the radiating structures being additional and fastened onto the housing

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H05K7/20418

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HELECTRICITY H05Electric techniques H05KPRINTED CIRCUITS CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS H05K7/00Constructional details common to different types of electric apparatus

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H05K7/20418the radiating structures being additional and fastened onto the housing

Industries

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Patents Grantslast 30 patents

Information Patent Grant
Cooling system and methods
- Patent number 12,200,908
- Issue date Jan 14, 2025
- Shuaib Badat
- F04 - POSITIVE DISPLACEMENT MACHINES FOR LIQUIDS PUMPS FOR LIQUIDS OR ELASTIC...
Information Patent Grant
Cavities for center-pinned actuator cooling systems
- Patent number 12,193,192
- Issue date Jan 7, 2025
- Frore Systems Inc.
- Suryaprakash Ganti
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Welding-type power supplies with expandable thermal interfaces
- Patent number 12,178,021
- Issue date Dec 24, 2024
- Illinois Tool Works Inc.
- Alan Adam Manthe
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Compressible thermal link
- Patent number 12,160,979
- Issue date Dec 3, 2024
- Cisco Technology, Inc.
- Chejung Liu
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Two-phase cold plate
- Patent number 12,146,506
- Issue date Nov 19, 2024
- AURAS TECHNOLOGY CO., LTD.
- Chien-Yu Chen
- F04 - POSITIVE DISPLACEMENT MACHINES FOR LIQUIDS PUMPS FOR LIQUIDS OR ELASTIC...
Information Patent Grant
System and method to help mitigate heat in an electronic device
- Patent number 12,150,280
- Issue date Nov 19, 2024
- Intel Corporation
- Baomin Liu
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Hybrid heat sink
- Patent number 12,150,277
- Issue date Nov 19, 2024
- SHENZHEN ENVICOOL TECHNOLOGY CO., LTD
- Viacheslav Stetsyuk
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Heat dissipation device assembly
- Patent number 12,146,714
- Issue date Nov 19, 2024
- Asia Vital Components Co., Ltd.
- Sheng-Huang Lin
- F28 - HEAT EXCHANGE IN GENERAL
Information Patent Grant
Transceiver and interface for IC package
- Patent number 12,140,809
- Issue date Nov 12, 2024
- Samtec, Inc.
- Eric J. Zbinden
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Cooling apparatus for power module
- Patent number 12,144,147
- Issue date Nov 12, 2024
- Hyundai Motor Company
- Sang Hun Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Dual mode cooling system for use with in-wall video-codec and other...
- Patent number 12,137,533
- Issue date Nov 5, 2024
- Crestron Electronics Inc.
- Mark LaBosco
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Cold plate architecture for liquid cooling of devices
- Patent number 12,133,357
- Issue date Oct 29, 2024
- Intel Corporation
- Jin Yang
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Cooling system and methods
- Patent number 12,133,365
- Issue date Oct 29, 2024
- Shuaib Badat
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Inductor thermal management system
- Patent number 12,119,156
- Issue date Oct 15, 2024
- Lunar Energy, Inc.
- Charles Ingalz
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Self-aligning heat fins for thermal management
- Patent number 12,108,577
- Issue date Oct 1, 2024
- SanDisk Technologies, Inc.
- Uthayarajan A/L Rasalingam
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Liquid cooling head with a heat dissipating liquid flowing from a c...
- Patent number 12,098,732
- Issue date Sep 24, 2024
- AURAS TECHNOLOGY CO., LTD.
- Mu-Shu Fan
- F04 - POSITIVE DISPLACEMENT MACHINES FOR LIQUIDS PUMPS FOR LIQUIDS OR ELASTIC...
Information Patent Grant
Heat dissipation structure and foldable display device
- Patent number 12,096,600
- Issue date Sep 17, 2024
- WUHAN CHINA STAR OPTOELECTRONICS SEMICONDUCTOR DISPLAY TECHNOLOGY CO., LTD.
- Zhenyu Yang
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Passive thermal-control structure for speakers and associated appar...
- Patent number 12,082,377
- Issue date Sep 3, 2024
- Google LLC
- Emil Rahim
- H04 - ELECTRIC COMMUNICATION TECHNIQUE
Information Patent Grant
Vapor chamber, heat sink, and terminal
- Patent number 12,082,381
- Issue date Sep 3, 2024
- Huawei Technologies Co., Ltd.
- Denis Yurchenko
- F28 - HEAT EXCHANGE IN GENERAL
Information Patent Grant
Fanless computer case
- Patent number 12,075,600
- Issue date Aug 27, 2024
- Anthony Lane Snyder
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Dual mode cooling system for use with in-wall video-codec and other...
- Patent number 12,075,595
- Issue date Aug 27, 2024
- Crestron Electronics Inc.
- Mark LaBosco
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Heat exchange assembly for a pluggable module
- Patent number 12,050,352
- Issue date Jul 30, 2024
- TE CONNECTIVITY SOLUTIONS GmbH
- Zachary Galbraith
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Power module and power device
- Patent number 12,048,122
- Issue date Jul 23, 2024
- Niko Semiconductor Co., Ltd.
- Chung-Ming Leng
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Load vectoring heat sink
- Patent number 11,991,864
- Issue date May 21, 2024
- Google LLC
- Ryan Tong
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Device for transferring heat between a first module and a second mo...
- Patent number 11,988,882
- Issue date May 21, 2024
- Huawei Technologies Co., Ltd.
- Fredrik Ohlsson
- G02 - OPTICS
Information Patent Grant
Heat dissipating mechanism and related electronic device
- Patent number 11,950,395
- Issue date Apr 2, 2024
- Wistron Corporation
- Yu-Chuan Wu
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
System and method for maintaining efficiency of a heat sink
- Patent number 11,913,737
- Issue date Feb 27, 2024
- FRACTAL HEATSINK TECHNOLOGIES LLC
- Alexander I Poltorak
- F28 - HEAT EXCHANGE IN GENERAL
Information Patent Grant
Portable electronic device
- Patent number 11,903,169
- Issue date Feb 13, 2024
- ASUSTeK COMPUTER Inc.
- Cheng-Han Chung
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Display assembly for an imaging device
- Patent number 11,903,153
- Issue date Feb 13, 2024
- FICOSA ADAS, S.L.U.
- Daniel Abad Garcia
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Heat spreader having conduction enhancement with EMI shielding
- Patent number 11,882,673
- Issue date Jan 23, 2024
- Advanced Cooling Technologies, Inc.
- Jens Weyant
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR

Patents Applicationslast 30 patents

Information Patent Application
COOLING DEVICE AND COOLING SYSTEM
- Publication number 20250056765
- Publication date Feb 13, 2025
- Fujitsu Limited
- Hideo Kubo
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
HEATSINK FOR ELECTRIC COMPONENT OF POWER EQUIPMENT, POWER EQUIPMENT...
- Publication number 20250048603
- Publication date Feb 6, 2025
- Honda Motor Co., Ltd.
- Toshiyuki HASEGAWA
- A01 - AGRICULTURE FORESTRY ANIMAL HUSBANDRY HUNTING TRAPPING FISHING
Information Patent Application
SYSTEM AND METHOD TO HELP MITIGATE HEAT IN AN ELECTRONIC DEVICE
- Publication number 20250048596
- Publication date Feb 6, 2025
- Intel Corporation
- Baomin Liu
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
ELECTRONIC DEVICE
- Publication number 20250048584
- Publication date Feb 6, 2025
- MITSUBISHI ELECTRIC CORPORATION
- Hirokazu TAKABAYASHI
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
ELECTRONIC DEVICE AND SERVER
- Publication number 20250014966
- Publication date Jan 9, 2025
- xFusion Digital Technologies Co., Ltd
- Shuimu JIANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Heat Sink and Power Conversion Device
- Publication number 20250008692
- Publication date Jan 2, 2025
- Huawei Digital Power Technologies Co., Ltd.
- Junheng Ren
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
COOLING MODULE ASSEMBLY FOR POLE-MOUNTED NETWORK NODE
- Publication number 20250008682
- Publication date Jan 2, 2025
- Telefonaktiebolaget LM Ericsson (publ)
- Ulf AHLBERG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
HOUSING FOR RECEIVING AN ELECTRICAL HEAT SOURCE
- Publication number 20240422947
- Publication date Dec 19, 2024
- Phoenix Contact GmbH & Co. KG
- Frank Best
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
DUAL MODE COOLING SYSTEM FOR USE WITH IN-WALL VIDEO-CODEC AND OTHER...
- Publication number 20240414875
- Publication date Dec 12, 2024
- Crestron Electronics, Inc.
- Mark LaBosco
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
SYSTEMS FOR COOLING MODULE ASSEMBLY FOR INVERTER FOR ELECTRIC VEHICLE
- Publication number 20240414885
- Publication date Dec 12, 2024
- DELPHI TECHNOLOGIES IP LIMITED
- Edward Choi
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
TRANSCEIVER AND INTERFACE FOR IC PACKAGE
- Publication number 20240402446
- Publication date Dec 5, 2024
- SAMTEC, INC.
- Eric J. ZBINDEN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
THERMAL REGULATION DEVICE AND ASSOCIATED PIECE OF ELECTRONIC EQUIPMENT
- Publication number 20240407138
- Publication date Dec 5, 2024
- SAGEMCOM BROADBAND SAS
- Nathan JEANROT
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
PASSIVE THERMAL-CONTROL STRUCTURE FOR SPEAKERS AND ASSOCIATED APPAR...
- Publication number 20240397669
- Publication date Nov 28, 2024
- Google LLC
- Emil Rahim
- H04 - ELECTRIC COMMUNICATION TECHNIQUE
Information Patent Application
REDUCING ENERGY CONSUMED FOR COOLING EQUIPMENT IN AN EDGE CONTAINER
- Publication number 20240397672
- Publication date Nov 28, 2024
- International Business Machines Corporation
- Dustin Demetriou
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
ELECTRONICS HOUSING ASSEMBLY
- Publication number 20240397637
- Publication date Nov 28, 2024
- Redarc Technologies Pty Ltd
- Peter William Cosgriff
