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the patterned circuits being prefabricated circuits, which are not yet attached to a permanent insulating substrate
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ELECTRICITY
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PRINTED CIRCUITS CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
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Printed circuits
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H05K1/187
the patterned circuits being prefabricated circuits, which are not yet attached to a permanent insulating substrate
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last 30 patents
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Electrical device, interlayer ply including an electrical device an...
Patent number
11,812,557
Issue date
Nov 7, 2023
Pilkington Group Limited
Stephen Roland Day
H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
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Patent Grant
Circuit board structure and method for manufacturing a circuit boar...
Patent number
11,792,941
Issue date
Oct 17, 2023
IMBERATEK, LLC
Risto Tuominen
H01 - BASIC ELECTRIC ELEMENTS
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Patent Grant
Chip on film package structure and method for reading a code-includ...
Patent number
11,576,263
Issue date
Feb 7, 2023
Novatek Microelectronics Corp.
Te-Hsien Kuo
H01 - BASIC ELECTRIC ELEMENTS
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Manufacturing method of an integrated driving module with energy co...
Patent number
11,495,379
Issue date
Nov 8, 2022
PHOENIX PIONEER TECHNOLOGY CO., LTD.
Wen-Hung Hu
H01 - BASIC ELECTRIC ELEMENTS
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Patent Grant
Circuit board structure and method for manufacturing a circuit boar...
Patent number
11,134,572
Issue date
Sep 28, 2021
IMBERATEK, LLC
Risto Tuominen
H01 - BASIC ELECTRIC ELEMENTS
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Patent Grant
Module-embedded multilayer circuit board and method for manufacturi...
Patent number
10,993,328
Issue date
Apr 27, 2021
HongQiSheng Precision Electronics (QinHuangDao) Co., Ltd.
Chih-Chieh Fu
H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
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Patent Grant
Interactive core for electronic cards
Patent number
10,970,612
Issue date
Apr 6, 2021
FITEQ, INC.
Michael Scruggs
G06 - COMPUTING CALCULATING COUNTING
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Substrate-embedded electronic component
Patent number
10,932,368
Issue date
Feb 23, 2021
SAMSUNG ELECTRO-MECHANICS CO., LTD.
Ha Yong Jung
H01 - BASIC ELECTRIC ELEMENTS
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Copper foil with carrier, production method for same, production me...
Patent number
10,886,146
Issue date
Jan 5, 2021
Mitsui Mining & Smelting Co., Ltd.
Yoshinori Matsuura
B32 - LAYERED PRODUCTS
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Component carrier with alternatingly vertically stacked layer struc...
Patent number
10,834,831
Issue date
Nov 10, 2020
AT&S (China) Co. Ltd.
Mikael Tuominen
H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
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Patent Grant
Electronic component embedded printed circuit board and method of m...
Patent number
10,779,414
Issue date
Sep 15, 2020
SAMSUNG ELECTRO-MECHANICS CO., LTD.
Ho-Sik Park
H01 - BASIC ELECTRIC ELEMENTS
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Circuit board and method for manufacturing the same
Patent number
10,772,217
Issue date
Sep 8, 2020
HongQiSheng Precision Electronics (QinHuangDao) Co., Ltd.
Lin-Jie Gao
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Patent Grant
Integrated driving module with energy conversion function and manuf...
Patent number
10,707,000
Issue date
Jul 7, 2020
PHOENIX & CORPORATION
Wen-Hung Hu
H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
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Patent Grant
Circuit board and method for manufacturing the same
Patent number
10,616,992
Issue date
Apr 7, 2020
Unimicron Technology Corp.
Yin-Ju Chen
G06 - COMPUTING CALCULATING COUNTING
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Patent Grant
Polymer film stencil process for fan-out wafer-level packaging of s...
Patent number
10,617,010
Issue date
Apr 7, 2020
Brewer Science, Inc.
Tony D. Flaim
H01 - BASIC ELECTRIC ELEMENTS
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Patent Grant
Circuit board and method for manufacturing the same
Patent number
9,883,598
Issue date
Jan 30, 2018
Unimicron Technology Corp.
Yin-Ju Chen
G06 - COMPUTING CALCULATING COUNTING
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Electronic device and method for manufacturing the same
Patent number
9,706,643
Issue date
Jul 11, 2017
PANASONIC INTELLECTUAL PROPERTY MANAGEMENT CO., LTD.
Tomoko Iwama
H01 - BASIC ELECTRIC ELEMENTS
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Package carrier and manufacturing method thereof
Patent number
9,668,351
Issue date
May 30, 2017
Subtron Technology Co., Ltd.
Chao-Min Wang
H01 - BASIC ELECTRIC ELEMENTS
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Method for manufacturing a circuit board structure
Patent number
9,622,354
Issue date
Apr 11, 2017
GE Embedded Electronics Oy
Risto Tuominen
H01 - BASIC ELECTRIC ELEMENTS
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Wiring substrate and light emitting device
Patent number
9,590,154
Issue date
Mar 7, 2017
Shinko Electric Industries Co., Ltd.
