the material being boron or phosphorus doped silicon oxides

Industry

CPC
H01L21/02129

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Parent Industries

HELECTRICITY H01Electric elements H01LSEMICONDUCTOR DEVICES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR H01L21/00Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof

Current Industry

H01L21/02129the material being boron or phosphorus doped silicon oxides

Industries

Patents Grantslast 30 patents

Information Patent Grant
Vertical etch heterolithic integrated circuit devices
- Patent number 11,978,808
- Issue date May 7, 2024
- MACOM Technology Solutions Holdings, Inc.
- Timothy Edward Boles
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of manufacturing a semiconductor and a semiconductor device
- Patent number 11,973,144
- Issue date Apr 30, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd
- Chang-Yin Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device including hard mask structure with repeating s...
- Patent number 11,901,187
- Issue date Feb 13, 2024
- Samsung Electronics Co., Ltd.
- Hwanyeol Park
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device with a passivation layer and method for produc...
- Patent number 11,854,926
- Issue date Dec 26, 2023
- Infineon Technologies AG
- Jens Peter Konrath
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Silicon doping for laser splash blockage
- Patent number 11,810,780
- Issue date Nov 7, 2023
- Micron Technology, Inc.
- Angelo Oria Espina
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device including transistor with doped oxide semicond...
- Patent number 11,810,858
- Issue date Nov 7, 2023
- Semiconductor Energy Laboratory Co., Ltd.
- Junichi Koezuka
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Integrated assemblies and methods of forming integrated assemblies
- Patent number 11,805,651
- Issue date Oct 31, 2023
- Jordan D. Greenlee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and method of manufacture
- Patent number 11,776,853
- Issue date Oct 3, 2023
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Hung-Hao Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for passivating full front-side deep trench isolation structure
- Patent number 11,769,779
- Issue date Sep 26, 2023
- OmniVision Technologies, Inc.
- Shiyu Sun
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Source/drain regions of FINFET devices and methods of forming same
- Patent number 11,735,664
- Issue date Aug 22, 2023
- Taiwan Semiconductor Manufacturing Company, Ltd
- Kun-Mu Li
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
DRAM with a hydrogen-supply layer and a high-capacitance embedded c...
- Patent number 11,737,256
- Issue date Aug 22, 2023
- Samsung Electronics Co., Ltd.
- Jun-Won Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Apparatus and method for semiconductor fabrication
- Patent number 11,680,321
- Issue date Jun 20, 2023
- XIA TAI XIN SEMICONDUCTOR (QING DAO) LTD.
- Chan-Sul Joo
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for forming semiconductor structure
- Patent number 11,658,023
- Issue date May 23, 2023
- United Microelectronics Corp.
- Zhen-Zhen Wang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device having deep trench structure and method of man...
- Patent number 11,615,989
- Issue date Mar 28, 2023
- KEY FOUNDRY CO., LTD.
- Yang Beom Kang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Interconnect structure for semiconductor device and methods of fabr...
- Patent number 11,610,841
- Issue date Mar 21, 2023
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Chia-Ta Yu
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Method of making a semiconductor structure
- Patent number 11,594,449
- Issue date Feb 28, 2023
- Taiwan Semiconductor Manufacturing Company, Ltd
- Chih-Ming Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Apparatus and method for semiconductor fabrication
- Patent number 11,572,624
- Issue date Feb 7, 2023
- XIA TAI XIN SEMICONDUCTOR (QING DAO) LTD.
- Chan-Sul Joo
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Semiconductor device
- Patent number 11,569,372
- Issue date Jan 31, 2023
- Fuji Electric Co., Ltd.
- Makoto Shimosawa
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of manufacturing semiconductor device, substrate processing...
- Patent number 11,562,905
- Issue date Jan 24, 2023
- Kokusai Electric Corporation
- Motomu Degai
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device having low-k spacer and converting spacer and...
- Patent number 11,545,494
- Issue date Jan 3, 2023
- SK Hynix Inc.
- Yun-Hyuck Ji
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Reduction of gate-drain capacitance
- Patent number 11,532,626
- Issue date Dec 20, 2022
- Taiwan Semiconductor Manufacturing Co., Ltd
- Jung-Hung Chang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor memory device, method of driving the same and method...
- Patent number 11,508,728
- Issue date Nov 22, 2022
- SK Hynix Inc.
- Jin Hong Ahn
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Plasma doping of gap fill materials
- Patent number 11,508,573
- Issue date Nov 22, 2022
- Micron Technology, Inc.
- Santanu Sarkar
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and method for manufacturing the same
- Patent number 11,495,679
- Issue date Nov 8, 2022
- Kabushiki Kaisha Toshiba
- Saya Shimomura
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Deposition of low-stress boron-containing layers
- Patent number 11,495,454
- Issue date Nov 8, 2022
- Applied Materials, Inc.
- Huiyuan Wang
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Integrated assemblies, and methods of forming integrated assemblies
- Patent number 11,489,049
- Issue date Nov 1, 2022
- Micron Technology, Inc.
- Gordon A. Haller
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor memory device, method of driving the same and method...
- Patent number 11,456,297
- Issue date Sep 27, 2022
- SK Hynix Inc.
- Jin Hong Ahn
- G11 - INFORMATION STORAGE
Information Patent Grant
Integrated assemblies and methods of forming integrated assemblies
- Patent number 11,411,021
- Issue date Aug 9, 2022
- Micron Technology, Inc.
- Jordan D. Greenlee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Silicon doping for laser splash blockage
- Patent number 11,404,264
- Issue date Aug 2, 2022
- Micron Technology, Inc.
- Angelo Oria Espina
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device having deep trench structure and method of man...
- Patent number 11,367,661
- Issue date Jun 21, 2022
- KEY FOUNDRY CO., LTD.
- Yang Beom Kang
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
METHOD OF FORMING OXIDE-NITRIDE-OXIDE STACK OF NON-VOLATILE MEMORY...
- Publication number 20240107771
- Publication date Mar 28, 2024
- Infineon Technologies LLC
- Michael ALLEN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTEGRATED ASSEMBLIES AND METHODS OF FORMING INTEGRATED ASSEMBLIES
- Publication number 20240057335
- Publication date Feb 15, 2024
- Lodestar Licensing Group LLC
- Jordan D. Greenlee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE
- Publication number 20240021668
- Publication date Jan 18, 2024
- Japan Display Inc.
- Hajime WATAKABE
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SOURCE/DRAIN REGIONS OF FINFET DEVICES AND METHODS OF FORMING SAME
- Publication number 20230352589
- Publication date Nov 2, 2023
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Kun-Mu Li
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SIDEWALL PASSIVATION FOR PLASMA ETCHING
- Publication number 20230245895
- Publication date Aug 3, 2023
- Applied Materials, Inc.
- Zhonghua Yao
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE HAVING DEEP TRENCH STRUCTURE AND METHOD OF MAN...
- Publication number 20230207394
- Publication date Jun 29, 2023
- KEY FOUNDRY CO., LTD.
- Yang Beom KANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
EXPANDABLE DOPED OXIDE FILMS FOR ADVANCED SEMICONDUCTOR APPLICATIONS
- Publication number 20230178424
- Publication date Jun 8, 2023
- LAM RESEARCH CORPORATION
- Reza Bayati
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE
- Publication number 20230139853
- Publication date May 4, 2023
- Fuji Electric Co., Ltd.
- Makoto SHIMOSAWA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD OF PROCESSING SUBSTRATE, RECORDING MEDIUM, SUBSTRATE PROCESS...
- Publication number 20230091654
- Publication date Mar 23, 2023
- Kokusai Electric Corporation
- Koei KURIBAYASHI
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
Multi-Channel Devices and Method with Anti-Punch Through Process
- Publication number 20230068668
