the components being field-effect transistors with insulated gate

Industry

CPC
H01L27/088

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HELECTRICITY H01Electric elements H01LSEMICONDUCTOR DEVICES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR H01L27/00Devices consisting of a plurality of semiconductor or other solid state components formed in or on a common substrate

Current Industry

H01L27/088the components being field-effect transistors with insulated gate

Industries

Patents Grantslast 30 patents

Information Patent Grant
Semiconductor device and method for fabricating the same
- Patent number 12,148,749
- Issue date Nov 19, 2024
- Samsung Electronics Co., Ltd.
- Cheol Kim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of fabricating a semiconductor device having capacitor material
- Patent number 12,148,811
- Issue date Nov 19, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd
- Wang-Chun Huang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
High voltage transistor structures
- Patent number 12,148,752
- Issue date Nov 19, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd
- Meng-Han Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Devices having a semiconductor material that is semimetal in bulk a...
- Patent number 12,148,816
- Issue date Nov 19, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Jean-Pierre Colinge
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of manufacturing semiconductor device including ferroelectri...
- Patent number 12,148,829
- Issue date Nov 19, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd
- Wilman Tsai
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and a method for fabricating the same
- Patent number 12,148,831
- Issue date Nov 19, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd
- Yu-Lien Huang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Hybrid fin structure of semiconductor device and method of forming...
- Patent number 12,148,672
- Issue date Nov 19, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd
- Yen-Chun Huang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
FinFET structure having a gate contact above a metal gate and strad...
- Patent number 12,148,834
- Issue date Nov 19, 2024
- Huawei Technologies Co., Ltd.
- Xinfang Liu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Silicon oxide layer for oxidation resistance and method forming same
- Patent number 12,148,652
- Issue date Nov 19, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd
- Wan-Yi Kao
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device, and associated method and system
- Patent number 12,148,700
- Issue date Nov 19, 2024
- Taiwan Semiconductor Manufacturing Company Ltd.
- Shih-Wei Peng
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device
- Patent number 12,148,701
- Issue date Nov 19, 2024
- Samsung Electronics Co., Ltd.
- Hongsik Shin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Manufacturing method for semiconductor structure, and semiconductor...
- Patent number 12,148,619
- Issue date Nov 19, 2024
- CHANGXIN MEMORY TECHNOLOGIES, INC.
- Mengmeng Yang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Work function design to increase density of nanosheet devices
- Patent number 12,148,750
- Issue date Nov 19, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd
- Mao-Lin Huang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Use of a placeholder for backside contact formation for transistor...
- Patent number 12,148,751
- Issue date Nov 19, 2024
- Intel Corporation
- Andy Chih-Hung Wei
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Nano-sheet-based devices having inner spacer structures or gate por...
- Patent number 12,148,812
- Issue date Nov 19, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Jui-Chien Huang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device with S/D bottom isolation and methods of formi...
- Patent number 12,148,669
- Issue date Nov 19, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd
- Xusheng Wu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor devices and methods of manufacturing thereof
- Patent number 12,148,671
- Issue date Nov 19, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd
- Shih-Yao Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of forming stacked trench contacts and structures formed the...
- Patent number 12,142,566
- Issue date Nov 12, 2024
- Intel Corporation
- Bernhard Sell
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Staggered stacked semiconductor devices
- Patent number 12,142,656
- Issue date Nov 12, 2024
- International Business Machines Corporation
- Albert Chu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Buffer circuit, semiconductor integrated circuit device, oscillator...
- Patent number RE50208
- Issue date Nov 12, 2024
- Seiko Epson Corporation
- Kenji Hayashi
Information Patent Grant
Devices and methods for enhancing insertion loss performance of an...
- Patent number 12,142,585
- Issue date Nov 12, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Jun-De Jin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Interconnect structures for semiconductor devices and methods of ma...
- Patent number 12,142,532
- Issue date Nov 12, 2024
- TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, Limited
- Yu-Lien Huang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Methods and apparatus for measuring analytes using large scale FET...
- Patent number 12,140,560
- Issue date Nov 12, 2024
- Life Technologies Corporation
- Jonathan Rothberg
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Dishing prevention structure embedded in a gate electrode
- Patent number 12,142,488
- Issue date Nov 12, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd
- Ta-Wei Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Pre-deposition treatment for FET technology and devices formed thereby
- Patent number 12,142,531
- Issue date Nov 12, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd
- Cheng-Yen Tsai
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device
- Patent number 12,142,650
- Issue date Nov 12, 2024
- Samsung Electronics Co., Ltd.
- Sang Hoon Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Biosensors for biological or chemical analysis and methods of manuf...
- Patent number 12,140,543
- Issue date Nov 12, 2024
- Illumina, Inc.
- Cheng Frank Zhong
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Integrated chip having a back-side power rail
- Patent number 12,142,557
- Issue date Nov 12, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd
- Shin-Yi Yang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor integrated circuit device and method of manufacturing...
- Patent number 12,142,606
- Issue date Nov 12, 2024
