the devices having semiconductor bodies comprising crystalline silicon carbide

Industry

CPC
H01L21/0445

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Parent Industries

HELECTRICITY H01Electric elements H01LSEMICONDUCTOR DEVICES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR H01L21/00Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof

Current Industry

H01L21/0445the devices having semiconductor bodies comprising crystalline silicon carbide

Industries

Patents Grantslast 30 patents

Information Patent Grant
Semiconductor device
- Patent number 11,777,030
- Issue date Oct 3, 2023
- Rohm Co., Ltd.
- Shuhei Mitani
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of cleaning wafer and wafer with reduced impurities
- Patent number 11,646,209
- Issue date May 9, 2023
- SENIC INC.
- Jong Hwi Park
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device
- Patent number 11,610,992
- Issue date Mar 21, 2023
- Rohm Co., Ltd.
- Shuhei Mitani
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor devices comprising getter layers and methods of makin...
- Patent number 11,315,845
- Issue date Apr 26, 2022
- Monolith Semiconductor, Inc.
- Kevin Matocha
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device
- Patent number 11,296,223
- Issue date Apr 5, 2022
- Rohm Co., Ltd.
- Shuhei Mitani
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Heat treatment apparatus
- Patent number 11,291,083
- Issue date Mar 29, 2022
- TOYOKO KAGAKU CO., LTD.
- Shiniti Itani
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for splitting semiconductor wafers
- Patent number 11,081,393
- Issue date Aug 3, 2021
- Infineon Technologies AG
- Christian Beyer
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device
- Patent number 11,043,589
- Issue date Jun 22, 2021
- Rohm Co., Ltd.
- Shuhei Mitani
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor substrate die sawing singulation systems and methods
- Patent number 10,957,597
- Issue date Mar 23, 2021
- Semiconductor Components Industries, LLC
- Michael J. Seddon
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Etching method
- Patent number 10,923,354
- Issue date Feb 16, 2021
- National University Corporation Saitama University
- Junichi Ikeno
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Methods for processing a silicon carbide wafer, and a silicon carbi...
- Patent number 10,903,078
- Issue date Jan 26, 2021
- Infineon Technologies AG
- Hans-Joachim Schulze
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device
- Patent number 10,804,392
- Issue date Oct 13, 2020
- Rohm Co., Ltd.
- Shuhei Mitani
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor devices comprising getter layers and methods of makin...
- Patent number 10,804,175
- Issue date Oct 13, 2020
- Monolith Semiconductor, Inc.
- Kevin Matocha
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device including ion implanted alignment marks and me...
- Patent number 10,763,331
- Issue date Sep 1, 2020
- PANASONIC INTELLECTUAL PROPERTY MANAGEMENT CO., LTD.
- Kouichi Saitou
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for producing a wafer from a hexagonal single crystal ingot...
- Patent number 10,755,946
- Issue date Aug 25, 2020
- Disco Corporation
- Kazuya Hirata
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Semiconductor stack
- Patent number 10,734,222
- Issue date Aug 4, 2020
- Sumitomo Electric Industries, Ltd.
- Taro Nishiguchi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor substrate die sawing singulation systems and methods
- Patent number 10,679,898
- Issue date Jun 9, 2020
- Semiconductor Components Industries, LLC
- Michael J. Seddon
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Surface treatment method for SiC substrate
- Patent number 10,665,465
- Issue date May 26, 2020
- Kwansei Gakuin Educational Foundation
- Tadaaki Kaneko
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Silicon carbide substrate heating
- Patent number 10,600,662
- Issue date Mar 24, 2020
- Varian Semiconductor Equipment Associates, Inc.
- Paul E. Pergande
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor stack
- Patent number 10,580,647
- Issue date Mar 3, 2020
- Sumitomo Electric Industries, Ltd.
- Taro Nishiguchi
- C30 - CRYSTAL GROWTH
Information Patent Grant
Semiconductor device
- Patent number 10,546,954
- Issue date Jan 28, 2020
- Rohm Co., Ltd.
- Shuhei Mitani
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for producing SiC composite substrate
- Patent number 10,431,460
- Issue date Oct 1, 2019
- Shin-Etsu Chemical Co., Ltd.
- Shoji Akiyama
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for manufacturing a bonded SOI wafer
- Patent number 10,424,484
- Issue date Sep 24, 2019
- Shin-Etsu Handotai Co., Ltd.
- Toru Ishizuka
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor stack
- Patent number 10,395,924
- Issue date Aug 27, 2019
- Sumitomo Electric Industries, Ltd.
- Taro Nishiguchi
- C30 - CRYSTAL GROWTH
Information Patent Grant
Heteroepitaxial structures with high temperature stable substrate i...
- Patent number 10,388,777
- Issue date Aug 20, 2019
- Intel Corporation
- Sansaptak Dasgupta
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device
- Patent number 10,319,853
- Issue date Jun 11, 2019
- Rohm Co., Ltd.
- Shuhei Mitani
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for fabricating semiconductor substrate, semiconductor subst...
- Patent number 10,312,330
- Issue date Jun 4, 2019
- Kabushiki Kaisha Toshiba
- Johji Nishio
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Heat treatment apparatus
- Patent number 10,237,915
- Issue date Mar 19, 2019
- TOYOKO KAGAKU CO., LTD.
- Shiniti Itani
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Method for processing wide-bandgap semiconductor substrate and appa...
- Patent number 10,163,645
- Issue date Dec 25, 2018
- Osaka University
- Kazuto Yamauchi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Bond and release layer transfer process
- Patent number 10,164,144
- Issue date Dec 25, 2018
- QMAT, INC.
- Francois J. Henley
- C30 - CRYSTAL GROWTH

Patents Applicationslast 30 patents

Information Patent Application
COMPOUND SEMICONDUCTOR LAYERED STRUCTURE AND PROCESS FOR PREPARING...
- Publication number 20240128080
- Publication date Apr 18, 2024
- Umicore
- Markus LEITGEB
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SUPPORT STAGE, SUPPORT DEVICE, AND METHOD FOR MANUFACTURING SEMICON...
- Publication number 20240079262
- Publication date Mar 7, 2024
- Rohm Co., Ltd.
- Hajime USHIO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD OF MANUFACTURING SILICON CARBIDE SEMICONDUCTOR DEVICE
- Publication number 20240079275
- Publication date Mar 7, 2024
- Fuji Electric Co., Ltd.
- Takashi TSUJI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE
- Publication number 20230395713
- Publication date Dec 7, 2023
- Rohm Co., Ltd.
- Shuhei MITANI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD FOR SPLITTING SEMICONDUCTOR WAFERS
- Publication number 20230005794
- Publication date Jan 5, 2023
- INFINEON TECHNOLOGIES AG
- Christian Beyer
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD FOR PREPARING POLISHING SLURRY AND POLISHING METHOD USING SAME
- Publication number 20220220341
- Publication date Jul 14, 2022
- Research & Business Foundation Sungkyunkwan University
- TAESUNG KIM
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE
- Publication number 20220181487
- Publication date Jun 9, 2022
- Rohm Co., Ltd.
- Shuhei MITANI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SiC SUBSTRATE MANUFACTURING METHOD AND MANUFACTURING DEVICE, AND ME...
- Publication number 20220181155
- Publication date Jun 9, 2022
- KWANSEI GAKUIN EDUCATIONAL FOUNDATION
- Tadaaki KANEKO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
WAFER PRODUCING METHOD
- Publication number 20220148881
- Publication date May 12, 2022
- Disco Corporation
- Kazuya Hirata
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
METHOD OF CLEANING WAFER AND WAFER WITH REDUCED IMPURITIES
- Publication number 20220093419
- Publication date Mar 24, 2022
- SENIC INC.
- Jong Hwi PARK
- B08 - CLEANING
Information Patent Application
SEMICONDUCTOR DEVICE
- Publication number 20210399130
- Publication date Dec 23, 2021
- Rohm Co., Ltd.
- Shuhei MITANI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SiC WAFER AND MANUFACTURING METHOD THEREOF
- Publication number 20210280677
- Publication date Sep 9, 2021
- Hitachi Metals, Ltd.
- Keisuke KOBAYASHI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE
- Publication number 20210280715
- Publication date Sep 9, 2021
- Rohm Co., Ltd.
- Shuhei MITANI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Method for Splitting Semiconductor Wafers
- Publication number 20210175123
- Publication date Jun 10, 2021
- INFINEON TECHNOLOGIES AG
- Christian Beyer
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICES COMPRISING GETTER LAYERS AND METHODS OF MAKIN...
- Publication number 20210005523
- Publication date Jan 7, 2021
- Monolith Semiconductor Inc.
- Kevin MATOCHA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE
- Publication number 20200411687
- Publication date Dec 31, 2020
- Rohm Co., Ltd.
- Shuhei MITANI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SUBSTRATE PROCESSING METHOD AND SUBSTRATE PROCESSING APPARATUS
- Publication number 20200381269
- Publication date Dec 3, 2020
- SCREEN Holdings Co., Ltd.
- Naozumi FUJIWARA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
WAFER PRODUCING METHOD AND WAFER PRODUCING APPARATUS
- Publication number 20200343102
- Publication date Oct 29, 2020
- Disco Corporation
- Kazuya HIRATA
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
SEMICONDUCTOR SUBSTRATE DIE SAWING SINGULATION SYSTEMS AND METHODS
- Publication number 20200266106
- Publication date Aug 20, 2020
- Semiconductor Components Industries, LLC
- Michael J. SEDDON
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR STACK
- Publication number 20200152457
- Publication date May 14, 2020
- Sumitomo Electric Industries, Ltd.
- Taro NISHIGUCHI
- C03 - GLASS MINERAL OR SLAG WOOL
Information Patent Application
SEMICONDUCTOR DEVICE
- Publication number 20200119192
- Publication date Apr 16, 2020
- Rohm Co., Ltd.
- Shuhei MITANI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR SUBSTRATE DIE SAWING SINGULATION SYSTEMS AND METHODS
- Publication number 20200066592
- Publication date Feb 27, 2020
- Semiconductor Components Industries, LLC
- Michael J. SEDDON
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Silicon Carbide Substrate Heating
- Publication number 20200027762
- Publication date Jan 23, 2020
- Varian Semiconductor Equipment Associates, Inc.
- Paul E. Pergande
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Etching Method
- Publication number 20200020535
- Publication date Jan 16, 2020
- Shin-Etsu Polymer Co., Ltd.
- Junichi IKENO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Methods for Processing a Silicon Carbide Wafer, and a Silicon Carbi...
- Publication number 20190362972
- Publication date Nov 28, 2019
- Hans-Joachim Schulze
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR STACK
- Publication number 20190341247
- Publication date Nov 7, 2019
- Sumitomo Electric Industries, Ltd.
- Taro NISHIGUCHI
- C03 - GLASS MINERAL OR SLAG WOOL
Information Patent Application
SEMICONDUCTOR DEVICE
- Publication number 20190273158
- Publication date Sep 5, 2019
- Rohm Co., Ltd.
- Shuhei MITANI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
HEAT TREATMENT APPARATUS
- Publication number 20190166652
- Publication date May 30, 2019
- TOYOKO KAGAKU CO., LTD.
- Shiniti Itani
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD FOR PRODUCING SiC COMPOSITE SUBSTRATE
- Publication number 20190157087
- Publication date May 23, 2019
- Shin-Etsu Chemical Co., Ltd.
- Shoji Akiyama
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
WAFER PRODUCING METHOD AND WAFER PRODUCING APPARATUS
- Publication number 20190148164
- Publication date May 16, 2019
- Disco Corporation
- Kazuya HIRATA
- H01 - BASIC ELECTRIC ELEMENTS

