the mould cavity walls being lined with a film

Industry

CPC
B29C2045/14663

This industry / category may be too specific. Please go to a parent level for more data

Parent Industries

BPERFORMING OPERATIONS TRANSPORTING B29Plastic substance processing B29CSHAPING OR JOINING OF PLASTICS SHAPING OF SUBSTANCES IN A PLASTIC STATE, IN GENERAL AFTER-TREATMENT OF THE SHAPED PRODUCTS

Current Industry

B29C2045/14663the mould cavity walls being lined with a film

Industries

Patents Grantslast 30 patents

Information Patent Grant
Method for manufacturing resin molded product
- Patent number 11,992,982
- Issue date May 28, 2024
- Towa Corporation
- Yoshito Okunishi
- B29 - WORKING OF PLASTICS WORKING OF SUBSTANCES IN A PLASTIC STATE, IN GENERAL
Information Patent Grant
Method for manufacturing resin molded product
- Patent number 11,969,922
- Issue date Apr 30, 2024
- Towa Corporation
- Yoshito Okunishi
- B29 - WORKING OF PLASTICS WORKING OF SUBSTANCES IN A PLASTIC STATE, IN GENERAL
Information Patent Grant
Method for manufacturing an electronic assembly and an electronic a...
- Patent number 11,292,166
- Issue date Apr 5, 2022
- TACTOTEK OY
- Anne Isohätälä
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for manufacturing an electronic assembly and an electronic a...
- Patent number 11,285,645
- Issue date Mar 29, 2022
- TACTOTEK OY
- Anne Isohätälä
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Process for producing package for mounting a semiconductor element...
- Patent number 10,913,183
- Issue date Feb 9, 2021
- AGC Inc.
- Wataru Kasai
- B29 - WORKING OF PLASTICS WORKING OF SUBSTANCES IN A PLASTIC STATE, IN GENERAL
Information Patent Grant
Mould, moulding apparatus and method for controlled overmoulding of...
- Patent number 10,913,191
- Issue date Feb 9, 2021
- Besi Netherlands B.V.
- Johannes Lambertus Gerardus Maria Venrooij
- B29 - WORKING OF PLASTICS WORKING OF SUBSTANCES IN A PLASTIC STATE, IN GENERAL
Information Patent Grant
Electronic assembly
- Patent number 10,653,004
- Issue date May 12, 2020
- TACTOTEK OY
- Mikko Heikkinen
- B29 - WORKING OF PLASTICS WORKING OF SUBSTANCES IN A PLASTIC STATE, IN GENERAL
Information Patent Grant
Heat conductive insulating sheet, power module, and manufacturing m...
- Patent number 10,177,068
- Issue date Jan 8, 2019
- Mitsubishi Electric Corporation
- Kenji Mimura
- B29 - WORKING OF PLASTICS WORKING OF SUBSTANCES IN A PLASTIC STATE, IN GENERAL
Information Patent Grant
Wafer-level molding chase design
- Patent number 10,020,211
- Issue date Jul 10, 2018
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chen-Hua Yu
- B29 - WORKING OF PLASTICS WORKING OF SUBSTANCES IN A PLASTIC STATE, IN GENERAL
Information Patent Grant
Semiconductor encapsulation system comprising a vacuum pump and a r...
- Patent number 9,947,561
- Issue date Apr 17, 2018
- ASM Technology Singapore Pte. Ltd.
- Teng Hock Kuah
- B29 - WORKING OF PLASTICS WORKING OF SUBSTANCES IN A PLASTIC STATE, IN GENERAL
Information Patent Grant
Method for moulding and surface processing electronic components an...
- Patent number 9,831,105
- Issue date Nov 28, 2017
- Besi Netherlands B.V.
- Wilhelmus Gerardus Jozef Gal
- B29 - WORKING OF PLASTICS WORKING OF SUBSTANCES IN A PLASTIC STATE, IN GENERAL
Information Patent Grant
Mold release film and method of process for producing a semiconduct...
- Patent number 9,306,135
- Issue date Apr 5, 2016
- Asahi Glass Company, Limited
- Wataru Kasai
- B29 - WORKING OF PLASTICS WORKING OF SUBSTANCES IN A PLASTIC STATE, IN GENERAL
Information Patent Grant
Semiconductor device including an insulating layer and heat sink pl...
- Patent number 8,872,325
- Issue date Oct 28, 2014
- PS4 Luxco S.A.R.L.
- Yuji Watanabe
- B29 - WORKING OF PLASTICS WORKING OF SUBSTANCES IN A PLASTIC STATE, IN GENERAL
Information Patent Grant
Method for the manufacture of an optoelectronic component and an op...
- Patent number 8,435,806
- Issue date May 7, 2013
- Osram Opto Semiconductors GmbH
