Tapered leads

Industry

CPC
H05K2201/10803

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Parent Industries

HELECTRICITY H05Electric techniques H05KPRINTED CIRCUITS CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS H05K2201/00Indexing scheme relating to printed circuits covered by H05K1/00

Current Industry

H05K2201/10803Tapered leads

Industries

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Patents Grantslast 30 patents

Information Patent Grant
Assembly having a solder pin and a solder point
- Patent number 12,170,431
- Issue date Dec 17, 2024
- Phoenix Contact GmbH & Co. KG
- Ralf Geske
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Component mounted on circuit board
- Patent number 11,744,019
- Issue date Aug 29, 2023
- Murata Manufacturing Co., Ltd.
- Shigeyuki Kamio
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Methods of making printed structures
- Patent number 11,540,398
- Issue date Dec 27, 2022
- X Display Company Technology Limited
- Christopher Andrew Bower
- B32 - LAYERED PRODUCTS
Information Patent Grant
Methods of making printed structures
- Patent number 11,483,937
- Issue date Oct 25, 2022
- X Display Company Technology Limited
- Christopher Andrew Bower
- B32 - LAYERED PRODUCTS
Information Patent Grant
Communication module packaging
- Patent number 10,952,312
- Issue date Mar 16, 2021
- II-VI DELAWARE, INC.
- Jianwei Mu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electronic device
- Patent number 10,602,613
- Issue date Mar 24, 2020
- Omron Corporation
- Seiki Shimoda
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Solder component
- Patent number 10,594,061
- Issue date Mar 17, 2020
- Japan Aviation Electronics Industry, Limited
- Osamu Hashiguchi
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Method of manufacturing wiring board and wiring board
- Patent number 10,321,582
- Issue date Jun 11, 2019
- Olympus Corporation
- Jumpei Yoneyama
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Soldered interconnect for a printed circuit board having an angular...
- Patent number 10,096,915
- Issue date Oct 9, 2018
- MERCURY SYSTEMS, INC.
- Darryl J. McKenney
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Step etched metal electrical contacts
- Patent number 9,967,977
- Issue date May 8, 2018
- Cree Fayetteville, Inc.
- Brice McPherson
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Solder spacer and electronic module comprising such a spacer
- Patent number 9,629,245
- Issue date Apr 18, 2017
- Sagemcom Broadband SAS
- Stephane Kohn
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Relay module device
- Patent number 9,515,652
- Issue date Dec 6, 2016
- Anden Co., Ltd.
- Hideyuki Ohtani
- H03 - BASIC ELECTRONIC CIRCUITRY
Information Patent Grant
Method of manufacturing surface mount device
- Patent number 9,392,702
- Issue date Jul 12, 2016
- Fujitsu Component Limited
- Takeshi Okuyama
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Surface mount device
- Patent number 9,106,005
- Issue date Aug 11, 2015
- Fujitsu Component Limited
- Takeshi Okuyama
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Electronic device and on-vehicle module
- Patent number 7,883,378
- Issue date Feb 8, 2011
- Hitachi, Ltd.
- Shiro Yamashita
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Sinking type electrical connector and assembly of the sinking type...
- Patent number 7,744,410
- Issue date Jun 29, 2010
- Wistron Corporation
- Sung-Yu Hsieh
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Electronic device and manufacturing method of the same
- Patent number 7,677,905
- Issue date Mar 16, 2010
- Denso Corporation
- Takayoshi Honda
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Electronic device
- Patent number 7,563,112
- Issue date Jul 21, 2009
- Denso Corporation
- Takayoshi Honda
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Electronic component with high density, low cost attachment
- Patent number 7,484,971
- Issue date Feb 3, 2009
- Amphenol Corporation
- Mark W. Gailus
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Shield can having tapered wall ends for surface mounting and radiot...
- Patent number 6,175,077
- Issue date Jan 16, 2001
- Ericsson Inc.
- Gregory S. Mendolia
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
3362005
- Patent number 3,362,005
- Issue date Jan 2, 1968
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
3059152
- Patent number 3,059,152
- Issue date Oct 16, 1962
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR

Patents Applicationslast 30 patents

Information Patent Application
FLEXIBLE PRINTED CIRCUIT BOARD, IN PARTICULAR FOR CONNECTING ELECTR...
- Publication number 20240268033
- Publication date Aug 8, 2024
- ROBERT BOSCH GmbH
- Florian Eichkorn
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
METHODS OF MAKING PRINTED STRUCTURES
- Publication number 20230091571
- Publication date Mar 23, 2023
- X Display Company Technology Limited
- Christopher Andrew Bower
- B32 - LAYERED PRODUCTS
Information Patent Application
METHODS OF MAKING PRINTED STRUCTURES
- Publication number 20220232707
- Publication date Jul 21, 2022
- X Display Company Technology Limited
- Christopher Andrew Bower
- B32 - LAYERED PRODUCTS
Information Patent Application
METHODS OF MAKING PRINTED STRUCTURES
- Publication number 20200214141
- Publication date Jul 2, 2020
- X-Celeprint Limited
- Christopher Andrew Bower
- B32 - LAYERED PRODUCTS
Information Patent Application
LASER WELDING OF THRU-HOLE ELECTRICAL COMPONENTS
- Publication number 20160021747
- Publication date Jan 21, 2016
- DELPHI INTERNATIONAL OPERATIONS LUXEMBOURG, S.A.R.L.
- KIN YEAN CHOW
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
CONNECTING SYSTEM OF CIRCUIT BOARDS
- Publication number 20140198471
- Publication date Jul 17, 2014
- Fujitsu Limited
- Naohiko Kajio
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
TUNER MODULE, CIRCUIT BOARD, AND METHOD FOR ASSEMBLING CIRCUIT BOARD
- Publication number 20140160709
- Publication date Jun 12, 2014
- Tadashi Imai
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SURFACE MOUNT TECHNOLOGY PROCESS FOR ADVANCED QUAD FLAT NO-LEAD PAC...
- Publication number 20130133193
- Publication date May 30, 2013
- MEDIATEK SINGAPORE PTE LTD
- Chih-Tai Hsu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SURFACE MOUNT DEVICE AND METHOD OF MANUFACTURING THE SAME
- Publication number 20120193139
- Publication date Aug 2, 2012
- FUJITSU COMPONENT LIMITED
- Takeshi Okuyama
- Y02 - TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMA...
Information Patent Application
Sinking Type Electrical Connector and Assembly of the Sinking Type...
- Publication number 20100099274
- Publication date Apr 22, 2010
- Sung-Yu Hsieh
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Electronic device and on-vehicle module
- Publication number 20090233468
- Publication date Sep 17, 2009
- Shiro Yamashita
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Electronic device
- Publication number 20080144260
- Publication date Jun 19, 2008
- DENSO CORPORATION
- Takayoshi Honda
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Electronic device and manufacturing method of the same
- Publication number 20080146051
- Publication date Jun 19, 2008
- DENSO CORPORATION
- Takayoshi Honda
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Electronic component with high density, low cost attachment
- Publication number 20070207635
- Publication date Sep 6, 2007
- Mark W. Gailus
- Y02 - TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMA...
Information Patent Application
CIRCUIT-BOARD CONNECTING TERMINAL
- Publication number 20020058428
- Publication date May 16, 2002
- CHIEKO TORII
- H01 - BASIC ELECTRIC ELEMENTS

Tapered leads

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Assembly having a solder pin and a solder point

Component mounted on circuit board

Methods of making printed structures

Methods of making printed structures

Communication module packaging

Electronic device

Solder component

Method of manufacturing wiring board and wiring board

Soldered interconnect for a printed circuit board having an angular...

Step etched metal electrical contacts

Solder spacer and electronic module comprising such a spacer

Relay module device

Method of manufacturing surface mount device

Surface mount device

Electronic device and on-vehicle module

Sinking type electrical connector and assembly of the sinking type...

Electronic device and manufacturing method of the same

Electronic device

Electronic component with high density, low cost attachment

Shield can having tapered wall ends for surface mounting and radiot...

3362005

3059152

Patents Applicationslast 30 patents

FLEXIBLE PRINTED CIRCUIT BOARD, IN PARTICULAR FOR CONNECTING ELECTR...

METHODS OF MAKING PRINTED STRUCTURES

METHODS OF MAKING PRINTED STRUCTURES

METHODS OF MAKING PRINTED STRUCTURES

LASER WELDING OF THRU-HOLE ELECTRICAL COMPONENTS

CONNECTING SYSTEM OF CIRCUIT BOARDS

TUNER MODULE, CIRCUIT BOARD, AND METHOD FOR ASSEMBLING CIRCUIT BOARD

SURFACE MOUNT TECHNOLOGY PROCESS FOR ADVANCED QUAD FLAT NO-LEAD PAC...

SURFACE MOUNT DEVICE AND METHOD OF MANUFACTURING THE SAME

Sinking Type Electrical Connector and Assembly of the Sinking Type...

Electronic device and on-vehicle module

Electronic device

Electronic device and manufacturing method of the same

Electronic component with high density, low cost attachment

CIRCUIT-BOARD CONNECTING TERMINAL