the devices having semiconductor bodies comprising crystalline silicon carbide

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Semiconductor device

Method of cleaning wafer and wafer with reduced impurities

Semiconductor device

Semiconductor devices comprising getter layers and methods of makin...

Semiconductor device

Heat treatment apparatus

Method for splitting semiconductor wafers

Semiconductor device

Semiconductor substrate die sawing singulation systems and methods

Etching method

Methods for processing a silicon carbide wafer, and a silicon carbi...

Semiconductor device

Semiconductor devices comprising getter layers and methods of makin...

Semiconductor device including ion implanted alignment marks and me...

Method for producing a wafer from a hexagonal single crystal ingot...

Semiconductor stack

Semiconductor substrate die sawing singulation systems and methods

Surface treatment method for SiC substrate

Silicon carbide substrate heating

Semiconductor stack

Semiconductor device

Method for producing SiC composite substrate

Method for manufacturing a bonded SOI wafer

Semiconductor stack

Heteroepitaxial structures with high temperature stable substrate i...

Semiconductor device

Method for fabricating semiconductor substrate, semiconductor subst...

Heat treatment apparatus

Method for processing wide-bandgap semiconductor substrate and appa...

Bond and release layer transfer process

Patents Applicationslast 30 patents

COMPOUND SEMICONDUCTOR LAYERED STRUCTURE AND PROCESS FOR PREPARING...

SUPPORT STAGE, SUPPORT DEVICE, AND METHOD FOR MANUFACTURING SEMICON...

METHOD OF MANUFACTURING SILICON CARBIDE SEMICONDUCTOR DEVICE

SEMICONDUCTOR DEVICE

METHOD FOR SPLITTING SEMICONDUCTOR WAFERS

METHOD FOR PREPARING POLISHING SLURRY AND POLISHING METHOD USING SAME

SEMICONDUCTOR DEVICE

SiC SUBSTRATE MANUFACTURING METHOD AND MANUFACTURING DEVICE, AND ME...

WAFER PRODUCING METHOD

METHOD OF CLEANING WAFER AND WAFER WITH REDUCED IMPURITIES

SEMICONDUCTOR DEVICE

SiC WAFER AND MANUFACTURING METHOD THEREOF

SEMICONDUCTOR DEVICE

Method for Splitting Semiconductor Wafers

SEMICONDUCTOR DEVICES COMPRISING GETTER LAYERS AND METHODS OF MAKIN...

SEMICONDUCTOR DEVICE

SUBSTRATE PROCESSING METHOD AND SUBSTRATE PROCESSING APPARATUS

WAFER PRODUCING METHOD AND WAFER PRODUCING APPARATUS

SEMICONDUCTOR SUBSTRATE DIE SAWING SINGULATION SYSTEMS AND METHODS

SEMICONDUCTOR STACK

SEMICONDUCTOR DEVICE

SEMICONDUCTOR SUBSTRATE DIE SAWING SINGULATION SYSTEMS AND METHODS

Silicon Carbide Substrate Heating

Etching Method

Methods for Processing a Silicon Carbide Wafer, and a Silicon Carbi...

SEMICONDUCTOR STACK

SEMICONDUCTOR DEVICE

HEAT TREATMENT APPARATUS

METHOD FOR PRODUCING SiC COMPOSITE SUBSTRATE

WAFER PRODUCING METHOD AND WAFER PRODUCING APPARATUS