- Harald Jaeger
- B29 - WORKING OF PLASTICS WORKING OF SUBSTANCES IN A PLASTIC STATE, IN GENERAL
Information Patent Grant
Optical device for reducing disturbance light and manufacturing met...
- Patent number 7,939,901
- Issue date May 10, 2011
- Panasonic Corporation
- Masanori Minamio
- B29 - WORKING OF PLASTICS WORKING OF SUBSTANCES IN A PLASTIC STATE, IN GENERAL
Information Patent Grant
Method of fabricating a molded package for micromechanical devices
- Patent number 6,858,910
- Issue date Feb 22, 2005
- Texas Instruments Incorporated
- Anthony L. Coyle
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Resin molding machine and resin tablet feeding machine
- Patent number 6,814,556
- Issue date Nov 9, 2004
- Apic Yamada Corporation
- Junji Hirano
- B29 - WORKING OF PLASTICS WORKING OF SUBSTANCES IN A PLASTIC STATE, IN GENERAL
Information Patent Grant
Method of resin molding
- Patent number 6,770,236
- Issue date Aug 3, 2004
- Apic Yamada Corp.
- Fumio Miyajima
- B29 - WORKING OF PLASTICS WORKING OF SUBSTANCES IN A PLASTIC STATE, IN GENERAL
Information Patent Grant
Resin molding machine and method of resin molding
- Patent number 6,743,389
- Issue date Jun 1, 2004
- Apic Yamada Corporation
- Fumio Miyajima
- B29 - WORKING OF PLASTICS WORKING OF SUBSTANCES IN A PLASTIC STATE, IN GENERAL
Information Patent Grant
Method for molding semiconductor components
- Patent number 6,652,799
- Issue date Nov 25, 2003
- Micron Technology, Inc.
- Toh Kok Seng
- B29 - WORKING OF PLASTICS WORKING OF SUBSTANCES IN A PLASTIC STATE, IN GENERAL
Information Patent Grant
Method of fabricating a molded package for micromechanical devices
- Patent number 6,489,178
- Issue date Dec 3, 2002
- Texas Instruments Incorporated
- Anthony L. Coyle
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Resin molding machine
- Patent number 6,478,562
- Issue date Nov 12, 2002
- Apic Yamada Corp.
- Fumio Miyajima
- B29 - WORKING OF PLASTICS WORKING OF SUBSTANCES IN A PLASTIC STATE, IN GENERAL
Information Patent Grant
Apparatus for sealing a semiconductor device utilizing a release film
- Patent number 6,459,159
- Issue date Oct 1, 2002
- Apic Yamada Corporation
- Tsutomu Miyagawa
- B29 - WORKING OF PLASTICS WORKING OF SUBSTANCES IN A PLASTIC STATE, IN GENERAL
Information Patent Grant
Method of resin molding
- Patent number 6,444,157
- Issue date Sep 3, 2002
- Apic Yamada Corporation
- Fumio Miyajima
- B29 - WORKING OF PLASTICS WORKING OF SUBSTANCES IN A PLASTIC STATE, IN GENERAL
Information Patent Grant
Apparatus for molding semiconductor components
- Patent number 6,439,869
- Issue date Aug 27, 2002
- Micron Technology, Inc.
- Toh Kok Seng
- B29 - WORKING OF PLASTICS WORKING OF SUBSTANCES IN A PLASTIC STATE, IN GENERAL
Information Patent Grant
Resin molding machine
- Patent number 6,350,113
- Issue date Feb 26, 2002
- Apic Yamada Corporation
- Fumio Miyajima
- B29 - WORKING OF PLASTICS WORKING OF SUBSTANCES IN A PLASTIC STATE, IN GENERAL
Information Patent Grant
Method of resin-encapsulating semiconductor chip and mold-releasing...
- Patent number 6,284,565
- Issue date Sep 4, 2001
- Nitto Denko Corporation
- Toshimitsu Tachibana
- B29 - WORKING OF PLASTICS WORKING OF SUBSTANCES IN A PLASTIC STATE, IN GENERAL
Information Patent Grant
Resin sealing method for a semiconductor device
- Patent number 6,261,501
- Issue date Jul 17, 2001
- Apic Yamada Corporation
- Tsutomu Miyagawa
- B29 - WORKING OF PLASTICS WORKING OF SUBSTANCES IN A PLASTIC STATE, IN GENERAL
Information Patent Grant
Resin sealing device for chip-size packages
- Patent number 6,224,360
- Issue date May 1, 2001
- Apic Yamada Corporation
- Fumio Miyajima
- B29 - WORKING OF PLASTICS WORKING OF SUBSTANCES IN A PLASTIC STATE, IN GENERAL
Information Patent Grant
Method of resin molding
- Patent number 6,187,243
- Issue date Feb 13, 2001
- Apic Yamada Corporation
- Fumio Miyajima
- B29 - WORKING OF PLASTICS WORKING OF SUBSTANCES IN A PLASTIC STATE, IN GENERAL