- SOCIONEXT INC.
- Junji Iwahori
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device manufacturing method and plasma processing method
- Patent number 12,142,489
- Issue date Nov 12, 2024
- HITACHI HIGH-TECH CORPORATION
- Mamoru Yakushiji
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
Devices Having a Semiconductor Material That Is Semimetal in Bulk a...
- Publication number 20240387711
- Publication date Nov 21, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Jean-Pierre Colinge
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICES WITH BACKSIDE POWER RAIL AND METHODS OF FABRI...
- Publication number 20240387732
- Publication date Nov 21, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chun-Yuan CHEN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND METHOD
- Publication number 20240387028
- Publication date Nov 21, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Feng-Ching Chu
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
FINFET DEVICE AND METHOD OF FORMING SAME
- Publication number 20240387237
- Publication date Nov 21, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Bo-Cyuan Lu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SILICON OXIDE LAYER FOR OXIDATION RESISTANCE AND METHOD FORMING SAME
- Publication number 20240387238
- Publication date Nov 21, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Wan-Yi Kao
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Backside Interconnect Structures for Semiconductor Devices and Meth...
- Publication number 20240387529
- Publication date Nov 21, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Cheng-Ting Chung
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTEGRATED CIRCUIT DEVICE INCLUDING A POWER SUPPLY LINE AND METHOD...
- Publication number 20240387530
- Publication date Nov 21, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Yi-Hsiung Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INPUT/OUTPUT DEVICES
- Publication number 20240387531
- Publication date Nov 21, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Sung-Hsin Yang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICES AND METHODS OF MANUFACTURING THEREOF
- Publication number 20240387275
- Publication date Nov 21, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Shih-Yao Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURE
- Publication number 20240387276
- Publication date Nov 21, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Chung-Chiang Wu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
HIGH VOLTAGE DEVICE
- Publication number 20240387284
- Publication date Nov 21, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Sung-Hsin Yang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Integrated Circuit Having a High Cell Density
- Publication number 20240387373
- Publication date Nov 21, 2024
- Taiwan Semiconductor Manufacturing Company Limited
- Sheng-Hsiung Chen
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
SEMICONDUCTOR DEVICE STRUCTURE WITH METAL GATE STACK
- Publication number 20240387691
- Publication date Nov 21, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Xusheng Wu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MEMORY DEVICES AND METHODS OF MANUFACTURING THEREOF
- Publication number 20240389313
- Publication date Nov 21, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Meng-Sheng Chang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CAP FOR GATE STACK OF MULTIGATE DEVICE
- Publication number 20240387688
- Publication date Nov 21, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chih-Wei Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Isolated Fin Structures in Semiconductor Devices
- Publication number 20240387694
- Publication date Nov 21, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Yu-Rung Hsu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND METHOD OF FABRICATING THE SAME
- Publication number 20240387527
- Publication date Nov 21, 2024
- Samsung Electronics Co., Ltd.
- Ho-Jun KIM
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICES AND METHODS OF MANUFACTURING THEREOF
- Publication number 20240387532
- Publication date Nov 21, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Ya-Yi Tsai
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTEGRATED CIRCUIT HAVING THREE-DIMENSIONAL TRANSISTORS AND SEAL RI...
- Publication number 20240387535
- Publication date Nov 21, 2024
- TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.
- Kuo-Yang Chia
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MIDDLE-END-OF-LINE STRAP FOR STANDARD CELL
- Publication number 20240387369
- Publication date Nov 21, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Meng-Hung SHEN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor Device and Method
- Publication number 20240387280
- Publication date Nov 21, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Ya-Yi Tsai
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE WITH AIR GAPS BETWEEN METAL GATES AND METHOD O...
- Publication number 20240387281
- Publication date Nov 21, 2024
- Taiwan Semiconductor Manufacturing Co., LTD
- Wei-Lun Min
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICES AND METHODS OF MANUFACTURING THEREOF
- Publication number 20240387283
- Publication date Nov 21, 2024
- Taiwan Semicondutor Manufacturing Company Limited
- Shih-Yao Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SILICON CARBIDE SEMICONDUCTOR DEVICE
- Publication number 20240387724
- Publication date Nov 21, 2024
- Fuji Electric Co., Ltd.
- Keiji OKUMURA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURE
- Publication number 20240387665
- Publication date Nov 21, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Kuo-Chiang Tsai
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD THEREOF
- Publication number 20240387524
- Publication date Nov 21, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chia-Che CHUNG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
BENT FIN DEVICES
- Publication number 20240387533
- Publication date Nov 21, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Jiun-Ming KUO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND METHOD
- Publication number 20240387536
- Publication date Nov 21, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Hsi-Jung WU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
TIE OFF DEVICE
- Publication number 20240387547
- Publication date Nov 21, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Shao-Lun Chien
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
RECESSED CONTACTS AT LINE END AND METHODS FORMING SAME
- Publication number 20240387266
- Publication date Nov 21, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Te-Chih Hsiung
- H01 - BASIC ELECTRIC ELEMENTS

