the substrate being a semiconductor, using SiC technology

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HELECTRICITY H01Electric elements H01LSEMICONDUCTOR DEVICES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR H01L21/00Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof

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H01L21/8213the substrate being a semiconductor, using SiC technology

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Patents Grantslast 30 patents

Information Patent Grant
Method for separating dies from a semiconductor substrate
- Patent number 12,170,226
- Issue date Dec 17, 2024
- Infineon Technologies AG
- Franz-Josef Pichler
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Silicon carbide semiconductor power transistor and method of manufa...
- Patent number 12,166,082
- Issue date Dec 10, 2024
- LEAP Semiconductor Corp.
- Wei-Fan Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Concept for silicon carbide power devices
- Patent number 12,034,001
- Issue date Jul 9, 2024
- II-VI ADVANCED MATERIALS, LLC
- Adolf Schoner
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Three-dimensional packaging structure and method for fan-out of bon...
- Patent number 12,014,965
- Issue date Jun 18, 2024
- Xiamen Sky Semiconductor Technology Co. Ltd.
- Daquan Yu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Singulation process for chiplets
- Patent number 11,972,970
- Issue date Apr 30, 2024
- HRL Laboratories, LLC
- Florian G. Herrault
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Two dimension material fin sidewall
- Patent number 11,929,286
- Issue date Mar 12, 2024
- TESSERA LLC
- Sami Rosenblatt
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
SiC multilayer body, production method therefor, and semiconductor...
- Patent number 11,862,460
- Issue date Jan 2, 2024
- CUSIC INC.
- Hiroyuki Nagasawa
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Laser-assisted method for parting crystalline material
- Patent number 11,826,846
- Issue date Nov 28, 2023
- Wolfspeed, Inc.
- Matthew Donofrio
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Structure for silicon carbide integrated power MOSFETs on a single...
- Patent number 11,798,938
- Issue date Oct 24, 2023
- CoolCAD Electronics, LLC
- Neil Goldsman
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device
- Patent number 11,777,030
- Issue date Oct 3, 2023
- Rohm Co., Ltd.
- Shuhei Mitani
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Concept for silicon for carbide power devices
- Patent number 11,652,099
- Issue date May 16, 2023
- II-VI DELAWARE, INC.
- Adolf Schöner
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of making a silicon carbide integrated circuit
- Patent number 11,626,325
- Issue date Apr 11, 2023
- Raytheon Systems Limited
- David Trann Clark
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device
- Patent number 11,610,992
- Issue date Mar 21, 2023
- Rohm Co., Ltd.
- Shuhei Mitani
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Silicon carbide integrated circuit
- Patent number 11,450,568
- Issue date Sep 20, 2022
- Raytheon Systems Limited
- David Trann Clark
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Two dimension material fin sidewall
- Patent number 11,424,365
- Issue date Aug 23, 2022
- TESSERA LLC
- Sami Rosenblatt
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device having temperature sensing portions and method...
- Patent number 11,404,408
- Issue date Aug 2, 2022
- Fuji Electric Co., Ltd.
- Yasuyuki Hoshi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device, method of manufacturing same, and sensor
- Patent number 11,380,764
- Issue date Jul 5, 2022
- Hitachi, Ltd.
- Masahiro Masunaga
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device
- Patent number 11,296,223
- Issue date Apr 5, 2022
- Rohm Co., Ltd.
- Shuhei Mitani
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Concept for silicon carbide power devices
- Patent number 11,276,681
- Issue date Mar 15, 2022
- II-VI DELAWARE, INC.
- Adolf Schöner
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Wafer processing method
- Patent number 11,171,056
- Issue date Nov 9, 2021
- Disco Corporation
- Naoko Yamamoto
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Structure and a manufacturing method of a MOSFET with an element of...
- Patent number 11,121,235
- Issue date Sep 14, 2021
- National Tsing Hua University
- Chih-Fang Huang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of making reverse conducting insulated gate bipolar transistor
- Patent number 11,101,137
- Issue date Aug 24, 2021
- ALPHA AND OMEGA SEMICONDUCTOR INTERNATIONAL LP
- Zhiqiang Niu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for splitting semiconductor wafers
- Patent number 11,081,393
- Issue date Aug 3, 2021
- Infineon Technologies AG
- Christian Beyer
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device
- Patent number 11,043,589
- Issue date Jun 22, 2021
- Rohm Co., Ltd.
- Shuhei Mitani
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for processing semiconductor wafers using a grinding wheel
- Patent number 10,974,365
- Issue date Apr 13, 2021
- Infineon Technologies AG
- Rudolf Lehner
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and method of manufacturing semiconductor device
- Patent number 10,943,997
- Issue date Mar 9, 2021
- Fuji Electric Co., Ltd.
- Takeyoshi Nishimura
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Photodetector in a silicon carbide integrated circuit
- Patent number 10,910,414
- Issue date Feb 2, 2021
- CoolCAD Electronics, LLC
- Neil Goldsman
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electric assembly including an insulated gate bipolar transistor de...
- Patent number 10,886,909
- Issue date Jan 5, 2021
- Infineon Technologies AG
- Roman Baburske
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for manufacturing circulators with improved performance
- Patent number 10,847,858
- Issue date Nov 24, 2020
- Qorvo US, Inc.
- Yu Cao
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Silicon carbide-based transistor and method for manufacturing the same
