the layer covering a conductive structure

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H01L21/7685

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HELECTRICITY H01Electric elements H01LSEMICONDUCTOR DEVICES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR H01L21/00Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof

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H01L21/7685the layer covering a conductive structure

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Patents Grantslast 30 patents

Information Patent Grant
Method of forming nanocrystalline graphene
- Patent number 12,211,744
- Issue date Jan 28, 2025
- Samsung Electronics Co., Ltd.
- Keunwook Shin
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Method for preparing recessed gate structure with protection layer
- Patent number 12,211,905
- Issue date Jan 28, 2025
- NANYA TECHNOLOGY CORPORATION
- Kuo-Hui Su
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Low resistance interconnect structure for semiconductor device
- Patent number 12,199,036
- Issue date Jan 14, 2025
- Taiwan Semiconductor Manufacturing Co., Ltd
- Jason Huang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Gate-all-around transistor with reduced source/drain contact resist...
- Patent number 12,191,151
- Issue date Jan 7, 2025
- Taiwan Semiconductor Manufacturing Co., Ltd
- Jui-Ping Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor chip structure
- Patent number 12,176,245
- Issue date Dec 24, 2024
- Samsung Electronics Co., Ltd.
- Sangjun Park
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Air spacer surrounding conductive features and method forming same
- Patent number 12,165,914
- Issue date Dec 10, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd
- Yi-Nien Su
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Screwless semiconductor processing chambers
- Patent number 12,165,909
- Issue date Dec 10, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Bo-Ru Chen
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Chemical direct pattern plating method
- Patent number 12,159,837
- Issue date Dec 3, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Wen-Jiun Liu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Middle-of-line interconnect structure having air gap and method of...
- Patent number 12,142,520
- Issue date Nov 12, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd
- Yi-Nien Su
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Integrated assemblies having one or more modifying substances distr...
- Patent number 12,144,176
- Issue date Nov 12, 2024
- John D. Hopkins
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Bottom-up formation of contact plugs
- Patent number 12,131,949
- Issue date Oct 29, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd
- Yen-Yu Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device structure and methods of forming the same
- Patent number 12,132,000
- Issue date Oct 29, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd
- Shao-Kuan Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Bottom-up formation of contact plugs
- Patent number 12,125,747
- Issue date Oct 22, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd
- Yen-Yu Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Contact plug
- Patent number 12,125,748
- Issue date Oct 22, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd
- Chih-Hsuan Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Field effect transistor contact with reduced contact resistance
- Patent number 12,107,086
- Issue date Oct 1, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd
- Su-Hao Liu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of manufacturing semiconductor structure and semiconductor s...
- Patent number 12,096,618
- Issue date Sep 17, 2024
- CHANGXIN MEMORY TECHNOLOGIES, INC.
- Jingwen Lu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Interconnect structure and methods of forming the same
- Patent number 12,094,764
- Issue date Sep 17, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd
- Cheng-Chin Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Recessed gate strcutre with protection layer
- Patent number 12,080,773
- Issue date Sep 3, 2024
- NANYA TECHNOLOGY CORPORATION
- Kuo-Hui Su
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Interconnect structure with low capacitance and high thermal conduc...
- Patent number 12,080,650
- Issue date Sep 3, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd
- Kai-Fang Cheng
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of forming interconnect structure
- Patent number 12,080,595
- Issue date Sep 3, 2024
- Samsung Electronics Co., Ltd.
- Keunwook Shin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for preparing semiconductor device structure with silicide p...
- Patent number 12,080,598
- Issue date Sep 3, 2024
- NANYA TECHNOLOGY CORPORATION
- Chun-Cheng Liao
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for manufacturing semiconductor structure
- Patent number 12,074,062
- Issue date Aug 27, 2024
- CHANGXIN MEMORY TECHNOLOGIES, INC.
- Taoyan Yan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device structure with interconnect structure having a...
- Patent number 12,068,193
- Issue date Aug 20, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd
- Hsin-Yen Huang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Methods for forming contact plugs with reduced corrosion
- Patent number 12,068,197
- Issue date Aug 20, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd
- Yu-Sheng Wang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Low resistance contacts including intermetallic alloy of nickel, pl...
- Patent number 12,062,614
- Issue date Aug 13, 2024
- International Business Machines Corporation
- John Bruley
- C22 - METALLURGY FERROUS OR NON-FERROUS ALLOYS TREATMENT OF ALLOYS OR NON-FER...
Information Patent Grant
Prevention of contact bottom void in semiconductor fabrication
- Patent number 12,062,578
- Issue date Aug 13, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd
- Yun Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device having via sidewall adhesion with encapsulant
- Patent number 12,062,603
- Issue date Aug 13, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd
- Chen-Hua Yu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Integrated circuit device and method for forming the same
- Patent number 12,062,540
- Issue date Aug 13, 2024
- TAIWAN SEMICONDUCTOR MANUFACTURING LTD.
- Ya-Ting Chang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for forming barrier layer in semiconductor structure
- Patent number 12,062,573
- Issue date Aug 13, 2024
- Yangtze Memory Technologies Co., Ltd.
- Peng Zhou
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Top via interconnects without barrier metal between via and above line
