the processing being the formation of vias or contact holes

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HELECTRICITY H01Electric elements H01LSEMICONDUCTOR DEVICES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR H01L21/00Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof

Current Industry

H01L21/02063the processing being the formation of vias or contact holes

Industries

Patents Grantslast 30 patents

Information Patent Grant
Semiconductor structure and manufacturing method thereof
- Patent number 12,142,485
- Issue date Nov 12, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd
- Hung-Pin Chang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Methods for forming recesses in source/drain regions and devices fo...
- Patent number 12,132,089
- Issue date Oct 29, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd
- Yu-Lien Huang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Via-first process for connecting a contact and a gate electrode
- Patent number 12,125,743
- Issue date Oct 22, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd
- Chao-Hsun Wang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and cleaning system
- Patent number 12,106,975
- Issue date Oct 1, 2024
- CHANGXIN MEMORY TECHNOLOGIES, INC.
- Chao Guo
- B08 - CLEANING
Information Patent Grant
Abatement and strip process chamber in a load lock configuration
- Patent number 12,094,715
- Issue date Sep 17, 2024
- Applied Materials, Inc.
- Martin Jeffrey Salinas
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor structure
- Patent number 12,087,834
- Issue date Sep 10, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd
- Shih-Wen Huang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of detecting photoresist scum, method of forming semiconduct...
- Patent number 12,080,609
- Issue date Sep 3, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd
- Hung-Jui Kuo
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Transistor structure with air gap and method of fabricating the same
- Patent number 12,040,224
- Issue date Jul 16, 2024
- United Microelectronics Corp.
- Yunfei Li
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Soft ashing process for forming protective layer on conductive cap...
- Patent number 12,033,860
- Issue date Jul 9, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd
- Guan-Xuan Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for metal gate surface clean
- Patent number 11,996,283
- Issue date May 28, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd
- Shich-Chang Suen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of manufacturing semiconductor device
- Patent number 11,990,347
- Issue date May 21, 2024
- Kokusai Electric Corporation
- Takashi Yahata
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Schottky barrier diode with reduced leakage current and method of f...
- Patent number 11,984,490
- Issue date May 14, 2024
- Taiwan Semiconductor Manufacturing Company Ltd.
- Meng-Han Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Aqueous and semi-aqueous cleaners for the removal of post-etch resi...
- Patent number 11,978,622
- Issue date May 7, 2024
- Entegris, Inc.
- Lingyan Song
- C11 - ANIMAL AND VEGETABLE OILS, FATS, FATTY SUBSTANCES AND WAXES FATTY ACIDS...
Information Patent Grant
Forming contact holes with controlled local critical dimension unif...
- Patent number 11,978,631
- Issue date May 7, 2024
- Tokyo Electron Limited
- Junling Sun
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Self-aligned barrier for metal vias
- Patent number 11,972,974
- Issue date Apr 30, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd
- Sung-Li Wang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device
- Patent number 11,973,117
- Issue date Apr 30, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd
- Chun-Hsien Huang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Source/drain contact having a protruding segment
- Patent number 11,968,817
- Issue date Apr 23, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd
- Jui-Lin Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Low-temperature plasma pre-clean for selective gap fill
- Patent number 11,955,381
- Issue date Apr 9, 2024
- Applied Materials, Inc.
- Yi Xu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Methods and apparatus for forming dual metal interconnects
- Patent number 11,948,885
- Issue date Apr 2, 2024
- Applied Materials, Inc.
- Suketu A Parikh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device with thermal release layer and method for fabr...
- Patent number 11,948,857
- Issue date Apr 2, 2024
- NANYA TECHNOLOGY CORPORATION
- Jar-Ming Ho
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for fabricating semiconductor structure having alignment mar...
- Patent number 11,901,305
- Issue date Feb 13, 2024
- Taiwan Semiconductor Manufacturing Co. Ltd.
- Kuo-Hung Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Treatment liquid, method for washing substrate, and method for remo...
- Patent number 11,899,369
- Issue date Feb 13, 2024
- FUJIFILM Corporation
- Tomonori Takahashi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Multi-layer line structure and method for manufacturing thereof
- Patent number 11,862,564
- Issue date Jan 2, 2024
- Dai Nippon Printing Co., Ltd.
- Hiroshi Kudo
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
DC bias in plasma process
- Patent number 11,854,766
- Issue date Dec 26, 2023
- Taiwan Semiconductor Manufacturing Co., Ltd
- Sheng-Liang Pan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and method for manufacturing semiconductor device
- Patent number 11,855,103
- Issue date Dec 26, 2023
- Japan Display Inc.
- Akihiro Hanada
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor cleaning equipment and method for cleaning through vi...
- Patent number 11,854,794
- Issue date Dec 26, 2023
- NATIONAL CENTER FOR ADVANCED PACKAGING CO., LTD.
- Daping Yao
- B08 - CLEANING
Information Patent Grant
Method for fabricating semiconductor device with stacked dies
- Patent number 11,824,047
- Issue date Nov 21, 2023
- NANYA TECHNOLOGY CORPORATION
- Tse-Yao Huang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for forming semiconductor device
- Patent number 11,791,206
- Issue date Oct 17, 2023
- Taiwan Semiconductor Manufacturing Co., Ltd
- Jung-Tang Wu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for fabricating semiconductor device with stress relief stru...
- Patent number 11,791,294
- Issue date Oct 17, 2023
- NANYA TECHNOLOGY CORPORATION
- Tse-Yao Huang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and method of manufacture
- Patent number 11,776,853
- Issue date Oct 3, 2023
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Hung-Hao Chen
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
CONTACT FEATURES OF SEMICONDUCTOR DEVICE AND METHOD OF FORMING SAME
- Publication number 20240387265
- Publication date Nov 21, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Pin-Wen Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
DEPOSITION WINDOW ENLARGEMENT
- Publication number 20240387180
- Publication date Nov 21, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Meng-Han Chou
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR STRUCTURE AND MANUFACTURING METHOD THEREOF
- Publication number 20240379374
- Publication date Nov 14, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Hung-Pin Chang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD OF FORMING A MEOL CONTACT STRUCTURE
- Publication number 20240379768
- Publication date Nov 14, 2024
- Applied Materials, Inc.
- Shumao ZHANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTERCONNECT STRUCTURE FOR SEMICONDUCTOR DEVICES
- Publication number 20240379344
- Publication date Nov 14, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Po-Chuan Wang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
VIA-FIRST PROCESS FOR CONNECTING A CONTACT AND A GATE ELECTRODE
- Publication number 20240371687
- Publication date Nov 7, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chao-Hsun Wang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE
- Publication number 20240363707
- Publication date Oct 31, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Shih-Wen HUANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD OF DETECTING PHOTORESIST SCUM, METHOD OF FORMING SEMICONDUCT...
- Publication number 20240363450
- Publication date Oct 31, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Hung-Jui Kuo
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
HYBRID MOLYBDENUM FILL SCHEME FOR LOW RESISTIVITY SEMICONDUCTOR APP...
- Publication number 20240355673
- Publication date Oct 24, 2024
- Applied Materials, Inc.
- Wei LEI
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
TRANSISTOR STRUCTURE WITH AIR GAP AND METHOD OF FABRICATING THE SAME
- Publication number 20240332067
- Publication date Oct 3, 2024
- UNITED MICROELECTRONICS CORP.
- Yunfei Li
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SOFT ASHING PROCESS FOR FORMING PROTECTIVE LAYER ON CONDUCTIVE CAP...
- Publication number 20240321582
- Publication date Sep 26, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Guan-Xuan CHEN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SOURCE/DRAIN CONTACT HAVING A PROTRUDING SEGMENT
- Publication number 20240292590
- Publication date Aug 29, 2024
- Taiwan Semiconductor Manufacturing Co., LTD
- Jui-Lin Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHODS OF FORMING INTERCONNECT STRUCTURES
- Publication number 20240258164
- Publication date Aug 1, 2024
- Applied Materials, Inc.
- Jiajie Cen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SCHOTTKY BARRIER DIODE WITH REDUCED LEAKAGE CURRENT AND METHOD OF F...
- Publication number 20240258402
- Publication date Aug 1, 2024
- Taiwan Semiconductor Manufacturing company Ltd.
- MENG-HAN LIN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SELF-ALIGNED BARRIER FOR METAL VIAS
- Publication number 20240243009
- Publication date Jul 18, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Sung-Li WANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
TREATMENT LIQUID, METHOD FOR WASHING SUBSTRATE, AND METHOD FOR REMO...
- Publication number 20240231237
- Publication date Jul 11, 2024
- FUJIFILM CORPORATION
- Tomonori TAKAHASHI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ENHANCED DRY DESMEAR EQUIPMENT WITH PROTECTIVE FILM PEELING CAPABIL...
- Publication number 20240222089
- Publication date Jul 4, 2024
- Intel Corporation
- Ala OMER
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor Wafer Cleaning Solution and Cleaning Method Thereof
- Publication number 20240209290
- Publication date Jun 27, 2024
- Star Tracking Material Co. Ltd.
- CHUN-LI CHOU
- C11 - ANIMAL AND VEGETABLE OILS, FATS, FATTY SUBSTANCES AND WAXES FATTY ACIDS...
Information Patent Application
METHOD FOR FORMING CONDUCTIVE VIA, CONDUCTIVE VIA AND PASSIVE DEVICE
- Publication number 20240162138
- Publication date May 16, 2024
- BOE TECHNOLOGY GROUP CO., LTD.
- Xiyuan WANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
TREATMENT LIQUID, METHOD FOR WASHING SUBSTRATE, AND METHOD FOR REMO...
- Publication number 20240134284
- Publication date Apr 25, 2024
- FUJIFILM CORPORATION
- Tomonori TAKAHASHI
- C11 - ANIMAL AND VEGETABLE OILS, FATS, FATTY SUBSTANCES AND WAXES FATTY ACIDS...
Information Patent Application
MULTI-LAYER LINE STRUCTURE
- Publication number 20240088040
- Publication date Mar 14, 2024
- DAI NIPPON PRINTING CO., LTD.
- Hiroshi Kudo
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND METHOD FOR MANUFACTURING SEMICONDUCTOR DEVICE
- Publication number 20240088166
- Publication date Mar 14, 2024
- Japan Display Inc.
- Akihiro HANADA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
DC Bias in Plasma Process
- Publication number 20240071722
- Publication date Feb 29, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Sheng-Liang Pan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CONTACT FORMATION PROCESS FOR CMOS DEVICES
- Publication number 20240014075
- Publication date Jan 11, 2024
- Applied Materials, Inc.
- Nicolas Louis BREIL
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
WASHING SOLUTION AND WASHING METHOD FOR SEMICONDUCTOR SUBSTRATE
- Publication number 20230402275
- Publication date Dec 14, 2023
- FUJIFILM CORPORATION
- Atsushi MIZUTANI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CONDUCTIVE STRUCTURES
- Publication number 20230395426
- Publication date Dec 7, 2023
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Yi-Hsiang Chao
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURE
- Publication number 20230387221
- Publication date Nov 30, 2023
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Chun-Hsien Huang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTERCONNECT STRUCTURE FOR SEMICONDUCTOR DEVICES
- Publication number 20230386821
- Publication date Nov 30, 2023
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Po-Chuan Wang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CONTACT FORMATION PROCESS FOR CMOS DEVICES
- Publication number 20230377997
- Publication date Nov 23, 2023
- Applied Materials, Inc.
- Nicolas Louis BREIL
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
DEPOSITION WINDOW ENLARGEMENT
- Publication number 20230369055
- Publication date Nov 16, 2023
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Meng-Han Chou
- H01 - BASIC ELECTRIC ELEMENTS

