the capacitor being in a substrate trench

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HELECTRICITY H01Electric elements H01LSEMICONDUCTOR DEVICES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR H01L27/00Devices consisting of a plurality of semiconductor or other solid state components formed in or on a common substrate

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H01L27/10861the capacitor being in a substrate trench

Industries

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Patents Grantslast 30 patents

Information Patent Grant
Method of manufacturing semiconductor device having buried gate ele...
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- Issue date Jun 6, 2023
- Samsung Electronics Co., Ltd.
- Byung-jae Kang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of manufacturing capacitor structure and capacitor structure
- Patent number 11,651,896
- Issue date May 16, 2023
- NANYA TECHNOLOGY CORPORATION
- Chien-Chung Wang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Trench capacitor assembly for high capacitance density
- Patent number 11,652,101
- Issue date May 16, 2023
- QUALCOMM Incorporated
- Jonghae Kim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for fabricating semiconductor memory device with buried capa...
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- Issue date Mar 21, 2023
- HeFeChip Corporation Limited
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- G11 - INFORMATION STORAGE
Information Patent Grant
Semiconductor memory device
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- Issue date Jan 24, 2023
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- Jenn-Gwo Hwu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Dynamic random access memory device and method of fabricating the same
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- Issue date Dec 27, 2022
- Chen-Chih Wang
- G11 - INFORMATION STORAGE
Information Patent Grant
Method for manufacturing high-profile and high-capacitance capacitor
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- Issue date Oct 11, 2022
- XIA TAI XIN SEMICONDUCTOR (QING DAO) LTD.
- Sang-Man Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Heating device for heating object material using laser beam and ind...
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- Issue date Oct 4, 2022
- RNR LAB INC.
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Information Patent Grant
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- Issue date Aug 9, 2022
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- Shao Hsuan Chuang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor structure having a gate structure portion in a word line
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- Issue date May 24, 2022
- NANYA TECHNOLOGY CORPORATION
- Szu-Yao Chang
- G11 - INFORMATION STORAGE
Information Patent Grant
Semiconductor memory device with buried capacitor and fin-like elec...
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- Issue date Apr 5, 2022
- HeFeChip Corporation Limited
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- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Interconnect layout for semiconductor device
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- Issue date Dec 14, 2021
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- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device having a serpentine shape isolation
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Information Patent Grant
Vertical transistor with eDRAM
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- Issue date Jul 20, 2021
- International Business Machines Corporation
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- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Apparatuses including capacitor structures, and related memory devi...
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- Issue date Jun 29, 2021
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- G11 - INFORMATION STORAGE
Information Patent Grant
NOR-type memory device and method of fabricating the same
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- Chen-Chih Wang
- G11 - INFORMATION STORAGE
Information Patent Grant
Column formation using sacrificial material
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- Issue date May 18, 2021
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- Devesh Dadhich Shreeram
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor recess formation
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- Issue date Apr 13, 2021
- Micron Technology, Inc.
- Jerome A. Imonigie
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Formation of a capacitor using a hard mask
- Patent number 10,978,553
- Issue date Apr 13, 2021
- Micron Technology, Inc.
- Diem Thy N. Tran
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of manufacturing semiconductor device having buried gate ele...
- Patent number 10,930,544
- Issue date Feb 23, 2021
- Samsung Electronics Co., Ltd.
- Byung-jae Kang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device having buried gate structure and method for fa...
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- Issue date Feb 2, 2021
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- Tae-Su Jang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor memory device
- Patent number 10,879,249
- Issue date Dec 29, 2020
- Taiwan Semiconductor Manufacturing Co., Ltd
- Jenn-Gwo Hwu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Integrated circuit with backside structures to reduce substrate warp
- Patent number 10,833,026
- Issue date Nov 10, 2020
- Taiwan Semiconductor Manufacturing Co., Ltd
- Chih-Ming Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device having buried gate structure and method for fa...
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- Issue date Oct 20, 2020
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- Tae-Su Jang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of forming a stop layer filling in a space between spacers
