Testing a finished product

Industry

CPC
H05K2203/162

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Parent Industries

HELECTRICITY H05Electric techniques H05KPRINTED CIRCUITS CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS H05K2203/00Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00

Current Industry

H05K2203/162Testing a finished product

Industries

Patents Grantslast 30 patents

Information Patent Grant
LED circuit board structure and LED testing and packaging method
- Patent number 12,150,242
- Issue date Nov 19, 2024
- Ingentec Corporation
- Yi-Chuan Huang
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Hermetic metallized via with improved reliability
- Patent number 12,131,985
- Issue date Oct 29, 2024
- Corning Incorporated
- Mandakini Kanungo
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Stacking arrays and separator bodies during processing of component...
- Patent number 11,943,874
- Issue date Mar 26, 2024
- AT&S (Chongqing) Company Limited
- Amin Nickkolgh
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Stretchable display device
- Patent number 11,810,906
- Issue date Nov 7, 2023
- LG Display Co., Ltd.
- Seulki Kim
- G09 - EDUCATION CRYPTOGRAPHY DISPLAY ADVERTISING SEALS
Information Patent Grant
Method for identifying PCB core-layer properties
- Patent number 11,644,501
- Issue date May 9, 2023
- International Business Machines Corporation
- Tao Song
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Electrical connector and method for producing same
- Patent number 11,637,406
- Issue date Apr 25, 2023
- Shin-Etsu Polymer Co., Ltd.
- Masatoshi Tsuchiya
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Apparatus for depositing conductive and nonconductive material to f...
- Patent number 11,596,071
- Issue date Feb 28, 2023
- BotFactory Inc.
- Michael Knox
- G01 - MEASURING TESTING
Information Patent Grant
Process for in-situ warpage monitoring during solder reflow for hea...
- Patent number 11,558,964
- Issue date Jan 17, 2023
- International Business Machines Corporation
- Jennifer I. Bennett
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Methods, systems, and computer program products for determining a p...
- Patent number 11,531,019
- Issue date Dec 20, 2022
- Troxler Electronic Laboratories, Inc.
- Robert Ernest Troxler
- G01 - MEASURING TESTING
Information Patent Grant
Apparatus and method relating to electrochemical migration
- Patent number 11,470,727
- Issue date Oct 11, 2022
- Jaguar Land Rover Limited
- Thomas Liedtke
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Wiring assembly board
- Patent number 11,452,203
- Issue date Sep 20, 2022
- Aptiv Technologies Limited
- Marcin Szelest
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Resin composition, and prepreg, metal-clad laminate, and printed ci...
- Patent number 11,414,532
- Issue date Aug 16, 2022
- Taiwan Union Technology Corporation
- Chih-Wei Liao
- G01 - MEASURING TESTING
Information Patent Grant
Display panel and method of fabricating the same
- Patent number 11,327,372
- Issue date May 10, 2022
- Au Optronics Corporation
- Chih-Yu Yu
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Hermetic metallized via with improved reliability
- Patent number 11,201,109
- Issue date Dec 14, 2021
- Corning Incorporated
- Mandakini Kanungo
- C03 - GLASS MINERAL OR SLAG WOOL
Information Patent Grant
Embedding known-good component between known-good component carrier...
- Patent number 11,184,983
- Issue date Nov 23, 2021
- AT&S Austria Technologie & Systemtechnik Aktiengesellschaft
- Marco Gavagnin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Hermetic metallized via with improved reliability
- Patent number 11,152,294
- Issue date Oct 19, 2021
- Corning Incorporated
- Tian Huang
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Post-production substrate modification with FIB deposition
- Patent number 11,139,217
- Issue date Oct 5, 2021
- BAE Systems Information and Electronic Systems Integration Inc.
- Jeffrey A. Zimmerman
- B05 - SPRAYING OR ATOMISING IN GENERAL APPLYING LIQUIDS OR OTHER FLUENT MATER...
Information Patent Grant
Printed circuit board with a bent connecting section and method for...
- Patent number 11,067,622
- Issue date Jul 20, 2021
- Vitesco Technologies GmbH
- Detlev Bagung
- G01 - MEASURING TESTING
Information Patent Grant
Method for manufacturing multilayer wiring board
- Patent number 11,071,214
- Issue date Jul 20, 2021
- Mitsui Mining & Smelting Co., Ltd.
- Yoshinori Matsuura
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Operation checking device of electronic mounting machine
- Patent number 11,058,040
- Issue date Jul 6, 2021
- FUJI CORPORATION
- Minoru Yoriki
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Printed circuit board with contacting arrangement
- Patent number 11,002,785
- Issue date May 11, 2021
- Endress + Hauser Flowtec AG
- Thomas Böhler
- G01 - MEASURING TESTING
Information Patent Grant
Methods, systems, and computer program products for determining a p...
- Patent number 10,928,376
- Issue date Feb 23, 2021
- Troxler Electronic Laboratories, Inc.
- Robert Ernest Troxler
- G01 - MEASURING TESTING
Information Patent Grant
Board-to-board contactless connectors and methods for the assembly...
- Patent number 10,772,192
- Issue date Sep 8, 2020
- KEYSSA SYSTEMS, INC.
- Roger D. Isaac
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Circuit boards and circuit board assemblies
- Patent number 10,764,994
- Issue date Sep 1, 2020
- Hamilton Sundstrand Corporation
- Tran Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Display device and inspection method of display device
- Patent number 10,754,209
- Issue date Aug 25, 2020
- SHARP KABUSHIKI KAISHA
- Masanao Nakui
- G01 - MEASURING TESTING
Information Patent Grant
Circuit board assembly inspection method
- Patent number 10,736,221
- Issue date Aug 4, 2020
- UNIVERSAL GLOBAL TECHNOLOGY (KUNSHAN) CO., LTD
- Yi-Ming Chang
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Test apparatus for signal integrity testing of connectors
- Patent number 10,698,017
- Issue date Jun 30, 2020
- Dell Products, L.P.
- Umesh Chandra
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of forming a plurality of electro-optical module assemblies
- Patent number 10,687,425
- Issue date Jun 16, 2020
- International Business Machines Corporation
- Paul S. Andry
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Method of forming a plurality of electro-optical module assemblies
- Patent number 10,638,613
- Issue date Apr 28, 2020
- International Business Machines Corporation
- Paul S. Andry
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Intelligent power module and manufacturing method thereof
- Patent number 10,615,155
- Issue date Apr 7, 2020
- Yuxiang Feng
- H02 - GENERATION CONVERSION OR DISTRIBUTION OF ELECTRIC POWER