Patents Applicationslast 30 patents

Information Patent Application
INJECTION-MOLDING METHOD AND LIQUID CONTAINER FOR A MOTOR VEHICLE
- Publication number 20200206993
- Publication date Jul 2, 2020
- KAUTEX TEXTRON GmbH & Co. KG
- Roman BOUFFIER
- B29 - WORKING OF PLASTICS WORKING OF SUBSTANCES IN A PLASTIC STATE, IN GENERAL
Information Patent Application
PROCESS FOR PRODUCING PACKAGE FOR MOUNTING A SEMICONDUCTOR ELEMENT...
- Publication number 20160368176
- Publication date Dec 22, 2016
- Asahi Glass Company, Limited
- Wataru KASAI
- B32 - LAYERED PRODUCTS
Information Patent Application
MOLD RELEASE FILM, PROCESS FOR ITS PRODUCTION AND PROCESS FOR PRODU...
- Publication number 20160368177
- Publication date Dec 22, 2016
- Asahi Glass Company, Limited
- Wataru KASAI
- B32 - LAYERED PRODUCTS
Information Patent Application
MOLD RELEASE FILM AND PROCESS FOR PRODUCING SEALED BODY
- Publication number 20160368175
- Publication date Dec 22, 2016
- Asahi Glass Company, Limited
- Wataru KASAI
- B32 - LAYERED PRODUCTS
Information Patent Application
WAFER-LEVEL MOLDING CHASE DESIGN
- Publication number 20150364456
- Publication date Dec 17, 2015
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chen-Hua Yu
- B29 - WORKING OF PLASTICS WORKING OF SUBSTANCES IN A PLASTIC STATE, IN GENERAL
Information Patent Application
MOLD RELEASE FILM AND METHOD OF PROCESS FOR PRODUCING A SEMICONDUCT...
- Publication number 20140335634
- Publication date Nov 13, 2014
- Asahi Glass Company, Limited
- Wataru KASAI
- B29 - WORKING OF PLASTICS WORKING OF SUBSTANCES IN A PLASTIC STATE, IN GENERAL
Information Patent Application
Semiconductor device and method of manufacturing the same
- Publication number 20120098115
- Publication date Apr 26, 2012
- Elpida Memory, Inc.
- Yuji Watanabe
- B29 - WORKING OF PLASTICS WORKING OF SUBSTANCES IN A PLASTIC STATE, IN GENERAL
Information Patent Application
Method for the Manufacture of an Optoelectronic Component and an Op...
- Publication number 20100193815
- Publication date Aug 5, 2010
- Harald Jaeger
- B29 - WORKING OF PLASTICS WORKING OF SUBSTANCES IN A PLASTIC STATE, IN GENERAL
Information Patent Application
METHOD OF RESIN ENCAPSULATION MOLDING FOR ELECTRONIC PART
- Publication number 20090291532
- Publication date Nov 26, 2009
- Shinji Takase
- B29 - WORKING OF PLASTICS WORKING OF SUBSTANCES IN A PLASTIC STATE, IN GENERAL
Information Patent Application
OPTICAL DEVICE AND MANUFACTURING METHOD THEREOF
- Publication number 20090097139
- Publication date Apr 16, 2009
- Masanori Minamio
- B29 - WORKING OF PLASTICS WORKING OF SUBSTANCES IN A PLASTIC STATE, IN GENERAL
Information Patent Application
Resin sealing and molding method of electronic component
- Publication number 20070085237
- Publication date Apr 19, 2007
- TOWA CORPORATION
- Yohei Onishi
- B29 - WORKING OF PLASTICS WORKING OF SUBSTANCES IN A PLASTIC STATE, IN GENERAL
Information Patent Application
Method of fabricating a molded package for micromechanical devices
- Publication number 20030045025
- Publication date Mar 6, 2003
- Anthony L. Coyle
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
Method for molding semiconductor components
- Publication number 20020056942
- Publication date May 16, 2002
- Toh Kok Seng
- B29 - WORKING OF PLASTICS WORKING OF SUBSTANCES IN A PLASTIC STATE, IN GENERAL
Information Patent Application
Method of resin molding and resin molding machine
- Publication number 20020025352
- Publication date Feb 28, 2002
- Fumio Miyajima
- B29 - WORKING OF PLASTICS WORKING OF SUBSTANCES IN A PLASTIC STATE, IN GENERAL
Information Patent Application
Resin sealing method and resin sealing apparatus
- Publication number 20020017738
- Publication date Feb 14, 2002
- APIC YAMADA CORPORATION
- Fumio Miyajima
- B29 - WORKING OF PLASTICS WORKING OF SUBSTANCES IN A PLASTIC STATE, IN GENERAL
Information Patent Application
Resin molding machine and method of resin molding
- Publication number 20020015748
- Publication date Feb 7, 2002
- Fumio Miyajima
- B29 - WORKING OF PLASTICS WORKING OF SUBSTANCES IN A PLASTIC STATE, IN GENERAL
Information Patent Application
Resin molding machine and resin tablet feeding machine
- Publication number 20010033876
- Publication date Oct 25, 2001
- Junji Hirano
- B29 - WORKING OF PLASTICS WORKING OF SUBSTANCES IN A PLASTIC STATE, IN GENERAL
Information Patent Application
Method of fabricating a molded package for micromechanical devices
- Publication number 20010034083
- Publication date Oct 25, 2001
- Anthony L. Coyle
- B81 - MICRO-STRUCTURAL TECHNOLOGY

