the material being a silicon oxynitride

Industry

CPC
H01L21/0214

This industry / category may be too specific. Please go to a parent level for more data

Parent Industries

HELECTRICITY H01Electric elements H01LSEMICONDUCTOR DEVICES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR H01L21/00Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof

Current Industry

H01L21/0214the material being a silicon oxynitride

Industries

Patents Grantslast 30 patents

Information Patent Grant
Semiconductor film composition, method for manufacturing semiconduc...
- Patent number 11,965,109
- Issue date Apr 23, 2024
- Mitsui Chemicals, Inc.
- Yasuhisa Kayaba
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of depositing thin film and method of manufacturing semicond...
- Patent number 11,967,503
- Issue date Apr 23, 2024
- Wonik IPS Co., Ltd.
- Su In Kim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device
- Patent number 11,967,568
- Issue date Apr 23, 2024
- Kabushiki Kaisha Toshiba
- Kouta Tomita
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of processing substrate, method of manufacturing semiconduct...
- Patent number 11,967,499
- Issue date Apr 23, 2024
- Kokusai Electric Corporation
- Yoshitomo Hashimoto
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Forming nitrogen-containing low-K gate spacer
- Patent number 11,948,841
- Issue date Apr 2, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd
- Wan-Yi Kao
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and method of manufacture
- Patent number 11,942,549
- Issue date Mar 26, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd
- Wan-Yi Kao
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Three-dimensional memory devices and fabrication methods thereof
- Patent number 11,943,923
- Issue date Mar 26, 2024
- Yangtze Memory Technologies Co., Ltd.
- Li Hong Xiao
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and method for fabricating the same
- Patent number 11,935,926
- Issue date Mar 19, 2024
- SK Hynix Inc.
- Hyeng-Woo Eom
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Methods of manufacturing an integrated circuit having stress tuning...
- Patent number 11,935,842
- Issue date Mar 19, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Shin-Puu Jeng
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of fabricating high electron mobility transistor
- Patent number 11,929,407
- Issue date Mar 12, 2024
- Vanguard International Semiconductor Corporation
- Ting-En Hsieh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Voltage regulator circuit including one or more thin-film transistors
- Patent number 11,923,371
- Issue date Mar 5, 2024
- Intel Corporation
- Abhishek A. Sharma
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Semiconductor memory device and method for manufacturing the same
- Patent number 11,917,827
- Issue date Feb 27, 2024
- Kioxia Corporation
- Naoki Yasuda
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Dielectric film for semiconductor fabrication
- Patent number 11,901,295
- Issue date Feb 13, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd
- Cheng-Yi Wu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Fabrication method of device with cavity
- Patent number 11,901,193
- Issue date Feb 13, 2024
- Shenzhen Newsonic Technologies Co., Ltd.
- Guojun Weng
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Gate-all-around integrated circuit structures fabricated using alte...
- Patent number 11,894,368
- Issue date Feb 6, 2024
- Intel Corporation
- Sudipto Naskar
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and termination structure
- Patent number 11,881,514
- Issue date Jan 23, 2024
- Hitachi Power Semiconductor Device, Ltd.
- Shigeo Tokumitsu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Integrated assemblies having vertically-spaced channel material seg...
- Patent number 11,871,572
- Issue date Jan 9, 2024
- Shyam Surthi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and method of manufacturing semiconductor device
- Patent number 11,849,583
- Issue date Dec 19, 2023
- SK hynix Inc.
- Moon Sik Seo
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Doped or undoped silicon carbide deposition and remote hydrogen pla...
- Patent number 11,848,199
- Issue date Dec 19, 2023
- Lam Research Corporation
- Guangbi Yuan
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Semiconductor device, manufacturing method thereof, display device,...