Patents Applicationslast 30 patents

Information Patent Application
Method For Manufacturing Electrical Devices
- Publication number 20240282517
- Publication date Aug 22, 2024
- Hutchinson Technology Incorporated
- Collin M. Grove
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
LED CIRCUIT BOARD STRUCTURE, LED TESTING AND PACKAGING METHOD AND L...
- Publication number 20240008170
- Publication date Jan 4, 2024
- INGENTEC CORPORATION
- Yi-Chuan HUANG
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
SOLDER JOINT INSPECTION FEATURES
- Publication number 20230164923
- Publication date May 25, 2023
- KOLLMORGEN CORPORATION
- Jeffery Todd BREWSTER
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
PACKAGE GEOMETRIES TO ENABLE VISUAL INSPECTION OF SOLDER FILLETS
- Publication number 20230098907
- Publication date Mar 30, 2023
- TEXAS INSTRUMENTS INCORPORATED
- LongTing LI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHODS, SYSTEMS, AND COMPUTER PROGRAM PRODUCTS FOR DETERMINING A P...
- Publication number 20230094204
- Publication date Mar 30, 2023
- TROXLER ELECTRONIC LABORATORIES, INC.
- Robert Ernest Troxler
- G01 - MEASURING TESTING
Information Patent Application
SIMPLIFIED PEN CORE MODULE AND THE PREPARATION METHOD THEREOF
- Publication number 20220346225
- Publication date Oct 27, 2022
- YingKeSong BiYe Research and Development Center Shenzhen CO.,LTD
- Hao Liu
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
METHOD FOR IDENTIFYING PCB CORE-LAYER PROPERTIES
- Publication number 20220091181
- Publication date Mar 24, 2022
- International Business Machines Corporation
- Tao Song
- G01 - MEASURING TESTING
Information Patent Application
MEMS Assembly Process Flow
- Publication number 20220019128
- Publication date Jan 20, 2022
- MEMS DRIVE (NANJING) CO., LTD.
- MATTHEW NG
- H02 - GENERATION CONVERSION OR DISTRIBUTION OF ELECTRIC POWER
Information Patent Application
APPARATUS AND METHOD RELATING TO ELECTROCHEMICAL MIGRATION
- Publication number 20210289636
- Publication date Sep 16, 2021
- Jaguar Land Rover Limited
- Thomas LIEDTKE
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
METHODS, SYSTEMS, AND COMPUTER PROGRAM PRODUCTS FOR DETERMINING A P...
- Publication number 20210270799
- Publication date Sep 2, 2021
- Troxler Electronic Laboratories, Inc.
- Robert Ernest Troxler
- G01 - MEASURING TESTING
Information Patent Application
Wiring Assembly Board and Method for Verifying Connections When Ass...
- Publication number 20210274649
- Publication date Sep 2, 2021
- Aptiv Technologies Limited
- Marcin Szelest
- G01 - MEASURING TESTING
Information Patent Application
IN-SITU WARPAGE MONITORING DURING SOLDER REFLOW FOR HEAD-IN-PILLOW...
- Publication number 20210212218
- Publication date Jul 8, 2021
- International Business Machines Corporation
- Jennifer I. Bennett
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Stacking Arrays and Separator Bodies During Processing of Component...
- Publication number 20210195753
- Publication date Jun 24, 2021
- AT&S (Chongqing) Company Limited
- Amin Nickkolgh
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
CIRCUIT BOARD
- Publication number 20210185800
- Publication date Jun 17, 2021
- Chipbond Technology Corporation
- Yi-Chen Lien
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
POST-PRODUCTION LAND GRID ARRAY PACKAGE MODIFICATION WITH FIB DEPOS...
- Publication number 20210074595
- Publication date Mar 11, 2021
- BAE SYSTEMS INFORMATION AND ELECTRONIC SYSTEMS INTEGRATION INC
