Tape automated bonding [TAB] connectors

Industry

CPC
H01L24/50

This industry / category may be too specific. Please go to a parent level for more data

Parent Industries

HELECTRICITY H01Electric elements H01LSEMICONDUCTOR DEVICES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR H01L24/00Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto

Current Industry

H01L24/50Tape automated bonding [TAB] connectors

Industries

Patents Grantslast 30 patents

Information Patent Grant
Semiconductor device package assemblies with direct leadframe attac...
- Patent number 11,901,309
- Issue date Feb 13, 2024
- SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC
- Seungwon Im
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for manufacturing mounting structure for electronic componen...
- Patent number 11,881,470
- Issue date Jan 23, 2024
- Japan Aviation Electronics Industry, Limited
- Ryosuke Mitsui
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Chip packaging device, chip packaging method, and package chip
- Patent number 11,764,184
- Issue date Sep 19, 2023
- HOSIN GLOBAL ELECTRONICS CO., LTD
- Chen-Nan Lai
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Tape carrier assemblies having an integrated adhesive film
- Patent number 11,764,133
- Issue date Sep 19, 2023
- Daewon Semiconductor Packaging Industrial Company
- Sunna Chung
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Display device having at least four overlapping display panels
- Patent number 11,647,663
- Issue date May 9, 2023
- Semiconductor Energy Laboratory Co., Ltd.
- Hiroyuki Miyake
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Chip package structure and method of forming the same
- Patent number 11,610,864
- Issue date Mar 21, 2023
- Taiwan Semiconductor Manufacturing Co., Ltd
- Shuo-Mao Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Structure and method for isolation of bit-line drivers for a three-...
- Patent number 11,538,780
- Issue date Dec 27, 2022
- Yangtze Memory Technologies Co., Ltd.
- Liang Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Interconnect structure, semiconductor structure including interconn...
- Patent number 11,532,580
- Issue date Dec 20, 2022
- Taiwan Semiconductor Manufacturing Company Ltd.
- Jung-Chou Tsai
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Impedance controlled electrical interconnection employing meta-mate...
- Patent number 11,456,255
- Issue date Sep 27, 2022
- Taiwan Semiconductor Manufacturing Company, Ltd
- Christopher Wyland
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Bonding and indexing apparatus
- Patent number 11,362,058
- Issue date Jun 14, 2022
- Nexperia B.V.
- Ralph Huybers
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Tape carrier assemblies having an integrated adhesive film
- Patent number 11,362,025
- Issue date Jun 14, 2022
- Daewon Semiconductor Packaging Industrial Company
- Sunna Chung
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Mask-integrated surface protective tape with release liner
- Patent number 11,282,736
- Issue date Mar 22, 2022
- Furukawa Electric Co., Ltd.
- Yukihiro Matsubara
- C08 - ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-...
Information Patent Grant
Array substrate, display panel and display device
- Patent number 11,201,173
- Issue date Dec 14, 2021
- Hefei Xinsheng Optoelectronics Technology Co., Ltd.
- Mookeun Shin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor structure
- Patent number 11,145,617
- Issue date Oct 12, 2021
- Winbond Electronics Corp.
- Yu-Ming Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Image pickup apparatus, endoscope, and method for manufacturing ima...
- Patent number 11,134,829
- Issue date Oct 5, 2021
- Olympus Corporation
- Takuro Suyama
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Mounting structures for integrated device packages
- Patent number 11,127,716
- Issue date Sep 21, 2021
- Analog Devices International Unlimited Company
- Rigan McGeehan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Display device and electronic device having multiple overlapping di...
- Patent number 11,069,747
- Issue date Jul 20, 2021
- Semiconductor Energy Laboratory Co., Ltd.
- Hiroyuki Miyake
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Conductive paste and solar cell
- Patent number 11,049,983
- Issue date Jun 29, 2021
- Namics Corporation
- Seiya Konno
- C03 - GLASS MINERAL OR SLAG WOOL
Information Patent Grant
Polyimide film for semiconductor package reflow process, and manufa...
- Patent number 11,015,089
- Issue date May 25, 2021
- IPI TECH INC.
- Kye-Ung Lee
- B32 - LAYERED PRODUCTS
Information Patent Grant
Chip-on film and display device including the same
- Patent number 10,971,438
- Issue date Apr 6, 2021
- LG Display Co., Ltd.
- Jihun Song
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device packaging assembly, lead frame strip and unit...
- Patent number 10,957,633
- Issue date Mar 23, 2021
- Infineon Technologies AG
- Boon Teik Tee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
High-speed, high-resolution electrophysiology in-vivo using conform...
- Patent number 10,918,298
- Issue date Feb 16, 2021
- The Board of Trustees of the University of Illinois
- John A. Rogers
- A61 - MEDICAL OR VETERINARY SCIENCE HYGIENE
Information Patent Grant
Multi-stacked die package with flexible interconnect
- Patent number 10,892,248
- Issue date Jan 12, 2021
- Intel Corporation
- Hyoung Il Kim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Display device
- Patent number 10,833,000
- Issue date Nov 10, 2020
- Samsung Display Co., Ltd.
- Myong-soo Oh
- G02 - OPTICS
Information Patent Grant
Display device
- Patent number 10,747,038
- Issue date Aug 18, 2020
- Samsung Display Co., Ltd.
- Hae-Kwan Seo
- G09 - EDUCATION CRYPTOGRAPHY DISPLAY ADVERTISING SEALS
Information Patent Grant
Chip-on-film package structure and display device
- Patent number 10,692,807
- Issue date Jun 23, 2020
- Au Optronics Corporation
- Chang-Hui Wu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Power electronics assembly having an adhesion layer, and method for...
- Patent number 10,665,562
- Issue date May 26, 2020
- Semikron Elektronik GmbH & Co. KG
- Ulrich Sagebaum
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Display device and electronic device having multiple overlapping di...
- Patent number 10,642,314
- Issue date May 5, 2020
- Semiconductor Energy Laboratory Co., Ltd.
- Hiroyuki Miyake
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
High-density interconnecting adhesive tape
- Patent number 10,622,311
- Issue date Apr 14, 2020
- International Business Machines Corporation
- Akihiro Horibe
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Apparatus for the material-bonded connection of connection partners...
- Patent number 10,603,741
- Issue date Mar 31, 2020
- Semikron Elektronik GmbH & Co., KG
- Ingo Bogen
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR

Patents Applicationslast 30 patents

Information Patent Application
DISPLAY DEVICE AND ELECTRONIC DEVICE
- Publication number 20230255089
- Publication date Aug 10, 2023
- Semiconductor Energy Laboratory Co., Ltd.
- Hiroyuki MIYAKE
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
STRUCTURE AND METHOD FOR ISOLATION OF BIT-LINE DRIVERS FOR A THREE-...
- Publication number 20230078865
- Publication date Mar 16, 2023
- Yangtze Memory Technologies Co., Ltd.
- Liang Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Impedance Controlled Electrical Interconnection Employing Meta-Mate...
- Publication number 20230020310
- Publication date Jan 19, 2023
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Christopher Wyland
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTERCONNECT STRUCTURE AND METHOD FOR FORMING THE SAME
- Publication number 20220344293
- Publication date Oct 27, 2022
- Taiwan Semiconductor Manufacturing company Ltd.
- JUNG-CHOU TSAI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
STRUCTURE AND METHOD FOR ISOLATION OF BIT-LINE DRIVERS FOR A THREE-...
- Publication number 20220328441
- Publication date Oct 13, 2022
- Yangtze Memory Technologies Co., Ltd.
- Liang Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE PACKAGE WITH CONDUCTIVE VIAS AND METHOD OF MAN...
- Publication number 20220319963
- Publication date Oct 6, 2022
- STMicroelectronics Pte Ltd
- Jing-En LUAN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
BONDING AND INDEXING METHOD
- Publication number 20220310553
- Publication date Sep 29, 2022
- NEXPERIA B.V.
- Ralph HUYBERS
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
TAPE CARRIER ASSEMBLIES HAVING AN INTEGRATED ADHESIVE FILM
- Publication number 20220310494
- Publication date Sep 29, 2022
- Daewon Semiconductor Packaging Industrial Company
- Sunna Chung
- B29 - WORKING OF PLASTICS WORKING OF SUBSTANCES IN A PLASTIC STATE, IN GENERAL
Information Patent Application
DISPLAY DEVICE AND ELECTRONIC DEVICE
- Publication number 20220013591
- Publication date Jan 13, 2022
- Semiconductor Energy Laboratory Co., Ltd.
- Hiroyuki MIYAKE
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
STACKED MODULE PACKAGE INTERCONNECT STRUCTURE WITH FLEX CABLE
- Publication number 20210296280
- Publication date Sep 23, 2021
- QUALCOMM Incorporated
- Aniket PATIL
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD FOR MANUFACTURING MOUNTING STRUCTURE FOR ELECTRONIC COMPONEN...
- Publication number 20210193612
- Publication date Jun 24, 2021
- Japan Aviation Electronics Industry, Limited
- Ryosuke MITSUI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE PACKAGE ASSEMBLIES AND METHODS OF MANUFACTURE
- Publication number 20210143107
- Publication date May 13, 2021
- Semiconductor Components Industries, LLC
- Seungwon IM
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
STRUCTURE AND METHOD FOR ISOLATION OF BIT-LINE DRIVERS FOR A THREE-...
- Publication number 20210111137
- Publication date Apr 15, 2021
- Yangtze Memory Technologies Co., Ltd.
- Liang Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CHIP PACKAGE STRUCTURE AND METHOD OF FORMING THE SAME
- Publication number 20210074682
- Publication date Mar 11, 2021
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Shuo-Mao CHEN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTERCONNECT STRUCTURE, SEMICONDUCTOR STRUCTURE INCLUDING INTERCONN...
- Publication number 20210066223
- Publication date Mar 4, 2021
- Taiwan Semiconductor Manufacturing company Ltd.
- JUNG-CHOU TSAI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
