the material being carbon

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CPC
H01L21/02115

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HELECTRICITY H01Electric elements H01LSEMICONDUCTOR DEVICES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR H01L21/00Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof

Current Industry

H01L21/02115the material being carbon

Industries

Patents Grantslast 30 patents

Information Patent Grant
Throughput improvements for low-temperature/beol-compatible highly...
- Patent number 12,368,061
- Issue date Jul 22, 2025
- Destination 2D Inc.
- Ravi Iyengar
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of manufacturing semiconductor device
- Patent number 12,334,338
- Issue date Jun 17, 2025
- Kioxia Corporation
- Takaya Ishino
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Methods to reduce UNCD film roughness
- Patent number 12,327,733
- Issue date Jun 10, 2025
- Applied Materials, Inc.
- Vicknesh Sahmuganathan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Eliminating yield impact of stochastics in lithography
- Patent number 12,315,727
- Issue date May 27, 2025
- Lam Research Corporation
- Nader Shamma
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Selective etch of a substrate
- Patent number 12,261,049
- Issue date Mar 25, 2025
- Applied Materials , Inc.
- David Thompson
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Carbon based depositions used for critical dimension control during...
- Patent number 12,249,514
- Issue date Mar 11, 2025
- Lam Research Corporation
- Jon Henri
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Three-dimensional field effect device
- Patent number 12,237,325
- Issue date Feb 25, 2025
- International Business Machines Corporation
- Huimei Zhou
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Long-term implantable electronic devices
- Patent number 12,220,239
- Issue date Feb 11, 2025
- Northwestern University
- John A. Rogers
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Carbon film deposition method and deposition apparatus
- Patent number 12,217,956
- Issue date Feb 4, 2025
- Tokyo Electron Limited
- Yosuke Watanabe
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Processing chamber deposition confinement
- Patent number 12,211,673
- Issue date Jan 28, 2025
- Applied Materials, Inc.
- Sarah Michelle Bobek
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Dual RF for controllable film deposition
- Patent number 12,191,115
- Issue date Jan 7, 2025
- Applied Materials, Inc.
- Venkata Sharat Chandra Parimi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Low resistance and high reliability metallization module
- Patent number 12,148,660
- Issue date Nov 19, 2024
- Applied Materials, Inc.
- Roey Shaviv
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Spin on carbon composition and method of manufacturing a semiconduc...
- Patent number 12,148,610
- Issue date Nov 19, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd
- Jing Hong Huang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Plasma-enhanced chemical vapor deposition of carbon hard-mask
- Patent number 12,136,549
- Issue date Nov 5, 2024
- Applied Materials, Inc.
- Byung Seok Kwon
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Selective carbon deposition on top and bottom surfaces of semicondu...
- Patent number 12,125,699
- Issue date Oct 22, 2024
- Applied Materials, Inc.
- Abhijeet S. Bagal
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for manufacturing mask structure, semiconductor structure an...
- Patent number 12,119,226
- Issue date Oct 15, 2024
- CHANGXIN MEMORY TECHNOLOGIES, INC.
- Yexiao Yu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Highly etch selective amorphous carbon film
- Patent number 12,112,949
- Issue date Oct 8, 2024
- Applied Materials, Inc.
- Rajesh Prasad
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Method of using dual frequency RF power in a process chamber
- Patent number 12,106,958
- Issue date Oct 1, 2024
- Applied Materials, Inc.
- Anup Kumar Singh
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
High etch selectivity, low stress ashable carbon hard mask
- Patent number 12,062,537
- Issue date Aug 13, 2024
- Lam Research Corporation
- Jun Xue
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Semiconductor device having an extra low-k dielectric layer and met...