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
METHOD FOR PRODUCING A HEAT SINK
- Publication number 20240389272
- Publication date Nov 21, 2024
- Phoenix Contact GmbH & Co. KG
- Fabio Welslau
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
APPARATUS FOR PROVIDING THERMAL MANAGEMENT AND ELECTROMAGNETIC INTE...
- Publication number 20240341066
- Publication date Oct 10, 2024
- Thomson Licensing
- Lizhi ZHAO
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
ELASTIC HEAT CONDUCTION MECHANISM FOR ELECTRONIC DEVICES
- Publication number 20240292570
- Publication date Aug 29, 2024
- ADLINK TECHNOLOGY INC.
- Hsiu-Ling YU
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
CHASSIS FOR USE IN FANLESS AND FAN-COOLED DEVICES
- Publication number 20240268063
- Publication date Aug 8, 2024
- Rakuten Symphony UK Ltd
- Gerard MacManus
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
TWO-PHASE IMMERSION-COOLING HEAT-DISSIPATION STRUCTURE HAVING SKIVE...
- Publication number 20240268078
- Publication date Aug 8, 2024
- Amulaire thermal technology, INC.
- CHING-MING YANG
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
ACTIVE HEAT DISSIPATION APPARATUS AND MANUFACTURING METHOD OF THE SAME
- Publication number 20240251527
- Publication date Jul 25, 2024
- KMW Inc.
- Duk Yong KIM
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SYSTEM AND METHOD FOR MAINTAINING EFFICIENCY OF A HEAT SINK
- Publication number 20240247888
- Publication date Jul 25, 2024
- Fractal Heatsink Technologies, LLC
- Alexander I. Poltorak
- F28 - HEAT EXCHANGE IN GENERAL
Information Patent Application
PROTECTIVE COVER ASSEMBLY, RECEPTACLE CONNECTOR ASSEMBLY AND CONNEC...
- Publication number 20240235126
- Publication date Jul 11, 2024
- DONGGUAN LUXSHARE TECHNOLOGIES CO., LTD
- Baiyu DUAN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CAVITIES FOR CENTER-PINNED ACTUATOR COOLING SYSTEMS
- Publication number 20240215204
- Publication date Jun 27, 2024
- Frore Systems Inc.
- Suryaprakash Ganti
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
ACTUATING HEATSINK FOR PLUGGABLE MODULES
- Publication number 20240206127
- Publication date Jun 20, 2024
- Juniper Networks, Inc.
- Jimmy Chun-Chuen LEUNG
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
ELECTRONIC DEVICE
- Publication number 20240206132
- Publication date Jun 20, 2024
- MITSUBISHI ELECTRIC CORPORATION
- Takahiro MASUYAMA
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
HEAT DISSIPATION COMPONENT AND ASSOCIATED ELECTRICAL DEVICE
- Publication number 20240206129
- Publication date Jun 20, 2024
- Nokia Shanghai Bell Co., Ltd.
- Hua CAI
- H04 - ELECTRIC COMMUNICATION TECHNIQUE
Information Patent Application
LASER RADAR MODULE
- Publication number 20240192322
- Publication date Jun 13, 2024
- Cloud Light Technology Limited
- Chong Yang Qin
- G01 - MEASURING TESTING
Information Patent Application
Low Profile Attachment Method for Pluggable Optical Modules
- Publication number 20240192454
- Publication date Jun 13, 2024
- CIENA CORPORATION
- Peter Vincent Saturley
- G02 - OPTICS
Information Patent Application
CIRCUIT DEVICE
- Publication number 20240170472
- Publication date May 23, 2024
- AUTONETWORKS TECHNOLOGIES, LTD.
- Akira Haraguchi
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR

the radiating structures being additional and fastened onto the housing

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Cooling system and methods

Cavities for center-pinned actuator cooling systems

Welding-type power supplies with expandable thermal interfaces

Compressible thermal link

Two-phase cold plate

System and method to help mitigate heat in an electronic device

Hybrid heat sink

Heat dissipation device assembly

Transceiver and interface for IC package

Cooling apparatus for power module

Dual mode cooling system for use with in-wall video-codec and other...

Cold plate architecture for liquid cooling of devices

Cooling system and methods

Inductor thermal management system

Self-aligning heat fins for thermal management

Liquid cooling head with a heat dissipating liquid flowing from a c...

Heat dissipation structure and foldable display device

Passive thermal-control structure for speakers and associated appar...

Vapor chamber, heat sink, and terminal

Fanless computer case

Dual mode cooling system for use with in-wall video-codec and other...

Heat exchange assembly for a pluggable module

Power module and power device

Load vectoring heat sink

Device for transferring heat between a first module and a second mo...

Heat dissipating mechanism and related electronic device

System and method for maintaining efficiency of a heat sink

Portable electronic device

Display assembly for an imaging device

Heat spreader having conduction enhancement with EMI shielding

Patents Applicationslast 30 patents

COOLING DEVICE AND COOLING SYSTEM

HEATSINK FOR ELECTRIC COMPONENT OF POWER EQUIPMENT, POWER EQUIPMENT...

SYSTEM AND METHOD TO HELP MITIGATE HEAT IN AN ELECTRONIC DEVICE

ELECTRONIC DEVICE

ELECTRONIC DEVICE AND SERVER

Heat Sink and Power Conversion Device

COOLING MODULE ASSEMBLY FOR POLE-MOUNTED NETWORK NODE

HOUSING FOR RECEIVING AN ELECTRICAL HEAT SOURCE

DUAL MODE COOLING SYSTEM FOR USE WITH IN-WALL VIDEO-CODEC AND OTHER...

SYSTEMS FOR COOLING MODULE ASSEMBLY FOR INVERTER FOR ELECTRIC VEHICLE

TRANSCEIVER AND INTERFACE FOR IC PACKAGE

THERMAL REGULATION DEVICE AND ASSOCIATED PIECE OF ELECTRONIC EQUIPMENT

PASSIVE THERMAL-CONTROL STRUCTURE FOR SPEAKERS AND ASSOCIATED APPAR...

REDUCING ENERGY CONSUMED FOR COOLING EQUIPMENT IN AN EDGE CONTAINER

ELECTRONICS HOUSING ASSEMBLY

METHOD FOR PRODUCING A HEAT SINK

APPARATUS FOR PROVIDING THERMAL MANAGEMENT AND ELECTROMAGNETIC INTE...

ELASTIC HEAT CONDUCTION MECHANISM FOR ELECTRONIC DEVICES

CHASSIS FOR USE IN FANLESS AND FAN-COOLED DEVICES

TWO-PHASE IMMERSION-COOLING HEAT-DISSIPATION STRUCTURE HAVING SKIVE...

ACTIVE HEAT DISSIPATION APPARATUS AND MANUFACTURING METHOD OF THE SAME

SYSTEM AND METHOD FOR MAINTAINING EFFICIENCY OF A HEAT SINK

PROTECTIVE COVER ASSEMBLY, RECEPTACLE CONNECTOR ASSEMBLY AND CONNEC...

CAVITIES FOR CENTER-PINNED ACTUATOR COOLING SYSTEMS

ACTUATING HEATSINK FOR PLUGGABLE MODULES

ELECTRONIC DEVICE

HEAT DISSIPATION COMPONENT AND ASSOCIATED ELECTRICAL DEVICE

LASER RADAR MODULE

Low Profile Attachment Method for Pluggable Optical Modules

CIRCUIT DEVICE