TREA

the metal substrate being covered by an organic insulating layer

Follow

Industry

  • CPC
  • H05K1/056
This industry / category may be too specific. Please go to a parent level for more data

Parent Industries

HELECTRICITY H05Electric techniques H05KPRINTED CIRCUITS CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS H05K1/00Printed circuits

Current Industry

H05K1/056the metal substrate being covered by an organic insulating layer
Industries

Patents Grantslast 30 patents

Patents Applicationslast 30 patents

  • Information Patent Application

    METHOD AND SYSTEM FOR PROVIDING ILLUMINATING OBJECTS WITHIN SUBSTRATE
    • Publication number 20240349424
    • Publication date Oct 17, 2024
    • John Simonetti
    • H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
  • Information Patent Application

    CIRCUIT BOARD AND MANUFACTURING METHOD THEREOF
    • Publication number 20240306292
    • Publication date Sep 12, 2024
    • Samsung Electro-Mechanics Co., Ltd.
    • Kyehwan Lee
    • H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
  • Information Patent Application

    COMPONENT MOUNTING BOARD
    • Publication number 20240292532
    • Publication date Aug 29, 2024
    • NIPPON MEKTRON, LTD.
    • Azumi TOMINAGA
    • H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
  • Information Patent Application

    Method for preparing novel material layer structure of circuit boar...
    • Publication number 20240284599
    • Publication date Aug 22, 2024
    • LongKai LI
    • H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
  • Information Patent Application

    CIRCUIT BOARD, MANUFACTURING METHOD, AND DISPLAY MODULE
    • Publication number 20240284608
    • Publication date Aug 22, 2024
    • HongQiSheng Precision Electronics (QinHuangDao) Co., Ltd.
    • Gang Yuan
    • H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
  • Information Patent Application

    METHOD OF MANUFACTURING ELECTRONIC DEVICE
    • Publication number 20240237224
    • Publication date Jul 11, 2024
    • SAMSUNG DISPLAY CO., LTD.
    • SHINYA ONOUE
    • H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
  • Information Patent Application

    WIRING BOARD UNIT AND METHOD FOR DESIGNING THE SAME
    • Publication number 20240224421
    • Publication date Jul 4, 2024
    • TOPPAN Holdings Inc.
    • Ryoma TANABE
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Application

    ROLL FILM, METHOD FOR PRODUCING ROLL FILM, METHOD FOR PRODUCING COP...
    • Publication number 20240199829
    • Publication date Jun 20, 2024
    • AGC Inc.
    • Seigo KOTERA
    • B29 - WORKING OF PLASTICS WORKING OF SUBSTANCES IN A PLASTIC STATE, IN GENERAL
  • Information Patent Application

    WIRING BOARD
    • Publication number 20240206051
    • Publication date Jun 20, 2024
    • Murata Manufacturing Co., Ltd.
    • Kaori KOIZUMI
    • H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
  • Information Patent Application

    PRINTED CIRCUIT BOARD
    • Publication number 20240196528
    • Publication date Jun 13, 2024
    • Samsung Electro-Mechanics Co., Ltd.
    • Sangik CHO
    • H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
  • Information Patent Application

    RESIN COMPOSITION AND USES THEREOF
    • Publication number 20240150567
    • Publication date May 9, 2024
    • TAIWAN UNION TECHNOLOGY CORPORATION
    • JEN-CHI CHIANG
    • B32 - LAYERED PRODUCTS
  • Information Patent Application

    METHOD OF MANUFACTURING ELECTRONIC DEVICE
    • Publication number 20240138072
    • Publication date Apr 25, 2024
    • SAMSUNG DISPLAY CO., LTD.
    • SHINYA ONOUE
    • H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
  • Information Patent Application

    POLYIMIDE RESIN COMPOSITION AND METAL BASE SUBSTRATE
    • Publication number 20240117119
    • Publication date Apr 11, 2024
    • MITSUBISHI MATERIALS CORPORATION
    • Shintaro Hara
    • C08 - ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-...
  • Information Patent Application

    RESIN COMPOSITION, COPPER FOIL WITH RESIN, AND PRINTED WIRING BOARD
    • Publication number 20240101858
    • Publication date Mar 28, 2024
    • Mitsui Mining and Smelting Co., Ltd.
    • Kazuhiro OOSAWA
    • C08 - ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-...
  • Information Patent Application