- Patent number 12,062,613
- Issue date Aug 13, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd
- Po-Cheng Shih
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Amorphous carbon for gap fill
- Patent number 12,062,536
- Issue date Aug 13, 2024
- Applied Materials, Inc.
- Xiaoquan Min
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Gate spacer structure and method of forming same
- Patent number 12,062,709
- Issue date Aug 13, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd
- Wei-Ting Chien
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Forming a protective layer to prevent formation of leakage paths
- Patent number 12,057,350
- Issue date Aug 6, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Leo Hsu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Technologies for high aspect ratio carbon etching with inserted cha...
- Patent number 12,040,176
- Issue date Jul 16, 2024
- Tokyo Electron Limited
- Shihsheng Chang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Flim forming method of carbon-containing film by microwave plasma
- Patent number 12,018,375
- Issue date Jun 25, 2024
- Tokyo Electron Limited
- Ryota Ifuku
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Highly etch selective amorphous carbon film
- Patent number 12,014,927
- Issue date Jun 18, 2024
- Applied Materials, Inc.
- Rajesh Prasad
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Method and device for forming graphene structure
- Patent number 12,014,907
- Issue date Jun 18, 2024
- Tokyo Electron Limited
- Ryota Ifuku
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Metal-doped carbon hardmasks
- Patent number 12,014,925
- Issue date Jun 18, 2024
- Applied Materials, Inc.
- Eswaranand Venkatasubramanian
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Semiconductor structure and manufacturing method thereof
- Patent number 11,984,398
- Issue date May 14, 2024
- CHANGXIN MEMORY TECHNOLOGIES, INC.
- Yexiao Yu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Adhesion layers for EUV lithography
- Patent number 11,972,948
- Issue date Apr 30, 2024
- Brewer Science, Inc.
- Andrea M. Chacko
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
METHODS FOR PROTECTING A PERIPHERAL EDGE AND BACKSIDE OF A SEMICOND...
- Publication number 20250226208
- Publication date Jul 10, 2025
- TOKYO ELECTRON LIMITED
- Shan Hu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Fabrication and processing of graphene electronic devices on Silico...
- Publication number 20250226212
- Publication date Jul 10, 2025
- Archer Materials Limited
- Alexander James PORKOVICH
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ENCAPSULATED FLEXIBLE ELECTRONICS FOR LONG-TERM IMPLANTATION
- Publication number 20250213162
- Publication date Jul 3, 2025
- Northwestern University
- John A. ROGERS
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTEGRATED CIRCUIT AND MANUFACTURING METHOD THEREOF
- Publication number 20250210446
- Publication date Jun 26, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Isha Datye
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
UNIFORM GAPFILL DEPOSITION ON SEMICONDUCTOR SUBSTRATES WITH VARYING...
- Publication number 20250191909
- Publication date Jun 12, 2025
- Applied Materials, Inc.
- Bharati Neelamraju
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
FILM FORMING METHOD AND FILM FORMING APPARATUS
- Publication number 20250191907
- Publication date Jun 12, 2025
- TOKYO ELECTRON LIMITED
- Ayuta SUZUKI
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
CARBON BASED DEPOSITIONS USED FOR CRITICAL DIMENSION CONTROL DURING...
- Publication number 20250191926
- Publication date Jun 12, 2025
- LAM RESEARCH CORPORATION
- Jon HENRI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
FILM FORMING METHOD AND FILM FORMING APPARATUS
- Publication number 20250154645
- Publication date May 15, 2025
- Tokyo Electron Limited
- Tadashi MITSUNARI
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
SUBTRATE PROCESSING METHOD AND SUBSTRATE PROCESSING APPARATUS
- Publication number 20250149329
- Publication date May 8, 2025
- TOKYO ELECTRON LIMITED
- Ryota IFUKU
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
DEPOSITION OF CARBON GAPFILL MATERIALS
- Publication number 20250137119