DISPLAY DEVICE AND ELECTRONIC DEVICE
- Publication number 20200257337
- Publication date Aug 13, 2020
- Semiconductor Energy Laboratory Co., Ltd.
- Hiroyuki MIYAKE
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
CHIP-ON-FILM PACKAGE STRUCTURE AND DISPLAY DEVICE
- Publication number 20200152553
- Publication date May 14, 2020
- AU OPTRONICS CORPORATION
- Chang-Hui Wu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Impedance Controlled Electrical Interconnection Employing Meta-Mate...
- Publication number 20200083171
- Publication date Mar 12, 2020
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Christopher Wyland
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MASK-INTEGRATED SURFACE PROTECTIVE TAPE WITH RELEASE LINER
- Publication number 20200017728
- Publication date Jan 16, 2020
- FURUKAWA ELECTRIC CO., LTD.
- Yukihiro MATSUBARA
- C08 - ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-...
Information Patent Application
ARRAY SUBSTRATE, DISPLAY PANEL AND DISPLAY DEVICE
- Publication number 20200006390
- Publication date Jan 2, 2020
- Hefei Xinsheng Optoelectronics Technology Co., Ltd
- Mookeun Shin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Adhesive Tape for Semiconductor Processing, and Semiconductor Devic...
- Publication number 20190382633
- Publication date Dec 19, 2019
- LINTEC CORPORATION
- Kazuto AIZAWA
- C09 - DYES PAINTS POLISHES NATURAL RESINS ADHESIVES MISCELLANEOUS COMPOSITION...
Information Patent Application
DISPLAY DEVICE AND ELECTRONIC DEVICE
- Publication number 20190339743
- Publication date Nov 7, 2019
- Semiconductor Energy Laboratory Co., Ltd.
- Hiroyuki MIYAKE
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
MOUNTING STRUCTURES FOR INTEGRATED DEVICE PACKAGES
- Publication number 20190319011
- Publication date Oct 17, 2019
- Analog Devices Global Unlimited Company
- Rigan McGeehan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR STRUCTURE
- Publication number 20190221538
- Publication date Jul 18, 2019
- WINBOND ELECTRONICS CORP.
- Yu-Ming Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
DISPLAY DEVICE
- Publication number 20190206784
- Publication date Jul 4, 2019
- SAMSUNG DISPLAY CO., LTD.
- Myong-soo OH
- G09 - EDUCATION CRYPTOGRAPHY DISPLAY ADVERTISING SEALS
Information Patent Application
BONDING AND INDEXING APPARATUS
- Publication number 20190206829
- Publication date Jul 4, 2019
- NEXPERIA B.V.
- Ralph HUYBERS
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
POLYIMIDE FILM FOR SEMICONDUCTOR PACKAGE REFLOW PROCESS, AND MANUFA...
- Publication number 20190194496
- Publication date Jun 27, 2019
- IPI TECH INC.
- Kye-Ung LEE
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
FAN-OUT SEMICONDUCTOR PACKAGE
- Publication number 20190189589
- Publication date Jun 20, 2019
- Samsung Electro-Mechanics Co., Ltd.
- Ha Yong JUNG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
TAPE CARRIER ASSEMBLIES HAVING AN INTEGRATED ADHESIVE FILM
- Publication number 20190067173
- Publication date Feb 28, 2019
- Daewon Semiconductor Packaging Industrial Company
- Sunna Chang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
HIGH-DENSITY INTERCONNECTING ADHESIVE TAPE
- Publication number 20190051603
- Publication date Feb 14, 2019
- International Business Machines Corporation
- Akihiro Horibe
- H01 - BASIC ELECTRIC ELEMENTS

Tape automated bonding [TAB] connectors

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Semiconductor device package assemblies with direct leadframe attac...

