the layer also covering the sidewalls of the conductive structure

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HELECTRICITY H01Electric elements H01LSEMICONDUCTOR DEVICES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR H01L21/00Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof

Current Industry

H01L21/76852the layer also covering the sidewalls of the conductive structure

Industries

Patents Grantslast 30 patents

Information Patent Grant
Methods of forming interconnect structures in semiconductor fabrica...
- Patent number 11,967,552
- Issue date Apr 23, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd
- Ming-Han Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Contacts for highly scaled transistors
- Patent number 11,961,892
- Issue date Apr 16, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Carlos H. Diaz
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Package component with stepped passivation layer
- Patent number 11,961,762
- Issue date Apr 16, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd
- Ming-Da Cheng
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Contacts for highly scaled transistors
- Patent number 11,929,417
- Issue date Mar 12, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd
- Carlos H. Diaz
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for forming via structure having low interface resistance
- Patent number 11,929,321
- Issue date Mar 12, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd
- Li-Zhen Yu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electro-migration barrier for interconnect
- Patent number 11,923,304
- Issue date Mar 5, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd
- Su-Jen Sung
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Methods of forming apparatuses having tungsten-containing structures
- Patent number 11,923,305
- Issue date Mar 5, 2024
- Micron Technology, Inc.
- Luca Fumagalli
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor structure having tapered bit line
- Patent number 11,882,690
- Issue date Jan 23, 2024
- NANYA TECHNOLOGY CORPORATION
- Pei-Rou Jiang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for fabricating interconnection using graphene
- Patent number 11,876,050
- Issue date Jan 16, 2024
- Semiconductor Manufacturing International (Shanghai) Corporation
- Ming Zhou
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Plated metallization structures
- Patent number 11,862,518
- Issue date Jan 2, 2024
- Analog Devices International Unlimited Company
- Jan Kubik
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Metal contact structure and method of forming the same in a semicon...
- Patent number 11,854,874
- Issue date Dec 26, 2023
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Yu-Hung Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor structure with stacked vias having dome-shaped tips
- Patent number 11,848,264
- Issue date Dec 19, 2023
- International Business Machines Corporation
- Koichi Motoyama
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Conductive route patterning for electronic substrates
- Patent number 11,817,349
- Issue date Nov 14, 2023
- Intel Corporation
- Jeremy Ecton
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Through silicon via and redistribution layer
- Patent number 11,795,051
- Issue date Oct 24, 2023
- X-FAB SEMICONDUCTOR FOUNDRIES GMBH
- Thomas Weidner
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Integrated circuit components with dummy structures
- Patent number 11,784,121
- Issue date Oct 10, 2023
- Intel Corporation
- Kevin L. Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device with contact pad and method of making
- Patent number 11,784,089
- Issue date Oct 10, 2023
- Taiwan Semiconductor Manufacturing Company, Ltd
- Chun-Hsu Yen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Contacts for highly scaled transistors
- Patent number 11,777,009
- Issue date Oct 3, 2023
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Carlos H. Diaz
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Layer structure including diffusion barrier layer and method of man...
- Patent number 11,764,156
- Issue date Sep 19, 2023
- Samsung Electronics Co., Ltd.
- Hyunjae Song
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Cladded metal interconnects
- Patent number 11,749,560
- Issue date Sep 5, 2023
- Intel Corporation
- Thomas Marieb
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Method of semiconductor integrated circuit fabrication
- Patent number 11,735,477
- Issue date Aug 22, 2023
- Taiwan Semiconductor Manufacturing Company, Ltd
- Ming-Feng Shieh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Redistribution lines with protection layers and method forming same
- Patent number 11,721,579
- Issue date Aug 8, 2023
- Taiwan Semiconductor Manufacturing Co., Ltd
- Ming-Da Cheng
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Air gap spacer formation for nano-scale semiconductor devices
- Patent number 11,658,062
- Issue date May 23, 2023
- TESSERA LLC
- Kangguo Cheng
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of forming a semiconductor structure including forming a buf...
- Patent number 11,640,945
- Issue date May 2, 2023
- NANYA TECHNOLOGY CORPORATION
- Shing-Yih Shih
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor structure
- Patent number 11,594,483
- Issue date Feb 28, 2023
- Taiwan Semiconductor Manufacturing Co., Ltd
- Shin-Yi Yang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Integrated electronic device with a redistribution region and a hig...
- Patent number 11,587,866
- Issue date Feb 21, 2023
- STMicroelectronics S.r.l.
- Francesco Maria Pipia
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Scaled gate contact and source/drain cap
- Patent number 11,569,356
- Issue date Jan 31, 2023
- GLOBALFOUNDRIES U.S. Inc.
- Hui Zang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Integrated circuit chip, method of manufacturing the integrated cir...
- Patent number 11,569,206
- Issue date Jan 31, 2023
- Samsung Electronics Co., Ltd.
- Min-hee Uh
- G09 - EDUCATION CRYPTOGRAPHY DISPLAY ADVERTISING SEALS
Information Patent Grant
Chemical direct pattern plating method
- Patent number 11,552,018
- Issue date Jan 10, 2023
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Wen-Jiun Liu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Conductive feature structure including a blocking region
- Patent number 11,532,503
- Issue date Dec 20, 2022
- Taiwan Semiconductor Manufacturing Co., Ltd
- Pin-Wen Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
FinFET device with contact over dielectric gate
- Patent number 11,527,651
- Issue date Dec 13, 2022
- Taiwan Semiconductor Manufacturing Co., Ltd
- Fang Chen
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
MULTI-LAYER TOPOLOGICAL INTERCONNECT WITH PROXIMAL DOPING LAYER
- Publication number 20240113024
- Publication date Apr 4, 2024
- International Business Machines Corporation
- Ching-Tzu Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Metal Contact Structure and Method of Forming the Same in a Semicon...
- Publication number 20240087953
- Publication date Mar 14, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Yu-Hung Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
AIR GAP SPACER FORMATION FOR NANO-SCALE SEMICONDUCTOR DEVICES
- Publication number 20240079266
- Publication date Mar 7, 2024
- TESSERA LLC
- Kangguo Cheng
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
DEVICES WITH REDUCED CAPACITANCES
- Publication number 20240021468
- Publication date Jan 18, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Yu-Hsin Chan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR STRUCTURE HAVING TAPERED BIT LINE
- Publication number 20230403845
- Publication date Dec 14, 2023
- NANYA TECHNOLOGY CORPORATION
- PEI-ROU JIANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CONTACTS FOR HIGHLY SCALED TRANSISTORS
- Publication number 20230395687
- Publication date Dec 7, 2023
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Carlos H. Diaz
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
REDISTRIBUTION LINES WITH PROTECTION LAYERS AND METHOD FORMING SAME
- Publication number 20230352342
- Publication date Nov 2, 2023
- Taiwan Semiconductor Manufacturing Co, LTD.
- Ming-Da Cheng
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE INCLUDING GRAPHENE INTERCONNECT AND METHOD OF...
- Publication number 20230335497
- Publication date Oct 19, 2023
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Shu-Wei Li
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CONTACT FEATURES OF SEMICONDUCTOR DEVICE AND METHOD OF FORMING SAME
- Publication number 20230260836
- Publication date Aug 17, 2023
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Pei Shan Chang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MANUFACTURING METHOD FOR SEMICONDUCTOR STRUCTURE AND SEMICONDUCTOR...
- Publication number 20230253255
- Publication date Aug 10, 2023
- CHANGXIN MEMORY TECHNOLOGIES, INC.
- Qiang LONG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTERCONNECT STRUCTURE
- Publication number 20230223334
- Publication date Jul 13, 2023
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Shin-Yi YANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CHEMICAL DIRECT PATTERN PLATING METHOD
- Publication number 20230215807
- Publication date Jul 6, 2023
- TAIWAN SEMICONDUCTOR MANUFACTURING CO., LTD.
- Wen-Jiun LIU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE WITH AIR GAP
- Publication number 20230180462
- Publication date Jun 8, 2023
- NANYA TECHNOLOGY CORPORATION
- LIANG-PIN CHOU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ACCURATE METAL LINE AND VIA HEIGHT CONTROL FOR TOP VIA PROCESS
- Publication number 20230178429
- Publication date Jun 8, 2023
- International Business Machines Corporation
- Tsung-Sheng Kang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE STRUCTURE WITH STACKED CONDUCTIVE PLUGS AND ME...
- Publication number 20230140534
- Publication date May 4, 2023
- NANYA TECHNOLOGY CORPORATION
- JUNG-HSING CHIEN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Structure And Method For Finfet Device With Contact Over Dielectric...
- Publication number 20230115015
- Publication date Apr 13, 2023
- Taiwan Semiconductor Manufacturing Co., LTD
- Fang Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
TECHNOLOGIES FOR HIGH THROUGHPUT ADDITIVE MANUFACTURING FOR INTEGRA...
- Publication number 20230098303
- Publication date Mar 30, 2023
- Intel Corporation
- Yoshihiro Tomita
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELECTRO-MIGRATION BARRIER FOR INTERCONNECT
- Publication number 20230088795
- Publication date Mar 23, 2023
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Su-Jen Sung
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
TOP VIA INTERCONNECTS WITHOUT BARRIER METAL BETWEEN VIA AND ABOVE LINE
- Publication number 20230077760
- Publication date Mar 16, 2023
- International Business Machines Corporation
- Koichi Motoyama
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTERCONNECT STRUCTURE AND METHODS OF FORMING THE SAME
- Publication number 20230066861
- Publication date Mar 2, 2023
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Cheng-Chin LEE
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING THE SAME
- Publication number 20230056809
- Publication date Feb 23, 2023
- RENESAS ELECTRONICS CORPORATION
- Takeshi KAWAMURA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
GRAPHENE INTEGRATION
- Publication number 20220399230
- Publication date Dec 15, 2022
- LAM RESEARCH CORPORATION
- Bhadri N. VARADARAJAN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
HYBRID MANUFACTURING WITH MODIFIED VIA-LAST PROCESS
- Publication number 20220399310
- Publication date Dec 15, 2022
- Intel Corporation
- Abhishek A. Sharma
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR STRUCTURE AND MANUFACTURING METHOD THEREOF
- Publication number 20220384336
- Publication date Dec 1, 2022
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Shin-Yi YANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE WITH CONTACT PAD AND METHOD OF MAKING
- Publication number 20220359276
- Publication date Nov 10, 2022
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chun-Hsu YEN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Devices with Reduced Capacitances
- Publication number 20220359263
- Publication date Nov 10, 2022
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Yu-Hsin Chan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE HAVING A DUAL MATERIAL REDISTRIBUTION LINE
- Publication number 20220352022
- Publication date Nov 3, 2022
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Anhao CHENG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Redistribution Lines With Protection Layers and Method Forming Same
- Publication number 20220336275
- Publication date Oct 20, 2022
- Taiwan Semiconductor Manufacturing Co, LTD.
- Ming-Da Cheng
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Package Component with Stepped Passivation Layer
- Publication number 20220336276
- Publication date Oct 20, 2022
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Ming-Da Cheng
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CONTACTS FOR HIGHLY SCALED TRANSISTORS
- Publication number 20220328644
- Publication date Oct 13, 2022
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Carlos H. Diaz
- H01 - BASIC ELECTRIC ELEMENTS

the layer also covering the sidewalls of the conductive structure

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Methods of forming interconnect structures in semiconductor fabrica...

Contacts for highly scaled transistors

Package component with stepped passivation layer

Contacts for highly scaled transistors

Method for forming via structure having low interface resistance

Electro-migration barrier for interconnect

Methods of forming apparatuses having tungsten-containing structures

Semiconductor structure having tapered bit line

Method for fabricating interconnection using graphene

Plated metallization structures

Metal contact structure and method of forming the same in a semicon...

Semiconductor structure with stacked vias having dome-shaped tips

Conductive route patterning for electronic substrates

Through silicon via and redistribution layer

Integrated circuit components with dummy structures

Semiconductor device with contact pad and method of making

Contacts for highly scaled transistors

Layer structure including diffusion barrier layer and method of man...

Cladded metal interconnects

Method of semiconductor integrated circuit fabrication

Redistribution lines with protection layers and method forming same

Air gap spacer formation for nano-scale semiconductor devices

Method of forming a semiconductor structure including forming a buf...

Semiconductor structure

Integrated electronic device with a redistribution region and a hig...

Scaled gate contact and source/drain cap

Integrated circuit chip, method of manufacturing the integrated cir...

Chemical direct pattern plating method

Conductive feature structure including a blocking region

FinFET device with contact over dielectric gate

Patents Applicationslast 30 patents

MULTI-LAYER TOPOLOGICAL INTERCONNECT WITH PROXIMAL DOPING LAYER

Metal Contact Structure and Method of Forming the Same in a Semicon...

AIR GAP SPACER FORMATION FOR NANO-SCALE SEMICONDUCTOR DEVICES

DEVICES WITH REDUCED CAPACITANCES

SEMICONDUCTOR STRUCTURE HAVING TAPERED BIT LINE

CONTACTS FOR HIGHLY SCALED TRANSISTORS

REDISTRIBUTION LINES WITH PROTECTION LAYERS AND METHOD FORMING SAME

SEMICONDUCTOR DEVICE INCLUDING GRAPHENE INTERCONNECT AND METHOD OF...

CONTACT FEATURES OF SEMICONDUCTOR DEVICE AND METHOD OF FORMING SAME

MANUFACTURING METHOD FOR SEMICONDUCTOR STRUCTURE AND SEMICONDUCTOR...

INTERCONNECT STRUCTURE

CHEMICAL DIRECT PATTERN PLATING METHOD

SEMICONDUCTOR DEVICE WITH AIR GAP

ACCURATE METAL LINE AND VIA HEIGHT CONTROL FOR TOP VIA PROCESS

SEMICONDUCTOR DEVICE STRUCTURE WITH STACKED CONDUCTIVE PLUGS AND ME...

Structure And Method For Finfet Device With Contact Over Dielectric...

TECHNOLOGIES FOR HIGH THROUGHPUT ADDITIVE MANUFACTURING FOR INTEGRA...

ELECTRO-MIGRATION BARRIER FOR INTERCONNECT

TOP VIA INTERCONNECTS WITHOUT BARRIER METAL BETWEEN VIA AND ABOVE LINE

INTERCONNECT STRUCTURE AND METHODS OF FORMING THE SAME

SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING THE SAME

GRAPHENE INTEGRATION

HYBRID MANUFACTURING WITH MODIFIED VIA-LAST PROCESS

SEMICONDUCTOR STRUCTURE AND MANUFACTURING METHOD THEREOF

SEMICONDUCTOR DEVICE WITH CONTACT PAD AND METHOD OF MAKING

Devices with Reduced Capacitances

SEMICONDUCTOR DEVICE HAVING A DUAL MATERIAL REDISTRIBUTION LINE

Redistribution Lines With Protection Layers and Method Forming Same

Package Component with Stepped Passivation Layer

CONTACTS FOR HIGHLY SCALED TRANSISTORS