent Grant
Heater control circuitry for vaporizer device
- Patent number 11,638,443
- Issue date May 2, 2023
- JUUL Labs, Inc.
- Joshua Fu
- A24 - TOBACCO CIGARS CIGARETTES SMOKERS' REQUISITES
Information Patent Grant
Vaporizer device body
- Patent number 11,632,983
- Issue date Apr 25, 2023
- JUUL Labs, Inc.
- Joshua Fu
- A24 - TOBACCO CIGARS CIGARETTES SMOKERS' REQUISITES
Information Patent Grant
Power module having metallic heat-dissipation substrate
- Patent number 11,622,475
- Issue date Apr 4, 2023
- Delta Electronics, Inc.
- Da Jin
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Power module package and method of manufacturing the same
- Patent number 11,615,967
- Issue date Mar 28, 2023
- Semiconductor Components Industries, LLC
- Keunhyuk Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Vaporizer device with differential pressure sensor
- Patent number 11,606,970
- Issue date Mar 21, 2023
- JUUL Labs, Inc.
- Joshua Fu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electric drive device and electric power steering device
- Patent number 11,606,000
- Issue date Mar 14, 2023
- Hitachi Astemo, Ltd.
- Keiji Hamada
- B62 - LAND VEHICLES FOR TRAVELLING OTHERWISE THAN ON RAILS
Information Patent Grant
Socket alignment and retention system
- Patent number 11,503,732
- Issue date Nov 15, 2022
- TE CONNECTIVITY SOLUTIONS GmbH
- Brian Patrick Costello
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electronic assembly including cable modules
- Patent number 11,477,904
- Issue date Oct 18, 2022
- TE CONNECTIVITY SOLUTIONS GmbH
- Christopher William Blackburn
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Camera head
- Patent number 11,395,406
- Issue date Jul 19, 2022
- SCOUTCAM LTD.
- Amir Govrin
- H04 - ELECTRIC COMMUNICATION TECHNIQUE
Information Patent Grant
Touch display device and touch display module
- Patent number 11,231,797
- Issue date Jan 25, 2022
- Opto Plus LED Corp.
- Chien-Wen Chen
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Display panel and chip-on-film (COF) package bonding structure, pan...
- Patent number 11,184,982
- Issue date Nov 23, 2021
- WUHAN CHINA STAR OPTOELECTRONICS SEMICONDUCTOR DISPLAY TECHNOLOGY CO., LTD.
- Peiqian Tong
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Printed circuit board assembly
- Patent number 11,184,979
- Issue date Nov 23, 2021
- Phoenix Contact GmbH & Co. KG
- Werner Schäfertöns
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electronic device
- Patent number 11,166,372
- Issue date Nov 2, 2021
- Murata Manufacturing Co., Ltd.
- Junya Yamamoto
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Voltage regulator module
- Patent number 11,166,373
- Issue date Nov 2, 2021
- Delta Electronics, Inc.
- Yahong Xiong
- H02 - GENERATION CONVERSION OR DISTRIBUTION OF ELECTRIC POWER
Information Patent Grant
Appliance control module with in-molded electronics
- Patent number 11,162,203
- Issue date Nov 2, 2021
- Haier US Appliance Solutions, Inc.
- Donald James Leisl
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Power delivery module for an electronic package
- Patent number 11,129,290
- Issue date Sep 21, 2021
- TE CONNECTIVITY SERVICES GMBH
- Brian Patrick Costello
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Power module having metallic heat-dissipation substrate
- Patent number 11,122,714
- Issue date Sep 14, 2021
- Delta Electronics, Inc.
- Da Jin
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR

Patents Applicationslast 30 patents

Information Patent Application
INTERLINKED GROUND WELLS WITH SPECIALIZED PATTERNS FOR LIQUID METAL...
- Publication number 20250014980
- Publication date Jan 9, 2025
- Intel Corporation
- Eric ERIKE
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
LIQUID METAL PATCH INTERCONNECT FOR LARGE WARPAGE COMPONENTS
- Publication number 20240388018
- Publication date Nov 21, 2024
- Intel Corporation
- Karumbu MEYYAPPAN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELECTRONIC DEVICE COMPRISING PLURALITY OF PRINTED CIRCUIT BOARDS
- Publication number 20240334588
- Publication date Oct 3, 2024
- Samsung Electronics Co., Ltd.
- Jichul KIM
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
CIRCUIT BOARD, CHIP ON FILM, DISPLAY APPARATUS AND BONDING METHOD
- Publication number 20240298403
- Publication date Sep 5, 2024
- HEFEI BOE DISPLAY TECHNOLOGY CO., LTD.
- Yunyun LIANG
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
CIRCUIT MODULE
- Publication number 20240235071
- Publication date Jul 11, 2024
- Murata Manufacturing Co., Ltd.
- Yoshihito OTSUBO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
NON-UNIFORM SURFACE MOUNT PADS
- Publication number 20240164018
- Publication date May 16, 2024
- Dell Products L.P.
- Umesh CHANDRA
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
SUBSTRATE STRUCTURE CONNECTED ON BASIS OF SOLDER BALL AND ELASTIC BODY
- Publication number 20240147619
- Publication date May 2, 2024
- Samsung Electronics Co., Ltd.
- Jongwan SHIM
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
CIRCUIT MODULE
- Publication number 20240136739
- Publication date Apr 25, 2024
- Murata Manufacturing Co., Ltd.
- Yoshihito OTSUBO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
POWER CONVERTER, INTER-COMPONENT CONNECTION SYSTEM, AND INTER-COMPO...
- Publication number 20240088588
- Publication date Mar 14, 2024
- Panasonic Intellectual Property Management Co., Ltd.
- MOTOHIKO FUJIMURA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PCB PAD FOR SMT PROCESS
- Publication number 20240064896
- Publication date Feb 22, 2024
- Delta Electronics, Inc.
- Heng-Chao CHEN
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
LAYOUT FOR DUAL IN-LINE MEMORY TO SUPPORT 128-BYTE CACHE LINE PROCE...
- Publication number 20230132146
- Publication date Apr 27, 2023
- TACHYUM LTD.
- Radoslav DANILAK
- G11 - INFORMATION STORAGE
Information Patent Application
MODULE
- Publication number 20230105809
- Publication date Apr 6, 2023
- Murata Manufacturing Co., Ltd.
- Yoshihito OTSUBO
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
PRINTED CIRCUIT BOARD CORNER CONNECTION
- Publication number 20230061365
- Publication date Mar 2, 2023
- INTERPLEX NAS ELECTRONICS GMBH
- Hans-Jörg HAHN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Power Semiconductor Module with Accessible Metal Clips
- Publication number 20230048878
- Publication date Feb 16, 2023
- Hitachi Energy Switzerland AG
- Juergen Schuderer
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELECTRONIC ASSEMBLY INCLUDING CABLE MODULES
- Publication number 20230025397
- Publication date Jan 26, 2023
- TE Connectivity Solutions GMBH
- Christopher William Blackburn
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SOCKET ALIGNMENT AND RETENTION SYSTEM
- Publication number 20220354013
- Publication date Nov 3, 2022
- TE Connectivity Services GmbH
- Brian Patrick Costello
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Interconnect and Method for Manufacturing the Same
- Publication number 20220287179
- Publication date Sep 8, 2022
- Raytheon Company
- Brandon W. Pillans
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CIRCUIT BOARD ASSEMBLY, DISPLAY APPARATUS, TERMINAL, AND SIGNAL PRO...
- Publication number 20220256703
- Publication date Aug 11, 2022
- CHENGDU BOE OPTOELECTRONICS TECHNOLOGY CO., LTD.
- Zhongjie WANG
- G09 - EDUCATION CRYPTOGRAPHY DISPLAY ADVERTISING SEALS
Information Patent Application
SURFACE MOUNT PADS FOR NEXT GENERATION SPEEDS
- Publication number 20210378094
- Publication date Dec 2, 2021
- Dell Products L.P.
- Umesh CHANDRA
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
ELECTRONIC ASSEMBLY INCLUDING CABLE MODULES
- Publication number 20210274673
- Publication date Sep 2, 2021
- TE CONNECTIVITY CORPORATION
- Christopher William Blackburn
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELECTRIC DRIVE DEVICE AND ELECTRIC POWER STEERING DEVICE
- Publication number 20210226507
- Publication date Jul 22, 2021
- Hitachi Automotive Systems, Ltd.
- Keiji HAMADA
- B62 - LAND VEHICLES FOR TRAVELLING OTHERWISE THAN ON RAILS
Information Patent Application
DISPLAY PANEL AND CHIP-ON-FILM (COF) PACKAGE BONDING STRUCTURE, PAN...
- Publication number 20210212213
- Publication date Jul 8, 2021
- WUHAN CHINA STAR OPTOELECTRONICS SEMICONDUCTOR DISPLAY TECHNOLOGY CO., LTD.
- Peiqian TONG
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
PRINTED CIRCUIT BOARD ASSEMBLY
- Publication number 20210100102
- Publication date Apr 1, 2021
- Phoenix Contact GmbH & Co. KG
- Werner SCHÄFERTÖNS
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CAMERA HEAD
- Publication number 20210084766
- Publication date Mar 18, 2021
- MEDIGUS LTD.
- Amir GOVRIN
- H04 - ELECTRIC COMMUNICATION TECHNIQUE
Information Patent Application
POWER DELIVERY MODULE FOR AN ELECTRONIC PACKAGE
- Publication number 20200375053
- Publication date Nov 26, 2020
- TE Connectivity Corporation
- Brian Patrick Costello
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
TOUCH DISPLAY DEVICE AND TOUCH DISPLAY MODULE
- Publication number 20200333908
- Publication date Oct 22, 2020
- Opto Plus LED Corp.
- Chien-Wen CHEN
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
VOLTAGE REGULATOR MODULE
- Publication number 20200113053
- Publication date Apr 9, 2020
- Delta Electronics, Inc.
- Yahong Xiong
- H02 - GENERATION CONVERSION OR DISTRIBUTION OF ELECTRIC POWER
Information Patent Application
ELECTRONIC DEVICE
- Publication number 20200045819
- Publication date Feb 6, 2020
- Murata Manufacturing Co., Ltd.
- Junya YAMAMOTO
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
APPLIANCE CONTROL MODULE WITH IN-MOLDED ELECTRONICS
- Publication number 20200018004
- Publication date Jan 16, 2020
- Donald James Leisl
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
MODULE
- Publication number 20200008325
- Publication date Jan 2, 2020
- Murata Manufacturing Co., Ltd.
- Yoshihito OTSUBO
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR

Surface mounted metallic pins

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Module

Interconnect and method for manufacturing the same

Heater control circuitry for vaporizer device

Vaporizer device body

Vaporizer device with differential pressure sensor

Electronic assembly including cable modules

Identification of a cartridge for a vaporizer device

Power electronics unit comprising a circuit board and a power modul...

Surface mount pads for next generation speeds

Gantry for thermal management

Circuit board assembly, display apparatus, terminal, and signal pro...

Thermal dissipation and shielding improvement using merged PCB bott...

Vaporizer cartridge for a vaporizer

Heater control circuitry for vaporizer device

Vaporizer device body

Power module having metallic heat-dissipation substrate

Power module package and method of manufacturing the same

Vaporizer device with differential pressure sensor

Electric drive device and electric power steering device

Socket alignment and retention system

Electronic assembly including cable modules

Camera head

Touch display device and touch display module

Display panel and chip-on-film (COF) package bonding structure, pan...

Printed circuit board assembly

Electronic device

Voltage regulator module

Appliance control module with in-molded electronics

Power delivery module for an electronic package

Power module having metallic heat-dissipation substrate

Patents Applicationslast 30 patents

INTERLINKED GROUND WELLS WITH SPECIALIZED PATTERNS FOR LIQUID METAL...

LIQUID METAL PATCH INTERCONNECT FOR LARGE WARPAGE COMPONENTS

ELECTRONIC DEVICE COMPRISING PLURALITY OF PRINTED CIRCUIT BOARDS

CIRCUIT BOARD, CHIP ON FILM, DISPLAY APPARATUS AND BONDING METHOD

CIRCUIT MODULE

NON-UNIFORM SURFACE MOUNT PADS

SUBSTRATE STRUCTURE CONNECTED ON BASIS OF SOLDER BALL AND ELASTIC BODY

CIRCUIT MODULE

POWER CONVERTER, INTER-COMPONENT CONNECTION SYSTEM, AND INTER-COMPO...

PCB PAD FOR SMT PROCESS

LAYOUT FOR DUAL IN-LINE MEMORY TO SUPPORT 128-BYTE CACHE LINE PROCE...

MODULE

PRINTED CIRCUIT BOARD CORNER CONNECTION

Power Semiconductor Module with Accessible Metal Clips

ELECTRONIC ASSEMBLY INCLUDING CABLE MODULES

SOCKET ALIGNMENT AND RETENTION SYSTEM

Interconnect and Method for Manufacturing the Same

CIRCUIT BOARD ASSEMBLY, DISPLAY APPARATUS, TERMINAL, AND SIGNAL PRO...

SURFACE MOUNT PADS FOR NEXT GENERATION SPEEDS

ELECTRONIC ASSEMBLY INCLUDING CABLE MODULES

ELECTRIC DRIVE DEVICE AND ELECTRIC POWER STEERING DEVICE

DISPLAY PANEL AND CHIP-ON-FILM (COF) PACKAGE BONDING STRUCTURE, PAN...

PRINTED CIRCUIT BOARD ASSEMBLY

CAMERA HEAD

POWER DELIVERY MODULE FOR AN ELECTRONIC PACKAGE

TOUCH DISPLAY DEVICE AND TOUCH DISPLAY MODULE

VOLTAGE REGULATOR MODULE

ELECTRONIC DEVICE

APPLIANCE CONTROL MODULE WITH IN-MOLDED ELECTRONICS

MODULE