Yasuyoshi Horikawa
H01 - BASIC ELECTRIC ELEMENTS
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Element embedded printed circuit board and method of manufacturing...
Patent number
9,578,749
Issue date
Feb 21, 2017
SAMSUNG ELECTRO-MECHANICS CO., LTD.
Jung-Hyun Cho
H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information
Patent Grant
Multilayer wiring board for an electronic device
Patent number
9,521,755
Issue date
Dec 13, 2016
Invensas Corporation
Tomoo Iijima
H01 - BASIC ELECTRIC ELEMENTS
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Patent Grant
Printed wiring board and method for manufacturing printed wiring board
Patent number
9,391,044
Issue date
Jul 12, 2016
Ibiden Co., Ltd.
Keisuke Shimizu
H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information
Patent Grant
Flexible display device manufacturing method and carrier substrate...
Patent number
9,293,291
Issue date
Mar 22, 2016
Samsung Display Co., Ltd.
Dong-Min Lee
B32 - LAYERED PRODUCTS
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Method for integrating an electronic component into a printed circu...
Patent number
9,253,888
Issue date
Feb 2, 2016
AT & S Austria Technologie & Systemtechnik Aktiengesellschaft
Gerald Weidinger
F16 - ENGINEERING ELEMENTS AND UNITS GENERAL MEASURES FOR PRODUCING AND MAINT...
Information
Patent Grant
Method of fabricating packaging substrate having a passive element...
Patent number
9,232,665
Issue date
Jan 5, 2016
Unimicron Technology Corporation
Shih-Ping Hsu
H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
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Patent Grant
Brushless motor
Patent number
9,219,392
Issue date
Dec 22, 2015
Asmo Co., Ltd.
Yoshimichi Sahara
H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
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Patent Grant
Semiconductor device having a semiconductor chip mounted on an insu...
Patent number
9,153,541
Issue date
Oct 6, 2015
Cypress Semiconductor Corporation
Junji Tanaka
H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
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Patent Grant
Component built-in wiring board and manufacturing method of compone...
Patent number
8,987,901
Issue date
Mar 24, 2015
Dai Nippon Printing Co., Ltd.
Kenji Sasaoka
H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information
Patent Grant
Fabricating method of embedded package structure
Patent number
8,943,683
Issue date
Feb 3, 2015
Unimicron Technology Corp.
Tsung-Yuan Chen
H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Patents Applications
last 30 patents
Information
Patent Application
Circuit board structure and method for manufacturing a circuit boar...
Publication number
20210392752
Publication date
Dec 16, 2021
ImberaTek LLC
Risto Tuominen
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
ELECTRICAL DEVICE, INTERLAYER PLY INCLUDING AN ELECTRICAL DEVICE AN...
Publication number
20210329787
Publication date
Oct 21, 2021
PILKINGTON GROUP LIMITED
Stephen Roland DAY
H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information
Patent Application
MODULE-EMBEDDED MULTILAYER CIRCUIT BOARD AND METHOD FOR MANUFACTURI...
Publication number
20210037653
Publication date
Feb 4, 2021
HongQiSheng Precision Electronics (QinHuangDao) Co., Ltd.
CHIH-CHIEH FU
H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
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Patent Application
INTEGRATED DRIVING MODULE WITH ENERGY CONVERSION FUNCTION AND MANUF...
Publication number
20200279683
Publication date
Sep 3, 2020
PHOENIX & CORPORATION
Wen-Hung Hu
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
CHIP ON FILM PACKAGE STRUCTURE AND METHOD FOR READING A CODE-INCLUD...
Publication number
20200214136
Publication date
Jul 2, 2020
NOVATEK MICROELECTRONICS CORP.
Te-Hsien Kuo
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
Interactive Core for Electronic Cards
Publication number
20200125911
Publication date
Apr 23, 2020
Fiteq, Inc.
Michael Scruggs
G06 - COMPUTING CALCULATING COUNTING
Information
Patent Application
INTEGRATED DRIVING MODULE WITH ENERGY CONVERSION FUNCTION AND MANUF...
Publication number
20200075211
Publication date
Mar 5, 2020
PHOENIX & CORPORATION
Wen-Hung Hu
H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information
Patent Application
CIRCUIT BOARD AND METHOD FOR MANUFACTURING THE SAME
Publication number
20180116056
Publication date
Apr 26, 2018
Unimicron Technology Corp.
Yin-Ju CHEN
G06 - COMPUTING CALCULATING COUNTING
Information
Patent Application
POLYMER FILM STENCIL PROCESS FOR FAN-OUT WAFER-LEVEL PACKAGING OF S...
Publication number
20180063963
Publication date
Mar 1, 2018
BREWER SCIENCE INC.
Tony D. Flaim
H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information
Patent Application
THIN FILM COMPONENT SHEET, BOARD WITH BUILT-IN ELECTRONIC COMPONENT...
Publication number
20170290165
Publication date
Oct 5, 2017
TDK Corporation
Hitoshi SAITA
H01 - BASIC ELECTRIC ELEMENTS
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Patent Application
METHOD OF FABRICATING PACKAGING SUBSTRATE HAVING A PASSIVE ELEMENT...