- Jeffrey A. Zimmerman
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
DISPLAY PANEL AND METHOD OF FABRICATING THE SAME
- Publication number 20210026182
- Publication date Jan 28, 2021
- AU OPTRONICS CORPORATION
- Chih-Yu Yu
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
APPARATUS FOR DEPOSITING CONDUCTIVE AND NONCONDUCTIVE MATERIAL TO F...
- Publication number 20200163220
- Publication date May 21, 2020
- BOTFACTORY INC.
- Michael Knox
- G01 - MEASURING TESTING
Information Patent Application
BACK-DRILLED VIA PROBING TECHNIQUES
- Publication number 20200146194
- Publication date May 7, 2020
- International Business Machines Corporation
- LAYNE A. BERGE
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
METHOD FOR MANUFACTURING MULTILAYER WIRING BOARD
- Publication number 20190335594
- Publication date Oct 31, 2019
- Mitsui Mining and Smelting Co., Ltd.
- Yoshinori MATSUURA
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
PRECISION SCREEN PRINTING WITH SUB-MICRON UNIFORMITY OF METALLIZATI...
- Publication number 20190273008
- Publication date Sep 5, 2019
- Applied Materials, Inc.
- Shih-Ying Huang
- B41 - PRINTING LINING MACHINES TYPEWRITERS STAMPS
Information Patent Application
CIRCUIT BOARD ASSEMBLY INSPECTION METHOD
- Publication number 20190254173
- Publication date Aug 15, 2019
- UNIVERSAL GLOBAL TECHNOLOGY (KUNSHAN) CO., LTD.
- Yi-Ming CHANG
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Printed Circuit Board With A Bent Connecting Section And Method For...
- Publication number 20190235016
- Publication date Aug 1, 2019
- CPT GROUP GMBH
- DETLEV BAGUNG
- G01 - MEASURING TESTING
Information Patent Application
OPERATION CHECKING DEVICE OF ELECTRONIC MOUNTING MACHINE
- Publication number 20190104655
- Publication date Apr 4, 2019
- FUJI CORPORATION
- Minoru YORIKI
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
BOARD, ELECTRIC DEVICE, AND METHOD OF DETERMINING BOARD
- Publication number 20190098749
- Publication date Mar 28, 2019
- Sharp Kabushiki Kaisha
- NORIHISA SHINTANI
- G02 - OPTICS
Information Patent Application
METHOD FOR REPAIRING SUBSTRATES WITH AN ELECTRICALLY CONDUCTIVE COA...
- Publication number 20190037649
- Publication date Jan 31, 2019
- SAINT-GOBAIN GLASS FRANCE
- Valentin SCHULZ
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
PRINT HEAD MAINTENANCE
- Publication number 20190037704
- Publication date Jan 31, 2019
- MUTRACX INTERNATIONAL B.V.
- Henk Jan ZWIERS
- B41 - PRINTING LINING MACHINES TYPEWRITERS STAMPS
Information Patent Application
METHODS, SYSTEMS, AND COMPUTER PROGRAM PRODUCTS FOR DETERMINING A P...
- Publication number 20180224420
- Publication date Aug 9, 2018
- TROXLER ELECTRONIC LABORATORIES, INC.
- Robert Ernest Troxler
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
INTELLIGENT POWER MODULE AND MANUFACTURING METHOD THEREOF
- Publication number 20180047714
- Publication date Feb 15, 2018
- GD MIDEA AIRCONDITIONING EQUIPMENT CO., LTD.
- Yuxiang Feng
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PRECISION SCREEN PRINTING WITH SUB-MICRON UNIFORMITY OF METALLIZATI...
- Publication number 20180040498
- Publication date Feb 8, 2018
- Applied Materials, Inc.
- Shih-Ying Huang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INKJET SYSTEM FOR PRINTING A PRINTED CIRCUIT BOARD
- Publication number 20170347461
- Publication date Nov 30, 2017
- MUTRACX INTERNATIONAL B.V.
- Henk Jan ZWIERS
- B05 - SPRAYING OR ATOMISING IN GENERAL APPLYING LIQUIDS OR OTHER FLUENT MATER...

