the storage electrode stacked over transistor

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H01L27/10808

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HELECTRICITY H01Electric elements H01LSEMICONDUCTOR DEVICES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR H01L27/00Devices consisting of a plurality of semiconductor or other solid state components formed in or on a common substrate

Current Industry

H01L27/10808the storage electrode stacked over transistor

Industries

Patents Grantslast 30 patents

Information Patent Grant
Semiconductor constructions, and semiconductor processing methods
- Patent number 11,678,477
- Issue date Jun 13, 2023
- Micron Technology, Inc.
- Mark Kiehlbauch
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Integrated assemblies and methods of forming integrated assemblies
- Patent number 11,670,707
- Issue date Jun 6, 2023
- Micron Technology, Inc.
- David K. Hwang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device
- Patent number 11,670,673
- Issue date Jun 6, 2023
- Samsung Electronics Co., Ltd.
- Hyun-suk Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor memory device
- Patent number 11,665,882
- Issue date May 30, 2023
- Kioxia Corporation
- Masaharu Wada
- G11 - INFORMATION STORAGE
Information Patent Grant
Integrated assemblies containing diffusion alleviating two-dimensio...
- Patent number 11,658,242
- Issue date May 23, 2023
- Micron Technology, Inc.
- Kamal M. Karda
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Apparatuses and methods for controlling structure of bottom electro...
- Patent number 11,647,624
- Issue date May 9, 2023
- Micron Technology, Inc.
- Akira Kaneko
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor memory devices including stacked transistors and meth...
- Patent number 11,637,104
- Issue date Apr 25, 2023
- Samsung Electronics Co., Ltd.
- Yong-Hoon Son
- G11 - INFORMATION STORAGE
Information Patent Grant
Integrated circuit device and method of manufacturing the same
- Patent number 11,637,174
- Issue date Apr 25, 2023
- Samsung Electronics Co., Ltd.
- Yoonyoung Choi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Bonded unified semiconductor chips and fabrication and operation me...
- Patent number 11,631,688
- Issue date Apr 18, 2023
- Yangtze Memory Technologies Co., Ltd.
- Jun Liu
- G11 - INFORMATION STORAGE
Information Patent Grant
Interconnect structure to reduce contact resistance, electronic dev...
- Patent number 11,626,502
- Issue date Apr 11, 2023
- Samsung Electronics Co., Ltd.
- Hyeonjin Shin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
DRAM with selective epitaxial cell transistor
- Patent number 11,626,407
- Issue date Apr 11, 2023
- Integrated Silicon Solution, (Cayman) Inc.
- Andrew J. Walker
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device including a plurality of electrodes and suppor...
- Patent number 11,626,476
- Issue date Apr 11, 2023
- Samsung Electronics Co., Ltd.
- Ha-young Yi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Capacitor structures for memory and method of manufacturing the same
- Patent number 11,610,964
- Issue date Mar 21, 2023
- Powerchip Semiconductor Manufacturing Corporation
- Kai-Jyun Huang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device including insulating layers and method of manu...
- Patent number 11,605,714
- Issue date Mar 14, 2023
- Samsung Electronics Co., Ltd.
- Dong Kak Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for preparing semiconductor device with metal plug having ro...
- Patent number 11,605,557
- Issue date Mar 14, 2023
- NANYA TECHNOLOGY CORPORATION
- Chun-Heng Wu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Transistors and memory arrays
- Patent number 11,605,723
- Issue date Mar 14, 2023
- Micron Technology, Inc.
- Scott E. Sills
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device with composite dielectric structure and method...
- Patent number 11,594,539
- Issue date Feb 28, 2023
- NANYA TECHNOLOGY CORPORATION
- Tse-Yao Huang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Capacitor, semiconductor device including the same, and method of f...
- Patent number 11,594,592
- Issue date Feb 28, 2023
- Samsung Electronics Co., Ltd.
- Jeonggyu Song
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Three-dimensional memory device with embedded dynamic random-access...
- Patent number 11,551,753
- Issue date Jan 10, 2023
- Yangtze Memory Technologies Co., Ltd.
