the material containing tantalum

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H01L21/0215

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HELECTRICITY H01Electric elements H01LSEMICONDUCTOR DEVICES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR H01L21/00Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof

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H01L21/0215the material containing tantalum

Industries

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Patents Grantslast 30 patents

Information Patent Grant
Contact structure for semiconductor device and method
- Patent number 12,166,078
- Issue date Dec 10, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd
- Yan-Ming Tsai
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of manufacturing semiconductor devices and semiconductor dev...
- Patent number 12,142,682
- Issue date Nov 12, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd
- Chandrashekhar Prakash Savant
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electrode formation
- Patent number 12,046,658
- Issue date Jul 23, 2024
- Micron Technology, Inc.
- An-Jen B. Cheng
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Cobalt fill for gate structures
- Patent number 11,996,328
- Issue date May 28, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd
- Chung-Liang Cheng
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
P-type dipole for P-FET
- Patent number 11,996,455
- Issue date May 28, 2024
- Applied Materials, Inc.
- Yongjing Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor Fin cutting process and structures formed thereby
- Patent number 11,990,375
- Issue date May 21, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd
- Shih-Wen Huang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor structure and its formation method
- Patent number 11,978,624
- Issue date May 7, 2024
- CHANGXIN MEMORY TECHNOLOGIES, INC.
- Jiang Chu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of manufacturing semiconductor device, substrate processing...
- Patent number 11,967,500
- Issue date Apr 23, 2024
- Kokusai Electric Corporation
- Arito Ogawa
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Semiconductor device having cut gate dielectric
- Patent number 11,901,237
- Issue date Feb 13, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd
- Chang-Yun Chang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device having improved overlay shift tolerance
- Patent number 11,664,237
- Issue date May 30, 2023
- Taiwan Semiconductor Manufacturing Co., Ltd
- Chien-Hua Huang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
P-type dipole for p-FET
- Patent number 11,658,218
- Issue date May 23, 2023
- Applied Materials, Inc.
- Yongjing Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of manufacturing semiconductor device, substrate processing...
- Patent number 11,562,905
- Issue date Jan 24, 2023
- Kokusai Electric Corporation
- Motomu Degai
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Cobalt fill for gate structures
- Patent number 11,501,999
- Issue date Nov 15, 2022
- Taiwan Semiconductor Manufacturing Co., Ltd
- Chung-Liang Cheng
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Plasma enhanced deposition processes for controlled formation of me...
- Patent number 11,501,965
- Issue date Nov 15, 2022
- ASM IP Holding B.V.
- Lingyun Jia
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for forming semiconductor device
- Patent number 11,437,278
- Issue date Sep 6, 2022
- Taiwan Semiconductor Manufacturing Co., Ltd
- Chang-Yun Chang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor fin cutting process and structures formed thereby
- Patent number 11,380,593
- Issue date Jul 5, 2022
- Taiwan Semiconductor Manufacturing Co., Ltd
- Shih-Wen Huang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Contact structure for semiconductor device and method
- Patent number 11,335,774
- Issue date May 17, 2022
- Taiwan Semiconductor Manufacturing Company, Ltd
- Yan-Ming Tsai
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
P-type dipole for p-FET
- Patent number 11,289,579
- Issue date Mar 29, 2022
- Applied Materials, Inc.
- Yongjing Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of manufacturing semiconductor devices using a capping layer...
- Patent number 11,081,584
- Issue date Aug 3, 2021
- Taiwan Semiconductor Manufacturing Co., Ltd
- Chandrashekhar Prakash Savant
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Compound semiconductor and manufacturing method thereof
- Patent number 11,001,504
- Issue date May 11, 2021
- LG Chem, Ltd.
- Jae-Ki Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of forming semiconductor device and semiconductor device
- Patent number 10,879,074
- Issue date Dec 29, 2020
- Taiwan Semiconductor Manufacturing Co., Ltd
- Shu-Uei Jang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Selective removal of an etching stop layer for improving overlay sh...
- Patent number 10,867,805
- Issue date Dec 15, 2020
- Taiwan Semiconductor Manufacturing Co., Ltd
- Chien-Hua Huang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor Fin cutting process and structures formed thereby
- Patent number 10,777,466
- Issue date Sep 15, 2020
- Taiwan Semiconductor Manufacturing Co., Ltd
- Shih-Wen Huang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device having a metal gate and formation method thereof
- Patent number 10,741,450
- Issue date Aug 11, 2020
- Taiwan Semiconductor Manufacturing Co., Ltd
- Chang-Yun Chang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of manufacturing semiconductor device, substrate processing...
- Patent number 10,734,218
- Issue date Aug 4, 2020
- Kokusai Electric Corporation
- Arito Ogawa
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of forming semiconductor structure and semiconductor device
- Patent number 10,672,613
- Issue date Jun 2, 2020
- Taiwan Semiconductor Manufacturing Co., Ltd
- Shu-Uei Jang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Tantalum compound
- Patent number 10,651,031
- Issue date May 12, 2020
- Samsung Electronics Co., Ltd.
- Seung-min Ryu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Capacitor, method for manufacturing same, and wireless communicatio...
- Patent number 10,636,866
- Issue date Apr 28, 2020
- Toray Industries, Inc.
- Hiroji Shimizu
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Interface engineering for high capacitance capacitor for liquid cry...
- Patent number 10,381,454
- Issue date Aug 13, 2019
- PATTERSON + SHERIDAN LLP
- Xuena Zhang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Titanium compound based hard mask films
- Patent number 10,347,488
