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the coupling element being an additional piece

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HELECTRICITY H05Electric techniques H05KPRINTED CIRCUITS CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS H05K7/00Constructional details common to different types of electric apparatus

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H05K7/20445the coupling element being an additional piece
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Patents Grantslast 30 patents

Patents Applicationslast 30 patents

  • Information Patent Application

    ELECTRIC CONNECTOR
    • Publication number 20240422948
    • Publication date Dec 19, 2024
    • Delta Electronics, Inc.
    • Jing-Xian Shi
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Application

    THERMALLY INSULATING AND ELECTRICALLY CONDUCTIVE SPACER
    • Publication number 20240414868
    • Publication date Dec 12, 2024
    • Google LLC
    • Paul B. Crosbie
    • H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
  • Information Patent Application

    THERMALLY CONDUCTIVE MOUNT
    • Publication number 20240414894
    • Publication date Dec 12, 2024
    • SIEMENS AKTIENGESELLSCHAFT
    • VOLKER MÜLLER
    • H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
  • Information Patent Application

    DATA PROCESSING DEVICE
    • Publication number 20240404915
    • Publication date Dec 5, 2024
    • DELTA ELECTRONICS (SHANGHAI) CO., LTD.
    • Pengkai JI
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Application

    CONDUCTIVE CONNECTION THROUGH EYEWEAR HINGE
    • Publication number 20240310652
    • Publication date Sep 19, 2024
    • Snap Inc.
    • Douglas Wayne Moskowitz
    • E05 - LOCKS KEYS WINDOW OR DOOR FITTINGS SAFES
  • Information Patent Application

    SYSTEMS AND METHODS FOR A TOP SIDE COOLED POWER SEMICONDUCTOR THERM...
    • Publication number 20240314979
    • Publication date Sep 19, 2024
    • DELPHI TECHNOLOGIES IP LIMITED
    • Alexandre M. S. Reis
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Application

    ELECTRONIC DEVICE INCLUDING THERMAL INTERFACE MATERIAL HAVING PHASE...
    • Publication number 20240304565
    • Publication date Sep 12, 2024
    • Samsung Electronics Co., Ltd.
    • Sungbok LEE
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Application

    ELECTRICAL JUNCTION BOX
    • Publication number 20240260203
    • Publication date Aug 1, 2024
    • AUTONETWORKS TECHNOLOGIES, LTD.
    • Issei HORIBA
    • B60 - VEHICLES IN GENERAL
  • Information Patent Application

    ELECTRONIC PACKAGE STRUCTURE
    • Publication number 20240243114
    • Publication date Jul 18, 2024
    • ACER INCORPORATED
    • Yu-Ming Lin
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Application

    CHARGE INLET
    • Publication number 20240208340
    • Publication date Jun 27, 2024
    • YAZAKI CORPORATION
    • Akihiro SAITO
    • B60 - VEHICLES IN GENERAL
  • Information Patent Application

    HEAT EXCHANGE ENHANCED MODULE SHELL
    • Publication number 20240188255
    • Publication date Jun 6, 2024
    • Molex, LLC
    • Taolue Zhang
    • H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
  • Information Patent Application

    WEARABLE ELECTRONIC DEVICE WITH ARTICULATED JOINT
    • Publication number 20240168311
    • Publication date May 23, 2024
    • Snap Inc.
    • Nicholas Streets
    • G06 - COMPUTING CALCULATING COUNTING
  • Information Patent Application

    ELECTRONIC DEVICE
    • Publication number 20240164045
    • Publication date May 16, 2024
    • Hitachi, Ltd
    • Koumei YOSHIDA
    • H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
  • Information Patent Application

    LARGE ENERGY DISSIPATION ELECTRICAL LOAD
    • Publication number 20240092204
    • Publication date Mar 21, 2024
    • FLUKE CORPORATION
    • Timothy Byron Brown
    • B60 - VEHICLES IN GENERAL
  • Information Patent Application

    SEMICONDUCTOR STORAGE DEVICE
    • Publication number 20240098930
    • Publication date Mar 21, 2024
    • KIOXIA Corporation
    • Keishi SHIMIZU
    • H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
  • Information Patent Application

