the conductive layers comprising semiconducting material

Industry

CPC
H01L21/28525

This industry / category may be too specific. Please go to a parent level for more data

Parent Industries

HELECTRICITY H01Electric elements H01LSEMICONDUCTOR DEVICES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR H01L21/00Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof

Current Industry

H01L21/28525the conductive layers comprising semiconducting material

Industries

Patents Grantslast 30 patents

Information Patent Grant
Semiconductor device having fin structure
- Patent number 11,908,851
- Issue date Feb 20, 2024
- Taiwan Semiconductor Manufacturing Company Ltd.
- Shun-Li Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and method
- Patent number 11,862,468
- Issue date Jan 2, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd
- Kuei-Lun Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Three-dimensional semiconductor memory devices having a vertical se...
- Patent number 11,839,084
- Issue date Dec 5, 2023
- Samsung Electronics Co., Ltd.
- Euntaek Jung
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Memory device
- Patent number 11,823,950
- Issue date Nov 21, 2023
- Winbond Electronics Corp.
- Huang-Nan Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for reducing Schottky barrier height and semiconductor devic...
- Patent number 11,817,481
- Issue date Nov 14, 2023
- Taiwan Semiconductor Manufacturing Company, Ltd
- Hung-Hsiang Cheng
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device having an upper epitaxial layer contacting two...
- Patent number 11,798,941
- Issue date Oct 24, 2023
- Taiwan Semiconductor Manufacturing Co., Ltd
- Wei-Yuan Lu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for passivating full front-side deep trench isolation structure
- Patent number 11,769,779
- Issue date Sep 26, 2023
- OmniVision Technologies, Inc.
- Shiyu Sun
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Vertical semiconductor device and method for fabricating the vertic...
- Patent number 11,751,395
- Issue date Sep 5, 2023
- SK hynix Inc.
- In-Su Park
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Fin Field-Effect Transistor device and method of forming the same
- Patent number 11,728,215
- Issue date Aug 15, 2023
- Taiwan Semiconductor Manufacturing Company, Ltd
- Shich-Chang Suen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and method for fabricating the same
- Patent number 11,676,820
- Issue date Jun 13, 2023
- SK Hynix Inc.
- Oh-Hyun Kim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Vertical semiconductor device with enhanced contact structure and a...
- Patent number 11,664,427
- Issue date May 30, 2023
- ATOMERA INCORPORATED
- Robert John Stephenson
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Process for thin film deposition through controlled formation of va...
- Patent number 11,634,811
- Issue date Apr 25, 2023
- Gelest, Inc.
- Barry C. Arkles
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Patterned silicide structures and methods of manufacture
- Patent number 11,631,807
- Issue date Apr 18, 2023
- Integrated Silicon Solution, (Cayman) Inc.
- Kuk-Hwan Kim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Low resistance source drain contact formation with trench metastabl...
- Patent number 11,562,906
- Issue date Jan 24, 2023
- International Business Machines Corporation
- Oleg Gluschenkov
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and method for fabricating the same
- Patent number 11,515,389
- Issue date Nov 29, 2022
- SK Hynix Inc.
- Hae Jung Park
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Column IV transistors for PMOS integration
- Patent number 11,508,813
- Issue date Nov 22, 2022
- Daedalus Prime LLC
- Glenn A. Glass
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for providing a semiconductor device with silicon filled gaps
- Patent number 11,501,968
- Issue date Nov 15, 2022
- ASM IP Holding B.V.
- Dieter Pierreux
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for reducing Schottky barrier height and semiconductor devic...
- Patent number 11,502,174
- Issue date Nov 15, 2022
- Taiwan Semiconductor Manufacturing Co., Ltd
- Hung-Hsiang Cheng
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Three-dimensional memory devices and fabrication methods thereof
- Patent number 11,502,102
- Issue date Nov 15, 2022
- Yangtze Memory Technologies Co., Ltd.
- Li Hong Xiao
