the layer also covering the sidewalls of the conductive structure

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HELECTRICITY H01Electric elements H01LSEMICONDUCTOR DEVICES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR H01L21/00Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof

Current Industry

H01L21/76852the layer also covering the sidewalls of the conductive structure

Industries

Patents Grantslast 30 patents

Information Patent Grant
Chemical direct pattern plating method
- Patent number 12,159,837
- Issue date Dec 3, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Wen-Jiun Liu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device structure and methods of forming the same
- Patent number 12,132,000
- Issue date Oct 29, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd
- Shao-Kuan Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Interconnect structure and methods of forming the same
- Patent number 12,094,764
- Issue date Sep 17, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd
- Cheng-Chin Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Top via interconnects without barrier metal between via and above line
- Patent number 12,057,395
- Issue date Aug 6, 2024
- International Business Machines Corporation
- Koichi Motoyama
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device structure with stacked conductive plugs and me...
- Patent number 12,051,644
- Issue date Jul 30, 2024
- NANYA TECHNOLOGY CORPORATION
- Jung-Hsing Chien
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Devices with reduced capacitances
- Patent number 12,046,506
- Issue date Jul 23, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd
- Yu-Hsin Chan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device having a dual material redistribution line
- Patent number 12,027,447
- Issue date Jul 2, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd
- Anhao Cheng
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Redistribution lines with protection layers and method forming same
- Patent number 12,009,256
- Issue date Jun 11, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd
- Ming-Da Cheng
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device with air gap
- Patent number 11,985,816
- Issue date May 14, 2024
- NANYA TECHNOLOGY CORPORATION
- Liang-Pin Chou
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Methods of forming interconnect structures in semiconductor fabrica...
- Patent number 11,967,552
- Issue date Apr 23, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd
- Ming-Han Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Contacts for highly scaled transistors
- Patent number 11,961,892
- Issue date Apr 16, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Carlos H. Diaz
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Package component with stepped passivation layer
- Patent number 11,961,762
- Issue date Apr 16, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd
- Ming-Da Cheng
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Contacts for highly scaled transistors
- Patent number 11,929,417
- Issue date Mar 12, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd
- Carlos H. Diaz
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for forming via structure having low interface resistance
- Patent number 11,929,321
- Issue date Mar 12, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd
- Li-Zhen Yu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electro-migration barrier for interconnect
- Patent number 11,923,304
- Issue date Mar 5, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd
- Su-Jen Sung
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Methods of forming apparatuses having tungsten-containing structures
- Patent number 11,923,305
- Issue date Mar 5, 2024
- Micron Technology, Inc.
- Luca Fumagalli
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor structure having tapered bit line
- Patent number 11,882,690
- Issue date Jan 23, 2024
- NANYA TECHNOLOGY CORPORATION
- Pei-Rou Jiang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for fabricating interconnection using graphene
- Patent number 11,876,050
- Issue date Jan 16, 2024
- Semiconductor Manufacturing International (Shanghai) Corporation
- Ming Zhou
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Plated metallization structures
- Patent number 11,862,518
- Issue date Jan 2, 2024
- Analog Devices International Unlimited Company
- Jan Kubik
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Metal contact structure and method of forming the same in a semicon...