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- Issue date Sep 29, 2020
- United Microelectronics Corp.
- Chih-Chien Liu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Integrated isolation capacitance structure
- Patent number 10,629,474
- Issue date Apr 21, 2020
- Semiconductor Components Industries, LLC
- YongZhong Hu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Multilayer buried metal-insultor-metal capacitor structures
- Patent number 10,546,918
- Issue date Jan 28, 2020
- International Business Machines Corporation
- Alexander Reznicek
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device having a deep-trench capacitor including void...
- Patent number 10,529,797
- Issue date Jan 7, 2020
- MagnaChip Semiconductor, Ltd.
- Yang Beom Kang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor structure with a conductive line and fabricating meth...
- Patent number 10,468,417
- Issue date Nov 5, 2019
- United Microelectronics Corp.
- Chih-Chien Liu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Multilayer buried metal-insultor-metal capacitor structures
- Patent number 10,461,148
- Issue date Oct 29, 2019
- International Business Machines Corporation
- Alexander Reznicek
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
SEMICONDUCTOR DEVICE WITH CAPACITOR AND METHOD FOR FORMING THE SAME
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- Taiwan Semiconductor Manufacturing company Ltd.
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- H01 - BASIC ELECTRIC ELEMENTS
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METHOD FOR MANUFACTURING SEMICONDUCTOR STRUCTURE, SEMICONDUCTOR STR...
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- Xingsong SU
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MEMORY STRUCTURE AND METHOD OF FORMING THEREOF
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- NANYA TECHNOLOGY CORPORATION
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- Publication number 20230240065
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MEMORY DEVICE HAVING MEMORY CELL WITH REDUCED PROTRUSION
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- NANYA TECHNOLOGY CORPORATION
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SEMICONDUCTOR STRUCTURE, PREPARATION METHOD OF SEMICONDUCTOR STRUCT...
- Publication number 20230225107
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- CHANGXIN MEMORY TECHNOLOGIES, INC
- Xiaojie LI
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HIGH BANDWIDTH AND CAPACITY APPROACHES FOR STITCHED DIES
- Publication number 20230207445
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- Abhishek Anil SHARMA
- H01 - BASIC ELECTRIC ELEMENTS
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METHOD OF MANUFACTURING SEMICONDUCTOR STRUCTURE AND SEMICONDUCTOR S...
- Publication number 20230047359
- Publication date Feb 16, 2023
- CHANGXIN MEMORY TECHNOLOGIES, INC
- Xiaoling WANG
- H01 - BASIC ELECTRIC ELEMENTS
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SEMICONDUCTOR STRUCTURE AND METHOD FOR MANUFACTURING SEMICONDUCTOR...
- Publication number 20230012447
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HEATING DEVICE FOR HEATING OBJECT MATERIAL USING LASER BEAM AND IND...
- Publication number 20220392788
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- RNR LAB INC.
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SEMICONDUCTOR DEVICE INCLUDING INTEGRATED CAPACITOR AND VERTICAL CH...
- Publication number 20220359529
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- Taiwan Semiconductor Manufacturing Company Limited
- Yun-Feng KAO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MANUFACTURING METHOD OF SEMICONDUCTOR STRUCTURE AND SEMICONDUCTOR S...
- Publication number 20220336466
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- CHANGXIN MEMORY TECHNOLOGIES, INC
- Longyang CHEN
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METHOD FOR FORMING SEMICONDUCTOR STRUCTURES AND SEMICONDUCTOR STRUC...
- Publication number 20220293609
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METHOD OF FORMING SEMICONDUCTOR STRUCTURE
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- NANYA TECHNOLOGY CORPORATION
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SEMICONDUCTOR STRUCTURE AND MANUFACTURING METHOD THEREOF
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- CHANGXIN MEMORY TECHNOLOGIES, INC
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Interconnect Layout for Semiconductor Device
- Publication number 20220102482
- Publication date Mar 31, 2022
- Taiwan Semiconductor Manufacturing Co., Ltd.
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- Publication number 20220077157
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- CHANGXIN MEMORY TECHNOLOGIES, INC
- Xifei BAO
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- Taiwan Semiconductor Manufacturing Co., Ltd.
- Jenn-Gwo HWU
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- HeFeChip Corporation Limited
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- Publication date May 6, 2021
- NANYA TECHNOLOGY CORPORATION
- Szu-Yao CHANG
- G11 - INFORMATION STORAGE
Information Patent Application
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- Publication number 20200365595
- Publication date Nov 19, 2020
- Micron Technology, Inc.
- Mitsunari Sukekawa
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HEATING DEVICE FOR HEATING OBJECT MATERIAL USING LASER BEAM AND IND...
- Publication number 20200357665
- Publication date Nov 12, 2020
- Jeong Do RYU
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- Publication number 20200343246
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- Chen-Chih WANG
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- Micron Technology, Inc.
- Jerome A. Imonigie
- H01 - BASIC ELECTRIC ELEMENTS

the capacitor being in a substrate trench

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Method of manufacturing semiconductor device having buried gate ele...

