the layer being positioned on top of the main fill metal

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HELECTRICITY H01Electric elements H01LSEMICONDUCTOR DEVICES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR H01L21/00Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof

Current Industry

H01L21/76849the layer being positioned on top of the main fill metal

Industries

Patents Grantslast 30 patents

Information Patent Grant
Self-aligned barrier for metal vias
- Patent number 11,972,974
- Issue date Apr 30, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd
- Sung-Li Wang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Selective cobalt deposition on copper surfaces
- Patent number 11,959,167
- Issue date Apr 16, 2024
- Applied Materials, Inc.
- Sang-Ho Yu
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Dual metal gate structure having portions of metal gate layers in c...
- Patent number 11,955,532
- Issue date Apr 9, 2024
- Intel Corporation
- Jeffrey S. Leib
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Heterogeneous metal line compositions for advanced integrated circu...
- Patent number 11,955,534
- Issue date Apr 9, 2024
- Intel Corporation
- Andrew W. Yeoh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Trench contact structures for advanced integrated circuit structure...
- Patent number 11,948,997
- Issue date Apr 2, 2024
- Intel Corporation
- Subhash M. Joshi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Etch stop layer in integrated circuits
- Patent number 11,942,419
- Issue date Mar 26, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Shiu-Ko JangJian
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and method for fabricating the same
- Patent number 11,935,934
- Issue date Mar 19, 2024
- SK Hynix Inc.
- Young Gwang Yoon
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Selective deposition for integrated circuit interconnect structures
- Patent number 11,935,783
- Issue date Mar 19, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd
- Hsin-Yen Huang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Reducing oxidation by etching sacrificial and protection layer sepa...
- Patent number 11,929,281
- Issue date Mar 12, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd
- Chia Cheng Chou
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Via connection to wiring in a semiconductor device
- Patent number 11,923,291
- Issue date Mar 5, 2024
- Kioxia Corporation
- Atsushi Kato
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electro-migration barrier for interconnect
- Patent number 11,923,304
- Issue date Mar 5, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd
- Su-Jen Sung
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Wiring layer and manufacturing method therefor
- Patent number 11,901,372
- Issue date Feb 13, 2024
- Semiconductor Energy Laboratory Co., Ltd.
- Yutaka Okazaki
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Self-aligned contacts
- Patent number 11,887,891
- Issue date Jan 30, 2024
- Intel Corporation
- Mark T. Bohr
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Fin patterning for advanced integrated circuit structure fabrication
- Patent number 11,881,520
- Issue date Jan 23, 2024
- Intel Corporation
- Curtis Ward
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Interconnect wires including relatively low resistivity cores
- Patent number 11,881,432
- Issue date Jan 23, 2024
- Hui Jae Yoo
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Top via process with damascene metal
- Patent number 11,869,808
- Issue date Jan 9, 2024
- International Business Machines Corporation
- Lawrence A. Clevenger
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Multi-metal fill with self-aligned patterning and dielectric with v...
- Patent number 11,860,550
- Issue date Jan 2, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd
- Tai-I Yang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Cobalt based interconnects and methods of fabrication thereof
- Patent number 11,862,563
- Issue date Jan 2, 2024
- Tahoe Research, LTD.
- Christopher J. Jezewski
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Etch profile control of interconnect structures
- Patent number 11,854,873
- Issue date Dec 26, 2023
- Taiwan Semiconductor Manufacturing Co., Ltd
- Yu Lun Ke
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Cavity resonator for enhancing radio-frequency performance and meth...
- Patent number 11,848,291
