the compound comprising silicon and oxygen

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CPC
H01L21/02214

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HELECTRICITY H01Electric elements H01LSEMICONDUCTOR DEVICES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR H01L21/00Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof

Current Industry

H01L21/02214the compound comprising silicon and oxygen

Industries

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Patents Grantslast 30 patents

Information Patent Grant
Semiconductor device and method
- Patent number 11,948,798
- Issue date Apr 2, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd
- Ching-Yu Chang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Alkoxysilacyclic or acyloxysilacyclic compounds and methods for dep...
- Patent number 11,884,689
- Issue date Jan 30, 2024
- Robert Gordon Ridgeway
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Method of material deposition
- Patent number 11,798,804
- Issue date Oct 24, 2023
- FEI Company
- Brian Roberts Routh
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Integrated capacitor with sidewall having reduced roughness
- Patent number 11,798,979
- Issue date Oct 24, 2023
- Texas Instruments Incorporated
- Elizabeth Costner Stewart
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of manufacturing semiconductor device, substrate processing...
- Patent number 11,705,326
- Issue date Jul 18, 2023
- Kokusai Electric Corporation
- Kimihiko Nakatani
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of selective deposition for forming fully self-aligned vias
- Patent number 11,658,068
- Issue date May 23, 2023
- Tokyo Electron Limited
- Kandabara Tapily
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Formation of SiOC thin films
- Patent number 11,562,900
- Issue date Jan 24, 2023
- ASM IP Holding B.V.
- Toshiya Suzuki
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Initiation modulation for plasma deposition
- Patent number 11,430,654
- Issue date Aug 30, 2022
- Applied Materials, Inc.
- Madhu Santosh Kumar Mutyala
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Electronic device
- Patent number 11,375,633
- Issue date Jun 28, 2022
- ENDRESS+HAUSER SE+CO.KG
- Simon Keßler
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Precursors and flowable CVD methods for making low-k films to fill...
- Patent number 11,270,880
- Issue date Mar 8, 2022
- VERSUM MATERIALS US, LLC
- Jianheng Li
- C09 - DYES PAINTS POLISHES NATURAL RESINS ADHESIVES MISCELLANEOUS COMPOSITION...
Information Patent Grant
Gallium nitride based semiconductor device and manufacturing method...
- Patent number 11,257,676
- Issue date Feb 22, 2022
- Fuji Electric Co., Ltd.
- Hideaki Matsuyama
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Area selective deposition for cap layer formation in advanced contacts
- Patent number 11,170,992
- Issue date Nov 9, 2021
- Tokyo Electron Limited
- Kandabara Tapily
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of manufacturing semiconductor device
- Patent number 11,164,775
- Issue date Nov 2, 2021
- Kioxia Corporation
- Kazuki Takahashi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Three-dimensional memory device including different height memory s...
- Patent number 11,094,715
- Issue date Aug 17, 2021
- SanDisk Technologies LLC
- Zhixin Cui
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of material deposition
- Patent number 11,069,523
- Issue date Jul 20, 2021
- FEI Company
- Brian Roberts Routh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and method
- Patent number 11,069,528
- Issue date Jul 20, 2021
- Taiwan Semiconductor Manufacturing Company, Ltd
- Ching-Yu Chang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Integrated capacitor with sidewall having reduced roughness
- Patent number 10,978,548
- Issue date Apr 13, 2021
- Texas Instruments Incorporated
- Elizabeth Costner Stewart
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of selective deposition for forming fully self-aligned vias
- Patent number 10,847,363
- Issue date Nov 24, 2020
- Tokyo Electron Limited
- Kandabara Tapily
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Composition for forming silica layer, silica layer, and electronic...
- Patent number 10,804,095
- Issue date Oct 13, 2020