- Publication date Mar 2, 2023
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Ko-Cheng Liu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PLASMA DOPING OF GAP FILL MATERIALS
- Publication number 20230044518
- Publication date Feb 9, 2023
- Micron Technology, Inc.
- Santanu Sarkar
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHODS FOR FORMING DOPED SILICON OXIDE THIN FILMS
- Publication number 20230031720
- Publication date Feb 2, 2023
- ASM INTERNATIONAL N.V.
- Noboru Takamure
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SUBSTRATE PROCESSING METHOD
- Publication number 20230030566
- Publication date Feb 2, 2023
- ASM IP HOLDING B.V.
- TaeHee Yoo
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD THEREOF
- Publication number 20220399202
- Publication date Dec 15, 2022
- United Microelectronics Corp.
- Jingyu Fan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PLASMA PROCESSING METHOD
- Publication number 20220392772
- Publication date Dec 8, 2022
- Hitachi High-Tech Corporation
- Chaomei Liu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
REDUCTION OF GATE-DRAIN CAPACITANCE
- Publication number 20220367463
- Publication date Nov 17, 2022
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Jung-Hung Chang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE INCLUDING HARD MASK STRUCTURE
- Publication number 20220344166
- Publication date Oct 27, 2022
- Samsung Electronics Co., Ltd.
- Hwanyeol PARK
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Integrated Assemblies and Methods of Forming Integrated Assemblies
- Publication number 20220336494
- Publication date Oct 20, 2022
- Micron Technology, Inc.
- Jordan D. Greenlee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SILICON DOPING FOR LASER SPLASH BLOCKAGE
- Publication number 20220328305
- Publication date Oct 13, 2022
- Micron Technology, Inc.
- Angelo Oria Espina
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND METHOD FOR MANUFACTURING THE SEMICONDUCTOR...
- Publication number 20220310517
- Publication date Sep 29, 2022
- Semiconductor Energy Laboratory Co., Ltd.
- Junichi KOEZUKA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE HAVING DEEP TRENCH STRUCTURE AND METHOD OF MAN...
- Publication number 20220270932
- Publication date Aug 25, 2022
- KEY FOUNDRY CO., LTD.
- Yang Beom KANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
VERTICAL ETCH HETEROLITHIC INTEGRATED CIRCUIT DEVICES
- Publication number 20220262959
- Publication date Aug 18, 2022
- MACOM Technology Solutions Holdings, Inc.
- Timothy Edward Boles
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND METHOD FOR MANUFACTURING SEMICONDUCTOR DEVICE
- Publication number 20220189766
- Publication date Jun 16, 2022
- SEMICONDUCTOR ENERGY LABORATORY CO., LTD.
- Yuichi YANAGISAWA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
APPARATUS AND METHOD FOR SEMICONDUCTOR FABRICATION
- Publication number 20220178030
- Publication date Jun 9, 2022
- XIA TAI XIN SEMICONDUCTOR (QING DAO) LTD.
- CHAN-SUL JOO
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
Semiconductor Device and Method of Manufacture
- Publication number 20220130729
- Publication date Apr 28, 2022
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Hung-Hao Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD OF MANUFACTURING A SEMICONDUCTOR AND A SEMICONDUCTOR DEVICE
- Publication number 20220085203
- Publication date Mar 17, 2022
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chang-Yin CHEN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Method of Manufacturing Semiconductor Device, Substrate Processing...
- Publication number 20220084816
- Publication date Mar 17, 2022
- Kokusai Electric Corporation
- Keita ICHIMURA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
LOW STRESS FILMS FOR ADVANCED SEMICONDUCTOR APPLICATIONS
- Publication number 20220068636
- Publication date Mar 3, 2022
- LAM RESEARCH CORPORATION
- Reza Bayati
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
DEPOSITION OF LOW-STRESS BORON-CONTAINING LAYERS
- Publication number 20220044927
- Publication date Feb 10, 2022
- Applied Materials, Inc.
- Huiyuan Wang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE
- Publication number 20220005808
- Publication date Jan 6, 2022
- Samsung Electronics Co., Ltd.
- Jun-Won LEE
- H01 - BASIC ELECTRIC ELEMENTS