Testing a finished product

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

LED circuit board structure and LED testing and packaging method

Hermetic metallized via with improved reliability

Stacking arrays and separator bodies during processing of component...

Stretchable display device

Method for identifying PCB core-layer properties

Electrical connector and method for producing same

Apparatus for depositing conductive and nonconductive material to f...

Process for in-situ warpage monitoring during solder reflow for hea...

Methods, systems, and computer program products for determining a p...

Apparatus and method relating to electrochemical migration

Wiring assembly board

Resin composition, and prepreg, metal-clad laminate, and printed ci...

Display panel and method of fabricating the same

Hermetic metallized via with improved reliability

Embedding known-good component between known-good component carrier...

Hermetic metallized via with improved reliability

Post-production substrate modification with FIB deposition

Printed circuit board with a bent connecting section and method for...

Method for manufacturing multilayer wiring board

Operation checking device of electronic mounting machine

Printed circuit board with contacting arrangement

Methods, systems, and computer program products for determining a p...

Board-to-board contactless connectors and methods for the assembly...

Circuit boards and circuit board assemblies

Display device and inspection method of display device

Circuit board assembly inspection method

Test apparatus for signal integrity testing of connectors

Method of forming a plurality of electro-optical module assemblies

Method of forming a plurality of electro-optical module assemblies

Intelligent power module and manufacturing method thereof

Patents Applicationslast 30 patents

Method For Manufacturing Electrical Devices

LED CIRCUIT BOARD STRUCTURE, LED TESTING AND PACKAGING METHOD AND L...

SOLDER JOINT INSPECTION FEATURES

PACKAGE GEOMETRIES TO ENABLE VISUAL INSPECTION OF SOLDER FILLETS

METHODS, SYSTEMS, AND COMPUTER PROGRAM PRODUCTS FOR DETERMINING A P...

SIMPLIFIED PEN CORE MODULE AND THE PREPARATION METHOD THEREOF

METHOD FOR IDENTIFYING PCB CORE-LAYER PROPERTIES

MEMS Assembly Process Flow

APPARATUS AND METHOD RELATING TO ELECTROCHEMICAL MIGRATION

METHODS, SYSTEMS, AND COMPUTER PROGRAM PRODUCTS FOR DETERMINING A P...

Wiring Assembly Board and Method for Verifying Connections When Ass...

IN-SITU WARPAGE MONITORING DURING SOLDER REFLOW FOR HEAD-IN-PILLOW...

Stacking Arrays and Separator Bodies During Processing of Component...

CIRCUIT BOARD

POST-PRODUCTION LAND GRID ARRAY PACKAGE MODIFICATION WITH FIB DEPOS...

DISPLAY PANEL AND METHOD OF FABRICATING THE SAME

APPARATUS FOR DEPOSITING CONDUCTIVE AND NONCONDUCTIVE MATERIAL TO F...

BACK-DRILLED VIA PROBING TECHNIQUES

METHOD FOR MANUFACTURING MULTILAYER WIRING BOARD

PRECISION SCREEN PRINTING WITH SUB-MICRON UNIFORMITY OF METALLIZATI...

CIRCUIT BOARD ASSEMBLY INSPECTION METHOD

Printed Circuit Board With A Bent Connecting Section And Method For...

OPERATION CHECKING DEVICE OF ELECTRONIC MOUNTING MACHINE

BOARD, ELECTRIC DEVICE, AND METHOD OF DETERMINING BOARD

METHOD FOR REPAIRING SUBSTRATES WITH AN ELECTRICALLY CONDUCTIVE COA...

PRINT HEAD MAINTENANCE

METHODS, SYSTEMS, AND COMPUTER PROGRAM PRODUCTS FOR DETERMINING A P...

INTELLIGENT POWER MODULE AND MANUFACTURING METHOD THEREOF

PRECISION SCREEN PRINTING WITH SUB-MICRON UNIFORMITY OF METALLIZATI...

INKJET SYSTEM FOR PRINTING A PRINTED CIRCUIT BOARD