- Patent number 10,825,896
- Issue date Nov 3, 2020
- Sogang University Research Foundation
- Kwang Soo Kim
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
VERTICAL JUNCTION FIELD-EFFECT TRANSISTORS WITH SOURCE-DRAIN DIODE...
- Publication number 20240421151
- Publication date Dec 19, 2024
- Qorvo US, Inc.
- Zhongda Li
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD FOR SEPARATING DIES FROM A SEMICONDUCTOR SUBSTRATE
- Publication number 20240339361
- Publication date Oct 10, 2024
- INFINEON TECHNOLOGIES AG
- Franz-Josef Pichler
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CONCEPT FOR SILICON CARBIDE POWER DEVICES
- Publication number 20240321868
- Publication date Sep 26, 2024
- II-VI ADVANCED MATERIALS, LLC
- Adolf SCHONER
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD THEREOF
- Publication number 20240266351
- Publication date Aug 8, 2024
- NATIONAL INSTITUTE OF ADVANCED INDUSTRIAL SCIENCE AND TECHNOLOGY
- Mitsuo OKAMOTO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE
- Publication number 20240258173
- Publication date Aug 1, 2024
- Mitsuboshi Diamond Industrial Co., Ltd.
- Mitsuru KITAICHI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
TRANSISTORS WITH SELECTIVELY LANDED GATE ARRAY
- Publication number 20240153850
- Publication date May 9, 2024
- Semiconductor Components Industries, LLC
- Jimmy Robert Hannes FRANCHI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
WAFER PROCESSING METHOD AND DEVICE CHIP MANUFACTURING METHOD
- Publication number 20240105513
- Publication date Mar 28, 2024
- Disco Corporation
- Kazuma SEKIYA
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
METHOD OF MANUFACTURING SILICON CARBIDE SEMICONDUCTOR POWER DEVICE
- Publication number 20240021478
- Publication date Jan 18, 2024
- LEAP Semiconductor Corp.
- Wei-Fan Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICES HAVING ON-CHIP GATE RESISTORS
- Publication number 20230420451
- Publication date Dec 28, 2023
- Wolfspeed, Inc.
- Rahul R. Potera
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE
- Publication number 20230395713
- Publication date Dec 7, 2023
- Rohm Co., Ltd.
- Shuhei MITANI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SILICON CARBIDE SEMICONDUCTOR POWER TRANSISTOR AND METHOD OF MANUFA...
- Publication number 20230326972
- Publication date Oct 12, 2023
- LEAP Semiconductor Corp.
- Wei-Fan Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SiC MULTILAYER BODY, PRODUCTION METHOD THEREFOR, AND SEMICONDUCTOR...
- Publication number 20230298886
- Publication date Sep 21, 2023
- CUSIC INC.
- Hiroyuki NAGASAWA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CONCEPT FOR SILICON FOR CARBIDE POWER DEVICES
- Publication number 20230246020
- Publication date Aug 3, 2023
- II-VI Delaware, Inc.
- Adolf Schöner
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD OF MANUFACTURING CHIP
- Publication number 20230044283
- Publication date Feb 9, 2023
- Disco Corporation
- Fumiya KAWANO
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
METHOD FOR SPLITTING SEMICONDUCTOR WAFERS
- Publication number 20230005794
- Publication date Jan 5, 2023
- INFINEON TECHNOLOGIES AG
- Christian Beyer
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
TWO DIMENSION MATERIAL FIN SIDEWALL
- Publication number 20220352376
- Publication date Nov 3, 2022
- TESSERA LLC
- Sami Rosenblatt
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE
- Publication number 20220181487
- Publication date Jun 9, 2022
- Rohm Co., Ltd.
- Shuhei MITANI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
THREE-DIMENSIONAL PACKAGING STRUCTURE AND METHOD FOR FAN-OUT OF BON...
- Publication number 20220165632
- Publication date May 26, 2022
- Xiamen Sky Semiconductor Technology Co. Ltd.
- Daquan YU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CONCEPT FOR SILICON FOR CARBIDE POWER DEVICES
- Publication number 20220139906
- Publication date May 5, 2022
- II-VI Delaware, Inc.
- Adolf Schöner
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
STRUCTURE FOR SILICON CARBIDE INTEGRATED POWER MOSFETS ON A SINGLE...
- Publication number 20220115373
- Publication date Apr 14, 2022
- CoolCAD Electronics, LLC
- Neil GOLDSMAN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE
- Publication number 20210399130
- Publication date Dec 23, 2021
- Rohm Co., Ltd.
- Shuhei MITANI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE
- Publication number 20210280715
- Publication date Sep 9, 2021
- Rohm Co., Ltd.
- Shuhei MITANI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Method for Splitting Semiconductor Wafers
- Publication number 20210175123
- Publication date Jun 10, 2021
- INFINEON TECHNOLOGIES AG
- Christian Beyer
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING A SEMICONDUCTOR DE...
- Publication number 20210013196
- Publication date Jan 14, 2021
- Fuji Electric Co., Ltd.
- Yasuyuki HOSHI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE
- Publication number 20200411687
- Publication date Dec 31, 2020
- Rohm Co., Ltd.
- Shuhei MITANI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
LASER-ASSISTED METHOD FOR PARTING CRYSTALLINE MATERIAL
- Publication number 20200316724
- Publication date Oct 8, 2020
- Cree, Inc.
- Matthew Donofrio
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
Method for Processing Semiconductor Wafers Using a Grinding Wheel
- Publication number 20200298369
- Publication date Sep 24, 2020
- Rudolf Lehner
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD FOR MANUFACTURING CIRCULATORS WITH IMPROVED PERFORMANCE
- Publication number 20200287262
- Publication date Sep 10, 2020
- Qorvo US, Inc.
- Yu Cao
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
A CONCEPT FOR SILICON CARBIDE POWER DEVICES
- Publication number 20200243513
- Publication date Jul 30, 2020
- ASCATRON AB
- Adolf SCHÖNER
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
TWO DIMENSION MATERIAL FIN SIDEWALL
- Publication number 20200219873
- Publication date Jul 9, 2020
- Tessera, Inc.
- Sami Rosenblatt
- H01 - BASIC ELECTRIC ELEMENTS