- Patent number 11,854,874
- Issue date Dec 26, 2023
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Yu-Hung Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor structure with stacked vias having dome-shaped tips
- Patent number 11,848,264
- Issue date Dec 19, 2023
- International Business Machines Corporation
- Koichi Motoyama
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Conductive route patterning for electronic substrates
- Patent number 11,817,349
- Issue date Nov 14, 2023
- Intel Corporation
- Jeremy Ecton
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Through silicon via and redistribution layer
- Patent number 11,795,051
- Issue date Oct 24, 2023
- X-FAB SEMICONDUCTOR FOUNDRIES GMBH
- Thomas Weidner
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Integrated circuit components with dummy structures
- Patent number 11,784,121
- Issue date Oct 10, 2023
- Intel Corporation
- Kevin L. Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device with contact pad and method of making
- Patent number 11,784,089
- Issue date Oct 10, 2023
- Taiwan Semiconductor Manufacturing Company, Ltd
- Chun-Hsu Yen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Contacts for highly scaled transistors
- Patent number 11,777,009
- Issue date Oct 3, 2023
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Carlos H. Diaz
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Layer structure including diffusion barrier layer and method of man...
- Patent number 11,764,156
- Issue date Sep 19, 2023
- Samsung Electronics Co., Ltd.
- Hyunjae Song
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Cladded metal interconnects
- Patent number 11,749,560
- Issue date Sep 5, 2023
- Intel Corporation
- Thomas Marieb
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Method of semiconductor integrated circuit fabrication
- Patent number 11,735,477
- Issue date Aug 22, 2023
- Taiwan Semiconductor Manufacturing Company, Ltd
- Ming-Feng Shieh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Redistribution lines with protection layers and method forming same
- Patent number 11,721,579
- Issue date Aug 8, 2023
- Taiwan Semiconductor Manufacturing Co., Ltd
- Ming-Da Cheng
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
2-DIMENSIONAL MATERIALS AS BARRIER LAYERS IN METALLIZATION OF SEMIC...
- Publication number 20240387371
- Publication date Nov 21, 2024
- TOKYO ELECTRON LIMITED
- Kandabara Tapily
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTERCONNECT STRUCTURE AND METHODS OF FORMING THE SAME
- Publication number 20240379413
- Publication date Nov 14, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Cheng-Chin LEE
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE STRUCTURE AND METHODS OF FORMING THE SAME
- Publication number 20240379560
- Publication date Nov 14, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Shao-Kuan LEE
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTEGRATED CIRCUIT DEVICES INCLUDING A CONDUCTIVE VIA AND METHODS O...
- Publication number 20240355727
- Publication date Oct 24, 2024
- Samsung Electronics Co., Ltd.
- JAEMYUNG CHOI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE STRUCTURE WITH STACKED CONDUCTIVE PLUGS AND ME...
- Publication number 20240332168
- Publication date Oct 3, 2024
- NANYA TECHNOLOGY CORPORATION
- JUNG-HSING CHIEN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
REDISTRIBUTION LINES WITH PROTECTION LAYERS AND METHOD FORMING SAME
- Publication number 20240290656
- Publication date Aug 29, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Ming-Da Cheng
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHODS OF FORMING INTERCONNECT STRUCTURES IN SEMICONDUCTOR FABRICA...
- Publication number 20240274528
- Publication date Aug 15, 2024
- Taiwan Semiconductor Manufacturing Co., LTD
- Ming-Han LEE
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE WITH POLYMER LINER AND METHOD FOR FABRICATING...
- Publication number 20240234252
- Publication date Jul 11, 2024
- NANYA TECHNOLOGY CORPORATION
- Shing-Yih SHIH
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE WITH POLYMER LINER AND METHOD FOR FABRICATING...
- Publication number 20240234249
- Publication date Jul 11, 2024
- NANYA TECHNOLOGY CORPORATION
- Shing-Yih SHIH
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PACKAGE COMPONENT WITH STEPPED PASSIVATION LAYER
- Publication number 20240222194
- Publication date Jul 4, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Ming-Da Cheng
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Wire Structure for Low Resistance Interconnects
- Publication number 20240186242
- Publication date Jun 6, 2024
- International Business Machines Corporation
- Oscar van der Straten
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
VIA STRUCTURE HAVING LOW INTERFACE RESISTANCE
- Publication number 20240178132
- Publication date May 30, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Li-Zhen YU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MULTI-LAYER TOPOLOGICAL INTERCONNECT WITH PROXIMAL DOPING LAYER
- Publication number 20240113024
- Publication date Apr 4, 2024
- International Business Machines Corporation
- Ching-Tzu Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Metal Contact Structure and Method of Forming the Same in a Semicon...
- Publication number 20240087953
- Publication date Mar 14, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Yu-Hung Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
AIR GAP SPACER FORMATION FOR NANO-SCALE SEMICONDUCTOR DEVICES
- Publication number 20240079266
- Publication date Mar 7, 2024
- TESSERA LLC
- Kangguo Cheng
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
DEVICES WITH REDUCED CAPACITANCES
- Publication number 20240021468
- Publication date Jan 18, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Yu-Hsin Chan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR STRUCTURE HAVING TAPERED BIT LINE
- Publication number 20230403845
- Publication date Dec 14, 2023
- NANYA TECHNOLOGY CORPORATION
- PEI-ROU JIANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CONTACTS FOR HIGHLY SCALED TRANSISTORS
- Publication number 20230395687
- Publication date Dec 7, 2023
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Carlos H. Diaz
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
REDISTRIBUTION LINES WITH PROTECTION LAYERS AND METHOD FORMING SAME
- Publication number 20230352342
- Publication date Nov 2, 2023
- Taiwan Semiconductor Manufacturing Co, LTD.
- Ming-Da Cheng
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE INCLUDING GRAPHENE INTERCONNECT AND METHOD OF...
- Publication number 20230335497
- Publication date Oct 19, 2023
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Shu-Wei Li
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CONTACT FEATURES OF SEMICONDUCTOR DEVICE AND METHOD OF FORMING SAME
- Publication number 20230260836
- Publication date Aug 17, 2023
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Pei Shan Chang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MANUFACTURING METHOD FOR SEMICONDUCTOR STRUCTURE AND SEMICONDUCTOR...
- Publication number 20230253255
- Publication date Aug 10, 2023
- CHANGXIN MEMORY TECHNOLOGIES, INC.
- Qiang LONG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTERCONNECT STRUCTURE
- Publication number 20230223334
- Publication date Jul 13, 2023
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Shin-Yi YANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CHEMICAL DIRECT PATTERN PLATING METHOD
- Publication number 20230215807
- Publication date Jul 6, 2023
- TAIWAN SEMICONDUCTOR MANUFACTURING CO., LTD.
- Wen-Jiun LIU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE WITH AIR GAP
- Publication number 20230180462
- Publication date Jun 8, 2023
- NANYA TECHNOLOGY CORPORATION
- LIANG-PIN CHOU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ACCURATE METAL LINE AND VIA HEIGHT CONTROL FOR TOP VIA PROCESS
- Publication number 20230178429
- Publication date Jun 8, 2023
- International Business Machines Corporation
- Tsung-Sheng Kang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE STRUCTURE WITH STACKED CONDUCTIVE PLUGS AND ME...
- Publication number 20230140534
- Publication date May 4, 2023
- NANYA TECHNOLOGY CORPORATION
- JUNG-HSING CHIEN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Structure And Method For Finfet Device With Contact Over Dielectric...
- Publication number 20230115015
- Publication date Apr 13, 2023
- Taiwan Semiconductor Manufacturing Co., LTD
- Fang Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
TECHNOLOGIES FOR HIGH THROUGHPUT ADDITIVE MANUFACTURING FOR INTEGRA...
- Publication number 20230098303
- Publication date Mar 30, 2023
- Intel Corporation
- Yoshihiro Tomita
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELECTRO-MIGRATION BARRIER FOR INTERCONNECT
- Publication number 20230088795
- Publication date Mar 23, 2023
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Su-Jen Sung
- H01 - BASIC ELECTRIC ELEMENTS

