the material containing silicon

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H01L21/02123

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HELECTRICITY H01Electric elements H01LSEMICONDUCTOR DEVICES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR H01L21/00Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof

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H01L21/02123the material containing silicon

Industries

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Patents Grantslast 30 patents

Information Patent Grant
Method for manufacturing semiconductor device and substrate process...
- Patent number 12,191,140
- Issue date Jan 7, 2025
- Tokyo Electron Limited
- Yutaka Motoyama
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Sequential plasma and thermal treatment
- Patent number 12,142,475
- Issue date Nov 12, 2024
- Applied Materials, Inc.
- Ning Li
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Method for manufacturing semiconductor device and substrate process...
- Patent number 12,131,947
- Issue date Oct 29, 2024
- Tokyo Electron Limited
- Yutaka Motoyama
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Method for forming film and processing apparatus
- Patent number 12,112,943
- Issue date Oct 8, 2024
- Tokyo Electron Limited
- Keita Kumagai
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Selective silicon deposition
- Patent number 12,106,972
- Issue date Oct 1, 2024
- Applied Materials, Inc.
- Yifeng Zhou
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Processes for depositing sib films
- Patent number 12,033,848
- Issue date Jul 9, 2024
- Applied Materials, Inc.
- Aykut Aydin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Cyclic plasma processing
- Patent number 11,961,735
- Issue date Apr 16, 2024
- Tokyo Electron Limited
- Yun Han
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Substrate processing apparatus and method of manufacturing semicond...
- Patent number 11,952,664
- Issue date Apr 9, 2024
- Kokusai Electric Corporation
- Hidenari Yoshida
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Methods of manufacturing an integrated circuit having stress tuning...
- Patent number 11,935,842
- Issue date Mar 19, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Shin-Puu Jeng
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of manufacturing semiconductor device, substrate processing...
- Patent number 11,923,188
- Issue date Mar 5, 2024
- Kokusai Electric Corporation
- Takeo Hanashima
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Semiconductor device pre-cleaning
- Patent number 11,915,976
- Issue date Feb 27, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd
- Li-Wei Chu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Barrier-free approach for forming contact plugs
- Patent number 11,901,229
- Issue date Feb 13, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd
- Ching-Yi Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
FinFET device having oxide region between vertical fin structures
- Patent number 11,894,275
- Issue date Feb 6, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Kuo-Cheng Ching
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Stress patterning systems and methods for manufacturing free-form d...
- Patent number 11,879,170
- Issue date Jan 23, 2024
- Massachusetts Institute of Technology
- Youwei Yao
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Composition for forming silicon-containing resist underlayer film r...
- Patent number 11,815,815
- Issue date Nov 14, 2023
- Nissan Chemical Industries, Ltd.
- Hiroyuki Wakayama
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
PECVD apparatus for in-situ deposition of film stacks
- Patent number 11,746,420
- Issue date Sep 5, 2023
- Novellus Systems, Inc.
- Pramod Subramonium
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Low resistance composite silicon-based electrode
- Patent number 11,721,801
- Issue date Aug 8, 2023
- International Business Machines Corporation, Armonk
- John Collins
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Substrate processing method and substrate processing apparatus
- Patent number 11,694,890
- Issue date Jul 4, 2023
- Tokyo Electron Limited
- Kiwamu Ito
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
High resistivity single crystal silicon ingot and wafer having impr...