Publication number
20140345125
Publication date
Nov 27, 2014
Shih-Ping Hsu
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
PACKAGING SUBSTRATE HAVING A PASSIVE ELEMENT EMBEDDED THEREIN
Publication number
20140345930
Publication date
Nov 27, 2014
Shih-Ping Hsu
H01 - BASIC ELECTRIC ELEMENTS
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Patent Application
METHOD OF FABRICATING PACKAGING SUBSTRATE HAVING A PASSIVE ELEMENT...
Publication number
20140345126
Publication date
Nov 27, 2014
Shih-Ping Hsu
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
MULTILAYER WIRING BOARD FOR AN ELECTRONIC DEVICE
Publication number
20140240934
Publication date
Aug 28, 2014
Invensas Corporation
Tomoo Iijima
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
FLAT WIRING MEMBER AND MANUFACTURING METHOD THEREOF
Publication number
20140204544
Publication date
Jul 24, 2014
Hitachi Metals, Ltd.
Kotaro TANAKA
H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
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Patent Application
Circuit board structure and method for manufacturing a circuit boar...
Publication number
20140059851
Publication date
Mar 6, 2014
Imbera Electronics Oy
Risto Tuominen
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
FLEXIBLE DISPLAY DEVICE MANUFACTURING METHOD AND CARRIER SUBSTRATE...
Publication number
20140065916
Publication date
Mar 6, 2014
SAMSUNG DISPLAY CO., LTD.
Dong-Min Lee
B32 - LAYERED PRODUCTS
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Patent Application
BRUSHLESS MOTOR
Publication number
20140042848
Publication date
Feb 13, 2014
ASMO CO., LTD
Yoshimichi SAHARA
H02 - GENERATION CONVERSION OR DISTRIBUTION OF ELECTRIC POWER
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Patent Application
FABRICATING METHOD OF EMBEDDED PACKAGE STRUCTURE
Publication number
20140033526
Publication date
Feb 6, 2014
Unimicron Technology Corp.
Tsung-Yuan Chen
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
METHOD FOR INTEGRATING AN ELECTRONIC COMPONENT INTO A PRINTED CIRCU...
Publication number
20140000941
Publication date
Jan 2, 2014
AT & S AUSTRIA TECHNOLOGIE & SYSTEMTECHNIK AKTIENGESELLSCHAFT
Gerald Weidinger
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
PRINTED CIRCUIT BOARD AND METHOD OF MANUFACTURING PRINTED CIRCUIT B...
Publication number
20130286615
Publication date
Oct 31, 2013
Yasushi Inagaki
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
MULTILAYER WIRING BOARD FOR AN ELECTRONIC DEVICE
Publication number
20130247372
Publication date
Sep 26, 2013
Invensas Corporation
Tomoo Iijima
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
COMPONENT BUILT-IN WIRING BOARD AND MANUFACTURING METHOD OF COMPONE...
Publication number
20130082370
Publication date
Apr 4, 2013
DAI NIPPON PRINTING CO., LTD.
Kenji Sasaoka
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
SEMICONDUCTOR ELEMENT-EMBEDDED SUBSTRATE, AND METHOD OF MANUFACTURI...
Publication number
20130009325
Publication date
Jan 10, 2013
NEC Corporation
Kentaro Mori
H01 - BASIC ELECTRIC ELEMENTS
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Patent Application
METHOD OF FORMING HOLE FOR INTERLAYER CONNECTION CONDUCTOR, METHOD...
Publication number
20120321814
Publication date
Dec 20, 2012
Murata Manufacturing Co., Ltd.
Yasuyuki SEKIMOTO
H01 - BASIC ELECTRIC ELEMENTS
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Patent Application
Semiconductor Device and Method of Forming the Device Using Sacrifi...
Publication number
20120217634
Publication date
Aug 30, 2012
STATS ChipPAC, Ltd.
Il Kwon Shim
H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
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Patent Application
METHOD OF MANUFACTURING ELECTRONIC COMPONENT EMBEDDED CIRCUIT BOARD
Publication number
20120134125
Publication date
May 31, 2012
SAMSUNG ELECTRO-MECHANICS CO., LTD.
Byoung-Chan KIM
H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information
Patent Application
PACKAGING SUBSTRATE HAVING A PASSIVE ELEMENT EMBEDDED THEREIN AND M...
Publication number
20120037404
Publication date
Feb 16, 2012
Unimicron Technology Corporation
Shih- Ping Hsu
Y02 - TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMA...
Information
Patent Application
PRINTED CIRCUIT BOARD AND METHOD OF MANUFACTURING PRINTED CIRCUIT B...
Publication number
20120006469
Publication date
Jan 12, 2012
IBIDEN CO., LTD.
Yasushi Inagaki
Y02 - TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMA...
Information
Patent Application
ELECTRICAL DEVICE HAVING BOARDLESS ELECTRICAL COMPONENT MOUNTING AR...
Publication number
20110146068
Publication date
Jun 23, 2011
INNOTEC, CORP.
Thomas J. Veenstra
B29 - WORKING OF PLASTICS WORKING OF SUBSTANCES IN A PLASTIC STATE, IN GENERAL