- Issue date Jul 9, 2019
- Applied Materials, Inc.
- Rui Cheng
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
METHOD OF MANUFACTURING SEMICONDUCTOR DEVICES AND SEMICONDUCTOR DEV...
- Publication number 20240387734
- Publication date Nov 21, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chandrashekhar Prakash SAVANT
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
COBALT FILL FOR GATE STRUCTURES
- Publication number 20240312837
- Publication date Sep 19, 2024
- Taiwan Semiconductor Manufacturing Co., LTD
- Chung-Liang Cheng
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor Fin Cutting Process and Structures Formed Thereby
- Publication number 20240282638
- Publication date Aug 22, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Shih-Wen Huang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE HAVING CUT GATE DIELECTRIC
- Publication number 20240213097
- Publication date Jun 27, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Chang-Yun CHANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
BARRIER LAYER FOR PREVENTING ALUMINUM DIFFUSION
- Publication number 20230377879
- Publication date Nov 23, 2023
- Applied Materials, Inc.
- Srinivas Gandikota
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
P-TYPE DIPOLE FOR P-FET
- Publication number 20230253466
- Publication date Aug 10, 2023
- Applied Materials, Inc.
- Yongjing Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
NH RADICAL THERMAL NITRIDATION TO FORM METAL SILICON NITRIDE FILMS
- Publication number 20230178365
- Publication date Jun 8, 2023
- Applied Materials, Inc.
- Wei Liu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE HAVING CUT GATE DIELECTRIC
- Publication number 20220359302
- Publication date Nov 10, 2022
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Chang-Yun CHANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Cobalt Fill for Gate Structures
- Publication number 20220359283
- Publication date Nov 10, 2022
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Chung-Liang CHENG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor Fin Cutting Process and Structures Formed Thereby
- Publication number 20220328360
- Publication date Oct 13, 2022
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Shih-Wen Huang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CONTACT STRUCTURE FOR SEMICONDUCTOR DEVICE AND METHOD
- Publication number 20220278199
- Publication date Sep 1, 2022
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Yan-Ming Tsai
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
FILM FORMATION METHOD AND FILM FORMATION DEVICE
- Publication number 20220181144
- Publication date Jun 9, 2022
- TOKYO ELECTRON LIMITED
- Yumiko KAWANO
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
P-Type Dipole For P-FET
- Publication number 20220165854
- Publication date May 26, 2022
- Applied Materials, Inc.
- Yongjing Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR STRUCTURE AND ITS FORMATION METHOD
- Publication number 20220084818
- Publication date Mar 17, 2022
- CHANGXIN MEMORY TECHNOLOGIES, INC
- Jiang CHU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD OF MANUFACTURING SEMICONDUCTOR DEVICES AND SEMICONDUCTOR DEV...
- Publication number 20220059684
- Publication date Feb 24, 2022
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chandrashekhar Prakash SAVANT
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELECTROSTATIC CHUCK AND MANUFACTURING METHOD THEREFOR
- Publication number 20210249260
- Publication date Aug 12, 2021
- KSM COMPONENT CO., LTD
- Yun Ho KIM
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CONTACT STRUCTURE FOR SEMICONDUCTOR DEVICE AND METHOD
- Publication number 20210118994
- Publication date Apr 22, 2021
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Yan-Ming Tsai
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
P-Type Dipole For P-FET
- Publication number 20210098581
- Publication date Apr 1, 2021
- Applied Materials, Inc.
- Yongjing Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELECTRODE FORMATION
- Publication number 20210013318
- Publication date Jan 14, 2021
- Micron Technology, Inc.
- An-Jen B. Cheng
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor Fin Cutting Process and Structures Formed Thereby
- Publication number 20200411386
- Publication date Dec 31, 2020
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Shih-Wen Huang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD FOR FORMING SEMICONDUCTOR DEVICE
- Publication number 20200365465
- Publication date Nov 19, 2020
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Chang-Yun CHANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE, SUBSTRATE PROCESSING...
- Publication number 20200335328
- Publication date Oct 22, 2020
- Kokusai Electric Corporation
- Arito OGAWA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD OF FORMING SEMICONDUCTOR DEVICE AND SEMICONDUCTOR DEVICE
- Publication number 20200294804
- Publication date Sep 17, 2020
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Shu-Uei JANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE, SUBSTRATE PROCESSING...
- Publication number 20200219727
- Publication date Jul 9, 2020
- Kokusai Electric Corporation
- Motomu DEGAI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD OF MANUFACTURING SEMICONDUCTOR DEVICES AND SEMICONDUCTOR DEV...
- Publication number 20200135915
- Publication date Apr 30, 2020
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Chandrashekhar Prakash SAVANT
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Cobalt Fill for Gate Structures
- Publication number 20200105594
- Publication date Apr 2, 2020
- Taiwan Semiconductor Manufacturing Co., LTD
- Chung-Liang CHENG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Selective Removal of an Etching Stop Layer for Improving Overlay Sh...
- Publication number 20200006083
- Publication date Jan 2, 2020
- Taiwan Semiconductor Manufacturing Co., LTD
- Chien-Hua Huang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR STRUCTURE CUTTING PROCESS AND STRUCTURES FORMED THEREBY
- Publication number 20190164844
- Publication date May 30, 2019
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Shih-Wen HUANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND FORMATION METHOD THEREOF
- Publication number 20190164838
- Publication date May 30, 2019
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Chang-Yun CHANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD OF FORMING SEMICONDUCTOR STRUCTURE AND SEMICONDUCTOR DEVICE
- Publication number 20190157090
- Publication date May 23, 2019
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Shu-Uei JANG
- H01 - BASIC ELECTRIC ELEMENTS