- Patent number 11,655,559
- Issue date May 23, 2023
- GlobalWafers Co., Ltd.
- Soubir Basak
- C30 - CRYSTAL GROWTH
Information Patent Grant
High resistivity single crystal silicon ingot and wafer having impr...
- Patent number 11,655,560
- Issue date May 23, 2023
- GlobalWafers Co., Ltd.
- Soubir Basak
- C30 - CRYSTAL GROWTH
Information Patent Grant
Flowable film formation and treatments
- Patent number 11,615,966
- Issue date Mar 28, 2023
- Applied Materials, Inc.
- Shishi Jiang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Target object processing method and plasma processing apparatus
- Patent number 11,610,766
- Issue date Mar 21, 2023
- Tokyo Electron Limited
- Seiji Yokoyama
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and fabrication method thereof
- Patent number 11,588,051
- Issue date Feb 21, 2023
- Semiconductor Manufacturing International (Shanghai) Corporation
- Fei Zhou
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Substrate processing apparatus and method of manufacturing semicond...
- Patent number 11,542,601
- Issue date Jan 3, 2023
- Hitachi Kokusai Electric Inc.
- Hidenari Yoshida
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Epitaxy substrate and method of manufacturing the same
- Patent number 11,538,681
- Issue date Dec 27, 2022
- GlobalWafers Co., Ltd.
- Ying-Ru Shih
- C30 - CRYSTAL GROWTH
Information Patent Grant
Composition for forming silica layer, manufacturing method for sili...
- Patent number 11,518,909
- Issue date Dec 6, 2022
- Samsung SDI Co., Ltd.
- Kunbae Noh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Integrated epitaxial metal electrodes
- Patent number 11,495,670
- Issue date Nov 8, 2022
- IQE PLC
- Rodney Pelzel
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Methods for gapfill in high aspect ratio structures
- Patent number 11,488,856
- Issue date Nov 1, 2022
- Applied Materials, Inc.
- Pramit Manna
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for making semiconductor device by adopting stress memorizat...
- Patent number 11,443,986
- Issue date Sep 13, 2022
- Shanghai Huali Integrated Circuit Corporation
- Weiwei Ma
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Trench isolation process
- Patent number 11,443,976
- Issue date Sep 13, 2022
- Taiwan Semiconductor Manufacturing Company, Ltd
- Chung-Lei Chen
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
SILICON CARBIDE DEVICE
- Publication number 20250006814
- Publication date Jan 2, 2025
- INFINEON TECHNOLOGIES AG
- Wolfgang LEHNERT
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PROCESSES FOR DEPOSITING SIB FILMS
- Publication number 20240339316
- Publication date Oct 10, 2024
- Applied Materials, Inc.
- Aykut AYDIN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND METHOD FOR FABRICATING THE SAME
- Publication number 20240339331
- Publication date Oct 10, 2024
- UNITED MICROELECTRONICS CORP.
- Chung-Fu Chang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD OF PROCESSING SUBSTRATE, METHOD OF MANUFACTURING SEMICONDUCT...
- Publication number 20240254625
- Publication date Aug 1, 2024
- Kokusai Electric Corporation
- Kimihiko NAKATANI
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
METHODS FOR FORMING SEMICONDUCTOR DEVICES USING MODIFIED PHOTOMASK...
- Publication number 20240222118
- Publication date Jul 4, 2024
- TOKYO ELECTRON LIMITED
- Peng WANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD AND STRUCTURE FOR FINFET DEVICE
- Publication number 20240178070
- Publication date May 30, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Kuo-Cheng Ching
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PROCESSING METHOD, METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE, PR...
- Publication number 20240170276
- Publication date May 23, 2024
- Kokusai Electric Corporation
- Takeo HANASHIMA
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
MULTILAYER STACKING WAFER BONDING STRUCTURE AND METHOD OF MANUFACTU...
- Publication number 20240162035
- Publication date May 16, 2024
- Powerchip Semiconductor Manufacturing Corporation
- Shou-Zen Chang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR CLEANING USING PLASMA-FREE PRECURSORS
- Publication number 20240145230
- Publication date May 2, 2024
- Applied Materials, Inc.
- Abhishek Mandal
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Substrate with Differing Dielectric Constants