    COATING COMPOSITION AND LAMINATE
    • Publication number 20240093052
    • Publication date Mar 21, 2024
    • DAIKIN INDUSTRIES, LTD.
    • Yuki UEDA
    • C09 - DYES PAINTS POLISHES NATURAL RESINS ADHESIVES MISCELLANEOUS COMPOSITION...
  • Information Patent Application

    WIRING CIRCUIT BOARD
    • Publication number 20240090128
    • Publication date Mar 14, 2024
    • Nitto Denko Corporation
    • Yusaku TAMAKI
    • H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
  • Information Patent Application

    COATING COMPOSITION AND LAMINATE
    • Publication number 20240084158
    • Publication date Mar 14, 2024
    • DAIKIN INDUSTRIES, LTD.
    • Yuki UEDA
    • H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
  • Information Patent Application

    WIRING CIRCUIT BOARD
    • Publication number 20240008178
    • Publication date Jan 4, 2024
    • Nitto Denko Corporation
    • Shusaku SHIBATA
    • H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
  • Information Patent Application

    RESIN COMPOSITION AND METAL CLAD SUBSTRATE
    • Publication number 20240002653
    • Publication date Jan 4, 2024
    • ITEQ CORPORATION
    • SHENG-YEN WU
    • C08 - ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-...
  • Information Patent Application

    SUBSTRATE STRUCTURE
    • Publication number 20230422411
    • Publication date Dec 28, 2023
    • Subtron Technology Co., Ltd.
    • Chung Ying Lu
    • H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
  • Information Patent Application

    CIRCUIT BOARD
    • Publication number 20230269872
    • Publication date Aug 24, 2023
    • LG Innotek Co., Ltd.
    • Yong Suk KIM
    • H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
  • Information Patent Application

    RESIN COATED COPPER AND CIRCUIT BOARD INCLUDING THE SAME
    • Publication number 20230240008
    • Publication date Jul 27, 2023
    • LG Innotek Co., Ltd.
    • Jeong Han KIM
    • B32 - LAYERED PRODUCTS
  • Information Patent Application

    CIRCUIT BOARD
    • Publication number 20230199954
    • Publication date Jun 22, 2023
    • Avary Holding (Shenzhen) Co., Limited.
    • LIN-JIE GAO
    • H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
  • Information Patent Application

    WIRING CIRCUIT BOARD
    • Publication number 20230156914
    • Publication date May 18, 2023
    • Nitto Denko Corporation
    • Yoshito FUJIMURA
    • H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
  • Information Patent Application

    CIRCUIT PART AND METHOD OF MANUFACTURING CIRCUIT PART
    • Publication number 20230136337
    • Publication date May 4, 2023
    • MAXELL, LTD.
    • Akiko KITO
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Application

    ELECTRONIC DEVICE AND CIRCUIT BOARD MODULE THEREOF
    • Publication number 20230132928
    • Publication date May 4, 2023
    • CHICONY ELECTRONICS CO., LTD.
    • Chien-Yueh Chen
    • H04 - ELECTRIC COMMUNICATION TECHNIQUE
  • Information Patent Application

    CIRCUIT BOARD
    • Publication number 20230119237
    • Publication date Apr 20, 2023
    • LG Innotek Co., Ltd.
    • Dong Hwa LEE
    • H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
  • Information Patent Application

    METAL BASE SUBSTRATE, ELECTRONIC COMPONENT MOUNTING SUBSTRATE
    • Publication number 20230111128
    • Publication date Apr 13, 2023
    • MITSUBISHI MATERIALS CORPORATION
    • Fumiaki Ishikawa
    • H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
  • Information Patent Application

    METAL BASE SUBSTRATE
    • Publication number 20230110469
    • Publication date Apr 13, 2023
    • MITSUBISHI MATERIALS CORPORATION
    • Fumiaki Ishikawa
    • H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
  • Information Patent Application

    COPPER BASE SUBSTRATE
    • Publication number 20230105989
    • Publication date Apr 6, 2023
    • MITSUBISHI MATERIALS CORPORATION
    • Fumiaki Ishikawa
    • H01 - BASIC ELECTRIC ELEMENTS