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Contact resistance reduction employing germanium overlayer pre-cont...
- Patent number 11,476,344
- Issue date Oct 18, 2022
- Daedalus Prime LLC
- Glenn A. Glass
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Transistors with high concentration of germanium
- Patent number 11,387,320
- Issue date Jul 12, 2022
- Intel Corporation
- Anand S. Murthy
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Vertical semiconductor device with enhanced contact structure and a...
- Patent number 11,387,325
- Issue date Jul 12, 2022
- ATOMERA INCORPORATED
- Robert John Stephenson
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor component having a fin and an epitaxial contact struc...
- Patent number 11,387,237
- Issue date Jul 12, 2022
- Taiwan Semiconductor Manufacturing Co., Ltd
- Kuo-Cheng Ching
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device having semiconductor alloy layer adjacent a ga...
- Patent number 11,380,762
- Issue date Jul 5, 2022
- Taiwan Semiconductor Manufacturing Company, Ltd
- Chien-Chao Huang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Direct sensing BioFETs and methods of manufacture
- Patent number 11,353,421
- Issue date Jun 7, 2022
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Yi-Hsien Chang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Memory device and method of fabricating the same
- Patent number 11,348,941
- Issue date May 31, 2022
- Macronix International Co., Ltd.
- Chih-Hsiung Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Three-dimensional semiconductor memory devices
- Patent number 11,348,942
- Issue date May 31, 2022
- Samsung Electronics Co., Ltd.
- Euntaek Jung
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Process for thin film deposition through controlled formation of va...
- Patent number 11,248,291
- Issue date Feb 15, 2022
- Gelest, Inc.
- Barry C. Arkles
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Contact resistance reduction employing germanium overlayer pre-cont...
- Patent number 11,251,281
- Issue date Feb 15, 2022
- Intel Corporation
- Glenn A. Glass
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Formation method of semiconductor device with fin structures
- Patent number 11,251,078
- Issue date Feb 15, 2022
- Taiwan Semiconductor Manufacturing Co., Ltd
- Chung-Liang Cheng
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
SEMICONDUCTOR STRUCTURE AND METHOD OF MANUFACTURING THE SAME
- Publication number 20240088234
- Publication date Mar 14, 2024
- Taiwan Semiconductor Manufacturing company Ltd.
- CHANSYUN DAVID YANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
THREE-DIMENSIONAL SEMICONDUCTOR MEMORY DEVICES
- Publication number 20240090224
- Publication date Mar 14, 2024
- Samsung Electronics Co., Ltd.
- Euntaek JUNG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD OF MANUFACTURING A SEMICONDUCTOR DEVICE INCLUDING A CONDUCTI...
- Publication number 20240079456
- Publication date Mar 7, 2024
- SK HYNIX INC.
- Jae Man YOON
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
VERTICAL SEMICONDUCTOR DEVICE AND METHOD FOR FABRICATING THE VERTIC...
- Publication number 20230403855
- Publication date Dec 14, 2023
- SK HYNIX INC.
- In-Su PARK
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND METHOD
- Publication number 20230377891
- Publication date Nov 23, 2023
- Taiwan Semiconducor Manufacturing Co., Ltd.
- Kuei-Lun Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD THEREOF
- Publication number 20230361116
- Publication date Nov 9, 2023
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Wei-Yuan LU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHODS OF GROWING METAL-CONTAINING FILMS
- Publication number 20230295803
- Publication date Sep 21, 2023
- Applied Materials, Inc.
- Haoming Yan
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
Carbon and/or Oxygen Doped Polysilicon Resistor
- Publication number 20230112644
- Publication date Apr 13, 2023
- TEXAS INSTRUMENTS INCORPORATED
- Yanbiao Pan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND METHOD FOR FABRICATING THE SAME
- Publication number 20230059787
- Publication date Feb 23, 2023
- SK HYNIX INC.
- Hae Jung PARK
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
FILM DEPOSITION METHOD AND ELEMENT INCLUDING FILM DEPOSITED BY THE...
- Publication number 20230022023
- Publication date Jan 26, 2023
- Samsung Electronics Co., Ltd.
- Changseok LEE