the components being field-effect transistors with insulated gate

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Semiconductor device and method for fabricating the same

Method of fabricating a semiconductor device having capacitor material

High voltage transistor structures

Devices having a semiconductor material that is semimetal in bulk a...

Method of manufacturing semiconductor device including ferroelectri...

Semiconductor device and a method for fabricating the same

Hybrid fin structure of semiconductor device and method of forming...

FinFET structure having a gate contact above a metal gate and strad...

Silicon oxide layer for oxidation resistance and method forming same

Semiconductor device, and associated method and system

Semiconductor device

Manufacturing method for semiconductor structure, and semiconductor...

Work function design to increase density of nanosheet devices

Use of a placeholder for backside contact formation for transistor...

Nano-sheet-based devices having inner spacer structures or gate por...

Semiconductor device with S/D bottom isolation and methods of formi...

Semiconductor devices and methods of manufacturing thereof

Method of forming stacked trench contacts and structures formed the...

Staggered stacked semiconductor devices

Buffer circuit, semiconductor integrated circuit device, oscillator...

Devices and methods for enhancing insertion loss performance of an...

Interconnect structures for semiconductor devices and methods of ma...

Methods and apparatus for measuring analytes using large scale FET...

Dishing prevention structure embedded in a gate electrode

Pre-deposition treatment for FET technology and devices formed thereby

Semiconductor device

Biosensors for biological or chemical analysis and methods of manuf...

Integrated chip having a back-side power rail

Semiconductor integrated circuit device and method of manufacturing...

Semiconductor device manufacturing method and plasma processing method

Patents Applicationslast 30 patents

Devices Having a Semiconductor Material That Is Semimetal in Bulk a...

SEMICONDUCTOR DEVICES WITH BACKSIDE POWER RAIL AND METHODS OF FABRI...

SEMICONDUCTOR DEVICE AND METHOD

FINFET DEVICE AND METHOD OF FORMING SAME

SILICON OXIDE LAYER FOR OXIDATION RESISTANCE AND METHOD FORMING SAME

Backside Interconnect Structures for Semiconductor Devices and Meth...

INTEGRATED CIRCUIT DEVICE INCLUDING A POWER SUPPLY LINE AND METHOD...

INPUT/OUTPUT DEVICES

SEMICONDUCTOR DEVICES AND METHODS OF MANUFACTURING THEREOF

SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURE

HIGH VOLTAGE DEVICE

Integrated Circuit Having a High Cell Density

SEMICONDUCTOR DEVICE STRUCTURE WITH METAL GATE STACK

MEMORY DEVICES AND METHODS OF MANUFACTURING THEREOF

CAP FOR GATE STACK OF MULTIGATE DEVICE

Isolated Fin Structures in Semiconductor Devices

SEMICONDUCTOR DEVICE AND METHOD OF FABRICATING THE SAME

SEMICONDUCTOR DEVICES AND METHODS OF MANUFACTURING THEREOF

INTEGRATED CIRCUIT HAVING THREE-DIMENSIONAL TRANSISTORS AND SEAL RI...

MIDDLE-END-OF-LINE STRAP FOR STANDARD CELL

Semiconductor Device and Method

SEMICONDUCTOR DEVICE WITH AIR GAPS BETWEEN METAL GATES AND METHOD O...

SEMICONDUCTOR DEVICES AND METHODS OF MANUFACTURING THEREOF

SILICON CARBIDE SEMICONDUCTOR DEVICE

SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURE

SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD THEREOF

BENT FIN DEVICES

SEMICONDUCTOR DEVICE AND METHOD

TIE OFF DEVICE

RECESSED CONTACTS AT LINE END AND METHODS FORMING SAME