the product being a printed circuit board [PCB]

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CPC
Y02P70/611

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YGENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS Y02Climate change prevention Y02PCLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION OR PROCESSING OF GOODS Y02P70/00Climate change mitigation technologies in the production process for final industrial or consumer products

Current Industry

Y02P70/611the product being a printed circuit board [PCB]

Industries

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Patents Grantslast 30 patents

Information Patent Grant
Laminate and circuit board
- Patent number 10,849,231
- Issue date Nov 24, 2020
- Toppan Forms Co., Ltd.
- Akihito Mori
- B32 - LAYERED PRODUCTS
Information Patent Grant
Hearing device with a microphone structure
- Patent number 10,820,126
- Issue date Oct 27, 2020
- Oticon A/S
- Søren Wichmann
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Composite electronic component and resistor
- Patent number 10,811,194
- Issue date Oct 20, 2020
- Murata Manufacturing Co., Ltd.
- Kazuo Hattori
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method and apparatus for flexible circuit cable attachment
- Patent number 10,813,230
- Issue date Oct 20, 2020
- Jabil Inc.
- Wenlu Wang
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Conformal coating composition containing metal nanoparticles to pre...
- Patent number 10,800,930
- Issue date Oct 13, 2020
- International Business Machines Corporation
- Dylan J. Boday
- C09 - DYES PAINTS POLISHES NATURAL RESINS ADHESIVES MISCELLANEOUS COMPOSITION...
Information Patent Grant
Memory controller for selective rank or subrank access
- Patent number 10,795,834
- Issue date Oct 6, 2020
- RAMBUS INC.
- Craig E. Hampel
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Circuit board having a passive device inside a via
- Patent number 10,798,821
- Issue date Oct 6, 2020
- Intel Corporation
- Carlos Gomez
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Printed circuit board and sensor
- Patent number 10,791,630
- Issue date Sep 29, 2020
- Vitesco Technologies GmbH
- Erich Mattmann
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Surface mounted protection device
- Patent number 10,790,108
- Issue date Sep 29, 2020
- Littelfuse, Inc.
- James Beckert
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Conductor path structure having a component received in a vibration...
- Patent number 10,779,399
- Issue date Sep 15, 2020
- POSSEHL ELECTRONICS DEUTSCHLAND GMBH
- Dietmar Kurzeja
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Multilayer ceramic capacitor and board having the same
- Patent number 10,770,233
- Issue date Sep 8, 2020
- Samsung Electro-Mechanics Co., Ltd.
- Min Hee Hong
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Composite electronic component, method of manufacturing the same, b...
- Patent number 10,770,226
- Issue date Sep 8, 2020
- Samsung Electro-Mechanics Co., Ltd.
- Jin Hwan Kim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Composite electronic component and resistor
- Patent number 10,741,331
- Issue date Aug 11, 2020
- Murata Manufacturing Co., Ltd.
- Kazuo Hattori
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Camera module, molded circuit board assembly, molded photosensitive...
- Patent number 10,742,859
- Issue date Aug 11, 2020
- NingBo Sunny Opotech Co., Ltd.
- Mingzhu Wang
- H04 - ELECTRIC COMMUNICATION TECHNIQUE
Information Patent Grant
Modular display panel
- Patent number 10,741,107
- Issue date Aug 11, 2020
- Ultravision Technologies, LLC
- William Y. Hall
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Array type discrete decoupling under BGA grid
- Patent number 10,743,408
- Issue date Aug 11, 2020
- ALCATEL LUCENT
- James M. Schriel
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Method of manufacturing wiring board, wiring board, and light emitt...
- Patent number 10,734,561
- Issue date Aug 4, 2020
- Nichia Corporation
- Yukitoshi Marutani
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Data processing device
- Patent number 10,726,878
- Issue date Jul 28, 2020
- Renesas Electronics Corporation
- Takafumi Betsui
- G11 - INFORMATION STORAGE
Information Patent Grant
Method for producing an electronic assembly, and electronic assembl...
- Patent number 10,729,023
- Issue date Jul 28, 2020
- Robert Bosch GmbH
- Peter Zweigle
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Multilayer ceramic capacitor with decreased high voltage stress def...
- Patent number 10,720,278
- Issue date Jul 21, 2020
- Samsung Electro-Mechanics Co., Ltd.
- Young Heon Oh
- Y02 - TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMA...
Information Patent Grant
Connection verification technique
- Patent number 10,717,141
- Issue date Jul 21, 2020
- Micron Technology, Inc.
- Thomas Kinsley
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Electric connection structure and electric connection member
- Patent number 10,721,822
- Issue date Jul 21, 2020
- Japan Aviation Electronics Industry, Limited
- Junya Sato
- Y02 - TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMA...
Information Patent Grant
Printed circuit board package and display device including the same
- Patent number 10,705,393
- Issue date Jul 7, 2020
- Samsung Display Co., Ltd.
- Byoung Yong Kim
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Multilayer ceramic electronic component and board having the same
- Patent number 10,707,021
- Issue date Jul 7, 2020
- Samsung Electro-Mechanics Co., Ltd.
- Sang Soo Park
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Electronic component-containing module
- Patent number 10,707,403
- Issue date Jul 7, 2020
- Murata Manufacturing Co., Ltd.
- Yoshiharu Suemori
- H03 - BASIC ELECTRONIC CIRCUITRY
Information Patent Grant
Camera module, molded circuit board assembly, molded photosensitive...
- Patent number 10,708,480
- Issue date Jul 7, 2020
- NingBo Sunny Opotech Co., Ltd.
- Mingzhu Wang
- B29 - WORKING OF PLASTICS WORKING OF SUBSTANCES IN A PLASTIC STATE, IN GENERAL
Information Patent Grant
Microelectronic package including microelectronic elements having s...
- Patent number 10,692,842
- Issue date Jun 23, 2020
- Invensas Corporation
- Richard Dewitt Crisp
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Method of forming camera module for vehicular vision system
- Patent number 10,694,090
- Issue date Jun 23, 2020
- Magna Electronics Inc.
- Jamie A. Mleczko
- B29 - WORKING OF PLASTICS WORKING OF SUBSTANCES IN A PLASTIC STATE, IN GENERAL
Information Patent Grant
Method of making integrated die paddle structures for bottom termin...
- Patent number 10,679,926
- Issue date Jun 9, 2020
- International Business Machines Corporation
- Stephen M. Hugo
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Camera module, molded circuit board assembly, molded photosensitive...
- Patent number 10,666,847
- Issue date May 26, 2020
- Ningbo Sunny Optotech Co., Ltd.
- Mingzhu Wang
- B29 - WORKING OF PLASTICS WORKING OF SUBSTANCES IN A PLASTIC STATE, IN GENERAL