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD FOR REDUCING SCHOTTKY BARRIER HEIGHT AND SEMICONDUCTOR DEVIC...
- Publication number 20220384581
- Publication date Dec 1, 2022
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Hung-Hsiang CHENG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE WITH EPITAXIAL CONTACT
- Publication number 20220352164
- Publication date Nov 3, 2022
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Kuo-Cheng Ching
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Contact Structures in Semiconductor Devices
- Publication number 20220310800
- Publication date Sep 29, 2022
- TAIWAN SEMICONDUCTOR MANUFACTURING CO., LTD.
- Mrunal Abhijith Khaderbad
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
THREE-DIMENSIONAL SEMICONDUCTOR MEMORY DEVICES
- Publication number 20220293633
- Publication date Sep 15, 2022
- Samsung Electronics Co., Ltd.
- Euntaek JUNG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
VERTICAL SEMICONDUCTOR DEVICE WITH ENHANCED CONTACT STRUCTURE AND A...
- Publication number 20220285498
- Publication date Sep 8, 2022
- ATOMERA INCORPORATED
- Robert John Stephenson
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
TRANSISTOR DEVICES HAVING SOURCE/DRAIN STRUCTURE CONFIGURED WITH HI...
- Publication number 20220271125
- Publication date Aug 25, 2022
- Intel Corporation
- GLENN A. GLASS
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor Device and Method
- Publication number 20220246433
- Publication date Aug 4, 2022
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Kuei-Lun Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PROCESS FOR THIN FILM DEPOSITION THROUGH CONTROLLED FORMATION OF VA...
- Publication number 20220119940
- Publication date Apr 21, 2022
- Gelest, Inc.
- Barry C. ARKLES
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
VERTICAL SEMICONDUCTOR DEVICE AND METHOD FOR FABRICATING THE VERTIC...
- Publication number 20220123020
- Publication date Apr 21, 2022
- SK HYNIX INC.
- In-Su PARK
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CONTACT RESISTANCE REDUCTION EMPLOYING GERMANIUM OVERLAYER PRE-CONT...
- Publication number 20220102523
- Publication date Mar 31, 2022
- Intel Corporation
- GLENN A. GLASS
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND METHOD FOR FABRICATING THE SAME
- Publication number 20220085158
- Publication date Mar 17, 2022
- SK HYNIX INC.
- Hae Jung PARK
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
NANOCRYSTALLINE GRAPHENE AND METHOD OF FORMING NANOCRYSTALLINE GRAP...
- Publication number 20220048773
- Publication date Feb 17, 2022
- Samsung Electronics Co., Ltd.
- Hyunjae SONG
- B82 - NANO-TECHNOLOGY
Information Patent Application
MEMORY DEVICE AND METHOD OF FABRICATING THE SAME
- Publication number 20210335802
- Publication date Oct 28, 2021
- Macronix International Co., Ltd.
- Chih-Hsiung Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Method for Forming Source/Drain Contacts
- Publication number 20210313324
- Publication date Oct 7, 2021
- Taiwan Semiconductor Manufacturing Co., LTD
- Shao-Ming Koh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Fin Field-Effect Transistor Device and Method of Forming the Same
- Publication number 20210296173
- Publication date Sep 23, 2021
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Shich-Chang Suen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
DEPOSITION SYSTEM AND METHOD USING THE SAME
- Publication number 20210217660
- Publication date Jul 15, 2021
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Jian-Zhi HUANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD FOR PASSIVATING FULL FRONT-SIDE DEEP TRENCH ISOLATION STRUCTURE
- Publication number 20210193704
- Publication date Jun 24, 2021
- OMNIVISION TECHNOLOGIES, INC.
- Shiyu Sun
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD FOR PROVIDING A SEMICONDUCTOR DEVICE WITH SILICON FILLED GAPS
- Publication number 20210151315
- Publication date May 20, 2021
- ASM IP HOLDING B.V.
- Dieter Pierreux
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PROCESS FOR THIN FILM DEPOSITION THROUGH CONTROLLED FORMATION OF VA...
- Publication number 20210140036
- Publication date May 13, 2021
- Gelest Technologies, Inc.
- Barry C. ARKLES
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
THREE-DIMENSIONAL MEMORY DEVICES AND FABRICATION METHODS THEREOF
- Publication number 20210104548
- Publication date Apr 8, 2021
- Yangtze Memory Technologies Co., Ltd.
- Li Hong XIAO
- H01 - BASIC ELECTRIC ELEMENTS

