the material being carbon

Industry

CPC
H01L21/02115

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Parent Industries

HELECTRICITY H01Electric elements H01LSEMICONDUCTOR DEVICES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR H01L21/00Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof

Current Industry

H01L21/02115the material being carbon

Industries

Patents Grantslast 30 patents

Information Patent Grant
Low resistance and high reliability metallization module
- Patent number 12,148,660
- Issue date Nov 19, 2024
- Applied Materials, Inc.
- Roey Shaviv
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Spin on carbon composition and method of manufacturing a semiconduc...
- Patent number 12,148,610
- Issue date Nov 19, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd
- Jing Hong Huang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Plasma-enhanced chemical vapor deposition of carbon hard-mask
- Patent number 12,136,549
- Issue date Nov 5, 2024
- Applied Materials, Inc.
- Byung Seok Kwon
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Selective carbon deposition on top and bottom surfaces of semicondu...
- Patent number 12,125,699
- Issue date Oct 22, 2024
- Applied Materials, Inc.
- Abhijeet S. Bagal
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for manufacturing mask structure, semiconductor structure an...
- Patent number 12,119,226
- Issue date Oct 15, 2024
- CHANGXIN MEMORY TECHNOLOGIES, INC.
- Yexiao Yu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Highly etch selective amorphous carbon film
- Patent number 12,112,949
- Issue date Oct 8, 2024
- Applied Materials, Inc.
- Rajesh Prasad
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Method of using dual frequency RF power in a process chamber
- Patent number 12,106,958
- Issue date Oct 1, 2024
- Applied Materials, Inc.
- Anup Kumar Singh
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
High etch selectivity, low stress ashable carbon hard mask
- Patent number 12,062,537
- Issue date Aug 13, 2024
- Lam Research Corporation
- Jun Xue
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Semiconductor device having an extra low-k dielectric layer and met...
- Patent number 12,062,613
- Issue date Aug 13, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd
- Po-Cheng Shih
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Amorphous carbon for gap fill
- Patent number 12,062,536
- Issue date Aug 13, 2024
- Applied Materials, Inc.
- Xiaoquan Min
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Gate spacer structure and method of forming same
- Patent number 12,062,709
- Issue date Aug 13, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd
- Wei-Ting Chien
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Forming a protective layer to prevent formation of leakage paths
- Patent number 12,057,350
- Issue date Aug 6, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Leo Hsu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Technologies for high aspect ratio carbon etching with inserted cha...
- Patent number 12,040,176
- Issue date Jul 16, 2024
- Tokyo Electron Limited
- Shihsheng Chang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Flim forming method of carbon-containing film by microwave plasma
- Patent number 12,018,375
- Issue date Jun 25, 2024
- Tokyo Electron Limited
- Ryota Ifuku
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Highly etch selective amorphous carbon film
- Patent number 12,014,927
- Issue date Jun 18, 2024
- Applied Materials, Inc.
- Rajesh Prasad
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Method and device for forming graphene structure
- Patent number 12,014,907
- Issue date Jun 18, 2024
- Tokyo Electron Limited
- Ryota Ifuku
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Metal-doped carbon hardmasks
- Patent number 12,014,925
- Issue date Jun 18, 2024
- Applied Materials, Inc.
- Eswaranand Venkatasubramanian
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Semiconductor structure and manufacturing method thereof
- Patent number 11,984,398
- Issue date May 14, 2024
- CHANGXIN MEMORY TECHNOLOGIES, INC.
- Yexiao Yu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Adhesion layers for EUV lithography
- Patent number 11,972,948
- Issue date Apr 30, 2024
- Brewer Science, Inc.
- Andrea M. Chacko
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Crystalline dielectric systems for interconnect circuit manufacturing
- Patent number 11,967,640
- Issue date Apr 23, 2024
- Tokyo Electron Limited
- Robert D Clark
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Cyclic plasma processing
- Patent number 11,961,735
- Issue date Apr 16, 2024
- Tokyo Electron Limited
- Yun Han
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Method for depositing silicon-free carbon-containing film as gap-fi...
- Patent number 11,923,190
- Issue date Mar 5, 2024
- ASM IP Holding B.V.
- Timothee Julien Vincent Blanquart
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Electronic device and method of manufacturing the same
- Patent number 11,908,918
- Issue date Feb 20, 2024
- Samsung Electronics Co., Ltd.
- Jinseong Heo
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Treatments for controlling deposition defects
- Patent number 11,894,228
- Issue date Feb 6, 2024
- Applied Materials, Inc.
- Sudha S. Rathi
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Selective deposition of etch-stop layer for enhanced patterning
- Patent number 11,869,770
- Issue date Jan 9, 2024
- Lam Research Corporation
- Nagraj Shankar
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Molecular layer deposition of amorphous carbon films
- Patent number 11,859,278
- Issue date Jan 2, 2024
- Applied Materials, Inc.
- Bhaskar Jyoti Bhuyan
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Electronic device and method of manufacturing the same
- Patent number 11,862,704
- Issue date Jan 2, 2024
- Samsung Electronics Co., Ltd.
- Jinseong Heo
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for manufacturing semiconductor device having low-k carbon-c...
- Patent number 11,848,198
- Issue date Dec 19, 2023
- Taiwan Semiconductor Manufacturing Company, Ltd
- Kai-Fang Cheng
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Depositive shielding for fiducial protection from redeposition
- Patent number 11,817,395
- Issue date Nov 14, 2023
- FEI Company
- Sean Morgan-Jones
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Carbon hard masks for patterning applications and methods related t...
- Patent number 11,784,042
- Issue date Oct 10, 2023
- Applied Materials, Inc.
- Eswaranand Venkatasubramanian
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...