Patents Applicationslast 30 patents

Information Patent Application
FINE PITCH COPPER PILLAR PACKAGE AND METHOD
- Publication number 20200219802
- Publication date Jul 9, 2020
- Amkor Technology, Inc.
- Robert Francis Darveaux
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CAPACITOR AND BOARD HAVING THE SAME
- Publication number 20200205291
- Publication date Jun 25, 2020
- Samsung Electro-Mechanics Co., Ltd.
- Jin Man JUNG
- Y02 - TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMA...
Information Patent Application
DISK HAVING AN ELECTRIC CONNECTING ELEMENT
- Publication number 20200185839
- Publication date Jun 11, 2020
- SAINT-GOBAIN GLASS FRANCE
- Harald Cholewa
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
CONDUCTOR PATH STRUCTURE HAVING A COMPONENT RECEIVED IN A VIBRATION...
- Publication number 20200170105
- Publication date May 28, 2020
- Possehl Electronics Deutschland GmbH
- Dietmar Kurzeja
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
Method of Enhancing Fatigue Life of Grid Arrays
- Publication number 20200146157
- Publication date May 7, 2020
- James H. Kelly
- Y02 - TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMA...
Information Patent Application
PRINTED CIRCUIT BOARD PACKAGE AND DISPLAY DEVICE INCLUDING THE SAME
- Publication number 20200110300
- Publication date Apr 9, 2020
- SAMSUNG DISPLAY CO., LTD.
- Byoung Yong Kim
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
Camera Module, Molded Circuit Board Assembly, Molded Photosensitive...
- Publication number 20200077002
- Publication date Mar 5, 2020
- NINGBO SUNNY OPOTECH CO., LTD.
- Mingzhu WANG
- B29 - WORKING OF PLASTICS WORKING OF SUBSTANCES IN A PLASTIC STATE, IN GENERAL
Information Patent Application
LAND SIDE AND DIE SIDE CAVITIES TO REDUCE PACKAGE Z-HEIGHT
- Publication number 20200051901
- Publication date Feb 13, 2020
- Intel Corporation
- MD Altaf Hossain
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Methods and Apparatus for Package with Interposers
- Publication number 20200027803
- Publication date Jan 23, 2020
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chun-Lin Lu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
OVERMOLDED ELECTRONIC MODULE WITH AN INTEGRATED ELECTROMAGNETIC SHI...
- Publication number 20190394912
- Publication date Dec 26, 2019
- SKYWORKS SOLUTIONS, INC.
- Philip H. Thompson
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD OF FORMING CAMERA MODULE FOR VEHICULAR VISION SYSTEM
- Publication number 20190356828
- Publication date Nov 21, 2019
- MAGNA ELECTRONICS INC.
- Jamie A. Mleczko
- B29 - WORKING OF PLASTICS WORKING OF SUBSTANCES IN A PLASTIC STATE, IN GENERAL
Information Patent Application
ARRAY SUBSTRATE AND METHOD OF MOUNTING INTEGRATED CIRCUIT USING THE...
- Publication number 20190333939
- Publication date Oct 31, 2019
- SAMSUNG DISPLAY CO., LTD.
- Dae Geun LEE
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
ELECTRONIC COMPONENT, ELECTRIC DEVICE INCLUDING THE SAME, AND BONDI...
- Publication number 20190281699
- Publication date Sep 12, 2019
- SAMSUNG DISPLAY CO., LTD.
- Han-Sung BAE
- G02 - OPTICS
Information Patent Application
RESISTOR ELEMENT AND RESISTOR ELEMENT ASSEMBLY
- Publication number 20190259514
- Publication date Aug 22, 2019
- Samsung Electro-Mechanics Co., Ltd.
- Kwang Hyun PARK
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Modular Display Panel
- Publication number 20190251879
- Publication date Aug 15, 2019
- Ultravision Technologies, LLC