- Publication date May 1, 2025
- Applied Materials, Inc.
- Bhargav S. CITLA
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
SUBSTRATE PROCESSING METHOD AND SUBSTRATE PROCESSING APPARATUS
- Publication number 20250129474
- Publication date Apr 24, 2025
- TOKYO ELECTRON LIMITED
- Ryota IFUKU
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
METHOD FOR PROCESSING SUBSTRATE
- Publication number 20250122611
- Publication date Apr 17, 2025
- TES CO., LTD.
- Sungwoo LEE
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
PROCESSING CHAMBER DEPOSITION CONFINEMENT
- Publication number 20250125129
- Publication date Apr 17, 2025
- Applied Materials, Inc.
- Sarah Michelle Bobek
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
METHOD OF FORMING CARBON-CONTAINING FILM
- Publication number 20250112036
- Publication date Apr 3, 2025
- TOKYO ELECTRON LIMITED
- Miyako KANEKO
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
METHOD OF PROCESSING SUBSTRATE, METHOD OF MANUFACTURING SEMICONDUCT...
- Publication number 20250104997
- Publication date Mar 27, 2025
- Kokusai Electric Corporation
- Tomoki IMAMURA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Opaque Thermal Layer for Silicon Carbide Substrates
- Publication number 20250079186
- Publication date Mar 6, 2025
- Yi ZHENG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
DIAMOND-LIKE CARBON GAP FILL
- Publication number 20250046599
- Publication date Feb 6, 2025
- Applied Materials, Inc.
- Jialiang WANG
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
METHODS OF FILLING TRENCHES ON SUBSTRATE SURFACE
- Publication number 20250037994
- Publication date Jan 30, 2025
- ASM IP HOLDING B.V.
- Yoshio Susa
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Low Resistance and High Reliability Metallization Module
- Publication number 20250029874
- Publication date Jan 23, 2025
- Applied Materials, Inc.
- Roey Shaviv
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PLASMA-ENHANCED CHEMICAL VAPOR DEPOSITION OF CARBON HARD-MASK
- Publication number 20250022709
- Publication date Jan 16, 2025
- Applied Materials, Inc.
- Byung Seok KWON
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
SYSTEM AND METHOD FOR CARBON PLUG FORMATION
- Publication number 20240420927
- Publication date Dec 19, 2024
- LAM RESEARCH CORPORATION
- Daniela ANJOS RIGSBY
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SELECTIVE CARBON DEPOSITION ON TOP AND BOTTOM SURFACES OF SEMICONDU...
- Publication number 20240420948
- Publication date Dec 19, 2024
- Applied Materials, Inc.
- Abhijeet S. Bagal
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SPIN ON CARBON COMPOSITION AND METHOD OF MANUFACTURING A SEMICONDUC...
- Publication number 20240395539
- Publication date Nov 28, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Jing Hong HUANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
HIGH ETCH SELECTIVITY, LOW STRESS ASHABLE CARBON HARD MASK
- Publication number 20240395542
- Publication date Nov 28, 2024
- LAM RESEARCH CORPORATION
- Jun XUE
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
SEMICONDUCTOR DEVICE HAVING AN EXTRA LOW-K DIELECTRIC LAYER AND MET...
- Publication number 20240371769
- Publication date Nov 7, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Po-Cheng SHIH
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
AMORPHOUS CARBON FOR GAP FILL
- Publication number 20240363332
- Publication date Oct 31, 2024
- Applied Materials, Inc.
- Xiaoquan Min
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
METHOD FOR DEPOSITING AMORPHOUS CARBON FILM
- Publication number 20240347335
- Publication date Oct 17, 2024
- TES CO., LTD.
- Kwang-Ki Kim
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
SEMICONDUCTOR SUBSTRATE AND METHOD FOR MANUFACTURING THE SAME
- Publication number 20240332081
- Publication date Oct 3, 2024
- ROHM CO., LTD.
- Makoto TAKAMURA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
DOPING BY MOLECULAR LAYER DEPOSITION
- Publication number 20240332014
- Publication date Oct 3, 2024
- Applied Materials, Inc.
- Xinke Wang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SUBSTRATE PROCESSING METHOD AND SUBSTRATE PROCESSING APPARATUS
- Publication number 20240304436
- Publication date Sep 12, 2024
- TOKYO ELECTRON LIMITED
- Miyako KANEKO
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...