Method for manufacturing mounting structure for electronic componen...

Chip packaging device, chip packaging method, and package chip

Tape carrier assemblies having an integrated adhesive film

Display device having at least four overlapping display panels

Chip package structure and method of forming the same

Structure and method for isolation of bit-line drivers for a three-...

Interconnect structure, semiconductor structure including interconn...

Impedance controlled electrical interconnection employing meta-mate...

Bonding and indexing apparatus

Tape carrier assemblies having an integrated adhesive film

Mask-integrated surface protective tape with release liner

Array substrate, display panel and display device

Semiconductor structure

Image pickup apparatus, endoscope, and method for manufacturing ima...

Mounting structures for integrated device packages

Display device and electronic device having multiple overlapping di...

Conductive paste and solar cell

Polyimide film for semiconductor package reflow process, and manufa...

Chip-on film and display device including the same

Semiconductor device packaging assembly, lead frame strip and unit...

High-speed, high-resolution electrophysiology in-vivo using conform...

Multi-stacked die package with flexible interconnect

Display device

Display device

Chip-on-film package structure and display device

Power electronics assembly having an adhesion layer, and method for...

Display device and electronic device having multiple overlapping di...

High-density interconnecting adhesive tape

Apparatus for the material-bonded connection of connection partners...

Patents Applicationslast 30 patents

DISPLAY DEVICE AND ELECTRONIC DEVICE

STRUCTURE AND METHOD FOR ISOLATION OF BIT-LINE DRIVERS FOR A THREE-...

Impedance Controlled Electrical Interconnection Employing Meta-Mate...

INTERCONNECT STRUCTURE AND METHOD FOR FORMING THE SAME

STRUCTURE AND METHOD FOR ISOLATION OF BIT-LINE DRIVERS FOR A THREE-...

SEMICONDUCTOR DEVICE PACKAGE WITH CONDUCTIVE VIAS AND METHOD OF MAN...

BONDING AND INDEXING METHOD

TAPE CARRIER ASSEMBLIES HAVING AN INTEGRATED ADHESIVE FILM

DISPLAY DEVICE AND ELECTRONIC DEVICE

STACKED MODULE PACKAGE INTERCONNECT STRUCTURE WITH FLEX CABLE

METHOD FOR MANUFACTURING MOUNTING STRUCTURE FOR ELECTRONIC COMPONEN...

SEMICONDUCTOR DEVICE PACKAGE ASSEMBLIES AND METHODS OF MANUFACTURE

STRUCTURE AND METHOD FOR ISOLATION OF BIT-LINE DRIVERS FOR A THREE-...

CHIP PACKAGE STRUCTURE AND METHOD OF FORMING THE SAME

INTERCONNECT STRUCTURE, SEMICONDUCTOR STRUCTURE INCLUDING INTERCONN...

DISPLAY DEVICE AND ELECTRONIC DEVICE

CHIP-ON-FILM PACKAGE STRUCTURE AND DISPLAY DEVICE

Impedance Controlled Electrical Interconnection Employing Meta-Mate...

MASK-INTEGRATED SURFACE PROTECTIVE TAPE WITH RELEASE LINER

ARRAY SUBSTRATE, DISPLAY PANEL AND DISPLAY DEVICE

Adhesive Tape for Semiconductor Processing, and Semiconductor Devic...

DISPLAY DEVICE AND ELECTRONIC DEVICE

MOUNTING STRUCTURES FOR INTEGRATED DEVICE PACKAGES

SEMICONDUCTOR STRUCTURE

DISPLAY DEVICE

BONDING AND INDEXING APPARATUS

POLYIMIDE FILM FOR SEMICONDUCTOR PACKAGE REFLOW PROCESS, AND MANUFA...

FAN-OUT SEMICONDUCTOR PACKAGE

TAPE CARRIER ASSEMBLIES HAVING AN INTEGRATED ADHESIVE FILM

HIGH-DENSITY INTERCONNECTING ADHESIVE TAPE