the conductive layers comprising semiconducting material

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Semiconductor device having fin structure

Semiconductor device and method

Three-dimensional semiconductor memory devices having a vertical se...

Memory device

Method for reducing Schottky barrier height and semiconductor devic...

Semiconductor device having an upper epitaxial layer contacting two...

Method for passivating full front-side deep trench isolation structure

Vertical semiconductor device and method for fabricating the vertic...

Fin Field-Effect Transistor device and method of forming the same

Semiconductor device and method for fabricating the same

Vertical semiconductor device with enhanced contact structure and a...

Process for thin film deposition through controlled formation of va...

Patterned silicide structures and methods of manufacture

Low resistance source drain contact formation with trench metastabl...

Semiconductor device and method for fabricating the same

Column IV transistors for PMOS integration

Method for providing a semiconductor device with silicon filled gaps

Method for reducing Schottky barrier height and semiconductor devic...

Three-dimensional memory devices and fabrication methods thereof

Contact resistance reduction employing germanium overlayer pre-cont...

Transistors with high concentration of germanium

Vertical semiconductor device with enhanced contact structure and a...

Semiconductor component having a fin and an epitaxial contact struc...

Semiconductor device having semiconductor alloy layer adjacent a ga...

Direct sensing BioFETs and methods of manufacture

Memory device and method of fabricating the same

Three-dimensional semiconductor memory devices

Process for thin film deposition through controlled formation of va...

Contact resistance reduction employing germanium overlayer pre-cont...

Formation method of semiconductor device with fin structures

Patents Applicationslast 30 patents

SEMICONDUCTOR STRUCTURE AND METHOD OF MANUFACTURING THE SAME

THREE-DIMENSIONAL SEMICONDUCTOR MEMORY DEVICES

METHOD OF MANUFACTURING A SEMICONDUCTOR DEVICE INCLUDING A CONDUCTI...

VERTICAL SEMICONDUCTOR DEVICE AND METHOD FOR FABRICATING THE VERTIC...

SEMICONDUCTOR DEVICE AND METHOD

SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD THEREOF

METHODS OF GROWING METAL-CONTAINING FILMS

Carbon and/or Oxygen Doped Polysilicon Resistor

SEMICONDUCTOR DEVICE AND METHOD FOR FABRICATING THE SAME

FILM DEPOSITION METHOD AND ELEMENT INCLUDING FILM DEPOSITED BY THE...

METHOD FOR REDUCING SCHOTTKY BARRIER HEIGHT AND SEMICONDUCTOR DEVIC...

SEMICONDUCTOR DEVICE WITH EPITAXIAL CONTACT

Contact Structures in Semiconductor Devices

THREE-DIMENSIONAL SEMICONDUCTOR MEMORY DEVICES

VERTICAL SEMICONDUCTOR DEVICE WITH ENHANCED CONTACT STRUCTURE AND A...

TRANSISTOR DEVICES HAVING SOURCE/DRAIN STRUCTURE CONFIGURED WITH HI...

Semiconductor Device and Method

PROCESS FOR THIN FILM DEPOSITION THROUGH CONTROLLED FORMATION OF VA...

VERTICAL SEMICONDUCTOR DEVICE AND METHOD FOR FABRICATING THE VERTIC...

CONTACT RESISTANCE REDUCTION EMPLOYING GERMANIUM OVERLAYER PRE-CONT...

SEMICONDUCTOR DEVICE AND METHOD FOR FABRICATING THE SAME

NANOCRYSTALLINE GRAPHENE AND METHOD OF FORMING NANOCRYSTALLINE GRAP...

MEMORY DEVICE AND METHOD OF FABRICATING THE SAME

Method for Forming Source/Drain Contacts

Fin Field-Effect Transistor Device and Method of Forming the Same

DEPOSITION SYSTEM AND METHOD USING THE SAME

METHOD FOR PASSIVATING FULL FRONT-SIDE DEEP TRENCH ISOLATION STRUCTURE

METHOD FOR PROVIDING A SEMICONDUCTOR DEVICE WITH SILICON FILLED GAPS

PROCESS FOR THIN FILM DEPOSITION THROUGH CONTROLLED FORMATION OF VA...

THREE-DIMENSIONAL MEMORY DEVICES AND FABRICATION METHODS THEREOF