- William Y. Hall
- F21 - LIGHTING
Information Patent Application
ELECTRONIC SYSTEM HAVING INCREASED COUPLING BY USING HORIZONTAL AND...
- Publication number 20190244948
- Publication date Aug 8, 2019
- STMicroelectronics S.r.l
- Alberto Pagani
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD FOR ORIENTING SOLDER BALLS ON A BGA DEVICE
- Publication number 20190230795
- Publication date Jul 25, 2019
- Intel Corporation
- MD Altaf HOSSAIN
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
SURFACE MOUNTED PROTECTION DEVICE
- Publication number 20190221396
- Publication date Jul 18, 2019
- LITTELFUSE, INC.
- James Beckert
- Y02 - TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMA...
Information Patent Application
Memory Controller For Selective Rank Or Subrank Access
- Publication number 20190205268
- Publication date Jul 4, 2019
- RAMBUS INC.
- Craig E. Hampel
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
LASER DIODE CHIP ON PRINTED CIRCUIT BOARD
- Publication number 20190208630
- Publication date Jul 4, 2019
- Microsoft Technology Licensing, LLC
- David MANDELBOUM
- F21 - LIGHTING
Information Patent Application
MULTILAYER CERAMIC CAPACITOR WITH DECREASED HIGH VOLTAGE STRESS DEF...
- Publication number 20190164691
- Publication date May 30, 2019
- Samsung Electro-Mechanics Co., Ltd.
- Young Heon OH
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SYSTEMS AND METHODS FOR AN INTERMEDIATE DEVICE STRUCTURE
- Publication number 20190150284
- Publication date May 16, 2019
- Daniel S. Spiro
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD OF FORMING CAMERA MODULE FOR VEHICULAR VISION SYSTEM
- Publication number 20190109968
- Publication date Apr 11, 2019
- MAGNA ELECTRONICS INC.
- Jamie A. Mleczko
- B29 - WORKING OF PLASTICS WORKING OF SUBSTANCES IN A PLASTIC STATE, IN GENERAL
Information Patent Application
SPOKED SOLDER PAD TO IMPROVE SOLDERABILITY AND SELF-ALIGNMENT OF IN...
- Publication number 20190088605
- Publication date Mar 21, 2019
- Myron WALKER
- Y02 - TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMA...
Information Patent Application
Fibrillated Liquid Crystal Polymer Powder, Method of Producing Fibr...
- Publication number 20190080817
- Publication date Mar 14, 2019
- MURATA MANUFACTURING CO., LTD.
- Hiroyuki OHATA
- C08 - ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-...
Information Patent Application
ELECTRIC CONNECTION STRUCTURE AND ELECTRIC CONNECTION MEMBER
- Publication number 20190075658
- Publication date Mar 7, 2019
- Japan Aviation Electronics Industry, Limited
- Junya SATO
- C09 - DYES PAINTS POLISHES NATURAL RESINS ADHESIVES MISCELLANEOUS COMPOSITION...
Information Patent Application
Microelectronic Package Including Microelectronic Elements Having S...
- Publication number 20190035769
- Publication date Jan 31, 2019
- Invensas Corporation
- Richard Dewitt Crisp
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
PACKAGE MODULE
- Publication number 20190037706
- Publication date Jan 31, 2019
- DELTA ELECTRONICS (SHANGHAI) CO.,LTD.
- Hai-Bin XU
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
COMMUNICATION MODULE ALIGNMENT
- Publication number 20180330859
- Publication date Nov 15, 2018
- Keyssa Licensing, Inc.
- Stephen Robert Venuti
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
CHIP CAPACITOR, CIRCUIT ASSEMBLY, AND ELECTRONIC DEVICE
- Publication number 20180323011
- Publication date Nov 8, 2018
- Rohm Co., Ltd.
- Hiroki YAMAMOTO
- H01 - BASIC ELECTRIC ELEMENTS