- Samsung SDI Co., Ltd.
- Jin-Hee Bae
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Wafer-level package with enhanced performance
- Patent number 10,804,179
- Issue date Oct 13, 2020
- Qorvo US, Inc.
- Julio C. Costa
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Three-dimensional memory device including different height memory s...
- Patent number 10,741,579
- Issue date Aug 11, 2020
- SanDisk Technologies LLC
- Zhixin Cui
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Wafer-level package with enhanced performance
- Patent number 10,679,918
- Issue date Jun 9, 2020
- Qorvo US, Inc.
- Julio C. Costa
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Wafer-level package with enhanced performance
- Patent number 10,636,720
- Issue date Apr 28, 2020
- Qorvo US, Inc.
- Julio C. Costa
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Three-dimensional memory device containing capacitor pillars and me...
- Patent number 10,629,675
- Issue date Apr 21, 2020
- SanDisk Technologies LLC
- Masatoshi Nishikawa
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Formation of SiOC thin films
- Patent number 10,600,637
- Issue date Mar 24, 2020
- ASM IP Holding B.V.
- Toshiya Suzuki
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Wafer-level package with enhanced performance
- Patent number 10,600,711
- Issue date Mar 24, 2020
- Qorvo US, Inc.
- Julio C. Costa
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Low dielectric constant oxide and low resistance OP stack for 3D NA...
- Patent number 10,553,427
- Issue date Feb 4, 2020
- Applied Materials, Inc.
- Xinhai Han
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Wafer-level package with enhanced performance
- Patent number 10,529,639
- Issue date Jan 7, 2020
- Qorvo US, Inc.
- Julio C. Costa
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Methods for high temperature etching a material layer using protect...
- Patent number 10,497,578
- Issue date Dec 3, 2019
- Applied Materials, Inc.
- Hailong Zhou
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Wafer-level package with enhanced performance
- Patent number 10,490,476
- Issue date Nov 26, 2019
- Qorvo US, Inc.
- Julio C. Costa
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
DEVICE AND METHOD OF FORMING THE SAME
- Publication number 20240387255
- Publication date Nov 21, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Yu-Lien Huang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHODS TO IMPROVE QUALITY SILICON-CONTAINING MATERIALS
- Publication number 20240332006
- Publication date Oct 3, 2024
- Applied Materials, Inc.
- Tianyang Li
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND METHOD
- Publication number 20240249942
- Publication date Jul 25, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Ching-Yu Chang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ALKOXYSILACYCLIC OR ACYLOXYSILACYCLIC COMPOUNDS AND METHODS FOR DEP...
- Publication number 20240182499
- Publication date Jun 6, 2024
- VERSUM MATERIALS US, LLC
- ROBERT GORDON RIDGEWAY
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
AUXILIARY PRECURSOR, THIN-FILM PRECURSOR COMPOSITION, METHOD OF FOR...
- Publication number 20240136175
- Publication date Apr 25, 2024
- SOULBRAIN CO., LTD.
- Jae Sun JUNG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHODS AND SYSTEMS FOR FORMING A LAYER COMPRISING SILICON OXIDE
- Publication number 20230411147
- Publication date Dec 21, 2023
- ASM IP HOLDING, B.V.
- Jihee Jeon
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
METHOD OF FORMING SiOCN LAYER
- Publication number 20230407465
- Publication date Dec 21, 2023
- ASM IP HOLDING B.V.
- Takashi Yoshida
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
SEMICONDUCTOR DEVICE AND METHOD OF FORMING THE SAME
- Publication number 20230268225
- Publication date Aug 24, 2023
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Yu-Lien Huang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
EXPANDABLE DOPED OXIDE FILMS FOR ADVANCED SEMICONDUCTOR APPLICATIONS
- Publication number 20230178424
- Publication date Jun 8, 2023
- LAM RESEARCH CORPORATION
- Reza Bayati
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
FORMATION OF SiOC THIN FILMS
- Publication number 20230132743
- Publication date May 4, 2023
- ASM IP HOLDING B.V.