Patents Applicationslast 30 patents

Information Patent Application
SYSTEM AND METHOD FOR CARBON PLUG FORMATION
- Publication number 20240420927
- Publication date Dec 19, 2024
- LAM RESEARCH CORPORATION
- Daniela ANJOS RIGSBY
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SELECTIVE CARBON DEPOSITION ON TOP AND BOTTOM SURFACES OF SEMICONDU...
- Publication number 20240420948
- Publication date Dec 19, 2024
- Applied Materials, Inc.
- Abhijeet S. Bagal
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SPIN ON CARBON COMPOSITION AND METHOD OF MANUFACTURING A SEMICONDUC...
- Publication number 20240395539
- Publication date Nov 28, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Jing Hong HUANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
HIGH ETCH SELECTIVITY, LOW STRESS ASHABLE CARBON HARD MASK
- Publication number 20240395542
- Publication date Nov 28, 2024
- LAM RESEARCH CORPORATION
- Jun XUE
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
SEMICONDUCTOR DEVICE HAVING AN EXTRA LOW-K DIELECTRIC LAYER AND MET...
- Publication number 20240371769
- Publication date Nov 7, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Po-Cheng SHIH
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
AMORPHOUS CARBON FOR GAP FILL
- Publication number 20240363332
- Publication date Oct 31, 2024
- Applied Materials, Inc.
- Xiaoquan Min
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
METHOD FOR DEPOSITING AMORPHOUS CARBON FILM
- Publication number 20240347335
- Publication date Oct 17, 2024
- TES CO., LTD.
- Kwang-Ki Kim
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
DOPING BY MOLECULAR LAYER DEPOSITION
- Publication number 20240332014
- Publication date Oct 3, 2024
- Applied Materials, Inc.
- Xinke Wang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR SUBSTRATE AND METHOD FOR MANUFACTURING THE SAME
- Publication number 20240332081
- Publication date Oct 3, 2024
- ROHM CO., LTD.
- Makoto TAKAMURA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SUBSTRATE PROCESSING METHOD AND SUBSTRATE PROCESSING APPARATUS
- Publication number 20240304436
- Publication date Sep 12, 2024
- TOKYO ELECTRON LIMITED
- Miyako KANEKO
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
FILM FORMING METHOD AND FILM FORMING APPARATUS
- Publication number 20240290610
- Publication date Aug 29, 2024
- Tokyo Electron Limited
- Takashi FUSE
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
DLC FILM DEPOSITION APPARATUS, SEMICONDUCTOR MANUFACTURING SYSTEM I...
- Publication number 20240287668
- Publication date Aug 29, 2024
- Samsung Electronics Co., Ltd.
- Se Jun PARK
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
RADICAL-ACTIVATED CARBON FILM DEPOSITION
- Publication number 20240282570
- Publication date Aug 22, 2024
- LAM RESEARCH CORPORATION
- Bhadri N. Varadarajan
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
METHOD OF MANUFACTURING SEMICONDUCTOR STRUCTURE
- Publication number 20240266184
- Publication date Aug 8, 2024
- NANYA TECHNOLOGY CORPORATION
- HSUAN-WU LAI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
FILM FORMATION METHOD AND FILM FORMATION APPARATUS
- Publication number 20240258086
- Publication date Aug 1, 2024
- TOKYO ELECTRON LIMITED
- Tadashi MITSUNARI
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
METHODS AND APPARATUSES FOR CARBON DEPOSITION
- Publication number 20240222107