- Issue date Dec 19, 2023
- Taiwan Semiconductor Manufacturing Company Limited
- Jheng-Hong Jiang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor structure and method making the same
- Patent number 11,830,808
- Issue date Nov 28, 2023
- Taiwan Semiconductor Manufacturing Company, Ltd
- Hsin-Yen Huang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Methods for forming a transition metal niobium nitride film on a su...
- Patent number 11,810,788
- Issue date Nov 7, 2023
- ASM IP Holding B.V.
- Jerry Peijun Chen
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Chemical mechanical polishing topography reset and control on inter...
- Patent number 11,810,816
- Issue date Nov 7, 2023
- Taiwan Semiconductor Manufacturing Co., Ltd
- Shih-Kang Fu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of forming copper interconnect structure with manganese barr...
- Patent number 11,804,405
- Issue date Oct 31, 2023
- TESSERA LLC
- Daniel C. Edelstein
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Gate cut and fin trim isolation for advanced integrated circuit str...
- Patent number 11,799,015
- Issue date Oct 24, 2023
- Intel Corporation
- Tahir Ghani
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Ruthenium liner and cap for back-end-of-line
- Patent number 11,784,127
- Issue date Oct 10, 2023
- Applied Materials, Inc.
- Wenjing Xu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Metal structures, devices, and methods
- Patent number 11,769,729
- Issue date Sep 26, 2023
- Intel Corporation
- Daniel J. Zierath
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Semiconductor device
- Patent number 11,770,922
- Issue date Sep 26, 2023
- Semiconductor Manufacturing International (Shanghai) Corporation
- Fei Zhou
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Layer structure including diffusion barrier layer and method of man...
- Patent number 11,764,156
- Issue date Sep 19, 2023
- Samsung Electronics Co., Ltd.
- Hyunjae Song
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Ruthenium liner and cap for back-end-of-line applications
- Patent number 11,764,157
- Issue date Sep 19, 2023
- Applied Materials, Inc.
- Wenjing Xu
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
COBALT BASED INTERCONNECTS AND METHODS OF FABRICATION THEREOF
- Publication number 20240145391
- Publication date May 2, 2024
- Tahoe Research, Ltd.
- Christopher J. JEZEWSKI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
STRUCTURE AND METHOD TO IMPROVE FAV RIE PROCESS MARGIN AND ELECTROM...
- Publication number 20240145299
- Publication date May 2, 2024
- TESSERA LLC
- Benjamin David Briggs
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTERCONNECT WIRES INCLUDING RELATIVELY LOW RESISTIVITY CORES
- Publication number 20240112952
- Publication date Apr 4, 2024
- Intel Corporation
- HUI JAE YOO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MULTI-METAL FILL WITH SELF-ALIGNED PATTERNING AND DIELECTRIC WITH V...
- Publication number 20240085803
- Publication date Mar 14, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Tai-I YANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR STRUCTURE AND METHOD MAKING THE SAME
- Publication number 20240088025
- Publication date Mar 14, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Hsin-Yen Huang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
LOW RESISTANCE INTERCONNECT FEATURES AND METHOD FOR MANUFACTURING T...
- Publication number 20240071822
- Publication date Feb 29, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chin-Lung CHUNG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
HETEROGENEOUS METAL LINE COMPOSITIONS FOR ADVANCED INTEGRATED CIRCU...
- Publication number 20240047556
- Publication date Feb 8, 2024
- Intel Corporation
- Andrew W. YEOH
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR STRUCTURE WITH AIR GAP AND METHOD FOR MANUFACTURING T...
- Publication number 20240038586
- Publication date Feb 1, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Kai-Fang CHENG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHODS FOR FORMING A TRANSITION METAL NIOBIUM NITRIDE FILM ON A SU...
- Publication number 20240030035
- Publication date Jan 25, 2024
- ASM IP HOLDING B.V.
- Jerry Peijun Chen
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
SELF-ALIGNED CONTACTS
- Publication number 20240030067
- Publication date Jan 25, 2024
- Intel Corporation
- Mark T. BOHR
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
OXIDATION BARRIERS WITH CVD SOAK PROCESSES
- Publication number 20240018647
- Publication date Jan 18, 2024
- Applied Materials, Inc.
- Nicolas Louis BREIL
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
SEMICONDUCTOR STRUCTURE, FABRICATION METHOD FOR SEMICONDUCTOR STRUC...
- Publication number 20240006319
- Publication date Jan 4, 2024
- CHANGXIN MEMORY TECHNOLOGIES, INC
- Shuai Guo
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD OF FORMING COPPER INTERCONNECT STRUCTURE WITH MANGANESE BARR...
- Publication number 20240006237
- Publication date Jan 4, 2024
- Adeia Semiconductor Solutions LLC
- Daniel C. Edelstein
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
GATE CUT AND FIN TRIM ISOLATION FOR ADVANCED INTEGRATED CIRCUIT STR...
- Publication number 20230420545
- Publication date Dec 28, 2023
- Intel Corporation
- Tahir GHANI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD OF MANUFACTURING SEMICONDUCTOR STRUCTURE AND SEMICONDUCTOR S...
- Publication number 20230420293
- Publication date Dec 28, 2023
- CHANGXIN MEMORY TECHNOLOGIES, INC
- Zhaopei CUI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND METHOD FOR PRODUCING THE SAME
- Publication number 20230411295
- Publication date Dec 21, 2023
- KIOXIA Corporation
- Atsushi KATO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
GRAPHENE-METAL HYBRID INTERCONNECT
- Publication number 20230402384
- Publication date Dec 14, 2023
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Jian-Hong LIN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR STRUCTURE AND METHOD FOR FORMING THE SAME
- Publication number 20230402320
- Publication date Dec 14, 2023
- Taiwan Semiconductor Manufacturing company Ltd.
- JUN-NAN NIAN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ETCH PROFILE CONTROL OF INTERCONNECT STRUCTURES
- Publication number 20230377963
- Publication date Nov 23, 2023
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Yu Lun KE
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELECTRON MIGRATION CONTROL IN INTERCONNECT STRUCTURES
- Publication number 20230377955
- Publication date Nov 23, 2023
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Chun-Jen CHEN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CAVITY RESONATOR FOR ENHANCING RADIO-FREQUENCY PERFORMANCE AND METH...
- Publication number 20230378104
- Publication date Nov 23, 2023
- Taiwan Semiconductor Manufacturing Company Limited
- Jheng-Hong JIANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
FIN FIELD EFFECT TRANSISTOR (FINFET) DEVICE STRUCTURE WITH PROTECTI...
- Publication number 20230369110
- Publication date Nov 16, 2023
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chien-Yuan CHEN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
GRAPHENE-ASSISTED LOW-RESISTANCE INTERCONNECT STRUCTURES AND METHOD...
- Publication number 20230369225
- Publication date Nov 16, 2023
- Taiwan Semiconductor Manufacturing Co., LTD
- Shin-Yi Yang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE
- Publication number 20230326848
- Publication date Oct 12, 2023
- Samsung Electronics Co., Ltd.
- JONGJIN LEE
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR STRUCTURES INCLUDING MIDDLE-OF-LINE (MOL) CAPACITANCE...
- Publication number 20230299134
- Publication date Sep 21, 2023
- TESSERA LLC
- Injo Ok
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICES AND METHODS OF FORMATION
- Publication number 20230299002
- Publication date Sep 21, 2023
- Taiwan Semiconductor Manufacturing Company Limited
- Shu-Cheng CHIN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTERCONNECT STRUCTURE
- Publication number 20230290675
- Publication date Sep 14, 2023
- Taiwan Semiconductor Manufacturing Co., LTD
- Hung-Chih YU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
BARRIER FREE INTERFACE BETWEEN BEOL INTERCONNECTS
- Publication number 20230290678
- Publication date Sep 14, 2023
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Hsiu-Wen Hsueh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Method of Forming an Interconnect Structure Having an Air Gap and S...
- Publication number 20230275025
- Publication date Aug 31, 2023
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Szu-Ping Tung
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
TRENCH CONTACT STRUCTURES FOR ADVANCED INTEGRATED CIRCUIT STRUCTURE...
- Publication number 20230261089
- Publication date Aug 17, 2023
- Intel Corporation
- Subhash M. JOSHI
- H01 - BASIC ELECTRIC ELEMENTS