- Toshiya Suzuki
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
POLY-SILICON BASED WORD LINE FOR 3D MEMORY
- Publication number 20220367560
- Publication date Nov 17, 2022
- Applied Materials, Inc.
- Chang Seok Kang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
LOW-TEMPERATURE DIRECT GROWTH METHOD OF MULTILAYER GRAPHENE, PELLIC...
- Publication number 20220326602
- Publication date Oct 13, 2022
- Korea Electronics Technology Institute
- Hyeong Keun KIM
- G03 - PHOTOGRAPHY CINEMATOGRAPHY ELECTROGRAPHY HOLOGRAPHY
Information Patent Application
Precursors and Flowable CVD Methods for Making Low-K Films to Fill...
- Publication number 20220157601
- Publication date May 19, 2022
- VERSUM MATERIALS US, LLC
- Jianheng Li
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
ELECTRIC ARC MITIGATING FACEPLATE
- Publication number 20220122811
- Publication date Apr 21, 2022
- Applied Materials, Inc.
- Madhu Santosh Kumar Mutyala
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
SEMICONDUCTOR DEVICE AND METHOD
- Publication number 20210343529
- Publication date Nov 4, 2021
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Ching-Yu Chang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INITIATION MODULATION FOR PLASMA DEPOSITION
- Publication number 20210159073
- Publication date May 27, 2021
- Applied Materials, Inc.
- Madhu Santosh Kumar Mutyala
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE
- Publication number 20210082749
- Publication date Mar 18, 2021
- KIOXIA Corporation
- Kazuki TAKAHASHI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD OF SELECTIVE DEPOSITION FOR FORMING FULLY SELF-ALIGNED VIAS
- Publication number 20210074584
- Publication date Mar 11, 2021
- TOKYO ELECTRON LIMITED
- Kandabara Tapily
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
ALKOXYSILACYCLIC OR ACYLOXYSILACYCLIC COMPOUNDS AND METHODS FOR DEP...
- Publication number 20200354386
- Publication date Nov 12, 2020
- VERSUM MATERIALS US, LLC
- Robert Gordon Ridgeway
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
FORMATION OF SiOC THIN FILMS
- Publication number 20200273697
- Publication date Aug 27, 2020
- ASM IP HOLDING B.V.
- Toshiya Suzuki
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE, SUBSTRATE PROCESSING...
- Publication number 20200135455
- Publication date Apr 30, 2020
- Kokusai Electric Corporation
- Kimihiko NAKATANI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND METHOD
- Publication number 20200135462
- Publication date Apr 30, 2020
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Ching-Yu Chang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
LOW DIELECTRIC CONSTANT OXIDE AND LOW RESISTANCE OP STACK FOR 3D NA...
- Publication number 20200126784
- Publication date Apr 23, 2020
- Applied Materials, Inc.
- Xinhai HAN
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
COMPOSITION FOR FORMING SILICA LAYER, SILICA LAYER, AND ELECTRONIC...
- Publication number 20190189430
- Publication date Jun 20, 2019
- Samsung SDI Co., Ltd.
- Jin-Hee BAE
- C01 - INORGANIC CHEMISTRY
Information Patent Application
METHOD OF SELECTIVE DEPOSITION FOR FORMING FULLY SELF-ALIGNED VIAS
- Publication number 20190164749
- Publication date May 30, 2019
- TOKYO ELECTRON LIMITED
- Kandabara Tapily
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
WAFER-LEVEL PACKAGE WITH ENHANCED PERFORMANCE
- Publication number 20190057922
- Publication date Feb 21, 2019
- Qorvo US, Inc.
- Julio C. Costa
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD OF MATERIAL DEPOSITION
- Publication number 20180277361
- Publication date Sep 27, 2018
- FEI Company
- Brian Roberts Routh
- G01 - MEASURING TESTING
Information Patent Application
Method and Composition for Providing Pore Sealing Layer on Porous L...
- Publication number 20180277360
- Publication date Sep 27, 2018
- Versum Materials US, LLC
- Jianheng Li
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD OF DEPOSITING AND ETCHING SI-CONTAINING FILM
- Publication number 20180182614
- Publication date Jun 28, 2018
- ASM IP HOLDING B.V.
- Toshihisa NOZAWA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
WAFER-LEVEL PACKAGE WITH ENHANCED PERFORMANCE
- Publication number 20180047653
- Publication date Feb 15, 2018
- Qorvo US, Inc.
- Julio C. Costa
- H01 - BASIC ELECTRIC ELEMENTS