- Jun Liu
- G11 - INFORMATION STORAGE
Information Patent Grant
Dynamic random access memory device and method of fabricating the same
- Patent number 11,538,823
- Issue date Dec 27, 2022
- Chen-Chih Wang
- G11 - INFORMATION STORAGE
Information Patent Grant
System-on-chip with ferroelectric random access memory and tunable...
- Patent number 11,527,542
- Issue date Dec 13, 2022
- Taiwan Semiconductor Manufacturing Co., Ltd
- Sai-Hooi Yeong
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Contact electrodes for vertical thin-film transistors
- Patent number 11,527,656
- Issue date Dec 13, 2022
- Intel Corporation
- Van H. Le
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor structure formation at differential depths
- Patent number 11,515,311
- Issue date Nov 29, 2022
- Micron Technology, Inc.
- Venkata Naveen Kumar Neelapala
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Channel and body region formation for semiconductor devices
- Patent number 11,495,604
- Issue date Nov 8, 2022
- Micron Technology, Inc.
- Si-Woo Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and manufacturing method of semiconductor device
- Patent number 11,495,601
- Issue date Nov 8, 2022
- Semiconductor Energy Laboratory Co., Ltd.
- Shunpei Yamazaki
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor structure and manufacturing method thereof
- Patent number 11,495,605
- Issue date Nov 8, 2022
- Winbond Electronics Corp.
- Chi-An Wang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor structure and method for manufacturing the same
- Patent number 11,488,957
- Issue date Nov 1, 2022
- NANYA TECHNOLOGY CORPORATION
- Li-Han Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Integrated assemblies having body contact regions proximate transis...
- Patent number 11,476,256
- Issue date Oct 18, 2022
- Micron Technology, Inc.
- Werner Juengling
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Array of recessed access gate lines
- Patent number 11,462,544
- Issue date Oct 4, 2022
- Micron Technology, Inc.
- Sanh D. Tang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor apparatus having stacked devices and method of manufa...
- Patent number 11,450,671
- Issue date Sep 20, 2022
- Tokyo Electron Limited
- Lars Liebmann
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
HYBRID MANUFACTURING OF ACCESS TRANSISTORS FOR MEMORY
- Publication number 20240098965
- Publication date Mar 21, 2024
- Intel Corporation
- Abhishek A. Sharma
- G11 - INFORMATION STORAGE
Information Patent Application
APPARATUS COMPRISING A METAL PORTION IN THE TOP PORTION OF CAPACITO...
- Publication number 20240090197
- Publication date Mar 14, 2024
- Micron Technology, Inc.
- Harutaka Honda
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR MEMORY DEVICE AND METHOD OF FABRICATING THE SAME
- Publication number 20240064960
- Publication date Feb 22, 2024
- Fujian Jinhua Integrated Circuit Co., Ltd.
- Janbo Zhang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MEMORY DEVICE INCLUDING STRUCTURES IN MEMORY ARRAY REGION AND PERIP...
- Publication number 20240064972
- Publication date Feb 22, 2024
- Micron Technology, Inc.
- Si-Woo Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR STRUCTURE HAVING AIR GAP
- Publication number 20240008252
- Publication date Jan 4, 2024
- NANYA TECHNOLOGY CORPORATION
- Lu-Wei CHUNG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR STRUCTURE AND MANUFACTURING METHOD THEREOF
- Publication number 20230369390
- Publication date Nov 16, 2023
- NANYA TECHNOLOGY CORPORATION
- Chia Che CHIANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE WITH T-SHAPED LANDING PAD STRUCTURE
- Publication number 20230326853
- Publication date Oct 12, 2023
- NANYA TECHNOLOGY CORPORATION
- MIN-CHUNG CHENG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR STRUCTURE AND METHOD OF FORMING THE SAME
- Publication number 20230326957
- Publication date Oct 12, 2023
- NANYA TECHNOLOGY CORPORATION
- Shih-Ting HUANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD FOR MANUFACTURING SEMICONDUCTOR DEVICE HAVING DIODE CONNECTE...
- Publication number 20230320064
- Publication date Oct 5, 2023
- NANYA TECHNOLOGY CORPORATION
- Hsih-Yang CHIU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE HAVING DIODE CONNECTEDTO MEMORY DEVICE AND CIR...
- Publication number 20230320081
- Publication date Oct 5, 2023
- NANYA TECHNOLOGY CORPORATION