- Patent number 12,057,395
- Issue date Aug 6, 2024
- International Business Machines Corporation
- Koichi Motoyama
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
INTERCONNECT STRUCTURE AND FABRICATION METHOD THEREOF
- Publication number 20250038049
- Publication date Jan 30, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Yen Yu Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MANAGING CONDUCTIVE CONNECTIONS FOR SEMICONDUCTIVE DEVICES
- Publication number 20250038044
- Publication date Jan 30, 2025
- Yangtze Memory Technologies Co., Ltd.
- Yingcheng Zhao
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
GRADIENT LINER IN METAL FILL
- Publication number 20250022751
- Publication date Jan 16, 2025
- LAM RESEARCH CORPORATION
- Sang-Hyeob LEE
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTERCONNECT CAPPING WITH INTEGRATED PROCESS STEPS
- Publication number 20250006474
- Publication date Jan 2, 2025
- Applied Materials, Inc.
- Naomi YOSHIDA
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
REDUCED TUNGSTEN GALVANIC CORROSION IN WET CLEANING FOR ADVANCED SE...
- Publication number 20250006554
- Publication date Jan 2, 2025
- Intel Corporation
- Ramanan Ehamparam
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METAL-INSULATOR-METAL STRUCTURES AND METHODS OF FORMING THE SAME
- Publication number 20240421066
- Publication date Dec 19, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chung-Liang CHENG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CARBON-BASED LINER TO REDUCE CONTACT RESISTANCE
- Publication number 20240395612
- Publication date Nov 28, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Po-Hsien CHENG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD OF FORMING INTERCONNECT STRUCTURE
- Publication number 20240395613
- Publication date Nov 28, 2024
- Samsung Electronics Co., Ltd.
- Keunwook SHIN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
COMMON RAIL CONTACT
- Publication number 20240387655
- Publication date Nov 21, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Cheng-Wei Chang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
LOW-RESISTANCE COPPER INTERCONNECTS
- Publication number 20240387382
- Publication date Nov 21, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Shu-Cheng CHIN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Interconnect Structures and Methods of Forming the Same
- Publication number 20240387253
- Publication date Nov 21, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Wei-Ren Wang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND METHOD
- Publication number 20240387646
- Publication date Nov 21, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Po-Chuan Wang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CONTACT PLUG
- Publication number 20240387267
- Publication date Nov 21, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Chih-Hsuan Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
2-DIMENSIONAL MATERIALS AS BARRIER LAYERS IN METALLIZATION OF SEMIC...
- Publication number 20240387371
- Publication date Nov 21, 2024
- TOKYO ELECTRON LIMITED
- Kandabara Tapily
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTERCONNECT STRUCTURE AND METHODS OF FORMING THE SAME
- Publication number 20240379413
- Publication date Nov 14, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Cheng-Chin LEE
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
NOVEL MIM STRUCTURE
- Publication number 20240379532
- Publication date Nov 14, 2024
- Taiwan Semiconductor Manufacturing Co., LTD
- Chun-huan WEI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICES HAVING SILICIDE LAYER
- Publication number 20240379806
- Publication date Nov 14, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chia-Ming HSU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTERCONNECT STRUCTURE AND MANUFACTURING METHOD THEREOF
- Publication number 20240379561
- Publication date Nov 14, 2024
- NANYA TECHNOLOGY CORPORATION
- JI-FENG LIU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
AIR SPACER SURROUNDING CONDUCTIVE FEATURES AND METHOD FORMING SAME
- Publication number 20240379414
- Publication date Nov 14, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Yi-Nien Su
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD OF MAKING HIGH ASPECT RATIO OPENINGS IN A SEMICONDUCTOR DEVI...
- Publication number 20240379424
- Publication date Nov 14, 2024
- Western Digital Technologies, Inc.
- Bing ZHOU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE STRUCTURE AND METHODS OF FORMING THE SAME
- Publication number 20240379560
- Publication date Nov 14, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Shao-Kuan LEE
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
BOTTOM-UP FORMATION OF CONTACT PLUGS
- Publication number 20240371691
- Publication date Nov 7, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Yen-Yu Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ION IMPLANT PROCESS FOR DEFECT ELIMINATION IN METAL LAYER PLANARIZA...
- Publication number 20240363404
- Publication date Oct 31, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chia-Cheng CHEN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Substrate Processing Method, Apparatus, and System
- Publication number 20240363405
- Publication date Oct 31, 2024
- TOKYO ELECTRON LIMITED
- Masato SAKAMOTO
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
METHODS FOR FORMING CONTACT PLUGS WITH REDUCED CORROSION
- Publication number 20240363409
- Publication date Oct 31, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Yu-Sheng Wang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PREVENTION OF CONTACT BOTTOM VOID IN SEMICONDUCTOR FABRICATION
- Publication number 20240363429
- Publication date Oct 31, 2024
- Taiwan Semiconductor Manufacturing Co., LTD
- Yun Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Capping Layer For Liner-Free Conductive Structures
- Publication number 20240355741
- Publication date Oct 24, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Shuen-Shin LIANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTEGRATED CIRCUIT DEVICES INCLUDING A CONDUCTIVE VIA AND METHODS O...
- Publication number 20240355727
- Publication date Oct 24, 2024
- Samsung Electronics Co., Ltd.
- JAEMYUNG CHOI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTEGRATED CIRCUIT DEVICE
- Publication number 20240355622
- Publication date Oct 24, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Ya-Ting CHANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE STRUCTURE WITH INTERCONNECT STRUCTURE HAVING A...
- Publication number 20240347381
- Publication date Oct 17, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Hsin-Yen HUANG
- H01 - BASIC ELECTRIC ELEMENTS

