the processing being the formation of vias or contact holes

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HELECTRICITY H01Electric elements H01LSEMICONDUCTOR DEVICES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR H01L21/00Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof

Current Industry

H01L21/02063the processing being the formation of vias or contact holes

Industries

Patents Grantslast 30 patents

Information Patent Grant
Self-aligned barrier for metal vias
- Patent number 11,972,974
- Issue date Apr 30, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd
- Sung-Li Wang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device
- Patent number 11,973,117
- Issue date Apr 30, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd
- Chun-Hsien Huang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Source/drain contact having a protruding segment
- Patent number 11,968,817
- Issue date Apr 23, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd
- Jui-Lin Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Low-temperature plasma pre-clean for selective gap fill
- Patent number 11,955,381
- Issue date Apr 9, 2024
- Applied Materials, Inc.
- Yi Xu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Methods and apparatus for forming dual metal interconnects
- Patent number 11,948,885
- Issue date Apr 2, 2024
- Applied Materials, Inc.
- Suketu A Parikh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device with thermal release layer and method for fabr...
- Patent number 11,948,857
- Issue date Apr 2, 2024
- NANYA TECHNOLOGY CORPORATION
- Jar-Ming Ho
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for fabricating semiconductor structure having alignment mar...
- Patent number 11,901,305
- Issue date Feb 13, 2024
- Taiwan Semiconductor Manufacturing Co. Ltd.
- Kuo-Hung Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Treatment liquid, method for washing substrate, and method for remo...
- Patent number 11,899,369
- Issue date Feb 13, 2024
- FUJIFILM Corporation
- Tomonori Takahashi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Multi-layer line structure and method for manufacturing thereof
- Patent number 11,862,564
- Issue date Jan 2, 2024
- Dai Nippon Printing Co., Ltd.
- Hiroshi Kudo
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
DC bias in plasma process
- Patent number 11,854,766
- Issue date Dec 26, 2023
- Taiwan Semiconductor Manufacturing Co., Ltd
- Sheng-Liang Pan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor cleaning equipment and method for cleaning through vi...
- Patent number 11,854,794
- Issue date Dec 26, 2023
- NATIONAL CENTER FOR ADVANCED PACKAGING CO., LTD.
- Daping Yao
- B08 - CLEANING
Information Patent Grant
Semiconductor device and method for manufacturing semiconductor device
- Patent number 11,855,103
- Issue date Dec 26, 2023
- Japan Display Inc.
- Akihiro Hanada
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for fabricating semiconductor device with stacked dies
- Patent number 11,824,047
- Issue date Nov 21, 2023
- NANYA TECHNOLOGY CORPORATION
- Tse-Yao Huang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for forming semiconductor device
- Patent number 11,791,206
- Issue date Oct 17, 2023
- Taiwan Semiconductor Manufacturing Co., Ltd
- Jung-Tang Wu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for fabricating semiconductor device with stress relief stru...
- Patent number 11,791,294
- Issue date Oct 17, 2023
- NANYA TECHNOLOGY CORPORATION
- Tse-Yao Huang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and method of manufacture
- Patent number 11,776,853
- Issue date Oct 3, 2023
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Hung-Hao Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Multi-step pre-clean for selective metal gap fill
- Patent number 11,776,806
- Issue date Oct 3, 2023
- Applied Materials, Inc.
- Xi Cen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Deposition window enlargement
- Patent number 11,742,210
- Issue date Aug 29, 2023
- Taiwan Semiconductor Manufacturing Co., Ltd
- Meng-Han Chou
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and fabrication method thereof
- Patent number 11,735,635
- Issue date Aug 22, 2023
- Taiwan Semiconductor Manufacturing Company, Ltd
- Chun-Han Tsao
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Substrate processing method and substrate processing apparatus
- Patent number 11,735,428
- Issue date Aug 22, 2023
- Tokyo Electron Limited
- Shoichiro Hidaka
- B08 - CLEANING