the material containing tantalum

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Contact structure for semiconductor device and method

Method of manufacturing semiconductor devices and semiconductor dev...

Electrode formation

Cobalt fill for gate structures

P-type dipole for P-FET

Semiconductor Fin cutting process and structures formed thereby

Semiconductor structure and its formation method

Method of manufacturing semiconductor device, substrate processing...

Semiconductor device having cut gate dielectric

Semiconductor device having improved overlay shift tolerance

P-type dipole for p-FET

Method of manufacturing semiconductor device, substrate processing...

Cobalt fill for gate structures

Plasma enhanced deposition processes for controlled formation of me...

Method for forming semiconductor device

Semiconductor fin cutting process and structures formed thereby

Contact structure for semiconductor device and method

P-type dipole for p-FET

Method of manufacturing semiconductor devices using a capping layer...

Compound semiconductor and manufacturing method thereof

Method of forming semiconductor device and semiconductor device

Selective removal of an etching stop layer for improving overlay sh...

Semiconductor Fin cutting process and structures formed thereby

Semiconductor device having a metal gate and formation method thereof

Method of manufacturing semiconductor device, substrate processing...

Method of forming semiconductor structure and semiconductor device

Tantalum compound

Capacitor, method for manufacturing same, and wireless communicatio...

Interface engineering for high capacitance capacitor for liquid cry...

Titanium compound based hard mask films

Patents Applicationslast 30 patents

METHOD OF MANUFACTURING SEMICONDUCTOR DEVICES AND SEMICONDUCTOR DEV...

COBALT FILL FOR GATE STRUCTURES

Semiconductor Fin Cutting Process and Structures Formed Thereby

SEMICONDUCTOR DEVICE HAVING CUT GATE DIELECTRIC

BARRIER LAYER FOR PREVENTING ALUMINUM DIFFUSION

P-TYPE DIPOLE FOR P-FET

NH RADICAL THERMAL NITRIDATION TO FORM METAL SILICON NITRIDE FILMS

SEMICONDUCTOR DEVICE HAVING CUT GATE DIELECTRIC

Cobalt Fill for Gate Structures

Semiconductor Fin Cutting Process and Structures Formed Thereby

CONTACT STRUCTURE FOR SEMICONDUCTOR DEVICE AND METHOD

FILM FORMATION METHOD AND FILM FORMATION DEVICE

P-Type Dipole For P-FET

SEMICONDUCTOR STRUCTURE AND ITS FORMATION METHOD

METHOD OF MANUFACTURING SEMICONDUCTOR DEVICES AND SEMICONDUCTOR DEV...

ELECTROSTATIC CHUCK AND MANUFACTURING METHOD THEREFOR

CONTACT STRUCTURE FOR SEMICONDUCTOR DEVICE AND METHOD

P-Type Dipole For P-FET

ELECTRODE FORMATION

Semiconductor Fin Cutting Process and Structures Formed Thereby

METHOD FOR FORMING SEMICONDUCTOR DEVICE

METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE, SUBSTRATE PROCESSING...

METHOD OF FORMING SEMICONDUCTOR DEVICE AND SEMICONDUCTOR DEVICE

METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE, SUBSTRATE PROCESSING...

METHOD OF MANUFACTURING SEMICONDUCTOR DEVICES AND SEMICONDUCTOR DEV...

Cobalt Fill for Gate Structures

Selective Removal of an Etching Stop Layer for Improving Overlay Sh...

SEMICONDUCTOR STRUCTURE CUTTING PROCESS AND STRUCTURES FORMED THEREBY

SEMICONDUCTOR DEVICE AND FORMATION METHOD THEREOF

METHOD OF FORMING SEMICONDUCTOR STRUCTURE AND SEMICONDUCTOR DEVICE