    POWER SUPPLY DEVICE WITH A HEAT GENERATING COMPONENT
    • Publication number 20240090183
    • Publication date Mar 14, 2024
    • Panasonic Intellectual Property Management Co., Ltd.
    • Atsushi YAMASHIMA
    • H02 - GENERATION CONVERSION OR DISTRIBUTION OF ELECTRIC POWER
  • Information Patent Application

    ELECTRONIC ASSEMBLY
    • Publication number 20240064940
    • Publication date Feb 22, 2024
    • VALEO COMFORT AND DRIVING ASSISTANCE
    • Matthias Wellens
    • H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
  • Information Patent Application

    DOMESTIC APPLIANCE AND BOARD HOUSING
    • Publication number 20240057293
    • Publication date Feb 15, 2024
    • Haier US Appliance Solutions, Inc.
    • Aldo Vincent Kremmel
    • H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
  • Information Patent Application

    WEARABLE DEVICE WITH HEAT TRANSFER PATHWAY
    • Publication number 20240027788
    • Publication date Jan 25, 2024
    • Snap Inc.
    • Andrea Ashwood
    • G06 - COMPUTING CALCULATING COUNTING
  • Information Patent Application

    DUAL MODE COOLING SYSTEM FOR USE WITH IN-WALL VIDEO-CODEC AND OTHER...
    • Publication number 20240015922
    • Publication date Jan 11, 2024
    • CRESTRON ELECTRONICS, INC.
    • Mark LaBosco
    • G06 - COMPUTING CALCULATING COUNTING
  • Information Patent Application

    HEAT DISSIPATION BOLT
    • Publication number 20230327418
    • Publication date Oct 12, 2023
    • Suzhou Littelfuse OVS Co., Ltd.
    • EDWARD JIN
    • H02 - GENERATION CONVERSION OR DISTRIBUTION OF ELECTRIC POWER
  • Information Patent Application

    APPARATUS FOR COOLING ELECTRONIC CIRCUITRY
    • Publication number 20230301015
    • Publication date Sep 21, 2023
    • CRESTRON ELECTRONICS, INC.
    • William P Rehak
    • H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
  • Information Patent Application

    HEAT DISSIPATION MODULE AND POWER CONVERSION DEVICE COMPRISING SAME
    • Publication number 20230292472
    • Publication date Sep 14, 2023
    • LG Innotek Co., Ltd.
    • Mi Sun LEE
    • H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
  • Information Patent Application

    THERMAL MODULE
    • Publication number 20230262924
    • Publication date Aug 17, 2023
    • ACER INCORPORATED
    • Jau-Han Ke
    • H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
  • Information Patent Application

    ELECTRONIC DEVICE
    • Publication number 20230262923
    • Publication date Aug 17, 2023
    • GETAC TECHNOLOGY CORPORATION
    • JUI-LIN YANG
    • H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
  • Information Patent Application

    ELECTRONIC APPARATUS
    • Publication number 20230209766
    • Publication date Jun 29, 2023
    • LENOVO (SINGAPORE) PTE. LTD.
    • Kosei Kimura
    • H04 - ELECTRIC COMMUNICATION TECHNIQUE
  • Information Patent Application

    THERMAL BRIDGE FOR AN ELECTRICAL COMPONENT
    • Publication number 20230200020
    • Publication date Jun 22, 2023
    • TE Connectivity Services GmbH
    • Alan Weir Bucher
    • H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
  • Information Patent Application

    ELECTRONIC APPARATUS, COOLING MODULE, AND HEAT SINK
    • Publication number 20230189472
    • Publication date Jun 15, 2023
    • LENOVO (SINGAPORE) PTE. LTD.
    • Hao-Yu Wang
    • G06 - COMPUTING CALCULATING COUNTING
  • Information Patent Application

    OPTICAL ENGINE DEVICE WITH HEAT DISSIPATION FUNCTION AND PROJECTOR...
    • Publication number 20230176460
    • Publication date Jun 8, 2023
    • BENQ CORPORATION
    • Chun-Han Lin
    • H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
  • Information Patent Application

    THERMALLY CONDUCTIVE SHEET AND METHOD FOR MANUFACTURING SAME
    • Publication number 20230144307
    • Publication date May 11, 2023
    • SEKISUI POLYMATECH CO., LTD.
    • Hiroki KUDOH
    • F28 - HEAT EXCHANGE IN GENERAL