Information Patent Grant
Semiconductor device having contact plug
- Patent number 11,694,924
- Issue date Jul 4, 2023
- Taiwan Semiconductor Manufacturing Co., Ltd
- Wen-Jia Hsieh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Interconnect structure
- Patent number 11,676,853
- Issue date Jun 13, 2023
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Hung-Chih Yu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Via-first process for connecting a contact and a gate electrode
- Patent number 11,670,544
- Issue date Jun 6, 2023
- Taiwan Semiconductor Manufacturing Company, Ltd
- Chao-Hsun Wang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Metal-containing passivation for high aspect ratio etch
- Patent number 11,670,516
- Issue date Jun 6, 2023
- Lam Research Corporation
- Karthik S. Colinjivadi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Interconnect structure with hybrid barrier layer
- Patent number 11,652,055
- Issue date May 16, 2023
- Taiwan Semiconductor Manufacturing Company, Ltd
- Shu-Wei Li
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Methods and apparatus for cleaning substrates
- Patent number 11,638,937
- Issue date May 2, 2023
- ACM Research, Inc.
- Hui Wang
- B08 - CLEANING
Information Patent Grant
Cleaning formulation for removing residues on surfaces
- Patent number 11,639,487
- Issue date May 2, 2023
- Fujifilm Electronic Materials U.S.A., Inc.
- Tomonori Takahashi
- C11 - ANIMAL AND VEGETABLE OILS, FATS, FATTY SUBSTANCES AND WAXES FATTY ACIDS...
Information Patent Grant
Method of manufacturing semiconductor device
- Patent number 11,621,158
- Issue date Apr 4, 2023
- Fuji Electric Co., Ltd.
- Naoko Kodama
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Cleaning formulation for removing residues on surfaces
- Patent number 11,618,867
- Issue date Apr 4, 2023
- Fujifilm Electronic Materials U.S.A., Inc.
- Tomonori Takahashi
- C11 - ANIMAL AND VEGETABLE OILS, FATS, FATTY SUBSTANCES AND WAXES FATTY ACIDS...
Information Patent Grant
Semiconductor device with low-galvanic corrosion structures, and me...
- Patent number 11,615,985
- Issue date Mar 28, 2023
- Taiwan Semiconductor Manufacturing Company, Ltd
- Shahaji B. More
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
TREATMENT LIQUID, METHOD FOR WASHING SUBSTRATE, AND METHOD FOR REMO...
- Publication number 20240134284
- Publication date Apr 25, 2024
- FUJIFILM CORPORATION
- Tomonori TAKAHASHI
- C11 - ANIMAL AND VEGETABLE OILS, FATS, FATTY SUBSTANCES AND WAXES FATTY ACIDS...
Information Patent Application
MULTI-LAYER LINE STRUCTURE
- Publication number 20240088040
- Publication date Mar 14, 2024
- DAI NIPPON PRINTING CO., LTD.
- Hiroshi Kudo
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND METHOD FOR MANUFACTURING SEMICONDUCTOR DEVICE
- Publication number 20240088166
- Publication date Mar 14, 2024
- Japan Display Inc.
- Akihiro HANADA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
DC Bias in Plasma Process
- Publication number 20240071722
- Publication date Feb 29, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Sheng-Liang Pan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CONTACT FORMATION PROCESS FOR CMOS DEVICES
- Publication number 20240014075
- Publication date Jan 11, 2024
- Applied Materials, Inc.
- Nicolas Louis BREIL
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
WASHING SOLUTION AND WASHING METHOD FOR SEMICONDUCTOR SUBSTRATE
- Publication number 20230402275
- Publication date Dec 14, 2023
- FUJIFILM CORPORATION
- Atsushi MIZUTANI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CONDUCTIVE STRUCTURES
- Publication number 20230395426
- Publication date Dec 7, 2023
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Yi-Hsiang Chao
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURE
- Publication number 20230387221
- Publication date Nov 30, 2023
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Chun-Hsien Huang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTERCONNECT STRUCTURE FOR SEMICONDUCTOR DEVICES
- Publication number 20230386821
- Publication date Nov 30, 2023
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Po-Chuan Wang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CONTACT FORMATION PROCESS FOR CMOS DEVICES
- Publication number 20230377997
- Publication date Nov 23, 2023
- Applied Materials, Inc.
- Nicolas Louis BREIL
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
DEPOSITION WINDOW ENLARGEMENT
- Publication number 20230369055
- Publication date Nov 16, 2023