the substrate being a semiconductor, using SiC technology

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Method for separating dies from a semiconductor substrate

Silicon carbide semiconductor power transistor and method of manufa...

Concept for silicon carbide power devices

Three-dimensional packaging structure and method for fan-out of bon...

Singulation process for chiplets

Two dimension material fin sidewall

SiC multilayer body, production method therefor, and semiconductor...

Laser-assisted method for parting crystalline material

Structure for silicon carbide integrated power MOSFETs on a single...

Semiconductor device

Concept for silicon for carbide power devices

Method of making a silicon carbide integrated circuit

Semiconductor device

Silicon carbide integrated circuit

Two dimension material fin sidewall

Semiconductor device having temperature sensing portions and method...

Semiconductor device, method of manufacturing same, and sensor

Semiconductor device

Concept for silicon carbide power devices

Wafer processing method

Structure and a manufacturing method of a MOSFET with an element of...

Method of making reverse conducting insulated gate bipolar transistor

Method for splitting semiconductor wafers

Semiconductor device

Method for processing semiconductor wafers using a grinding wheel

Semiconductor device and method of manufacturing semiconductor device

Photodetector in a silicon carbide integrated circuit

Electric assembly including an insulated gate bipolar transistor de...

Method for manufacturing circulators with improved performance

Silicon carbide-based transistor and method for manufacturing the same

Patents Applicationslast 30 patents

VERTICAL JUNCTION FIELD-EFFECT TRANSISTORS WITH SOURCE-DRAIN DIODE...

METHOD FOR SEPARATING DIES FROM A SEMICONDUCTOR SUBSTRATE

CONCEPT FOR SILICON CARBIDE POWER DEVICES

SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD THEREOF

SEMICONDUCTOR DEVICE

TRANSISTORS WITH SELECTIVELY LANDED GATE ARRAY

WAFER PROCESSING METHOD AND DEVICE CHIP MANUFACTURING METHOD

METHOD OF MANUFACTURING SILICON CARBIDE SEMICONDUCTOR POWER DEVICE

SEMICONDUCTOR DEVICES HAVING ON-CHIP GATE RESISTORS

SEMICONDUCTOR DEVICE

SILICON CARBIDE SEMICONDUCTOR POWER TRANSISTOR AND METHOD OF MANUFA...

SiC MULTILAYER BODY, PRODUCTION METHOD THEREFOR, AND SEMICONDUCTOR...

CONCEPT FOR SILICON FOR CARBIDE POWER DEVICES

METHOD OF MANUFACTURING CHIP

METHOD FOR SPLITTING SEMICONDUCTOR WAFERS

TWO DIMENSION MATERIAL FIN SIDEWALL

SEMICONDUCTOR DEVICE

THREE-DIMENSIONAL PACKAGING STRUCTURE AND METHOD FOR FAN-OUT OF BON...

CONCEPT FOR SILICON FOR CARBIDE POWER DEVICES

STRUCTURE FOR SILICON CARBIDE INTEGRATED POWER MOSFETS ON A SINGLE...

SEMICONDUCTOR DEVICE

SEMICONDUCTOR DEVICE

Method for Splitting Semiconductor Wafers

SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING A SEMICONDUCTOR DE...

SEMICONDUCTOR DEVICE

LASER-ASSISTED METHOD FOR PARTING CRYSTALLINE MATERIAL

Method for Processing Semiconductor Wafers Using a Grinding Wheel

METHOD FOR MANUFACTURING CIRCULATORS WITH IMPROVED PERFORMANCE

A CONCEPT FOR SILICON CARBIDE POWER DEVICES

TWO DIMENSION MATERIAL FIN SIDEWALL