the processing being the formation of vias or contact holes

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Semiconductor structure and manufacturing method thereof

Methods for forming recesses in source/drain regions and devices fo...

Via-first process for connecting a contact and a gate electrode

Semiconductor device and cleaning system

Abatement and strip process chamber in a load lock configuration

Semiconductor structure

Method of detecting photoresist scum, method of forming semiconduct...

Transistor structure with air gap and method of fabricating the same

Soft ashing process for forming protective layer on conductive cap...

Method for metal gate surface clean

Method of manufacturing semiconductor device

Schottky barrier diode with reduced leakage current and method of f...

Aqueous and semi-aqueous cleaners for the removal of post-etch resi...

Forming contact holes with controlled local critical dimension unif...

Self-aligned barrier for metal vias

Semiconductor device

Source/drain contact having a protruding segment

Low-temperature plasma pre-clean for selective gap fill

Methods and apparatus for forming dual metal interconnects

Semiconductor device with thermal release layer and method for fabr...

Method for fabricating semiconductor structure having alignment mar...

Treatment liquid, method for washing substrate, and method for remo...

Multi-layer line structure and method for manufacturing thereof

DC bias in plasma process

Semiconductor device and method for manufacturing semiconductor device

Semiconductor cleaning equipment and method for cleaning through vi...

Method for fabricating semiconductor device with stacked dies

Method for forming semiconductor device

Method for fabricating semiconductor device with stress relief stru...

Semiconductor device and method of manufacture

Patents Applicationslast 30 patents

CONTACT FEATURES OF SEMICONDUCTOR DEVICE AND METHOD OF FORMING SAME

DEPOSITION WINDOW ENLARGEMENT

SEMICONDUCTOR STRUCTURE AND MANUFACTURING METHOD THEREOF

METHOD OF FORMING A MEOL CONTACT STRUCTURE

INTERCONNECT STRUCTURE FOR SEMICONDUCTOR DEVICES

VIA-FIRST PROCESS FOR CONNECTING A CONTACT AND A GATE ELECTRODE

SEMICONDUCTOR DEVICE

METHOD OF DETECTING PHOTORESIST SCUM, METHOD OF FORMING SEMICONDUCT...

HYBRID MOLYBDENUM FILL SCHEME FOR LOW RESISTIVITY SEMICONDUCTOR APP...

TRANSISTOR STRUCTURE WITH AIR GAP AND METHOD OF FABRICATING THE SAME

SOFT ASHING PROCESS FOR FORMING PROTECTIVE LAYER ON CONDUCTIVE CAP...

SOURCE/DRAIN CONTACT HAVING A PROTRUDING SEGMENT

METHODS OF FORMING INTERCONNECT STRUCTURES

SCHOTTKY BARRIER DIODE WITH REDUCED LEAKAGE CURRENT AND METHOD OF F...

SELF-ALIGNED BARRIER FOR METAL VIAS

TREATMENT LIQUID, METHOD FOR WASHING SUBSTRATE, AND METHOD FOR REMO...

ENHANCED DRY DESMEAR EQUIPMENT WITH PROTECTIVE FILM PEELING CAPABIL...

Semiconductor Wafer Cleaning Solution and Cleaning Method Thereof

METHOD FOR FORMING CONDUCTIVE VIA, CONDUCTIVE VIA AND PASSIVE DEVICE

TREATMENT LIQUID, METHOD FOR WASHING SUBSTRATE, AND METHOD FOR REMO...

MULTI-LAYER LINE STRUCTURE

SEMICONDUCTOR DEVICE AND METHOD FOR MANUFACTURING SEMICONDUCTOR DEVICE

DC Bias in Plasma Process

CONTACT FORMATION PROCESS FOR CMOS DEVICES

WASHING SOLUTION AND WASHING METHOD FOR SEMICONDUCTOR SUBSTRATE

CONDUCTIVE STRUCTURES

SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURE

INTERCONNECT STRUCTURE FOR SEMICONDUCTOR DEVICES

CONTACT FORMATION PROCESS FOR CMOS DEVICES

DEPOSITION WINDOW ENLARGEMENT