the material being boron or phosphorus doped silicon oxides

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Vertical etch heterolithic integrated circuit devices

Method of manufacturing a semiconductor and a semiconductor device

Semiconductor device including hard mask structure with repeating s...

Semiconductor device with a passivation layer and method for produc...

Silicon doping for laser splash blockage

Semiconductor device including transistor with doped oxide semicond...

Integrated assemblies and methods of forming integrated assemblies

Semiconductor device and method of manufacture

Method for passivating full front-side deep trench isolation structure

Source/drain regions of FINFET devices and methods of forming same

DRAM with a hydrogen-supply layer and a high-capacitance embedded c...

Apparatus and method for semiconductor fabrication

Method for forming semiconductor structure

Semiconductor device having deep trench structure and method of man...

Interconnect structure for semiconductor device and methods of fabr...

Method of making a semiconductor structure

Apparatus and method for semiconductor fabrication

Semiconductor device

Method of manufacturing semiconductor device, substrate processing...

Semiconductor device having low-k spacer and converting spacer and...

Reduction of gate-drain capacitance

Semiconductor memory device, method of driving the same and method...

Plasma doping of gap fill materials

Semiconductor device and method for manufacturing the same

Deposition of low-stress boron-containing layers

Integrated assemblies, and methods of forming integrated assemblies

Semiconductor memory device, method of driving the same and method...

Integrated assemblies and methods of forming integrated assemblies

Silicon doping for laser splash blockage

Semiconductor device having deep trench structure and method of man...

Patents Applicationslast 30 patents

METHOD OF FORMING OXIDE-NITRIDE-OXIDE STACK OF NON-VOLATILE MEMORY...

INTEGRATED ASSEMBLIES AND METHODS OF FORMING INTEGRATED ASSEMBLIES

SEMICONDUCTOR DEVICE

SOURCE/DRAIN REGIONS OF FINFET DEVICES AND METHODS OF FORMING SAME

SIDEWALL PASSIVATION FOR PLASMA ETCHING

SEMICONDUCTOR DEVICE HAVING DEEP TRENCH STRUCTURE AND METHOD OF MAN...

EXPANDABLE DOPED OXIDE FILMS FOR ADVANCED SEMICONDUCTOR APPLICATIONS

METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE

METHOD OF PROCESSING SUBSTRATE, RECORDING MEDIUM, SUBSTRATE PROCESS...

Multi-Channel Devices and Method with Anti-Punch Through Process

PLASMA DOPING OF GAP FILL MATERIALS

METHODS FOR FORMING DOPED SILICON OXIDE THIN FILMS

SUBSTRATE PROCESSING METHOD

SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD THEREOF

PLASMA PROCESSING METHOD

REDUCTION OF GATE-DRAIN CAPACITANCE

SEMICONDUCTOR DEVICE INCLUDING HARD MASK STRUCTURE

Integrated Assemblies and Methods of Forming Integrated Assemblies

SILICON DOPING FOR LASER SPLASH BLOCKAGE

SEMICONDUCTOR DEVICE AND METHOD FOR MANUFACTURING THE SEMICONDUCTOR...

SEMICONDUCTOR DEVICE HAVING DEEP TRENCH STRUCTURE AND METHOD OF MAN...

VERTICAL ETCH HETEROLITHIC INTEGRATED CIRCUIT DEVICES

SEMICONDUCTOR DEVICE AND METHOD FOR MANUFACTURING SEMICONDUCTOR DEVICE

APPARATUS AND METHOD FOR SEMICONDUCTOR FABRICATION

Semiconductor Device and Method of Manufacture

METHOD OF MANUFACTURING A SEMICONDUCTOR AND A SEMICONDUCTOR DEVICE

Method of Manufacturing Semiconductor Device, Substrate Processing...

LOW STRESS FILMS FOR ADVANCED SEMICONDUCTOR APPLICATIONS

DEPOSITION OF LOW-STRESS BORON-CONTAINING LAYERS

SEMICONDUCTOR DEVICE