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Meng-Han Chou
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD OF MANUFACTURING SEMICONDUCTOR STRUCTURE AND SEMICONDUCTOR S...
- Publication number 20230360963
- Publication date Nov 9, 2023
- CHANGXIN MEMORY TECHNOLOGIES, INC.
- Junsheng ZANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND METHODS OF FORMATION
- Publication number 20230343637
- Publication date Oct 26, 2023
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Ying-Yu LAI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTERCONNECT STRUCTURE
- Publication number 20230290675
- Publication date Sep 14, 2023
- Taiwan Semiconductor Manufacturing Co., LTD
- Hung-Chih YU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICES AND METHODS OF MANUFACTURE
- Publication number 20230268223
- Publication date Aug 24, 2023
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Po-Chuan Wang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
VIA-FIRST PROCESS FOR CONNECTING A CONTACT AND A GATE ELECTRODE
- Publication number 20230253244
- Publication date Aug 10, 2023
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chao-Hsun Wang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE WITH LOW-GALVANIC CORROSION STRUCTURES, AND ME...
- Publication number 20230253249
- Publication date Aug 10, 2023
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Shahaji B. MORE
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTERCONNECT STRUCTURE WITH HYBRID BARRIER LAYER
- Publication number 20230253330
- Publication date Aug 10, 2023
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Shu-Wei Li
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ETCHING METHOD AND PLASMA PROCESSING APPARATUS
- Publication number 20230238250
- Publication date Jul 27, 2023
- TOKYO ELECTRON LIMITED
- Mizuki MATSUO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Use of a Composition Consisting of Ammonia and an Alkanol for Avoid...
- Publication number 20230235252
- Publication date Jul 27, 2023
- BASF SE
- Chi Yueh KAO
- C11 - ANIMAL AND VEGETABLE OILS, FATS, FATTY SUBSTANCES AND WAXES FATTY ACIDS...
Information Patent Application
CONTACT FEATURES OF SEMICONDUCTOR DEVICE AND METHOD OF FORMING SAME
- Publication number 20230223302
- Publication date Jul 13, 2023
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Pin-Wen Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
VIA IN SEMICONDUCTOR DEVICE STRUCTURE
- Publication number 20230197515
- Publication date Jun 22, 2023
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chun-Jui HUANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SELF-ASSEMBLED MONOLAYER FOR SELECTIVE DEPOSITION
- Publication number 20230197508
- Publication date Jun 22, 2023
- Applied Materials, Inc.
- Xiangjin Xie
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR STRUCTURE AND MANUFACTURING METHOD THEREOF
- Publication number 20230197464
- Publication date Jun 22, 2023
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Hung-Pin Chang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ABATEMENT AND STRIP PROCESS CHAMBER IN A LOAD LOCK CONFIGURATION
- Publication number 20230162984
- Publication date May 25, 2023
- Applied Materials, Inc.
- Martin Jeffrey SALINAS
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CLEANING FORMULATION FOR REMOVING RESIDUES ON SURFACES
- Publication number 20230100080
- Publication date Mar 30, 2023
- Fujifilm Electronic Materials U.S.A., Inc.
- Tomonori Takahashi
- C11 - ANIMAL AND VEGETABLE OILS, FATS, FATTY SUBSTANCES AND WAXES FATTY ACIDS...
Information Patent Application
METHODS FOR MINIMIZING FEATURE-TO-FEATURE GAP FILL HEIGHT VARIATIONS
- Publication number 20230098561
- Publication date Mar 30, 2023
- Jiajie CEN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD FOR FABRICATING SEMICONDUCTOR DEVICE WITH STACKED DIES
- Publication number 20230079072
- Publication date Mar 16, 2023
- NANYA TECHNOLOGY CORPORATION
- TSE-YAO HUANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CLEANING FORMULATION FOR REMOVING RESIDUES ON SURFACES
- Publication number 20230066300
- Publication date Mar 2, 2023
- Fujifilm Electronic Materials U.S.A., Inc.
- Tomonori Takahashi
- C11 - ANIMAL AND VEGETABLE OILS, FATS, FATTY SUBSTANCES AND WAXES FATTY ACIDS...
Information Patent Application
SEMICONDUCTOR STRUCTURE AND MANUFACTURING METHOD THEREOF
- Publication number 20230069214
- Publication date Mar 2, 2023
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Hung-Pin Chang
- H01 - BASIC ELECTRIC ELEMENTS

