the removal being a selective chemical etching step

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HELECTRICITY H01Electric elements H01LSEMICONDUCTOR DEVICES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR H01L21/00Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof

Current Industry

H01L21/31056the removal being a selective chemical etching step

Industries

Patents Grantslast 30 patents

Information Patent Grant
Composition for etching and manufacturing method of semiconductor d...
- Patent number 11,912,902
- Issue date Feb 27, 2024
- Jae-Wan Park
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Integrated circuit device
- Patent number 11,854,823
- Issue date Dec 26, 2023
- Taiwan Semiconductor Manufacturing Co., Ltd
- Meng-Han Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and manufacturing method thereof
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- Issue date Nov 7, 2023
- Taiwan Semiconductor Manufacturing Company, Ltd
- Tsun-Kai Tsao
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device having an air gap and method for fabricating t...
- Patent number 11,791,390
- Issue date Oct 17, 2023
- SK Hynix Inc.
- Se-Han Kwon
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Cut metal gate process for reducing transistor spacing
- Patent number 11,721,544
- Issue date Aug 8, 2023
- Taiwan Semiconductor Manufacturing Co., Ltd
- Ming-Chang Wen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of manufacturing a semiconductor device and a semiconductor...
- Patent number 11,677,010
- Issue date Jun 13, 2023
- Taiwan Semiconductor Manufacturing Co., Ltd
- Kuo-Cheng Chiang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Metal assisted chemical etching for fabricating high aspect ratio a...
- Patent number 11,648,557
- Issue date May 16, 2023
- International Business Machines Corporation
- Huan Hu
- B82 - NANO-TECHNOLOGY
Information Patent Grant
Scalable device for FINFET technology
- Patent number 11,631,617
- Issue date Apr 18, 2023
- International Business Machines Corporation
- Ruilong Xie
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor structures including middle-of-line (MOL) capacitance...
- Patent number 11,522,045
- Issue date Dec 6, 2022
- TESSERA LLC
- Injo Ok
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of making a semiconductor device including etching of a meta...
- Patent number 11,515,169
- Issue date Nov 29, 2022
- HITACHI HIGH-TECH CORPORATION
- Yoshihide Yamaguchi
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Composition for etching and manufacturing method of semiconductor d...
- Patent number 11,512,226
- Issue date Nov 29, 2022
- Jae-Wan Park
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for producing at least one device in compressive strained se...
- Patent number 11,515,148
- Issue date Nov 29, 2022
- Commissariat a l'Energie Atomique et Aux Energies Alternatives
- Loic Gaben
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Composition for etching and manufacturing method of semiconductor d...
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- Issue date Nov 15, 2022
- Jae-Wan Park
- C09 - DYES PAINTS POLISHES NATURAL RESINS ADHESIVES MISCELLANEOUS COMPOSITION...
Information Patent Grant
Atomic layer etching of metals
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- Issue date Aug 23, 2022
- Applied Materials, Inc.
- Nitin Deepak
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Composition for etching and manufacturing method of semiconductor d...
- Patent number 11,414,569
- Issue date Aug 16, 2022
- Jae-Wan Park
- C09 - DYES PAINTS POLISHES NATURAL RESINS ADHESIVES MISCELLANEOUS COMPOSITION...
Information Patent Grant
Method for producing a diode
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- Issue date May 31, 2022
- STMicroelectronics (Crolles 2) SAS
- Gregory Avenier
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Directional processing to remove a layer or a material formed over...
- Patent number 11,289,332
- Issue date Mar 29, 2022
- Taiwan Semiconductor Manufacturing Co., Ltd
- Shih-Chun Huang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and manufacturing method thereof
- Patent number 11,239,089
- Issue date Feb 1, 2022
- Taiwan Semiconductor Manufacturing Co., Ltd