the layer being positioned on top of the main fill metal

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Self-aligned barrier for metal vias

Selective cobalt deposition on copper surfaces

Dual metal gate structure having portions of metal gate layers in c...

Heterogeneous metal line compositions for advanced integrated circu...

Trench contact structures for advanced integrated circuit structure...

Etch stop layer in integrated circuits

Semiconductor device and method for fabricating the same

Selective deposition for integrated circuit interconnect structures

Reducing oxidation by etching sacrificial and protection layer sepa...

Via connection to wiring in a semiconductor device

Electro-migration barrier for interconnect

Wiring layer and manufacturing method therefor

Self-aligned contacts

Fin patterning for advanced integrated circuit structure fabrication

Interconnect wires including relatively low resistivity cores

Top via process with damascene metal

Multi-metal fill with self-aligned patterning and dielectric with v...

Cobalt based interconnects and methods of fabrication thereof

Etch profile control of interconnect structures

Cavity resonator for enhancing radio-frequency performance and meth...

Semiconductor structure and method making the same

Methods for forming a transition metal niobium nitride film on a su...

Chemical mechanical polishing topography reset and control on inter...

Method of forming copper interconnect structure with manganese barr...

Gate cut and fin trim isolation for advanced integrated circuit str...

Ruthenium liner and cap for back-end-of-line

Metal structures, devices, and methods

Semiconductor device

Layer structure including diffusion barrier layer and method of man...

Ruthenium liner and cap for back-end-of-line applications

Patents Applicationslast 30 patents

COBALT BASED INTERCONNECTS AND METHODS OF FABRICATION THEREOF

STRUCTURE AND METHOD TO IMPROVE FAV RIE PROCESS MARGIN AND ELECTROM...

INTERCONNECT WIRES INCLUDING RELATIVELY LOW RESISTIVITY CORES

MULTI-METAL FILL WITH SELF-ALIGNED PATTERNING AND DIELECTRIC WITH V...

SEMICONDUCTOR STRUCTURE AND METHOD MAKING THE SAME

LOW RESISTANCE INTERCONNECT FEATURES AND METHOD FOR MANUFACTURING T...

HETEROGENEOUS METAL LINE COMPOSITIONS FOR ADVANCED INTEGRATED CIRCU...

SEMICONDUCTOR STRUCTURE WITH AIR GAP AND METHOD FOR MANUFACTURING T...

METHODS FOR FORMING A TRANSITION METAL NIOBIUM NITRIDE FILM ON A SU...

SELF-ALIGNED CONTACTS

OXIDATION BARRIERS WITH CVD SOAK PROCESSES

SEMICONDUCTOR STRUCTURE, FABRICATION METHOD FOR SEMICONDUCTOR STRUC...

METHOD OF FORMING COPPER INTERCONNECT STRUCTURE WITH MANGANESE BARR...

GATE CUT AND FIN TRIM ISOLATION FOR ADVANCED INTEGRATED CIRCUIT STR...

METHOD OF MANUFACTURING SEMICONDUCTOR STRUCTURE AND SEMICONDUCTOR S...

SEMICONDUCTOR DEVICE AND METHOD FOR PRODUCING THE SAME

GRAPHENE-METAL HYBRID INTERCONNECT

SEMICONDUCTOR STRUCTURE AND METHOD FOR FORMING THE SAME

ETCH PROFILE CONTROL OF INTERCONNECT STRUCTURES

ELECTRON MIGRATION CONTROL IN INTERCONNECT STRUCTURES

CAVITY RESONATOR FOR ENHANCING RADIO-FREQUENCY PERFORMANCE AND METH...

FIN FIELD EFFECT TRANSISTOR (FINFET) DEVICE STRUCTURE WITH PROTECTI...

GRAPHENE-ASSISTED LOW-RESISTANCE INTERCONNECT STRUCTURES AND METHOD...

SEMICONDUCTOR DEVICE

SEMICONDUCTOR STRUCTURES INCLUDING MIDDLE-OF-LINE (MOL) CAPACITANCE...

SEMICONDUCTOR DEVICES AND METHODS OF FORMATION

INTERCONNECT STRUCTURE

BARRIER FREE INTERFACE BETWEEN BEOL INTERCONNECTS

Method of Forming an Interconnect Structure Having an Air Gap and S...

TRENCH CONTACT STRUCTURES FOR ADVANCED INTEGRATED CIRCUIT STRUCTURE...