the material being carbon

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Throughput improvements for low-temperature/beol-compatible highly...

Method of manufacturing semiconductor device

Methods to reduce UNCD film roughness

Eliminating yield impact of stochastics in lithography

Selective etch of a substrate

Carbon based depositions used for critical dimension control during...

Three-dimensional field effect device

Long-term implantable electronic devices

Carbon film deposition method and deposition apparatus

Processing chamber deposition confinement

Dual RF for controllable film deposition

Low resistance and high reliability metallization module

Spin on carbon composition and method of manufacturing a semiconduc...

Plasma-enhanced chemical vapor deposition of carbon hard-mask

Selective carbon deposition on top and bottom surfaces of semicondu...

Method for manufacturing mask structure, semiconductor structure an...

Highly etch selective amorphous carbon film

Method of using dual frequency RF power in a process chamber

High etch selectivity, low stress ashable carbon hard mask

Semiconductor device having an extra low-k dielectric layer and met...

Amorphous carbon for gap fill

Gate spacer structure and method of forming same

Forming a protective layer to prevent formation of leakage paths

Technologies for high aspect ratio carbon etching with inserted cha...

Flim forming method of carbon-containing film by microwave plasma

Highly etch selective amorphous carbon film

Method and device for forming graphene structure

Metal-doped carbon hardmasks

Semiconductor structure and manufacturing method thereof

Adhesion layers for EUV lithography

Patents Applicationslast 30 patents

METHODS FOR PROTECTING A PERIPHERAL EDGE AND BACKSIDE OF A SEMICOND...

Fabrication and processing of graphene electronic devices on Silico...

ENCAPSULATED FLEXIBLE ELECTRONICS FOR LONG-TERM IMPLANTATION

INTEGRATED CIRCUIT AND MANUFACTURING METHOD THEREOF

UNIFORM GAPFILL DEPOSITION ON SEMICONDUCTOR SUBSTRATES WITH VARYING...

FILM FORMING METHOD AND FILM FORMING APPARATUS

CARBON BASED DEPOSITIONS USED FOR CRITICAL DIMENSION CONTROL DURING...

FILM FORMING METHOD AND FILM FORMING APPARATUS

SUBTRATE PROCESSING METHOD AND SUBSTRATE PROCESSING APPARATUS

DEPOSITION OF CARBON GAPFILL MATERIALS

SUBSTRATE PROCESSING METHOD AND SUBSTRATE PROCESSING APPARATUS

METHOD FOR PROCESSING SUBSTRATE

PROCESSING CHAMBER DEPOSITION CONFINEMENT

METHOD OF FORMING CARBON-CONTAINING FILM

METHOD OF PROCESSING SUBSTRATE, METHOD OF MANUFACTURING SEMICONDUCT...

Opaque Thermal Layer for Silicon Carbide Substrates

DIAMOND-LIKE CARBON GAP FILL

METHODS OF FILLING TRENCHES ON SUBSTRATE SURFACE

Low Resistance and High Reliability Metallization Module

PLASMA-ENHANCED CHEMICAL VAPOR DEPOSITION OF CARBON HARD-MASK

SYSTEM AND METHOD FOR CARBON PLUG FORMATION

SELECTIVE CARBON DEPOSITION ON TOP AND BOTTOM SURFACES OF SEMICONDU...

SPIN ON CARBON COMPOSITION AND METHOD OF MANUFACTURING A SEMICONDUC...

HIGH ETCH SELECTIVITY, LOW STRESS ASHABLE CARBON HARD MASK

SEMICONDUCTOR DEVICE HAVING AN EXTRA LOW-K DIELECTRIC LAYER AND MET...

AMORPHOUS CARBON FOR GAP FILL

METHOD FOR DEPOSITING AMORPHOUS CARBON FILM

SEMICONDUCTOR SUBSTRATE AND METHOD FOR MANUFACTURING THE SAME

DOPING BY MOLECULAR LAYER DEPOSITION

SUBSTRATE PROCESSING METHOD AND SUBSTRATE PROCESSING APPARATUS