- Meng-Han Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Ion beam etching chamber with etching by-product redistributor
- Patent number 11,239,060
- Issue date Feb 1, 2022
- Taiwan Semiconductor Manufacturing Company, Ltd
- Te-Hsien Hsieh
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Cut metal gate process for reducing transistor spacing
- Patent number 11,239,072
- Issue date Feb 1, 2022
- Taiwan Semiconductor Manufacturing Co., Ltd
- Ming-Chang Wen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device having an air gap and method for fabricating t...
- Patent number 11,211,466
- Issue date Dec 28, 2021
- SK Hynix Inc.
- Se-Han Kwon
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Scalable device for FINFET technology
- Patent number 11,177,181
- Issue date Nov 16, 2021
- International Business Machines Corporation
- Ruilong Xie
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Etching method and a semiconductor device
- Patent number 11,152,220
- Issue date Oct 19, 2021
- Shanghai Huali Integrated Circuit Mfg. Co. Ltd.
- Penggang Han
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Etching method
- Patent number 11,127,597
- Issue date Sep 21, 2021
- Tokyo Electron Limited
- Reiko Sasahara
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method and apparatus for determining process rate
- Patent number 11,056,322
- Issue date Jul 6, 2021
- Lam Research Corporation
- Yassine Kabouzi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and manufacturing method thereof
- Patent number 11,004,858
- Issue date May 11, 2021
- Taiwan Semiconductor Manufacturing Co., Ltd
- Tsun-Kai Tsao
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for manufacturing a semiconductor device and semiconductor d...
- Patent number 10,950,455
- Issue date Mar 16, 2021
- Robert Bosch GmbH
- Zhenyu Wu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method and structure to construct cylindrical interconnects to redu...
- Patent number 10,943,866
- Issue date Mar 9, 2021
- International Business Machines Corporation
- Benjamin D. Briggs
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor structures including middle-of-line (MOL) capacitance...
- Patent number 10,937,861
- Issue date Mar 2, 2021
- Tessera, Inc.
- Injo Ok
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for manufacturing semiconductor device
- Patent number 10,910,260
- Issue date Feb 2, 2021
- Taiwan Semiconductor Manufacturing Co., Ltd
- Wei-Chieh Huang
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
INTEGRATED CIRCUIT DEVICE
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- Taiwan Semiconductor Manufacturing Co., Ltd.
- Meng-Han LIN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE WITH CONTACTS HAVING DIFFERENT DIMENSIONS AND...
- Publication number 20240006227
- Publication date Jan 4, 2024
- NANYA TECHNOLOGY CORPORATION
- TSE-YAO HUANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CUT METAL GATE PROCESS FOR REDUCING TRANSISTOR SPACING
- Publication number 20230377873
- Publication date Nov 23, 2023
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Ming-Chang Wen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Gallium Nitride Device with Field Plate Structure and Method of Man...
- Publication number 20230377952
- Publication date Nov 23, 2023
- UNITED MICROELECTRONICS CORP.
- Da-Jun Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD OF MANUFACTURING A SEMICONDUCTOR DEVICE AND A SEMICONDUCTOR...
- Publication number 20230268418
- Publication date Aug 24, 2023
- TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY , LTD.
- Kuo-Cheng CHIANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
AREA SELECTIVE AND DE-SELECTIVE ATOMIC LAYER DEPOSITION OF 360-DEGR...
- Publication number 20230261115
- Publication date Aug 17, 2023
- TOKYO ELECTRON LIMITED
- Mark I. Gardner
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE WITH CONTACTS HAVING DIFFERENT DIMENSIONS AND...
- Publication number 20230062967
- Publication date Mar 2, 2023
- NANYA TECHNOLOGY CORPORATION
- TSE-YAO HUANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Method for Providing Different Patterns on a Single Substrate
- Publication number 20220413380
- Publication date Dec 29, 2022
- IMEC vzw
- Sandeep Seema Saseendran
- G03 - PHOTOGRAPHY CINEMATOGRAPHY ELECTROGRAPHY HOLOGRAPHY
