the dielectric materials being obtained by full chemical transformation of non-dielectric materials, such as polycristalline silicon, metals

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H01L21/76227

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HELECTRICITY H01Electric elements H01LSEMICONDUCTOR DEVICES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR H01L21/00Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof

Current Industry

H01L21/76227the dielectric materials being obtained by full chemical transformation of non-dielectric materials, such as polycristalline silicon, metals

Industries

Patents Grantslast 30 patents

Information Patent Grant
Semiconductor device and method of manufacture
- Patent number 11,942,549
- Issue date Mar 26, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd
- Wan-Yi Kao
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Methods for seamless gap filling of dielectric material
- Patent number 11,830,728
- Issue date Nov 28, 2023
- Applied Materials, Inc.
- Chengyu Liu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Multiple thickness semiconductor-on-insulator field effect transist...
- Patent number 11,817,345
- Issue date Nov 14, 2023
- Taiwan Semiconductor Manufacturing Company Limited
- Gulbagh Singh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Seamless gap fill
- Patent number 11,798,984
- Issue date Oct 24, 2023
- Taiwan Semiconductor Manufacturing Co., Ltd
- Yen-Chun Huang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of planarizing insulating layer for memory device
- Patent number 11,587,941
- Issue date Feb 21, 2023
- SK hynix Inc.
- Byung Woo Kang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Fin trim plug structures having an oxidation catalyst layer surroun...
- Patent number 11,538,937
- Issue date Dec 27, 2022
- Intel Corporation
- Leonard Guler
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Materials and methods for chemical mechanical polishing of rutheniu...
- Patent number 11,525,072
- Issue date Dec 13, 2022
- Taiwan Semiconductor Manufacturing Co., Ltd
- An-Hsuan Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and method
- Patent number 11,495,464
- Issue date Nov 8, 2022
- Taiwan Semiconductor Manufacturing Co., Ltd
- Ya-Lan Chang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Multiple thickness semiconductor-on-insulator field effect transist...
- Patent number 11,398,403
- Issue date Jul 26, 2022
- Taiwan Semiconductor Manufacturing Company Limited
- Gulbagh Singh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for fabricating semiconductor device
- Patent number 11,271,000
- Issue date Mar 8, 2022
- United Microelectronics Corp.
- Bo-Ruei Cheng
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Bottom-up growth of silicon oxide and silicon nitride using sequent...
- Patent number 11,236,418
- Issue date Feb 1, 2022
- Applied Materials, Inc.
- Rui Cheng
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Seamless gap fill
- Patent number 11,239,310
- Issue date Feb 1, 2022
- Taiwan Semiconductor Manufacturing Co., Ltd
- Yen-Chun Huang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Patterned lumiramic for improved PCLED stability
- Patent number 11,217,734
- Issue date Jan 4, 2022
- Lumileds LLC
- Kentaro Shimizu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Methods and apparatuses including a boundary of a well beneath an a...
- Patent number 11,211,382
- Issue date Dec 28, 2021
- Micron Technology, Inc.
- Michael Smith
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
High pressure oxidation of metal films
- Patent number 11,131,015
- Issue date Sep 28, 2021
- Applied Materials, Inc.
- Amrita B. Mullick
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Method for forming isolation structure having improved gap-fill cap...
- Patent number 11,075,123
- Issue date Jul 27, 2021
- Taiwan Semiconductor Manufacturing Co., Ltd
- Wan-Yi Kao
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of fabricating image sensor
- Patent number 11,004,889
- Issue date May 11, 2021
- Samsung Electronics Co., Ltd.
- Sang-Su Park
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Materials and methods for chemical mechanical polishing of rutheniu...
- Patent number 10,920,105
- Issue date Feb 16, 2021
- Taiwan Semiconductor Manufacturing Co., Ltd
- An-Hsuan Lee
- C09 - DYES PAINTS POLISHES NATURAL RESINS ADHESIVES MISCELLANEOUS COMPOSITION...
Information Patent Grant
Three-dimensional memory device containing a capped insulating sour...
- Patent number 10,854,627
- Issue date Dec 1, 2020
- SanDisk Technologies LLC
- Takumi Moriyama
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device having a trench type device isolation film and...
- Patent number 10,832,983
- Issue date Nov 10, 2020
- Samsung Electronics Co., Ltd.
- Ji Min Choi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor switch device and method having at least two contacts...
- Patent number 10,825,900
- Issue date Nov 3, 2020
- NXP B.V.
- Mahmoud Shehab Mohammad Al-Sa'di
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Three dimensional memory device fabricating method and applications...
- Patent number 10,727,243
- Issue date Jul 28, 2020
- Macronix International Co., Ltd.
- Hang-Ting Lue
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Deposition and treatment of films for patterning
- Patent number 10,699,952
- Issue date Jun 30, 2020
- Applied Materials, Inc.
- Atashi Basu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Methods and apparatuses including a boundary of a well beneath an a...
- Patent number 10,679,991
- Issue date Jun 9, 2020
- Micron Technology, Inc.
- Michael Smith
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Seamless gap fill
- Patent number 10,672,866
- Issue date Jun 2, 2020
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Yen-Chun Huang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Bottom-up growth of silicon oxide and silicon nitride using sequent...
- Patent number 10,626,495
- Issue date Apr 21, 2020
- Applied Materials, Inc.
- Rui Cheng
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Integrated circuit and method of manufacturing integrated circuit
- Patent number 10,566,941
- Issue date Feb 18, 2020
- Rohm Co., Ltd.
- Naohiro Nomura
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for preparing semiconductor structures
- Patent number 10,410,910
- Issue date Sep 10, 2019
- NANYA TECHNOLOGY CORPORATION
- Shing-Yih Shih
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Deposition and treatment of films for patterning
- Patent number 10,319,636
- Issue date Jun 11, 2019
- Applied Materials, Inc.
- Atashi Basu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Seamless gap fill
- Patent number 10,084,040
- Issue date Sep 25, 2018
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Yen-Chun Huang
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
METHOD OF MANUFACTURING SEMICONDUCTOR DEVICES AND SEMICONDUCTOR DEV...
- Publication number 20230207381
- Publication date Jun 29, 2023
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Jun-Nan NIAN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SCALED LINER LAYER FOR ISOLATION STRUCTURE
- Publication number 20230178419
- Publication date Jun 8, 2023
- Applied Materials, Inc.
- Benjamin COLOMBEAU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
FIN TRIM PLUG STRUCTURES HAVING AN OXIDATION CATALYST LAYER SURROUN...
- Publication number 20230089815
- Publication date Mar 23, 2023
- Intel Corporation
- Leonard GULER
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor Device and Method
- Publication number 20220367193
- Publication date Nov 17, 2022
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Ya-Lan Chang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MULTIPLE THICKNESS SEMICONDUCTOR-ON-INSULATOR FIELD EFFECT TRANSIST...
- Publication number 20220328345
- Publication date Oct 13, 2022
- Taiwan Semiconductor Manufacturing Company Limited
- Gulbagh Singh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Seamless Gap Fill
- Publication number 20220157934
- Publication date May 19, 2022
- Taiwan Semiconductor Manufacturing Co., LTD
- Yen-Chun Huang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD OF MANUFACTURING SEMICONDUCTOR STRUCTURE
- Publication number 20220102196
- Publication date Mar 31, 2022
- NANYA TECHNOLOGY CORPORATION
- Ying-Cheng CHUANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD OF MANUFACTURING SEMICONDUCTOR STRUCTURE AND SEMICONDUCTOR S...
- Publication number 20220037197
- Publication date Feb 3, 2022
- NANYA TECHNOLOGY CORPORATION
- Ying-Cheng CHUANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
High Pressure Oxidation of Metal Films
- Publication number 20210404046
- Publication date Dec 30, 2021
- Applied Materials, Inc.
- Amrita B. Mullick
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Materials and Methods for Chemical Mechanical Polishing of Rutheniu...
- Publication number 20210171800
- Publication date Jun 10, 2021
- Taiwan Semiconductor Manufacturing Co., LTD
- An-Hsuan Lee
- C09 - DYES PAINTS POLISHES NATURAL RESINS ADHESIVES MISCELLANEOUS COMPOSITION...
Information Patent Application
SEAMLESS GAP FILL
- Publication number 20200295131
- Publication date Sep 17, 2020
- Taiwan Semiconductor Manufacturing Co., LTD
- Yen-Chun Huang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Bottom-Up Growth of Silicon Oxide and Silicon Nitride Using Sequent...
- Publication number 20200248303
- Publication date Aug 6, 2020
- Applied Materials, Inc.
- Rui Cheng
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
METHOD OF FABRICATING IMAGE SENSOR
- Publication number 20200219928
- Publication date Jul 9, 2020
- Samsung Electronics Co., Ltd.
- SANG-SU PARK
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SCALED LINER LAYER FOR ISOLATION STRUCTURE
- Publication number 20200161171
- Publication date May 21, 2020
- Applied Materials, Inc.
- Benjamin COLOMBEAU
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
Materials and Methods for Chemical Mechanical Polishing of Rutheniu...
- Publication number 20200032105
- Publication date Jan 30, 2020
- Taiwan Semiconductor Manufacturing Co., LTD
- An-Hsuan Lee
- C09 - DYES PAINTS POLISHES NATURAL RESINS ADHESIVES MISCELLANEOUS COMPOSITION...
Information Patent Application
Deposition And Treatment Of Films For Patterning
- Publication number 20190252252
- Publication date Aug 15, 2019
- Applied Materials, Inc.
- Atashi Basu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTEGRATED CIRCUIT AND METHOD OF MANUFACTURING INTEGRATED CIRCUIT
- Publication number 20190036500
- Publication date Jan 31, 2019
- Rohm Co., Ltd.
- Naohiro NOMURA
- H03 - BASIC ELECTRONIC CIRCUITRY
Information Patent Application
SEMICONDUCTOR SWITCH DEVICE AND METHOD
- Publication number 20190019867
- Publication date Jan 17, 2019
- NXP B.V.
- Mahmoud Shehab Mohammad Al-Sa'di
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Seamless Gap Fill
- Publication number 20180350906
- Publication date Dec 6, 2018
- Taiwan Semiconductor Manufacturing Co., LTD
- Yen-Chun Huang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE HAVING A TRENCH TYPE DEVICE ISOLATION FILM AND...
- Publication number 20180166352
- Publication date Jun 14, 2018
- Samsung Electronics Co., Ltd.
- Ji Min Choi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Deposition And Treatment Of Films For Patterning
- Publication number 20180144980
- Publication date May 24, 2018
- Applied Materials, Inc.
- Atashi Basu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Seamless Gap Fill
- Publication number 20170194424
- Publication date Jul 6, 2017
- Taiwan Semiconductor Manufacturing Co., LTD
- Yen-Chun Huang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Dielectric Structures with Negative Taper and Methods of Formation...
- Publication number 20160240429
- Publication date Aug 18, 2016
- INFINEON TECHNOLOGIES AG
- Manfred Engelhardt
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MANUFACTURING METHOD FOR A SEMICONDUCTOR DEVICE
- Publication number 20160027682
- Publication date Jan 28, 2016
- Kabushiki Kaisha Toshiba
- Shintaro Okujo
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
WAFER STRESS CONTROL WITH BACKSIDE PATTERNING
- Publication number 20150364362
- Publication date Dec 17, 2015
- International Business Machines Corporation
- Edward Engbrecht
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DIE, INTEGRATED CIRCUITS AND DRIVER CIRCUITS, AND MET...
- Publication number 20150194421
- Publication date Jul 9, 2015
- NXP B.V.
- Priscilla Boos
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor Structure and Method
- Publication number 20140162432
- Publication date Jun 12, 2014
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chun-Hung Ko
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD AND APPARATUS FOR PREPARING POLYSILAZANE ON A SEMICONDUCTOR...
- Publication number 20140030866
- Publication date Jan 30, 2014
- Taiwan Semiconductor Manufacturing Company, Ltd.
- You-Hua Chou
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor Structure and Method
- Publication number 20130056830
- Publication date Mar 7, 2013
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chun-Hung Ko
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD OF FORMING ISOLATION STRUCTURE
- Publication number 20130017666
- Publication date Jan 17, 2013
- NANYA TECHNOLOGY CORPORATION
- Jui Hsuan Chung
- H01 - BASIC ELECTRIC ELEMENTS

the dielectric materials being obtained by full chemical transformation of non-dielectric materials, such as polycristalline silicon, metals

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Semiconductor device and method of manufacture

Methods for seamless gap filling of dielectric material

Multiple thickness semiconductor-on-insulator field effect transist...

Seamless gap fill

Method of planarizing insulating layer for memory device

Fin trim plug structures having an oxidation catalyst layer surroun...

Materials and methods for chemical mechanical polishing of rutheniu...

Semiconductor device and method

Multiple thickness semiconductor-on-insulator field effect transist...

Method for fabricating semiconductor device

Bottom-up growth of silicon oxide and silicon nitride using sequent...

Seamless gap fill

Patterned lumiramic for improved PCLED stability

Methods and apparatuses including a boundary of a well beneath an a...

High pressure oxidation of metal films

Method for forming isolation structure having improved gap-fill cap...

Method of fabricating image sensor

Materials and methods for chemical mechanical polishing of rutheniu...

Three-dimensional memory device containing a capped insulating sour...

Semiconductor device having a trench type device isolation film and...

Semiconductor switch device and method having at least two contacts...

Three dimensional memory device fabricating method and applications...

Deposition and treatment of films for patterning

Methods and apparatuses including a boundary of a well beneath an a...

Seamless gap fill

Bottom-up growth of silicon oxide and silicon nitride using sequent...

Integrated circuit and method of manufacturing integrated circuit

Method for preparing semiconductor structures

Deposition and treatment of films for patterning

Seamless gap fill

Patents Applicationslast 30 patents

METHOD OF MANUFACTURING SEMICONDUCTOR DEVICES AND SEMICONDUCTOR DEV...

SCALED LINER LAYER FOR ISOLATION STRUCTURE

FIN TRIM PLUG STRUCTURES HAVING AN OXIDATION CATALYST LAYER SURROUN...

Semiconductor Device and Method

MULTIPLE THICKNESS SEMICONDUCTOR-ON-INSULATOR FIELD EFFECT TRANSIST...

Seamless Gap Fill

METHOD OF MANUFACTURING SEMICONDUCTOR STRUCTURE

METHOD OF MANUFACTURING SEMICONDUCTOR STRUCTURE AND SEMICONDUCTOR S...

High Pressure Oxidation of Metal Films

Materials and Methods for Chemical Mechanical Polishing of Rutheniu...

SEAMLESS GAP FILL

Bottom-Up Growth of Silicon Oxide and Silicon Nitride Using Sequent...

METHOD OF FABRICATING IMAGE SENSOR

SCALED LINER LAYER FOR ISOLATION STRUCTURE

Materials and Methods for Chemical Mechanical Polishing of Rutheniu...

Deposition And Treatment Of Films For Patterning

INTEGRATED CIRCUIT AND METHOD OF MANUFACTURING INTEGRATED CIRCUIT

SEMICONDUCTOR SWITCH DEVICE AND METHOD

Seamless Gap Fill

SEMICONDUCTOR DEVICE HAVING A TRENCH TYPE DEVICE ISOLATION FILM AND...

Deposition And Treatment Of Films For Patterning

Seamless Gap Fill

Dielectric Structures with Negative Taper and Methods of Formation...

MANUFACTURING METHOD FOR A SEMICONDUCTOR DEVICE

WAFER STRESS CONTROL WITH BACKSIDE PATTERNING

SEMICONDUCTOR DIE, INTEGRATED CIRCUITS AND DRIVER CIRCUITS, AND MET...

Semiconductor Structure and Method

METHOD AND APPARATUS FOR PREPARING POLYSILAZANE ON A SEMICONDUCTOR...

Semiconductor Structure and Method

METHOD OF FORMING ISOLATION STRUCTURE