- Hsih-Yang CHIU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD OF PREPARING SEMICONDUCTOR STRUCTURE HAVING LOW DIELECTRIC C...
- Publication number 20230320059
- Publication date Oct 5, 2023
- NANYA TECHNOLOGY CORPORATION
- YU-KAI LU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
THREE-DIMENSIONAL INTEGRATED STRUCTURE AND MANUFACTURING METHOD THE...
- Publication number 20230307351
- Publication date Sep 28, 2023
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Yun-Feng Kao
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
DOPED METAL-INSULATOR-METAL (MIM) CAPACITOR OF A MEMORY ARRAY
- Publication number 20230290812
- Publication date Sep 14, 2023
- Intel Corporation
- Travis Lajoie
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CONTACT STRUCTURE, METHOD OF MANUFACTURING CONTACT STRUCTURE, AND S...
- Publication number 20230262963
- Publication date Aug 17, 2023
- CHANGXIN MEMORY TECHNOLOGIES, INC
- Haiyan Wang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
3D STACKED DRAM WITH 3D VERTICAL CIRCUIT DESIGN
- Publication number 20230225109
- Publication date Jul 13, 2023
- TOKYO ELECTRON LIMITED
- H. Jim Fulford
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Transistors, Array Of Transistors, And Array Of Memory Cells Indivi...
- Publication number 20230207699
- Publication date Jun 29, 2023
- Micron Technology, Inc.
- Kamal M. Karda
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD OF MAKING OF PLURALITY OF 3D VERTICAL LOGIC ELEMENTS INTEGRA...
- Publication number 20230200052
- Publication date Jun 22, 2023
- TOKYO ELECTRON LIMITED
- H. Jim Fulford
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
DIELECTRIC HAVING HIGH-DIELECTRIC CONSTANT, METHOD OF MANUFACTURING...
- Publication number 20230178584
- Publication date Jun 8, 2023
- Samsung Electronics Co., Ltd.
- Hyungjun KIM
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
DYNAMIC RANDOM ACCESS MEMORY DEVICES WITH ENHANCED DATA RETENTION A...
- Publication number 20230164975
- Publication date May 25, 2023
- Taiwan Semiconductor Manufacturing Company Limited
- Hung-Li CHIANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD FOR FORMING SEMICONDUCTOR DEVICE WITH COMPOSITE DIELECTRIC S...
- Publication number 20230128805
- Publication date Apr 27, 2023
- NANYA TECHNOLOGY CORPORATION
- TSE-YAO HUANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR MEMORY DEVICE AND METHOD OF MANUFACTURING THE SEMICON...
- Publication number 20230126213
- Publication date Apr 27, 2023
- SK HYNIX INC.
- Won Geun CHOI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR MEMORY PREPARATION METHOD AND SEMICONDUCTOR MEMORY
- Publication number 20230103594
- Publication date Apr 6, 2023
- CHANGXIN MEMORY TECHNOLOGIES, INC.
- Kui ZHANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CAPACITOR, MEMORY DEVICE INCLUDING THE CAPACITOR, AND METHOD OF MAN...
- Publication number 20230102906
- Publication date Mar 30, 2023
- Samsung Electronics Co., Ltd.
- Changsoo LEE
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND METHOD FOR FABRICATING THE SAME
- Publication number 20230094890
- Publication date Mar 30, 2023
- NANYA TECHNOLOGY CORPORATION
- Tsu-Chieh AI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE, POWER STORAGE DEVICE, BATTERY MANAGEMENT CIRC...
- Publication number 20230100524
- Publication date Mar 30, 2023
- SEMICONDUCTOR ENERGY LABORATORY CO., LTD.
- Takayuki IKEDA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
GRAPHITIC CARBON CONTACTS FOR DEVICES WITH OXIDE CHANNELS
- Publication number 20230102219
- Publication date Mar 30, 2023
- Intel Corporation
- Arnab Sen Gupta
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE
- Publication number 20230099168
- Publication date Mar 30, 2023
- SEMICONDUCTOR ENERGY LABORATORY CO., LTD.
- Yuki OKAMOTO
- G11 - INFORMATION STORAGE
Information Patent Application
INTEGRATED CIRCUIT DEVICES WITH FINFETS OVER GATE-ALL-AROUND TRANSI...
- Publication number 20230086977
- Publication date Mar 23, 2023
- Intel Corporation
- Prashant Majhi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR MEMORY DEVICE AND FABRICATION METHOD THEREOF
- Publication number 20230092928
- Publication date Mar 23, 2023
- Fujian Jinhua Integrated Circuit Co., Ltd.
- Janbo Zhang
- G11 - INFORMATION STORAGE
Information Patent Application
SEMICONDUCTOR STRUCTURE AND MANUFACTURING METHOD THEREOF
- Publication number 20230068654
- Publication date Mar 2, 2023
- CHANGXIN MEMORY TECHNOLOGIES, INC
- Xiang LIU
- H01 - BASIC ELECTRIC ELEMENTS