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POLISHING COMPOSITION AND METHOD FOR SELECTIVELY REMOVING SILICON N...
- Publication number 20220315801
- Publication date Oct 6, 2022
- Fujimi Incorporated
- Jingzhi CHEN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD FOR PRODUCING A DIODE
- Publication number 20220254686
- Publication date Aug 11, 2022
- STMicroelectronics (Crolles 2) SAS
- Gregory AVENIER
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SELECTIVE REMOVAL OF METAL OXIDE HARD MASKS
- Publication number 20220208553
- Publication date Jun 30, 2022
- Entegris, Inc.
- SeungHyun Chae
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
CUT METAL GATE PROCESS FOR REDUCING TRANSISTOR SPACING
- Publication number 20220157595
- Publication date May 19, 2022
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Ming-Chang Wen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ION BEAM ETCHING CHAMBER WITH ETCHING BY-PRODUCT REDISTRIBUTOR
- Publication number 20220148856
- Publication date May 12, 2022
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Te-Hsien Hsieh
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
INTEGRATED CIRCUIT DEVICE
- Publication number 20220139718
- Publication date May 5, 2022
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Meng-Han LIN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE HAVING AN AIR GAP AND METHOD FOR FABRICATING T...
- Publication number 20220077294
- Publication date Mar 10, 2022
- SK HYNIX INC.
- Se-Han KWON
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Scalable Device for FINFET Technology
- Publication number 20220037212
- Publication date Feb 3, 2022
- International Business Machines Corporation
- Ruilong Xie
- H01 - BASIC ELECTRIC ELEMENTS
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SEMICONDUCTOR MANUFACTURING APPARATUS AND METHOD FOR MANUFACTURING...
- Publication number 20210335622
- Publication date Oct 28, 2021
- HITACHI HIGH-TECH CORPORATION
- Yoshihide Yamaguchi
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD THEREOF
- Publication number 20210280593
- Publication date Sep 9, 2021
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Tsun-Kai TSAO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Scalable Device for FINFET Technology
- Publication number 20210217667
- Publication date Jul 15, 2021
- International Business Machines Corporation
- Ruilong Xie
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD THEREOF
- Publication number 20210183659
- Publication date Jun 17, 2021
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Meng-Han LIN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
COMPOSITION FOR ETCHING AND MANUFACTURING METHOD OF SEMICONDUCTOR D...
- Publication number 20210079266
- Publication date Mar 18, 2021
- SOULBRAIN CO., LTD
- Jae-Wan PARK
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COMPOSITION FOR ETCHING AND MANUFACTURING METHOD OF SEMICONDUCTOR D...
- Publication number 20210054237
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- SOULBRAIN CO., LTD
- Jae-Wan PARK
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COMPOSITION FOR ETCHING AND METHOD FOR MANUFACTURING SEMICONDUCTOR...
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- SOULBRAIN CO., LTD
- Jae-Wan PARK
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- Jae-Wan PARK
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- SOULBRAIN CO., LTD
- Jae-Wan PARK
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- Publication number 20210057539
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- Taiwan Semiconductor Manufacturing Co., Ltd.
- Kuo-Cheng CHIANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD FOR PRODUCING AT LEAST ONE DEVICE IN COMPRESSIVE STRAINED SE...
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- Commissariat A L'Energie Atomique et Aux Energies Alternatives
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POLISHING COMPOSITIONS AND METHODS OF USING SAME
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- Fujifilm Electronic Materials U.S.A., Inc.
- Eric Turner
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METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE
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- KABUSHIKI KAISHA TOSHIBA
- Tsuyoshi FUJITA
- H01 - BASIC ELECTRIC ELEMENTS