the product being a printed circuit board [PCB]

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Laminate and circuit board

Hearing device with a microphone structure

Composite electronic component and resistor

Method and apparatus for flexible circuit cable attachment

Conformal coating composition containing metal nanoparticles to pre...

Memory controller for selective rank or subrank access

Circuit board having a passive device inside a via

Printed circuit board and sensor

Surface mounted protection device

Conductor path structure having a component received in a vibration...

Multilayer ceramic capacitor and board having the same

Composite electronic component, method of manufacturing the same, b...

Composite electronic component and resistor

Camera module, molded circuit board assembly, molded photosensitive...

Modular display panel

Array type discrete decoupling under BGA grid

Method of manufacturing wiring board, wiring board, and light emitt...

Data processing device

Method for producing an electronic assembly, and electronic assembl...

Multilayer ceramic capacitor with decreased high voltage stress def...

Connection verification technique

Electric connection structure and electric connection member

Printed circuit board package and display device including the same

Multilayer ceramic electronic component and board having the same

Electronic component-containing module

Camera module, molded circuit board assembly, molded photosensitive...

Microelectronic package including microelectronic elements having s...

Method of forming camera module for vehicular vision system

Method of making integrated die paddle structures for bottom termin...

Camera module, molded circuit board assembly, molded photosensitive...

Patents Applicationslast 30 patents

FINE PITCH COPPER PILLAR PACKAGE AND METHOD

CAPACITOR AND BOARD HAVING THE SAME

DISK HAVING AN ELECTRIC CONNECTING ELEMENT

CONDUCTOR PATH STRUCTURE HAVING A COMPONENT RECEIVED IN A VIBRATION...

Method of Enhancing Fatigue Life of Grid Arrays

PRINTED CIRCUIT BOARD PACKAGE AND DISPLAY DEVICE INCLUDING THE SAME

Camera Module, Molded Circuit Board Assembly, Molded Photosensitive...

LAND SIDE AND DIE SIDE CAVITIES TO REDUCE PACKAGE Z-HEIGHT

Methods and Apparatus for Package with Interposers

OVERMOLDED ELECTRONIC MODULE WITH AN INTEGRATED ELECTROMAGNETIC SHI...

METHOD OF FORMING CAMERA MODULE FOR VEHICULAR VISION SYSTEM

ARRAY SUBSTRATE AND METHOD OF MOUNTING INTEGRATED CIRCUIT USING THE...

ELECTRONIC COMPONENT, ELECTRIC DEVICE INCLUDING THE SAME, AND BONDI...

RESISTOR ELEMENT AND RESISTOR ELEMENT ASSEMBLY

Modular Display Panel

ELECTRONIC SYSTEM HAVING INCREASED COUPLING BY USING HORIZONTAL AND...

METHOD FOR ORIENTING SOLDER BALLS ON A BGA DEVICE

SURFACE MOUNTED PROTECTION DEVICE

Memory Controller For Selective Rank Or Subrank Access

LASER DIODE CHIP ON PRINTED CIRCUIT BOARD

MULTILAYER CERAMIC CAPACITOR WITH DECREASED HIGH VOLTAGE STRESS DEF...

SYSTEMS AND METHODS FOR AN INTERMEDIATE DEVICE STRUCTURE

METHOD OF FORMING CAMERA MODULE FOR VEHICULAR VISION SYSTEM

SPOKED SOLDER PAD TO IMPROVE SOLDERABILITY AND SELF-ALIGNMENT OF IN...

Fibrillated Liquid Crystal Polymer Powder, Method of Producing Fibr...

ELECTRIC CONNECTION STRUCTURE AND ELECTRIC CONNECTION MEMBER

Microelectronic Package Including Microelectronic Elements Having S...

PACKAGE MODULE

COMMUNICATION MODULE ALIGNMENT

CHIP CAPACITOR, CIRCUIT ASSEMBLY, AND ELECTRONIC DEVICE