- Publication number 20240145392
- Publication date May 2, 2024
- Avago Technologies International Sales Pte. Limited
- Dharmendra Saraswat
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Barrier-Free Approach for Forming Contact Plugs
- Publication number 20240136227
- Publication date Apr 25, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Ching-Yi Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE PRE-CLEANING
- Publication number 20240136226
- Publication date Apr 25, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Li-Wei CHU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
DIELECTRIC ON DIELECTRIC SELECTIVE DEPOSITION USING ANILINE PASSIVA...
- Publication number 20240120195
- Publication date Apr 11, 2024
- Applied Materials, Inc.
- Keith T. Wong
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
FILM FORMING METHOD
- Publication number 20230420249
- Publication date Dec 28, 2023
- TOKYO ELECTRON LIMITED
- Shota CHIDA
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
METHOD FOR MANUFACTURING SEMICONDUCTOR DEVICE
- Publication number 20230411322
- Publication date Dec 21, 2023
- KIOXIA Corporation
- Hiroaki ASHIDATE
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICES AND METHODS OF FORMING THE SAME
- Publication number 20230402278
- Publication date Dec 14, 2023
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Yan-Ming Tsai
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PECVD APPARATUS FOR IN-SITU DEPOSITION OF FILM STACKS
- Publication number 20230366094
- Publication date Nov 16, 2023
- Novellus Systems, Inc.
- Jason Dirk Haverkamp
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
SILICON-AND-CARBON-CONTAINING MATERIALS WITH LOW DIELECTRIC CONSTANTS
- Publication number 20230360906
- Publication date Nov 9, 2023
- Applied Materials, Inc.
- Zeqing Shen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
LARGE AREA GAPFILL USING VOLUMETRIC EXPANSION
- Publication number 20230360903
- Publication date Nov 9, 2023
- Applied Materials, Inc.
- Supriya Ghosh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ORGANIC VAPOR JET PRINTING SYSTEM
- Publication number 20230269994
- Publication date Aug 24, 2023
- UNIVERSAL DISPLAY CORPORATION
- William E. QUINN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD FOR ACTIVATING AN EXPOSED LAYER
- Publication number 20230207311
- Publication date Jun 29, 2023
- Commissariat A L'Energie Atomique et Aux Energies Alternatives
- Pierre BRIANCEAU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
COMPOSITE SUBSTRATE AND PRODUCTION METHOD THEREFOR
- Publication number 20230207307
- Publication date Jun 29, 2023
- Shin-Etsu Chemical Co., Ltd.
- Shoji AKIYAMA
- C30 - CRYSTAL GROWTH
Information Patent Application
GaN POWER DEVICE
- Publication number 20230115017
- Publication date Apr 13, 2023
- LX Semicon Co., Ltd.
- Jang Hyun YOON
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SUBSTRATE PROCESSING APPARATUS AND METHOD OF MANUFACTURING SEMICOND...
- Publication number 20230109474
- Publication date Apr 6, 2023
- Hitachi Kokusai Electric Inc.
- Hidenari YOSHIDA
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
SUBSTRATE PROCESSING METHOD AND SUBSTRATE PROCESSING SYSTEM
- Publication number 20230094053
- Publication date Mar 30, 2023
- TOKYO ELECTRON LIMITED
- Yuichiro WAGATSUMA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PROCESSES FOR DEPOSITING SIB FILMS
- Publication number 20220406594
- Publication date Dec 22, 2022
- Applied Materials, Inc.
- Aykut AYDIN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CYCLIC PLASMA PROCESSING
- Publication number 20220392765
- Publication date Dec 8, 2022
- TOKYO ELECTRON LIMITED
- Yun Han
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
TRENCH ISOLATION PROCESS
- Publication number 20220392799
- Publication date Dec 8, 2022
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chung-Lei CHEN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD FOR MANUFACTURING SEMICONDUCTOR DEVICE AND SUBSTRATE PROCESS...
- Publication number 20220384184
- Publication date Dec 1, 2022
- TOKYO ELECTRON LIMITED
- Yutaka MOTOYAMA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Method and Structure for FinFET Device
- Publication number 20220359307
- Publication date Nov 10, 2022
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Kuo-Cheng Ching
- H01 - BASIC ELECTRIC ELEMENTS