the mould cavity walls being lined with a film

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Method for manufacturing resin molded product

Method for manufacturing resin molded product

Method for manufacturing an electronic assembly and an electronic a...

Method for manufacturing an electronic assembly and an electronic a...

Process for producing package for mounting a semiconductor element...

Mould, moulding apparatus and method for controlled overmoulding of...

Electronic assembly

Heat conductive insulating sheet, power module, and manufacturing m...

Wafer-level molding chase design

Semiconductor encapsulation system comprising a vacuum pump and a r...

Method for moulding and surface processing electronic components an...

Mold release film and method of process for producing a semiconduct...

Semiconductor device including an insulating layer and heat sink pl...

Method for the manufacture of an optoelectronic component and an op...

Optical device for reducing disturbance light and manufacturing met...

Method of fabricating a molded package for micromechanical devices

Resin molding machine and resin tablet feeding machine

Method of resin molding

Resin molding machine and method of resin molding

Method for molding semiconductor components

Method of fabricating a molded package for micromechanical devices

Resin molding machine

Apparatus for sealing a semiconductor device utilizing a release film

Method of resin molding

Apparatus for molding semiconductor components

Resin molding machine

Method of resin-encapsulating semiconductor chip and mold-releasing...

Resin sealing method for a semiconductor device

Resin sealing device for chip-size packages

Method of resin molding

Patents Applicationslast 30 patents

INJECTION-MOLDING METHOD AND LIQUID CONTAINER FOR A MOTOR VEHICLE

PROCESS FOR PRODUCING PACKAGE FOR MOUNTING A SEMICONDUCTOR ELEMENT...

MOLD RELEASE FILM, PROCESS FOR ITS PRODUCTION AND PROCESS FOR PRODU...

MOLD RELEASE FILM AND PROCESS FOR PRODUCING SEALED BODY

WAFER-LEVEL MOLDING CHASE DESIGN

MOLD RELEASE FILM AND METHOD OF PROCESS FOR PRODUCING A SEMICONDUCT...

Semiconductor device and method of manufacturing the same

Method for the Manufacture of an Optoelectronic Component and an Op...

METHOD OF RESIN ENCAPSULATION MOLDING FOR ELECTRONIC PART

OPTICAL DEVICE AND MANUFACTURING METHOD THEREOF

Resin sealing and molding method of electronic component

Method of fabricating a molded package for micromechanical devices

Method for molding semiconductor components

Method of resin molding and resin molding machine

Resin sealing method and resin sealing apparatus

Resin molding machine and method of resin molding

Resin molding machine and resin tablet feeding machine

Method of fabricating a molded package for micromechanical devices