- Patent number 11,842,901
- Issue date Dec 12, 2023
- Semiconductor Energy Laboratory Co., Ltd.
- Masami Jintyou
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Metal-Insulator-Metal structure
- Patent number 11,842,959
- Issue date Dec 12, 2023
- Taiwan Semiconductor Manufacturing Co., Ltd
- Yuan-Yang Hsiao
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and termination structure
- Patent number 11,843,036
- Issue date Dec 12, 2023
- Hitachi Power Semiconductor Device, Ltd.
- Shigeo Tokumitsu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of manufacturing semiconductor device, method of processing...
- Patent number 11,823,886
- Issue date Nov 21, 2023
- Kokusai Electric Corporation
- Kazuhiro Harada
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Method for forming insulating film, apparatus for processing substr...
- Patent number 11,823,897
- Issue date Nov 21, 2023
- Tokyo Electron Limited
- Makoto Muramatsu
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Methods of depositing SiCON with C, O, and N compositional control
- Patent number 11,823,893
- Issue date Nov 21, 2023
- Applied Materials, Inc.
- Mark Saly
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of processing substrate, substrate processing apparatus, rec...
- Patent number 11,810,781
- Issue date Nov 7, 2023
- Kokusai Electric Corporation
- Kiyohisa Ishibashi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
3DIC formation with dies bonded to formed RDLs
- Patent number 11,810,899
- Issue date Nov 7, 2023
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chen-Hua Yu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Methods for forming a metal silicate film on a substrate in a react...
- Patent number 11,798,999
- Issue date Oct 24, 2023
- ASM IP Holding B.V.
- Fu Tang
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Semiconductor structure including MIM capacitor
- Patent number 11,764,256
- Issue date Sep 19, 2023
- Taiwan Semiconductor Manufacturing Company, Ltd
- Tung-Jiun Wu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of processing substrate, substrate processing apparatus, rec...
- Patent number 11,764,056
- Issue date Sep 19, 2023
- Kokusai Electric Corporation
- Kiyohisa Ishibashi
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
VOLTAGE REGULATOR CIRCUIT INCLUDING ONE OR MORE THIN-FILM TRANSISTORS
- Publication number 20240128269
- Publication date Apr 18, 2024
- Intel Corporation
- Abhishek A. SHARMA
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
GATE-ALL-AROUND INTEGRATED CIRCUIT STRUCTURES FABRICATED USING ALTE...
- Publication number 20240120335
- Publication date Apr 11, 2024
- Intel Corporation
- Sudipto NASKAR
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
STABILIZING DIELECTRIC STRESS IN A GALVANIC ISOLATION DEVICE
- Publication number 20240113095
- Publication date Apr 4, 2024
- TEXAS INSTRUMENTS INCORPORATED
- Yoshihiro Takei
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PROCESS TO REDUCE PLASMA INDUCED DAMAGE
- Publication number 20240088301
- Publication date Mar 14, 2024
- Applied Materials, Inc.
- Jianheng LI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Metal-Insulator-Metal Structure
- Publication number 20240088016
- Publication date Mar 14, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Yuan-Yang Hsiao
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SUBSTRATE PROCESSING METHOD
- Publication number 20240071748
- Publication date Feb 29, 2024
- ASM IP HOLDING B.V.
- SangHeon Yong
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ION IMPLANTATION FOR INCREASED ADHESION WITH RESIST MATERIAL
- Publication number 20240071773
- Publication date Feb 29, 2024
- Applied Materials, Inc.
- Lei Liao
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE
- Publication number 20240074198
- Publication date Feb 29, 2024
- SK HYNIX INC.
- Moon Sik SEO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
DOPED OR UNDOPED SILICON CARBIDE DEPOSITION AND REMOTE HYDROGEN PLA...
- Publication number 20240063015
- Publication date Feb 22, 2024
- LAM RESEARCH CORPORATION
- Guangbi Yuan
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
Methods of Depositing SiCON with C, O, and N Compositional Control
- Publication number 20240047193
- Publication date Feb 8, 2024
- Applied Materials, Inc.
- Mark Saly
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
HIGH DENSITY PLASMA CVD FOR DISPLAY ENCAPSULATION APPLICATION
- Publication number 20240047291
- Publication date Feb 8, 2024
- Applied Materials, Inc.
- Tae Kyung WON
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHODS FOR FORMING A METAL SILICATE FILM ON A SUBSTRATE IN A REACT...
- Publication number 20240030296
- Publication date Jan 25, 2024
- ASM IP HOLDING B.V.
- Fu Tang
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
METHOD OF REMOVING A BY-PRODUCT FROM A COMPONENT OF A SEMICONDUCTOR...
- Publication number 20240014029
- Publication date Jan 11, 2024
- Taiwan Semiconductor Manufacturing company Ltd.
- REN-GUAN DUAN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SIDEWALL EPITAXY ENCAPSULATION FOR NANOSHEET I/O DEVICE
- Publication number 20240014266
- Publication date Jan 11, 2024
- International Business Machines Corporation
- Ruqiang Bao
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SELECTIVE PLASMA ENHANCED ATOMIC LAYER DEPOSITION
- Publication number 20240014036
- Publication date Jan 11, 2024
- VERSUM MATERIALS US, LLC
- RONALD M. PEARLSTEIN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE INCLUDING ISOLATION ST...
- Publication number 20230420290
- Publication date Dec 28, 2023
- NANYA TECHNOLOGY CORPORATION
- YING-CHENG CHUANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SELECTIVE DEPOSITION OF SILICON AND OXYGEN CONTAINING DIELECTRIC FI...
- Publication number 20230416911
- Publication date Dec 28, 2023
- VERSUM MATERIALS US, LLC
- RAVINDRA KANJOLIA
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
METHOD OF MANUFACTURING SEMICONDUCTOR STRUCTURE AND SEMICONDUCTOR S...
- Publication number 20230411166
- Publication date Dec 21, 2023
- CHANGXIN MEMORY TECHNOLOGIES, INC
- Yizhi ZENG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SILICON COMPOUND AND METHOD OF MANUFACTURING INTEGRATED CIRCUIT DEV...
- Publication number 20230406822
- Publication date Dec 21, 2023
- DNF CO., LTD.
- Sunhye HWANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE, SUBSTRATE PROCESSING...
- Publication number 20230407472
- Publication date Dec 21, 2023
- Kokusai Electric Corporation
- Hiroki HATTA
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
APPARATUS FOR PROCESSING SUBSTRATE
- Publication number 20230411203
- Publication date Dec 21, 2023
- EUGENE TECHNOLOGY CO., LTD.
- Ryong HWANG
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
FILM FORMING METHOD AND FILM FORMING APPARATUS
- Publication number 20230399737
- Publication date Dec 14, 2023
- TOKYO ELECTRON LIMITED
- Yoshihiro KATO
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
SUBSTRATE PROCESSING METHOD AND SUBSTRATE PROCESSING APPARATUS
- Publication number 20230395368
- Publication date Dec 7, 2023
- TOKYO ELECTRON LIMITED
- Kazumasa IGARASHI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SELECTIVE DEPOSITION OF METAL OXIDES USING SILANES AS AN INHIBITOR
- Publication number 20230386831
- Publication date Nov 30, 2023
- LAM RESEARCH CORPORATION
- Kashish SHARMA
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
CUT METAL GATE PROCESS FOR REDUCING TRANSISTOR SPACING
- Publication number 20230377873
- Publication date Nov 23, 2023
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Ming-Chang Wen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
FILM FORMATION METHOD AND FILM FORMATION DEVICE
- Publication number 20230369041
- Publication date Nov 16, 2023
- Tokyo Electron Limited
- Zeyuan NI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PROCESSING TOOL AND METHODS OF OPERATION
- Publication number 20230366081
- Publication date Nov 16, 2023
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Ker-hsun LIAO
- B08 - CLEANING
Information Patent Application
DOSE MAPPING USING SUBSTRATE CURVATURE TO COMPENSATE FOR OUT-OF-PLA...
- Publication number 20230367941
- Publication date Nov 16, 2023
- Applied Materials, Inc.
- Pradeep Subrahmanyan
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE, SUBSTRATE PROCESSING...
- Publication number 20230369043
- Publication date Nov 16, 2023
- Kokusai Electric Corporation
- Kiyohisa ISHIBASHI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD OF PROCESSING SUBSTRATE, METHOD OF MANUFACTURING SEMICONDUCT...
- Publication number 20230360904
- Publication date Nov 9, 2023
- Kokusai Electric Corporation
- Tomiyuki SHIMIZU
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...

the material being a silicon oxynitride

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Semiconductor film composition, method for manufacturing semiconduc...

Method of depositing thin film and method of manufacturing semicond...

Semiconductor device

Method of processing substrate, method of manufacturing semiconduct...

Forming nitrogen-containing low-K gate spacer

Semiconductor device and method of manufacture

Three-dimensional memory devices and fabrication methods thereof

Semiconductor device and method for fabricating the same

Methods of manufacturing an integrated circuit having stress tuning...

Method of fabricating high electron mobility transistor

Voltage regulator circuit including one or more thin-film transistors

Semiconductor memory device and method for manufacturing the same

Dielectric film for semiconductor fabrication

Fabrication method of device with cavity

Gate-all-around integrated circuit structures fabricated using alte...

Semiconductor device and termination structure

Integrated assemblies having vertically-spaced channel material seg...

Semiconductor device and method of manufacturing semiconductor device

Doped or undoped silicon carbide deposition and remote hydrogen pla...

Semiconductor device, manufacturing method thereof, display device,...

Metal-Insulator-Metal structure

Semiconductor device and termination structure

Method of manufacturing semiconductor device, method of processing...

Method for forming insulating film, apparatus for processing substr...

Methods of depositing SiCON with C, O, and N compositional control

Method of processing substrate, substrate processing apparatus, rec...

3DIC formation with dies bonded to formed RDLs

Methods for forming a metal silicate film on a substrate in a react...

Semiconductor structure including MIM capacitor

Method of processing substrate, substrate processing apparatus, rec...

Patents Applicationslast 30 patents

VOLTAGE REGULATOR CIRCUIT INCLUDING ONE OR MORE THIN-FILM TRANSISTORS

GATE-ALL-AROUND INTEGRATED CIRCUIT STRUCTURES FABRICATED USING ALTE...

STABILIZING DIELECTRIC STRESS IN A GALVANIC ISOLATION DEVICE

PROCESS TO REDUCE PLASMA INDUCED DAMAGE

Metal-Insulator-Metal Structure

SUBSTRATE PROCESSING METHOD

ION IMPLANTATION FOR INCREASED ADHESION WITH RESIST MATERIAL

SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE

DOPED OR UNDOPED SILICON CARBIDE DEPOSITION AND REMOTE HYDROGEN PLA...

Methods of Depositing SiCON with C, O, and N Compositional Control

HIGH DENSITY PLASMA CVD FOR DISPLAY ENCAPSULATION APPLICATION

METHODS FOR FORMING A METAL SILICATE FILM ON A SUBSTRATE IN A REACT...

METHOD OF REMOVING A BY-PRODUCT FROM A COMPONENT OF A SEMICONDUCTOR...

SIDEWALL EPITAXY ENCAPSULATION FOR NANOSHEET I/O DEVICE

SELECTIVE PLASMA ENHANCED ATOMIC LAYER DEPOSITION

METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE INCLUDING ISOLATION ST...

SELECTIVE DEPOSITION OF SILICON AND OXYGEN CONTAINING DIELECTRIC FI...

METHOD OF MANUFACTURING SEMICONDUCTOR STRUCTURE AND SEMICONDUCTOR S...

SILICON COMPOUND AND METHOD OF MANUFACTURING INTEGRATED CIRCUIT DEV...

METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE, SUBSTRATE PROCESSING...

APPARATUS FOR PROCESSING SUBSTRATE

FILM FORMING METHOD AND FILM FORMING APPARATUS

SUBSTRATE PROCESSING METHOD AND SUBSTRATE PROCESSING APPARATUS

SELECTIVE DEPOSITION OF METAL OXIDES USING SILANES AS AN INHIBITOR

CUT METAL GATE PROCESS FOR REDUCING TRANSISTOR SPACING

FILM FORMATION METHOD AND FILM FORMATION DEVICE

SEMICONDUCTOR PROCESSING TOOL AND METHODS OF OPERATION

DOSE MAPPING USING SUBSTRATE CURVATURE TO COMPENSATE FOR OUT-OF-PLA...

METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE, SUBSTRATE PROCESSING...

METHOD OF PROCESSING SUBSTRATE, METHOD OF MANUFACTURING SEMICONDUCT...