the material containing silicon

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Method for manufacturing semiconductor device and substrate process...

Sequential plasma and thermal treatment

Method for manufacturing semiconductor device and substrate process...

Method for forming film and processing apparatus

Selective silicon deposition

Processes for depositing sib films

Cyclic plasma processing

Substrate processing apparatus and method of manufacturing semicond...

Methods of manufacturing an integrated circuit having stress tuning...

Method of manufacturing semiconductor device, substrate processing...

Semiconductor device pre-cleaning

Barrier-free approach for forming contact plugs

FinFET device having oxide region between vertical fin structures

Stress patterning systems and methods for manufacturing free-form d...

Composition for forming silicon-containing resist underlayer film r...

PECVD apparatus for in-situ deposition of film stacks

Low resistance composite silicon-based electrode

Substrate processing method and substrate processing apparatus

High resistivity single crystal silicon ingot and wafer having impr...

High resistivity single crystal silicon ingot and wafer having impr...

Flowable film formation and treatments

Target object processing method and plasma processing apparatus

Semiconductor device and fabrication method thereof

Substrate processing apparatus and method of manufacturing semicond...

Epitaxy substrate and method of manufacturing the same

Composition for forming silica layer, manufacturing method for sili...

Integrated epitaxial metal electrodes

Methods for gapfill in high aspect ratio structures

Method for making semiconductor device by adopting stress memorizat...

Trench isolation process

Patents Applicationslast 30 patents

SILICON CARBIDE DEVICE

PROCESSES FOR DEPOSITING SIB FILMS

SEMICONDUCTOR DEVICE AND METHOD FOR FABRICATING THE SAME

METHOD OF PROCESSING SUBSTRATE, METHOD OF MANUFACTURING SEMICONDUCT...

METHODS FOR FORMING SEMICONDUCTOR DEVICES USING MODIFIED PHOTOMASK...

METHOD AND STRUCTURE FOR FINFET DEVICE

PROCESSING METHOD, METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE, PR...

MULTILAYER STACKING WAFER BONDING STRUCTURE AND METHOD OF MANUFACTU...

SEMICONDUCTOR CLEANING USING PLASMA-FREE PRECURSORS

Substrate with Differing Dielectric Constants

Barrier-Free Approach for Forming Contact Plugs

SEMICONDUCTOR DEVICE PRE-CLEANING

DIELECTRIC ON DIELECTRIC SELECTIVE DEPOSITION USING ANILINE PASSIVA...

FILM FORMING METHOD

METHOD FOR MANUFACTURING SEMICONDUCTOR DEVICE

SEMICONDUCTOR DEVICES AND METHODS OF FORMING THE SAME

PECVD APPARATUS FOR IN-SITU DEPOSITION OF FILM STACKS

SILICON-AND-CARBON-CONTAINING MATERIALS WITH LOW DIELECTRIC CONSTANTS

LARGE AREA GAPFILL USING VOLUMETRIC EXPANSION

ORGANIC VAPOR JET PRINTING SYSTEM

METHOD FOR ACTIVATING AN EXPOSED LAYER

COMPOSITE SUBSTRATE AND PRODUCTION METHOD THEREFOR

GaN POWER DEVICE

SUBSTRATE PROCESSING APPARATUS AND METHOD OF MANUFACTURING SEMICOND...

SUBSTRATE PROCESSING METHOD AND SUBSTRATE PROCESSING SYSTEM

PROCESSES FOR DEPOSITING SIB FILMS

CYCLIC PLASMA PROCESSING

TRENCH ISOLATION PROCESS

METHOD FOR MANUFACTURING SEMICONDUCTOR DEVICE AND SUBSTRATE PROCESS...

Method and Structure for FinFET Device