the layer covering a conductive structure

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Method of forming nanocrystalline graphene

Method for preparing recessed gate structure with protection layer

Low resistance interconnect structure for semiconductor device

Gate-all-around transistor with reduced source/drain contact resist...

Semiconductor chip structure

Air spacer surrounding conductive features and method forming same

Screwless semiconductor processing chambers

Chemical direct pattern plating method

Middle-of-line interconnect structure having air gap and method of...

Integrated assemblies having one or more modifying substances distr...

Bottom-up formation of contact plugs

Semiconductor device structure and methods of forming the same

Bottom-up formation of contact plugs

Contact plug

Field effect transistor contact with reduced contact resistance

Method of manufacturing semiconductor structure and semiconductor s...

Interconnect structure and methods of forming the same

Recessed gate strcutre with protection layer

Interconnect structure with low capacitance and high thermal conduc...

Method of forming interconnect structure

Method for preparing semiconductor device structure with silicide p...

Method for manufacturing semiconductor structure

Semiconductor device structure with interconnect structure having a...

Methods for forming contact plugs with reduced corrosion

Low resistance contacts including intermetallic alloy of nickel, pl...

Prevention of contact bottom void in semiconductor fabrication

Semiconductor device having via sidewall adhesion with encapsulant

Integrated circuit device and method for forming the same

Method for forming barrier layer in semiconductor structure

Top via interconnects without barrier metal between via and above line

Patents Applicationslast 30 patents

INTERCONNECT STRUCTURE AND FABRICATION METHOD THEREOF

MANAGING CONDUCTIVE CONNECTIONS FOR SEMICONDUCTIVE DEVICES

GRADIENT LINER IN METAL FILL

INTERCONNECT CAPPING WITH INTEGRATED PROCESS STEPS

REDUCED TUNGSTEN GALVANIC CORROSION IN WET CLEANING FOR ADVANCED SE...

METAL-INSULATOR-METAL STRUCTURES AND METHODS OF FORMING THE SAME

CARBON-BASED LINER TO REDUCE CONTACT RESISTANCE

METHOD OF FORMING INTERCONNECT STRUCTURE

COMMON RAIL CONTACT

LOW-RESISTANCE COPPER INTERCONNECTS

Interconnect Structures and Methods of Forming the Same

SEMICONDUCTOR DEVICE AND METHOD

CONTACT PLUG

2-DIMENSIONAL MATERIALS AS BARRIER LAYERS IN METALLIZATION OF SEMIC...

INTERCONNECT STRUCTURE AND METHODS OF FORMING THE SAME

NOVEL MIM STRUCTURE

SEMICONDUCTOR DEVICES HAVING SILICIDE LAYER

INTERCONNECT STRUCTURE AND MANUFACTURING METHOD THEREOF

AIR SPACER SURROUNDING CONDUCTIVE FEATURES AND METHOD FORMING SAME

METHOD OF MAKING HIGH ASPECT RATIO OPENINGS IN A SEMICONDUCTOR DEVI...

SEMICONDUCTOR DEVICE STRUCTURE AND METHODS OF FORMING THE SAME

BOTTOM-UP FORMATION OF CONTACT PLUGS

ION IMPLANT PROCESS FOR DEFECT ELIMINATION IN METAL LAYER PLANARIZA...

Substrate Processing Method, Apparatus, and System

METHODS FOR FORMING CONTACT PLUGS WITH REDUCED CORROSION

PREVENTION OF CONTACT BOTTOM VOID IN SEMICONDUCTOR FABRICATION

Capping Layer For Liner-Free Conductive Structures

INTEGRATED CIRCUIT DEVICES INCLUDING A CONDUCTIVE VIA AND METHODS O...

INTEGRATED CIRCUIT DEVICE

SEMICONDUCTOR DEVICE STRUCTURE WITH INTERCONNECT STRUCTURE HAVING A...