Method of manufacturing capacitor structure and capacitor structure

Trench capacitor assembly for high capacitance density

Method for fabricating semiconductor memory device with buried capa...

Semiconductor memory device

Dynamic random access memory device and method of fabricating the same

Method for manufacturing high-profile and high-capacitance capacitor

Heating device for heating object material using laser beam and ind...

Semiconductor package device and method for manufacturing the same

Semiconductor structure having a gate structure portion in a word line

Semiconductor memory device with buried capacitor and fin-like elec...

Interconnect layout for semiconductor device

Semiconductor device having a serpentine shape isolation

Vertical transistor with eDRAM

Apparatuses including capacitor structures, and related memory devi...

NOR-type memory device and method of fabricating the same

Column formation using sacrificial material

Semiconductor recess formation

Formation of a capacitor using a hard mask

Method of manufacturing semiconductor device having buried gate ele...

Semiconductor device having buried gate structure and method for fa...

Semiconductor memory device

Integrated circuit with backside structures to reduce substrate warp

Semiconductor device having buried gate structure and method for fa...

Method of forming a stop layer filling in a space between spacers

Integrated isolation capacitance structure

Multilayer buried metal-insultor-metal capacitor structures

Semiconductor device having a deep-trench capacitor including void...

Semiconductor structure with a conductive line and fabricating meth...

Multilayer buried metal-insultor-metal capacitor structures

Patents Applicationslast 30 patents

SEMICONDUCTOR DEVICE WITH CAPACITOR AND METHOD FOR FORMING THE SAME

METHOD FOR MANUFACTURING SEMICONDUCTOR STRUCTURE, SEMICONDUCTOR STR...

MEMORY STRUCTURE AND METHOD OF FORMING THEREOF

METHOD OF MANUFACTURING MEMORY DEVICE HAVING MEMORY CELL WITH REDUC...

METHOD OF FORMING PLUG FOR SEMICONDUCTOR DEVICE AND SEMICONDUCTOR D...

MEMORY DEVICE HAVING MEMORY CELL WITH REDUCED PROTRUSION

SEMICONDUCTOR STRUCTURE, PREPARATION METHOD OF SEMICONDUCTOR STRUCT...

HIGH BANDWIDTH AND CAPACITY APPROACHES FOR STITCHED DIES

METHOD OF MANUFACTURING SEMICONDUCTOR STRUCTURE AND SEMICONDUCTOR S...

SEMICONDUCTOR STRUCTURE AND METHOD FOR MANUFACTURING SEMICONDUCTOR...

HEATING DEVICE FOR HEATING OBJECT MATERIAL USING LASER BEAM AND IND...

SEMICONDUCTOR DEVICE INCLUDING INTEGRATED CAPACITOR AND VERTICAL CH...

MANUFACTURING METHOD OF SEMICONDUCTOR STRUCTURE AND SEMICONDUCTOR S...

METHOD FOR FORMING SEMICONDUCTOR STRUCTURES AND SEMICONDUCTOR STRUC...

METHOD OF FORMING SEMICONDUCTOR STRUCTURE

SEMICONDUCTOR STRUCTURE AND MANUFACTURING METHOD THEREOF

METHOD FOR FABRICATING SEMICONDUCTOR MEMORY DEVICE WITH BURIED CAPA...

SEMICONDUCTOR DEVICE, SEMICONDUCTOR STRUCTURE AND FORMATION METHOD...

Interconnect Layout for Semiconductor Device

DIELECTRIC THIN FILM, INTEGRATED DEVICE INCLUDING THE SAME, AND MET...

METHOD FOR MANUFACTURING SEMICONDUCTOR STRUCTURE AND SEMICONDUCTOR...

METHOD FOR FORMING CAPACITOR HOLES

SEMICONDUCTOR MEMORY DEVICE

METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE HAVING BURIED GATE ELE...

SEMICONDUCTOR MEMORY DEVICE WITH BURIED CAPACITOR AND FIN-LIKE ELEC...

SEMICONDUCTOR STRUCTURE AND METHOD OF FORMING THE SAME

APPARATUSES INCLUDING CAPACITOR STRUCTURES, AND RELATED MEMORY DEVI...

HEATING DEVICE FOR HEATING OBJECT MATERIAL USING LASER BEAM AND IND...

DYNAMIC RANDOM ACCESS MEMORY DEVICE AND METHOD OF FABRICATING THE SAME

SEMICONDUCTOR RECESS FORMATION