the compound comprising silicon and oxygen

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Semiconductor device and method

Alkoxysilacyclic or acyloxysilacyclic compounds and methods for dep...

Method of material deposition

Integrated capacitor with sidewall having reduced roughness

Method of manufacturing semiconductor device, substrate processing...

Method of selective deposition for forming fully self-aligned vias

Formation of SiOC thin films

Initiation modulation for plasma deposition

Electronic device

Precursors and flowable CVD methods for making low-k films to fill...

Gallium nitride based semiconductor device and manufacturing method...

Area selective deposition for cap layer formation in advanced contacts

Method of manufacturing semiconductor device

Three-dimensional memory device including different height memory s...

Method of material deposition

Semiconductor device and method

Integrated capacitor with sidewall having reduced roughness

Method of selective deposition for forming fully self-aligned vias

Composition for forming silica layer, silica layer, and electronic...

Wafer-level package with enhanced performance

Three-dimensional memory device including different height memory s...

Wafer-level package with enhanced performance

Wafer-level package with enhanced performance

Three-dimensional memory device containing capacitor pillars and me...

Formation of SiOC thin films

Wafer-level package with enhanced performance

Low dielectric constant oxide and low resistance OP stack for 3D NA...

Wafer-level package with enhanced performance

Methods for high temperature etching a material layer using protect...

Wafer-level package with enhanced performance

Patents Applicationslast 30 patents

DEVICE AND METHOD OF FORMING THE SAME

METHODS TO IMPROVE QUALITY SILICON-CONTAINING MATERIALS

SEMICONDUCTOR DEVICE AND METHOD

ALKOXYSILACYCLIC OR ACYLOXYSILACYCLIC COMPOUNDS AND METHODS FOR DEP...

AUXILIARY PRECURSOR, THIN-FILM PRECURSOR COMPOSITION, METHOD OF FOR...

METHODS AND SYSTEMS FOR FORMING A LAYER COMPRISING SILICON OXIDE

METHOD OF FORMING SiOCN LAYER

SEMICONDUCTOR DEVICE AND METHOD OF FORMING THE SAME

EXPANDABLE DOPED OXIDE FILMS FOR ADVANCED SEMICONDUCTOR APPLICATIONS

FORMATION OF SiOC THIN FILMS

POLY-SILICON BASED WORD LINE FOR 3D MEMORY

LOW-TEMPERATURE DIRECT GROWTH METHOD OF MULTILAYER GRAPHENE, PELLIC...

Precursors and Flowable CVD Methods for Making Low-K Films to Fill...

ELECTRIC ARC MITIGATING FACEPLATE

SEMICONDUCTOR DEVICE AND METHOD

INITIATION MODULATION FOR PLASMA DEPOSITION

METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE

METHOD OF SELECTIVE DEPOSITION FOR FORMING FULLY SELF-ALIGNED VIAS

ALKOXYSILACYCLIC OR ACYLOXYSILACYCLIC COMPOUNDS AND METHODS FOR DEP...

FORMATION OF SiOC THIN FILMS

METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE, SUBSTRATE PROCESSING...

SEMICONDUCTOR DEVICE AND METHOD

LOW DIELECTRIC CONSTANT OXIDE AND LOW RESISTANCE OP STACK FOR 3D NA...

COMPOSITION FOR FORMING SILICA LAYER, SILICA LAYER, AND ELECTRONIC...

METHOD OF SELECTIVE DEPOSITION FOR FORMING FULLY SELF-ALIGNED VIAS

WAFER-LEVEL PACKAGE WITH ENHANCED PERFORMANCE

METHOD OF MATERIAL DEPOSITION

Method and Composition for Providing Pore Sealing Layer on Porous L...

METHOD OF DEPOSITING AND ETCHING SI-CONTAINING FILM

WAFER-LEVEL PACKAGE WITH ENHANCED PERFORMANCE