the enclosure being defined by a housing formed by a cavity in a resin

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H03H9/1042

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Parent Industries

HELECTRICITY H03Electronic circuits H03HIMPEDANCE NETWORKS H03H9/00Networks comprising electromechanical or electro-acoustic devices Electromechanical resonators

Current Industry

H03H9/1042the enclosure being defined by a housing formed by a cavity in a resin

Industries

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Patents Grantslast 30 patents

Information Patent Grant
Piezoelectric vibrating device
- Patent number 12,126,321
- Issue date Oct 22, 2024
- Daishinku Corporation
- Manabu Ohnishi
- H03 - BASIC ELECTRONIC CIRCUITRY
Information Patent Grant
Chip packaging method and particle chips
- Patent number 12,126,322
- Issue date Oct 22, 2024
- Shenzhen Newsonic Technologies Co., Ltd.
- Jian Wang
- H03 - BASIC ELECTRONIC CIRCUITRY
Information Patent Grant
Package comprising stacked filters
- Patent number 11,984,871
- Issue date May 14, 2024
- RF360 SINGAPORE PTE. LTD.
- Robert Felix Bywalez
- H03 - BASIC ELECTRONIC CIRCUITRY
Information Patent Grant
Acoustic device package and method of making
- Patent number 11,838,004
- Issue date Dec 5, 2023
- Texas Instruments Incorporated
- Enis Tuncer
- H03 - BASIC ELECTRONIC CIRCUITRY
Information Patent Grant
Chip packaging method and particle chips
- Patent number 11,683,020
- Issue date Jun 20, 2023
- Shenzhen Newsonic Technologies Co., Ltd.
- Jian Wang
- H03 - BASIC ELECTRONIC CIRCUITRY
Information Patent Grant
Acoustic wave device
- Patent number 11,581,868
- Issue date Feb 14, 2023
- Murata Manufacturing Co., Ltd.
- Toru Takeshita
- H03 - BASIC ELECTRONIC CIRCUITRY
Information Patent Grant
Method for packaging an electronic component in a package with an o...
- Patent number 11,463,063
- Issue date Oct 4, 2022
- ZHUHAI CRYSTAL RESONANCE TECHNOLOGIES CO., LTD.
- Dror Hurwitz
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Elastic wave device and manufacturing method therefor
- Patent number 11,277,114
- Issue date Mar 15, 2022
- Murata Manufacturing Co., Ltd.
- Taku Kikuchi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
3D-printed protective shell structures with support columns for str...
- Patent number 11,082,028
- Issue date Aug 3, 2021
- Texas Instruments Incorporated
- James Cooper Wainerdi
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Electronic package including cavity defined by resin and method of...
- Patent number 10,999,932
- Issue date May 4, 2021
- SKYWORKS FILTER SOLUTIONS JAPAN CO., LTD.
- Atsushi Takano
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electronic component with two substrates enclosing functional eleme...
- Patent number 10,659,003
- Issue date May 19, 2020
- Taiyo Yuden Co., Ltd.
- Hidetaro Nakazawa
- H03 - BASIC ELECTRONIC CIRCUITRY
Information Patent Grant
Ceramic electronic component and mount structure therefor
- Patent number 10,559,427
- Issue date Feb 11, 2020
- Murata Manufacturing Co., Ltd.
- Teppei Akiyoshi
- H03 - BASIC ELECTRONIC CIRCUITRY
Information Patent Grant
3D-printed protective shell structures for stress sensitive circuits
- Patent number 10,516,381
- Issue date Dec 24, 2019
- Texas Instruments Incorporated
- James Cooper Wainerdi
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
GaN stack acoustic reflector and method for producing the same
- Patent number 10,468,454
- Issue date Nov 5, 2019
- GLOBALFOUNDRIES Singapore Pte. Ltd.
- Humberto Campanella-Pineda
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Embedded RF filter package structure and method of manufacturing th...
- Patent number 10,333,493
- Issue date Jun 25, 2019
- General Electric Company
- Kaustubh Ravindra Nagarkar
- H03 - BASIC ELECTRONIC CIRCUITRY
Information Patent Grant
Electronic package including cavity defined by resin and method of...
- Patent number 10,321,572
- Issue date Jun 11, 2019
- SKYWORKS FILTER SOLUTIONS JAPAN CO., LTD.
- Atsushi Takano
- H03 - BASIC ELECTRONIC CIRCUITRY
Information Patent Grant
Acoustic device package and method of making
- Patent number 10,284,172
- Issue date May 7, 2019
- Texas Instruments Incorporated
- Enis Tuncer
- H03 - BASIC ELECTRONIC CIRCUITRY
Information Patent Grant
Surface acoustic wave device
- Patent number 10,205,435
- Issue date Feb 12, 2019
- Murata Manufacturing Co., Ltd.
- Taku Kikuchi
- H03 - BASIC ELECTRONIC CIRCUITRY
Information Patent Grant
High-frequency module
- Patent number 9,935,613
- Issue date Apr 3, 2018
- Murata Manufacturing Co., Ltd.
- Morio Takeuchi
- H03 - BASIC ELECTRONIC CIRCUITRY
Information Patent Grant
Elastic wave device with first and second support layers providing...
- Patent number 9,876,484
- Issue date Jan 23, 2018
- Murata Manufacturing Co., Ltd.
- Mitsuyoshi Hira
- H03 - BASIC ELECTRONIC CIRCUITRY
Information Patent Grant
Acoustic wave device
- Patent number 9,160,301
- Issue date Oct 13, 2015
- Taiyo Yuden Co., Ltd.
- Motoyuki Tajima
- H03 - BASIC ELECTRONIC CIRCUITRY
Information Patent Grant
Elastic wave device and method for manufacturing the same
- Patent number 8,461,940
- Issue date Jun 11, 2013
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- Norihiko Takada
- H03 - BASIC ELECTRONIC CIRCUITRY
Information Patent Grant
Method of manufacturing a piezoelectric component
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- Issue date Jul 31, 2012
- Nihon Dempa Kogyo Co., Ltd.
- Toshimasa Tsuda
- H03 - BASIC ELECTRONIC CIRCUITRY
Information Patent Grant
Piezoelectric resonator
- Patent number 6,388,363
- Issue date May 14, 2002
- Murata Manufacturing, Ltd.
- Kenichi Kotani
- H03 - BASIC ELECTRONIC CIRCUITRY
Information Patent Grant
Resonator and piezoelectric resonance device with grooved lead term...
- Patent number 6,204,593
- Issue date Mar 20, 2001
- TDK Corporation
- Touru Takahashi
- H03 - BASIC ELECTRONIC CIRCUITRY
Information Patent Grant
Electronic part and a method of production thereof
- Patent number 6,154,940
- Issue date Dec 5, 2000
- Matsushita Electric Industrial Co., Ltd.
- Keiji Onishi
- H03 - BASIC ELECTRONIC CIRCUITRY
Information Patent Grant
Electronic part and a method of production thereof
- Patent number 5,920,142
- Issue date Jul 6, 1999
- Matsushita Electric Industrial Co., Ltd.
- Keiji Onishi
- H03 - BASIC ELECTRONIC CIRCUITRY
Information Patent Grant
Method for manufacturing an electronic component
- Patent number 5,600,877
- Issue date Feb 11, 1997
- Murata Manufacturing Co., Ltd.
- Toshiaki Sugimura
- H03 - BASIC ELECTRONIC CIRCUITRY
Information Patent Grant
Method for manufacturing a piezoelectric resonant component
- Patent number 5,593,721
- Issue date Jan 14, 1997
- Murata Manufacturing Co., Ltd.
- Muneyuki Daidai
- H03 - BASIC ELECTRONIC CIRCUITRY
Information Patent Grant
Piezoelectric-resonance device
- Patent number 5,444,326
- Issue date Aug 22, 1995
- Murata Manufacturing Co., Ltd.
- Ryuhei Yoshida
- H03 - BASIC ELECTRONIC CIRCUITRY

Patents Applicationslast 30 patents

Information Patent Application
CRYSTAL RESONATOR DEVICE WITH THERMISTOR
- Publication number 20240421796
- Publication date Dec 19, 2024
- DAISHINKU CORPORATION
- Yoshinari MORIMOTO
- H03 - BASIC ELECTRONIC CIRCUITRY
Information Patent Application
Bulk Acoustic Wave (BAW) Microresonator Package
- Publication number 20240322786
- Publication date Sep 26, 2024
- TEXAS INSTRUMENTS INCORPORATED
- John Carlo Molina
- H03 - BASIC ELECTRONIC CIRCUITRY
Information Patent Application
MODULE
- Publication number 20240266240
- Publication date Aug 8, 2024
- Murata Manufacturing Co., Ltd.
- Akio KATSUBE
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELECTRONIC DEVICE AND FORMATION METHOD THEREFOR
- Publication number 20230344400
- Publication date Oct 26, 2023
- SEMICONDUCTOR MANUFACTURING ELECTRONICS (SHAOXING) CORPORATION
- Xueli FENG
- H03 - BASIC ELECTRONIC CIRCUITRY
Information Patent Application
CHIP PACKAGING METHOD AND PARTICLE CHIPS
- Publication number 20230275561
- Publication date Aug 31, 2023
- Shenzhen Newsonic Technologies Co., Ltd.
- Jian WANG
- H03 - BASIC ELECTRONIC CIRCUITRY
Information Patent Application
ACOUSTIC WAVE DEVICE AND METHOD OF MANUFACTURING ACOUSTIC WAVE DEVICE
- Publication number 20230246619
- Publication date Aug 3, 2023
- Murata Manufacturing Co., Ltd.
- Kazunori INOUE
- H03 - BASIC ELECTRONIC CIRCUITRY
Information Patent Application
ACOUSTIC WAVE DEVICE
- Publication number 20230134299
- Publication date May 4, 2023
- Murata Manufacturing Co., Ltd.
- Keiji OKADA
- H03 - BASIC ELECTRONIC CIRCUITRY
Information Patent Application
HIGH FREQUENCY MODULE AND COMMUNICATION APPARATUS
- Publication number 20230121885
- Publication date Apr 20, 2023
- MURATA MANUFACTURING CO., LTD.
- Naoya MATSUMOTO
- H03 - BASIC ELECTRONIC CIRCUITRY
Information Patent Application
CHIP PACKAGING METHOD AND PARTICLE CHIPS
- Publication number 20220239276
- Publication date Jul 28, 2022
- Newsonic Technologies
- Jian WANG
- H03 - BASIC ELECTRONIC CIRCUITRY
Information Patent Application
PIEZOELECTRIC VIBRATING DEVICE
- Publication number 20220131519
- Publication date Apr 28, 2022
- DAISHINKU CORPORATION
- Manabu OHNISHI
- H03 - BASIC ELECTRONIC CIRCUITRY
Information Patent Application
INTEGRATION STRUCTURE OF CRYSTAL OSCILIATOR AND CONTROL CIRCUIT AND...
- Publication number 20220077231
- Publication date Mar 10, 2022
- Ningbo Semiconductor International Corporation (Shanghai Branch)
- Xiaoshan QIN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTEGRATED STRUCTURE OF AND INTEGRATED METHOD FOR CRYSTAL RESONATOR...
- Publication number 20220077232
- Publication date Mar 10, 2022
- NINGBO SEMCONDUCTOR INTERNATIONAL CORPORATION (SHANGHAI BRANCH)
- Xiaoshan QIN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTEGRATING STRUCTURE FOR CRYSTAL RESONATOR AND CONTROL CIRCUIT, AN...
- Publication number 20220069008
- Publication date Mar 3, 2022
- Ningbo Semiconductor International Corporation (Shanghai Branch)
- Xiaoshan QIN
- H03 - BASIC ELECTRONIC CIRCUITRY
Information Patent Application
PACKAGE COMPRISING STACKED FILTERS
- Publication number 20210376816
- Publication date Dec 2, 2021
- RF360 EUROPE GMBH
- Robert Felix Bywalez
- H03 - BASIC ELECTRONIC CIRCUITRY
Information Patent Application
Method for Packaging an Electronic Component in a Package with an O...
- Publication number 20210028751
- Publication date Jan 28, 2021
- Zhuhai Crystal Resonance Technologies Co., Ltd.
- Dror Hurwitz
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Single-Crystal Bulk Acoustic Wave Resonator and Method of Making Th...
- Publication number 20200313648
- Publication date Oct 1, 2020
- Global Communication Semiconductors, LLC
- Shing-Kuo Wang
- H03 - BASIC ELECTRONIC CIRCUITRY
Information Patent Application
3D PRINTING OF PROTECTIVE SHELL STRUCTURES FOR STRESS SENSITIVE CIR...
- Publication number 20200127637
- Publication date Apr 23, 2020
- TEXAS INSTRUMENTS INCORPORATED
- James Cooper WAINERDI
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
FILM BULK ACOUSTIC WAVE RESONATORS AND FABRICATION METHODS THEREOF
- Publication number 20190379344
- Publication date Dec 12, 2019
- Shanghai Jadic Optoelectronics Technology Co., Ltd
- Xiaochuan Wang
- H03 - BASIC ELECTRONIC CIRCUITRY
Information Patent Application
GAN STACK ACOUSTIC REFLECTOR AND METHOD FOR PRODUCING THE SAME
- Publication number 20190333965
- Publication date Oct 31, 2019
- GLOBALFOUNDRIES SINGAPORE PTE. LTD.
- Humberto CAMPANELLA-PINEDA
- H03 - BASIC ELECTRONIC CIRCUITRY
Information Patent Application
ELECTRONIC PACKAGE INCLUDING CAVITY DEFINED BY RESIN AND METHOD OF...
- Publication number 20190246500
- Publication date Aug 8, 2019
- SKYWORKS FILTER SOLUTIONS JAPAN CO., LTD.
- Atsushi Takano
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Acoustic Device Package And Method Of Making
- Publication number 20190214964
- Publication date Jul 11, 2019
- TEXAS INSTRUMENTS INCORPORATED
- Enis Tuncer
- H03 - BASIC ELECTRONIC CIRCUITRY
Information Patent Application
3D PRINTING OF PROTECTIVE SHELL STRUCTURES FOR STRESS SENSITIVE CIR...
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- TEXAS INSTRUMENTS INCORPORATED
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- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
RADIO-FREQUENCY PACKAGE WITH OVERMOLD STRUCTURE
- Publication number 20180198436
- Publication date Jul 12, 2018
- SKYWORKS SOLUTIONS, INC.
- Jaydutt Jagdish Joshi
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
PIEZOELECTRIC VIBRATOR, OSCILLATOR, ELECTRONIC DEVICE, AND RADIO-CO...
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- SEIKO INSTRUMENTS INC.
- Kiyoshi ARATAKE
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELASTIC WAVE DEVICE AND METHOD FOR MANUFACTURING THE SAME
- Publication number 20130205586
- Publication date Aug 15, 2013
- Murata Manufacturing Co., Ltd.
- Norihiko TAKADA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ACOUSTIC WAVE DEVICE
- Publication number 20130106530
- Publication date May 2, 2013
- Taiyo Yuden Co., Ltd.
- Motoyuki TAJIMA
- H03 - BASIC ELECTRONIC CIRCUITRY
Information Patent Application
ACOUSTIC WAVE DEVICE
- Publication number 20120181898
- Publication date Jul 19, 2012
- Taiyo Yuden Co., Ltd.
- Kazushige HATAKEYAMA
- H03 - BASIC ELECTRONIC CIRCUITRY
Information Patent Application
ELASTIC WAVE DEVICE AND METHOD FOR MANUFACTURING THE SAME
- Publication number 20100289600
- Publication date Nov 18, 2010
- Murata Manufacturing Co., Ltd.
- Norihiko TAKADA
- H03 - BASIC ELECTRONIC CIRCUITRY
Information Patent Application
Piezoelectric component and manufacturing method thereof
- Publication number 20100019867
- Publication date Jan 28, 2010
- NIHON DEMPA KOGYO CO., LTD.
- Toshimasa Tsuda
- H03 - BASIC ELECTRONIC CIRCUITRY

the enclosure being defined by a housing formed by a cavity in a resin

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Piezoelectric vibrating device

Chip packaging method and particle chips

Package comprising stacked filters

Acoustic device package and method of making

Chip packaging method and particle chips

Acoustic wave device

Method for packaging an electronic component in a package with an o...

Elastic wave device and manufacturing method therefor

3D-printed protective shell structures with support columns for str...

Electronic package including cavity defined by resin and method of...

Electronic component with two substrates enclosing functional eleme...

Ceramic electronic component and mount structure therefor

3D-printed protective shell structures for stress sensitive circuits

GaN stack acoustic reflector and method for producing the same

Embedded RF filter package structure and method of manufacturing th...

Electronic package including cavity defined by resin and method of...

Acoustic device package and method of making

Surface acoustic wave device

High-frequency module

Elastic wave device with first and second support layers providing...

Acoustic wave device

Elastic wave device and method for manufacturing the same

Method of manufacturing a piezoelectric component

Piezoelectric resonator

Resonator and piezoelectric resonance device with grooved lead term...

Electronic part and a method of production thereof

Electronic part and a method of production thereof

Method for manufacturing an electronic component

Method for manufacturing a piezoelectric resonant component

Piezoelectric-resonance device

Patents Applicationslast 30 patents

CRYSTAL RESONATOR DEVICE WITH THERMISTOR

Bulk Acoustic Wave (BAW) Microresonator Package

MODULE

ELECTRONIC DEVICE AND FORMATION METHOD THEREFOR

CHIP PACKAGING METHOD AND PARTICLE CHIPS

ACOUSTIC WAVE DEVICE AND METHOD OF MANUFACTURING ACOUSTIC WAVE DEVICE

ACOUSTIC WAVE DEVICE

HIGH FREQUENCY MODULE AND COMMUNICATION APPARATUS

CHIP PACKAGING METHOD AND PARTICLE CHIPS

PIEZOELECTRIC VIBRATING DEVICE

INTEGRATION STRUCTURE OF CRYSTAL OSCILIATOR AND CONTROL CIRCUIT AND...

INTEGRATED STRUCTURE OF AND INTEGRATED METHOD FOR CRYSTAL RESONATOR...

INTEGRATING STRUCTURE FOR CRYSTAL RESONATOR AND CONTROL CIRCUIT, AN...

PACKAGE COMPRISING STACKED FILTERS

Method for Packaging an Electronic Component in a Package with an O...

Single-Crystal Bulk Acoustic Wave Resonator and Method of Making Th...

3D PRINTING OF PROTECTIVE SHELL STRUCTURES FOR STRESS SENSITIVE CIR...

FILM BULK ACOUSTIC WAVE RESONATORS AND FABRICATION METHODS THEREOF

GAN STACK ACOUSTIC REFLECTOR AND METHOD FOR PRODUCING THE SAME

ELECTRONIC PACKAGE INCLUDING CAVITY DEFINED BY RESIN AND METHOD OF...

Acoustic Device Package And Method Of Making

3D PRINTING OF PROTECTIVE SHELL STRUCTURES FOR STRESS SENSITIVE CIR...

RADIO-FREQUENCY PACKAGE WITH OVERMOLD STRUCTURE

PIEZOELECTRIC VIBRATOR, OSCILLATOR, ELECTRONIC DEVICE, AND RADIO-CO...

ELASTIC WAVE DEVICE AND METHOD FOR MANUFACTURING THE SAME

ACOUSTIC WAVE DEVICE

ACOUSTIC WAVE DEVICE

ELASTIC WAVE DEVICE AND METHOD FOR MANUFACTURING THE SAME

Piezoelectric component and manufacturing method thereof