- Publication date Jul 4, 2024
- ASM IP HOLDING B.V.
- Varun Sharma
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
ADHESION LAYERS FOR EUV LITHOGRAPHY
- Publication number 20240222122
- Publication date Jul 4, 2024
- Brewer Science, Inc.
- Andrea M. Chacko
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
3D STACKED PACKAGING STRUCTURE AND MANUFACTURING METHOD THEREOF
- Publication number 20240153913
- Publication date May 9, 2024
- INSTITUTE OF SEMICONDUCTORS, GUANGDONG ACADEMY OF SCIENCES
- Yinhua CUI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR MANUFACTURING FACILITY AND METHOD OF OPERATING THE SAME
- Publication number 20240128065
- Publication date Apr 18, 2024
- LOT CES CO., LTD.
- Jin Ho BAE
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
SUBSTRATE PROCESSING METHOD AND SUBSTRATE PROCESSING APPARATUS
- Publication number 20240120183
- Publication date Apr 11, 2024
- Tokyo Electron Limited
- Makoto WADA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
2D Layered Thin Film Structure
- Publication number 20240117487
- Publication date Apr 11, 2024
- NATIONAL APPLIED RESEARCH LABORATORIES
- Shu-Ju Tsai
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
MOLECULAR LAYER DEPOSITION CARBON MASKS FOR DIRECT SELECTIVE DEPOSI...
- Publication number 20240105499
- Publication date Mar 28, 2024
- Applied Materials, Inc.
- Zeqing Shen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHODS OF FORMING PATTERNS USING HARD MASK
- Publication number 20230386836
- Publication date Nov 30, 2023
- SK HYNIX INC.
- Joo Hwan PARK
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SUBSTRATE PROCESSING METHOD AND SUBSTRATE PROCESSING APPARATUS
- Publication number 20230377953
- Publication date Nov 23, 2023
- Tokyo Electron Limited
- Hiroki MURAKAMI
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
SOI Structures with Carbon in Body Regions for Improved RF-SOI Swit...
- Publication number 20230360962
- Publication date Nov 9, 2023
- Newport Fab, LLC dba Tower Semiconductor Newport Beach
- Kurt Moen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
LOW TEMPERATURE CARBON GAPFILL
- Publication number 20230360924
- Publication date Nov 9, 2023
- Applied Materials, Inc.
- Supriya Ghosh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SPIN ON CARBON COMPOSITION AND METHOD OF MANUFACTURING A SEMICONDUC...
- Publication number 20230343582
- Publication date Oct 26, 2023
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Jing Hong HUANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD OF PROCESSING SUBSTRATE
- Publication number 20230343585
- Publication date Oct 26, 2023
- TES CO., LTD.
- Joo-Hyun PARK
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD OF USING DUAL FREQUENCY RF POWER IN A PROCESS CHAMBER
- Publication number 20230343586
- Publication date Oct 26, 2023
- Applied Materials, Inc.
- Anup Kumar SINGH
- B08 - CLEANING
Information Patent Application
TECHNOLOGIES FOR HIGH ASPECT RATIO CARBON ETCHING WITH INSERTED CHA...
- Publication number 20230326737
- Publication date Oct 12, 2023
- TOKYO ELECTRON LIMITED
- Shihsheng Chang
- H01 - BASIC ELECTRIC ELEMENTS

the material being carbon

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Low resistance and high reliability metallization module

Spin on carbon composition and method of manufacturing a semiconduc...