the storage electrode stacked over transistor

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Semiconductor constructions, and semiconductor processing methods

Integrated assemblies and methods of forming integrated assemblies

Semiconductor device

Semiconductor memory device

Integrated assemblies containing diffusion alleviating two-dimensio...

Apparatuses and methods for controlling structure of bottom electro...

Semiconductor memory devices including stacked transistors and meth...

Integrated circuit device and method of manufacturing the same

Bonded unified semiconductor chips and fabrication and operation me...

Interconnect structure to reduce contact resistance, electronic dev...

DRAM with selective epitaxial cell transistor

Semiconductor device including a plurality of electrodes and suppor...

Capacitor structures for memory and method of manufacturing the same

Semiconductor device including insulating layers and method of manu...

Method for preparing semiconductor device with metal plug having ro...

Transistors and memory arrays

Semiconductor device with composite dielectric structure and method...

Capacitor, semiconductor device including the same, and method of f...

Three-dimensional memory device with embedded dynamic random-access...

Dynamic random access memory device and method of fabricating the same

System-on-chip with ferroelectric random access memory and tunable...

Contact electrodes for vertical thin-film transistors

Semiconductor structure formation at differential depths

Channel and body region formation for semiconductor devices

Semiconductor device and manufacturing method of semiconductor device

Semiconductor structure and manufacturing method thereof

Semiconductor structure and method for manufacturing the same

Integrated assemblies having body contact regions proximate transis...

Array of recessed access gate lines

Semiconductor apparatus having stacked devices and method of manufa...

Patents Applicationslast 30 patents

HYBRID MANUFACTURING OF ACCESS TRANSISTORS FOR MEMORY

APPARATUS COMPRISING A METAL PORTION IN THE TOP PORTION OF CAPACITO...

SEMICONDUCTOR MEMORY DEVICE AND METHOD OF FABRICATING THE SAME

MEMORY DEVICE INCLUDING STRUCTURES IN MEMORY ARRAY REGION AND PERIP...

SEMICONDUCTOR STRUCTURE HAVING AIR GAP

SEMICONDUCTOR STRUCTURE AND MANUFACTURING METHOD THEREOF

SEMICONDUCTOR DEVICE WITH T-SHAPED LANDING PAD STRUCTURE

SEMICONDUCTOR STRUCTURE AND METHOD OF FORMING THE SAME

METHOD FOR MANUFACTURING SEMICONDUCTOR DEVICE HAVING DIODE CONNECTE...

SEMICONDUCTOR DEVICE HAVING DIODE CONNECTEDTO MEMORY DEVICE AND CIR...

METHOD OF PREPARING SEMICONDUCTOR STRUCTURE HAVING LOW DIELECTRIC C...

THREE-DIMENSIONAL INTEGRATED STRUCTURE AND MANUFACTURING METHOD THE...

DOPED METAL-INSULATOR-METAL (MIM) CAPACITOR OF A MEMORY ARRAY

CONTACT STRUCTURE, METHOD OF MANUFACTURING CONTACT STRUCTURE, AND S...

3D STACKED DRAM WITH 3D VERTICAL CIRCUIT DESIGN

Transistors, Array Of Transistors, And Array Of Memory Cells Indivi...

METHOD OF MAKING OF PLURALITY OF 3D VERTICAL LOGIC ELEMENTS INTEGRA...

DIELECTRIC HAVING HIGH-DIELECTRIC CONSTANT, METHOD OF MANUFACTURING...

DYNAMIC RANDOM ACCESS MEMORY DEVICES WITH ENHANCED DATA RETENTION A...

METHOD FOR FORMING SEMICONDUCTOR DEVICE WITH COMPOSITE DIELECTRIC S...

SEMICONDUCTOR MEMORY DEVICE AND METHOD OF MANUFACTURING THE SEMICON...

SEMICONDUCTOR MEMORY PREPARATION METHOD AND SEMICONDUCTOR MEMORY

CAPACITOR, MEMORY DEVICE INCLUDING THE CAPACITOR, AND METHOD OF MAN...

SEMICONDUCTOR DEVICE AND METHOD FOR FABRICATING THE SAME

SEMICONDUCTOR DEVICE, POWER STORAGE DEVICE, BATTERY MANAGEMENT CIRC...

GRAPHITIC CARBON CONTACTS FOR DEVICES WITH OXIDE CHANNELS

SEMICONDUCTOR DEVICE

INTEGRATED CIRCUIT DEVICES WITH FINFETS OVER GATE-ALL-AROUND TRANSI...

SEMICONDUCTOR MEMORY DEVICE AND FABRICATION METHOD THEREOF

SEMICONDUCTOR STRUCTURE AND MANUFACTURING METHOD THEREOF