the layer also covering the sidewalls of the conductive structure

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Chemical direct pattern plating method

Semiconductor device structure and methods of forming the same

Interconnect structure and methods of forming the same

Top via interconnects without barrier metal between via and above line

Semiconductor device structure with stacked conductive plugs and me...

Devices with reduced capacitances

Semiconductor device having a dual material redistribution line

Redistribution lines with protection layers and method forming same

Semiconductor device with air gap

Methods of forming interconnect structures in semiconductor fabrica...

Contacts for highly scaled transistors

Package component with stepped passivation layer

Contacts for highly scaled transistors

Method for forming via structure having low interface resistance

Electro-migration barrier for interconnect

Methods of forming apparatuses having tungsten-containing structures

Semiconductor structure having tapered bit line

Method for fabricating interconnection using graphene

Plated metallization structures

Metal contact structure and method of forming the same in a semicon...

Semiconductor structure with stacked vias having dome-shaped tips

Conductive route patterning for electronic substrates

Through silicon via and redistribution layer

Integrated circuit components with dummy structures

Semiconductor device with contact pad and method of making

Contacts for highly scaled transistors

Layer structure including diffusion barrier layer and method of man...

Cladded metal interconnects

Method of semiconductor integrated circuit fabrication

Redistribution lines with protection layers and method forming same

Patents Applicationslast 30 patents

2-DIMENSIONAL MATERIALS AS BARRIER LAYERS IN METALLIZATION OF SEMIC...

INTERCONNECT STRUCTURE AND METHODS OF FORMING THE SAME

SEMICONDUCTOR DEVICE STRUCTURE AND METHODS OF FORMING THE SAME

INTEGRATED CIRCUIT DEVICES INCLUDING A CONDUCTIVE VIA AND METHODS O...

SEMICONDUCTOR DEVICE STRUCTURE WITH STACKED CONDUCTIVE PLUGS AND ME...

REDISTRIBUTION LINES WITH PROTECTION LAYERS AND METHOD FORMING SAME

METHODS OF FORMING INTERCONNECT STRUCTURES IN SEMICONDUCTOR FABRICA...

SEMICONDUCTOR DEVICE WITH POLYMER LINER AND METHOD FOR FABRICATING...

SEMICONDUCTOR DEVICE WITH POLYMER LINER AND METHOD FOR FABRICATING...

PACKAGE COMPONENT WITH STEPPED PASSIVATION LAYER

Wire Structure for Low Resistance Interconnects

VIA STRUCTURE HAVING LOW INTERFACE RESISTANCE

MULTI-LAYER TOPOLOGICAL INTERCONNECT WITH PROXIMAL DOPING LAYER

Metal Contact Structure and Method of Forming the Same in a Semicon...

AIR GAP SPACER FORMATION FOR NANO-SCALE SEMICONDUCTOR DEVICES

DEVICES WITH REDUCED CAPACITANCES

SEMICONDUCTOR STRUCTURE HAVING TAPERED BIT LINE

CONTACTS FOR HIGHLY SCALED TRANSISTORS

REDISTRIBUTION LINES WITH PROTECTION LAYERS AND METHOD FORMING SAME

SEMICONDUCTOR DEVICE INCLUDING GRAPHENE INTERCONNECT AND METHOD OF...

CONTACT FEATURES OF SEMICONDUCTOR DEVICE AND METHOD OF FORMING SAME

MANUFACTURING METHOD FOR SEMICONDUCTOR STRUCTURE AND SEMICONDUCTOR...

INTERCONNECT STRUCTURE

CHEMICAL DIRECT PATTERN PLATING METHOD

SEMICONDUCTOR DEVICE WITH AIR GAP

ACCURATE METAL LINE AND VIA HEIGHT CONTROL FOR TOP VIA PROCESS

SEMICONDUCTOR DEVICE STRUCTURE WITH STACKED CONDUCTIVE PLUGS AND ME...

Structure And Method For Finfet Device With Contact Over Dielectric...

TECHNOLOGIES FOR HIGH THROUGHPUT ADDITIVE MANUFACTURING FOR INTEGRA...

ELECTRO-MIGRATION BARRIER FOR INTERCONNECT