Plasma-enhanced chemical vapor deposition of carbon hard-mask

Selective carbon deposition on top and bottom surfaces of semicondu...

Method for manufacturing mask structure, semiconductor structure an...

Highly etch selective amorphous carbon film

Method of using dual frequency RF power in a process chamber

High etch selectivity, low stress ashable carbon hard mask

Semiconductor device having an extra low-k dielectric layer and met...

Amorphous carbon for gap fill

Gate spacer structure and method of forming same

Forming a protective layer to prevent formation of leakage paths

Technologies for high aspect ratio carbon etching with inserted cha...

Flim forming method of carbon-containing film by microwave plasma

Highly etch selective amorphous carbon film

Method and device for forming graphene structure

Metal-doped carbon hardmasks

Semiconductor structure and manufacturing method thereof

Adhesion layers for EUV lithography

Crystalline dielectric systems for interconnect circuit manufacturing

Cyclic plasma processing

Method for depositing silicon-free carbon-containing film as gap-fi...

Electronic device and method of manufacturing the same

Treatments for controlling deposition defects

Selective deposition of etch-stop layer for enhanced patterning

Molecular layer deposition of amorphous carbon films

Electronic device and method of manufacturing the same

Method for manufacturing semiconductor device having low-k carbon-c...

Depositive shielding for fiducial protection from redeposition

Carbon hard masks for patterning applications and methods related t...

Patents Applicationslast 30 patents

SYSTEM AND METHOD FOR CARBON PLUG FORMATION

SELECTIVE CARBON DEPOSITION ON TOP AND BOTTOM SURFACES OF SEMICONDU...

SPIN ON CARBON COMPOSITION AND METHOD OF MANUFACTURING A SEMICONDUC...

HIGH ETCH SELECTIVITY, LOW STRESS ASHABLE CARBON HARD MASK

SEMICONDUCTOR DEVICE HAVING AN EXTRA LOW-K DIELECTRIC LAYER AND MET...

AMORPHOUS CARBON FOR GAP FILL

METHOD FOR DEPOSITING AMORPHOUS CARBON FILM

DOPING BY MOLECULAR LAYER DEPOSITION

SEMICONDUCTOR SUBSTRATE AND METHOD FOR MANUFACTURING THE SAME

SUBSTRATE PROCESSING METHOD AND SUBSTRATE PROCESSING APPARATUS

FILM FORMING METHOD AND FILM FORMING APPARATUS

DLC FILM DEPOSITION APPARATUS, SEMICONDUCTOR MANUFACTURING SYSTEM I...

RADICAL-ACTIVATED CARBON FILM DEPOSITION

METHOD OF MANUFACTURING SEMICONDUCTOR STRUCTURE

FILM FORMATION METHOD AND FILM FORMATION APPARATUS

METHODS AND APPARATUSES FOR CARBON DEPOSITION

ADHESION LAYERS FOR EUV LITHOGRAPHY

3D STACKED PACKAGING STRUCTURE AND MANUFACTURING METHOD THEREOF

SEMICONDUCTOR MANUFACTURING FACILITY AND METHOD OF OPERATING THE SAME

SUBSTRATE PROCESSING METHOD AND SUBSTRATE PROCESSING APPARATUS

2D Layered Thin Film Structure

MOLECULAR LAYER DEPOSITION CARBON MASKS FOR DIRECT SELECTIVE DEPOSI...

METHODS OF FORMING PATTERNS USING HARD MASK

SUBSTRATE PROCESSING METHOD AND SUBSTRATE PROCESSING APPARATUS

SOI Structures with Carbon in Body Regions for Improved RF-SOI Swit...

LOW TEMPERATURE CARBON GAPFILL

SPIN ON CARBON COMPOSITION AND METHOD OF MANUFACTURING A SEMICONDUC...

METHOD OF PROCESSING SUBSTRATE

METHOD OF USING DUAL FREQUENCY RF POWER IN A PROCESS CHAMBER

TECHNOLOGIES FOR HIGH ASPECT RATIO CARBON ETCHING WITH INSERTED CHA...