the processing being the formation of vias or contact holes

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Self-aligned barrier for metal vias

Semiconductor device

Source/drain contact having a protruding segment

Low-temperature plasma pre-clean for selective gap fill

Methods and apparatus for forming dual metal interconnects

Semiconductor device with thermal release layer and method for fabr...

Method for fabricating semiconductor structure having alignment mar...

Treatment liquid, method for washing substrate, and method for remo...

Multi-layer line structure and method for manufacturing thereof

DC bias in plasma process

Semiconductor cleaning equipment and method for cleaning through vi...

Semiconductor device and method for manufacturing semiconductor device

Method for fabricating semiconductor device with stacked dies

Method for forming semiconductor device

Method for fabricating semiconductor device with stress relief stru...

Semiconductor device and method of manufacture

Multi-step pre-clean for selective metal gap fill

Deposition window enlargement

Semiconductor device and fabrication method thereof

Substrate processing method and substrate processing apparatus

Semiconductor device having contact plug

Interconnect structure

Via-first process for connecting a contact and a gate electrode

Metal-containing passivation for high aspect ratio etch

Interconnect structure with hybrid barrier layer

Methods and apparatus for cleaning substrates

Cleaning formulation for removing residues on surfaces

Method of manufacturing semiconductor device

Cleaning formulation for removing residues on surfaces

Semiconductor device with low-galvanic corrosion structures, and me...

Patents Applicationslast 30 patents

TREATMENT LIQUID, METHOD FOR WASHING SUBSTRATE, AND METHOD FOR REMO...

MULTI-LAYER LINE STRUCTURE

SEMICONDUCTOR DEVICE AND METHOD FOR MANUFACTURING SEMICONDUCTOR DEVICE

DC Bias in Plasma Process

CONTACT FORMATION PROCESS FOR CMOS DEVICES

WASHING SOLUTION AND WASHING METHOD FOR SEMICONDUCTOR SUBSTRATE

CONDUCTIVE STRUCTURES

SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURE

INTERCONNECT STRUCTURE FOR SEMICONDUCTOR DEVICES

CONTACT FORMATION PROCESS FOR CMOS DEVICES

DEPOSITION WINDOW ENLARGEMENT

METHOD OF MANUFACTURING SEMICONDUCTOR STRUCTURE AND SEMICONDUCTOR S...

SEMICONDUCTOR DEVICE AND METHODS OF FORMATION

INTERCONNECT STRUCTURE

SEMICONDUCTOR DEVICES AND METHODS OF MANUFACTURE

VIA-FIRST PROCESS FOR CONNECTING A CONTACT AND A GATE ELECTRODE

SEMICONDUCTOR DEVICE WITH LOW-GALVANIC CORROSION STRUCTURES, AND ME...

INTERCONNECT STRUCTURE WITH HYBRID BARRIER LAYER

ETCHING METHOD AND PLASMA PROCESSING APPARATUS

Use of a Composition Consisting of Ammonia and an Alkanol for Avoid...

CONTACT FEATURES OF SEMICONDUCTOR DEVICE AND METHOD OF FORMING SAME

VIA IN SEMICONDUCTOR DEVICE STRUCTURE

SELF-ASSEMBLED MONOLAYER FOR SELECTIVE DEPOSITION

SEMICONDUCTOR STRUCTURE AND MANUFACTURING METHOD THEREOF

ABATEMENT AND STRIP PROCESS CHAMBER IN A LOAD LOCK CONFIGURATION

CLEANING FORMULATION FOR REMOVING RESIDUES ON SURFACES

METHODS FOR MINIMIZING FEATURE-TO-FEATURE GAP FILL HEIGHT VARIATIONS

METHOD FOR FABRICATING SEMICONDUCTOR DEVICE WITH STACKED DIES

CLEANING FORMULATION FOR REMOVING RESIDUES ON SURFACES

SEMICONDUCTOR STRUCTURE AND MANUFACTURING METHOD THEREOF