the removal being a selective chemical etching step

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Composition for etching and manufacturing method of semiconductor d...

Integrated circuit device

Semiconductor device and manufacturing method thereof

Semiconductor device having an air gap and method for fabricating t...

Cut metal gate process for reducing transistor spacing

Method of manufacturing a semiconductor device and a semiconductor...

Metal assisted chemical etching for fabricating high aspect ratio a...

Scalable device for FINFET technology

Semiconductor structures including middle-of-line (MOL) capacitance...

Method of making a semiconductor device including etching of a meta...

Composition for etching and manufacturing method of semiconductor d...

Method for producing at least one device in compressive strained se...

Composition for etching and manufacturing method of semiconductor d...

Atomic layer etching of metals

Composition for etching and manufacturing method of semiconductor d...

Method for producing a diode

Directional processing to remove a layer or a material formed over...

Semiconductor device and manufacturing method thereof

Ion beam etching chamber with etching by-product redistributor

Cut metal gate process for reducing transistor spacing

Semiconductor device having an air gap and method for fabricating t...

Scalable device for FINFET technology

Etching method and a semiconductor device

Etching method

Method and apparatus for determining process rate

Semiconductor device and manufacturing method thereof

Method for manufacturing a semiconductor device and semiconductor d...

Method and structure to construct cylindrical interconnects to redu...

Semiconductor structures including middle-of-line (MOL) capacitance...

Method for manufacturing semiconductor device

Patents Applicationslast 30 patents

INTEGRATED CIRCUIT DEVICE

SEMICONDUCTOR DEVICE WITH CONTACTS HAVING DIFFERENT DIMENSIONS AND...

CUT METAL GATE PROCESS FOR REDUCING TRANSISTOR SPACING

Gallium Nitride Device with Field Plate Structure and Method of Man...

METHOD OF MANUFACTURING A SEMICONDUCTOR DEVICE AND A SEMICONDUCTOR...

AREA SELECTIVE AND DE-SELECTIVE ATOMIC LAYER DEPOSITION OF 360-DEGR...

SEMICONDUCTOR DEVICE WITH CONTACTS HAVING DIFFERENT DIMENSIONS AND...

Method for Providing Different Patterns on a Single Substrate

POLISHING COMPOSITION AND METHOD FOR SELECTIVELY REMOVING SILICON N...

METHOD FOR PRODUCING A DIODE

SELECTIVE REMOVAL OF METAL OXIDE HARD MASKS

CUT METAL GATE PROCESS FOR REDUCING TRANSISTOR SPACING

ION BEAM ETCHING CHAMBER WITH ETCHING BY-PRODUCT REDISTRIBUTOR

INTEGRATED CIRCUIT DEVICE

SEMICONDUCTOR DEVICE HAVING AN AIR GAP AND METHOD FOR FABRICATING T...

Scalable Device for FINFET Technology

SEMICONDUCTOR MANUFACTURING APPARATUS AND METHOD FOR MANUFACTURING...

SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD THEREOF

Scalable Device for FINFET Technology

SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD THEREOF

COMPOSITION FOR ETCHING AND MANUFACTURING METHOD OF SEMICONDUCTOR D...

COMPOSITION FOR ETCHING AND MANUFACTURING METHOD OF SEMICONDUCTOR D...

COMPOSITION FOR ETCHING AND METHOD FOR MANUFACTURING SEMICONDUCTOR...

COMPOSITION FOR ETCHING AND MANUFACTURING METHOD OF SEMICONDUCTOR D...

COMPOSITION FOR ETCHING AND MANUFACTURING METHOD OF SEMICONDUCTOR D...

COMPOSITION FOR ETCHING AND MANUFACTURING METHOD OF SEMICONDUCTOR D...

METHOD OF MANUFACTURING A SEMICONDUCTOR DEVICE AND A SEMICONDUCTOR...

METHOD FOR PRODUCING AT LEAST ONE DEVICE IN COMPRESSIVE STRAINED SE...

POLISHING COMPOSITIONS AND METHODS OF USING SAME

METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE