the substrate on which the devices are formed not being the final device substrate

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CPC
H01L27/1266

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HELECTRICITY H01Electric elements H01LSEMICONDUCTOR DEVICES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR H01L27/00Devices consisting of a plurality of semiconductor or other solid state components formed in or on a common substrate

Current Industry

H01L27/1266the substrate on which the devices are formed not being the final device substrate

Industries

Patents Grantslast 30 patents

Information Patent Grant
Thin film transistor including crystallized semiconductor, display...
- Patent number 12,176,353
- Issue date Dec 24, 2024
- ADRC. CO. KR
- Youngbin Do
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Integrated logic and passive device structure
- Patent number 12,176,410
- Issue date Dec 24, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd
- Chung-Liang Cheng
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Display device
- Patent number 12,170,291
- Issue date Dec 17, 2024
- Hisao Ikeda
- G09 - EDUCATION CRYPTOGRAPHY DISPLAY ADVERTISING SEALS
Information Patent Grant
Stack for manufacturing flexible element and method for manufacturi...
- Patent number 12,154,815
- Issue date Nov 26, 2024
- LG Chem, Ltd.
- Chae Won Park
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Methods for producing a 3D semiconductor memory device and structure
- Patent number 12,154,817
- Issue date Nov 26, 2024
- Monolithic 3D Inc.
- Zvi Or-Bach
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Display device and method for manufacturing display device
- Patent number 12,154,906
- Issue date Nov 26, 2024
- Semiconductor Energy Laboratory Co., Ltd.
- Shunpei Yamazaki
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Display device and tiled display device including the same
- Patent number 12,148,767
- Issue date Nov 19, 2024
- Samsung Display Co., Ltd.
- Se Hoon Jeong
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
3D semiconductor device and structure with single-crystal layers
- Patent number 12,136,562
- Issue date Nov 5, 2024
- Monolithic 3D Inc.
- Zvi Or-Bach
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
3D semiconductor device and structure with metal layers and memory...
- Patent number 12,125,737
- Issue date Oct 22, 2024
- Monolithic 3D Inc.
- Zvi Or-Bach
- G11 - INFORMATION STORAGE
Information Patent Grant
Display device and method of manufacturing the same
- Patent number 12,120,943
- Issue date Oct 15, 2024
- Samsung Display Co., Ltd.
- Wang Woo Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Backside gate contact, backside gate etch stop layer, and methods o...
- Patent number 12,119,271
- Issue date Oct 15, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd
- Yi-Bo Liao
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and method for manufacturing the same
- Patent number 12,113,074
- Issue date Oct 8, 2024
- Semiconductor Energy Laboratory Co., Ltd.
- Shunpei Yamazaki
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Methods for producing a 3D semiconductor device and structure with...
- Patent number 12,100,611
- Issue date Sep 24, 2024
- Monolithic 3D Inc.
- Zvi Or-Bach
- G11 - INFORMATION STORAGE
Information Patent Grant
Flexible display device that suppresses peeling of a layered structure
- Patent number 12,087,779
- Issue date Sep 10, 2024
- SHARP KABUSHIKI KAISHA
- Tetsunori Tanaka
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of placing a micro device to a receiver substrate
- Patent number 12,080,685
- Issue date Sep 3, 2024
- VueReal Inc.
- Gholamreza Chaji
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
3D semiconductor device and structure with bonding and DRAM memory...
- Patent number 12,068,187
- Issue date Aug 20, 2024
- Monolithic 3D Inc.
- Zvi Or-Bach
- G11 - INFORMATION STORAGE
Information Patent Grant
Display device and method for manufacturing the same
- Patent number 12,048,207
- Issue date Jul 23, 2024
- Semiconductor Energy Laboratory Co., Ltd.
- Shunpei Yamazaki
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Package having bonding layers
- Patent number 12,046,579
- Issue date Jul 23, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd
- Ming-Fa Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Methods for producing a 3D semiconductor device and structure with...
- Patent number 12,033,884
- Issue date Jul 9, 2024
- Monolithic 3D Inc.
- Zvi Or-Bach
- G11 - INFORMATION STORAGE
Information Patent Grant
Display device and method of manufacturing the display device
- Patent number 12,002,815
- Issue date Jun 4, 2024
- Samsung Display Co., Ltd.
- Jihyun Kim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Integrated circuit on flexible substrate manufacturing process
- Patent number 11,990,484
- Issue date May 21, 2024
- Pragmatic Printing Ltd.
- Richard Price
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Substrate having dual edge connection line and method for manufactu...
- Patent number 11,942,485
- Issue date Mar 26, 2024
- Beijing Boe Display Technology Co., Ltd.
- Yonglian Qi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Backside contact structures and fabrication for metal on both sides...
- Patent number 11,935,933
- Issue date Mar 19, 2024
- Intel Corporation
- Patrick Morrow
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Flexible light-emitting device and EL module including transparent...
- Patent number 11,930,668
- Issue date Mar 12, 2024
- Semiconductor Energy Laboratory Co., Ltd.
- Kaoru Hatano
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Display apparatus and method of manufacturing the same
- Patent number 11,923,375
- Issue date Mar 5, 2024
- Samsung Display Co., Ltd.
- Wonkyu Kwak
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
3D semiconductor device and structure with bonding
- Patent number 11,923,230
- Issue date Mar 5, 2024
- Monolithic 3D Inc.
- Zvi Or-Bach
- G11 - INFORMATION STORAGE
Information Patent Grant
Liquid crystal display device and manufacturing method thereof
- Patent number 11,906,826
- Issue date Feb 20, 2024
- Semiconductor Energy Laboratory Co., Ltd.
- Shunpei Yamazaki
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
3D semiconductor device and structure with memory
- Patent number 11,901,210
- Issue date Feb 13, 2024
- Monolithic 3D Inc.
- Zvi Or-Bach
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Polyimide, laminate, and electronic device including same
- Patent number 11,898,009
- Issue date Feb 13, 2024
- UBE Corporation
- Norio Miura
- C09 - DYES PAINTS POLISHES NATURAL RESINS ADHESIVES MISCELLANEOUS COMPOSITION...
Information Patent Grant
Display device
- Patent number 11,881,489
- Issue date Jan 23, 2024
- Semiconductor Energy Laboratory Co., Ltd.
- Hisao Ikeda
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
3D SEMICONDUCTOR DEVICE AND STRUCTURE WITH METAL LAYERS AND MEMORY...
- Publication number 20250006544
- Publication date Jan 2, 2025
- Monolithic 3D Inc.
- Zvi Or-Bach
- G11 - INFORMATION STORAGE
Information Patent Application
HEAT DISSIPATION IN SEMICONDUCTOR DEVICES
- Publication number 20250006687
- Publication date Jan 2, 2025
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Zheng-Yong Liang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
3D SEMICONDUCTOR DEVICE AND STRUCTURE WITH SINGLE-CRYSTAL LAYERS
- Publication number 20240429086
- Publication date Dec 26, 2024
- Monolithic 3D Inc.
- Zvi Or-Bach
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTEGRATED CIRCUIT DEVICE
- Publication number 20240421162
- Publication date Dec 19, 2024
- Samsung Electronics Co., Ltd.
- Minchul AHN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
3D SEMICONDUCTOR DEVICE AND STRUCTURE WITH MEMORY CELLS AND MULTIPL...
- Publication number 20240404866
- Publication date Dec 5, 2024
- Monolithic 3D Inc.
- Zvi Or-Bach
- G11 - INFORMATION STORAGE
Information Patent Application
METHODS FOR PRODUCING A 3D SEMICONDUCTOR MEMORY DEVICE AND STRUCTURE
- Publication number 20240395592
- Publication date Nov 28, 2024
- Monolithic 3D Inc.
- Zvi Or-Bach
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTEGRATED LOGIC AND PASSIVE DEVICE STRUCTURE
- Publication number 20240379804
- Publication date Nov 14, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Chung-Liang Cheng
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
3D SEMICONDUCTOR DEVICE AND STRUCTURE WITH METAL LAYERS AND MEMORY...
- Publication number 20240363385
- Publication date Oct 31, 2024
- Monolithic 3D Inc.
- Zvi Or-Bach
- G11 - INFORMATION STORAGE
Information Patent Application
PACKAGE
- Publication number 20240347512
- Publication date Oct 17, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Ming-Fa Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
FLEXIBLE LIGHT-EMITTING DEVICE, ELECTRONIC DEVICE, AND METHOD FOR M...
- Publication number 20240349546
- Publication date Oct 17, 2024
- Semiconductor Energy Laboratory Co., Ltd.
- Kaoru HATANO
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
DISPLAY DEVICE AND METHOD OF MANUFACTURING THE DISPLAY DEVICE
- Publication number 20240321904
- Publication date Sep 26, 2024
- SAMSUNG DISPLAY CO., LTD.
- Jihyun KIM
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD FOR PREPARING DISPLAY PANEL, DISPLAY PANEL, AND ELECTRONIC D...
- Publication number 20240297175
- Publication date Sep 5, 2024
- TCL China Star Optoelectronics Technology Co., Ltd.
- Linfeng LIU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTEGRATED CIRCUIT DEVICE
- Publication number 20240274679
- Publication date Aug 15, 2024
- Samsung Electronics Co., Ltd.
- Jongmin SHIN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTEGRATED CIRCUIT DEVICE
- Publication number 20240258328
- Publication date Aug 1, 2024
- Samsung Electronics Co., Ltd.
- Donghoon HWANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Hybrid Power Rail Formation in Dielectric Isolation for Semiconduct...
- Publication number 20240234317
- Publication date Jul 11, 2024
- International Business Machines Corporation
- Nikhil Jain
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
BACKSIDE-CONNECTING VIA WITH NANOSHEET SPACERS FOR TRANSISTORS
- Publication number 20240222395
- Publication date Jul 4, 2024
- International Business Machines Corporation
- Oscar van der Straten
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE
- Publication number 20240213276
- Publication date Jun 27, 2024
- Semiconductor Energy Laboratory Co., Ltd.
- Hajime Kimura
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
3D SEMICONDUCTOR DEVICE AND STRUCTURE WITH BONDING AND DRAM MEMORY...
- Publication number 20240213073
- Publication date Jun 27, 2024
- Monolithic 3D Inc.
- Zvi Or-Bach
- G11 - INFORMATION STORAGE
Information Patent Application
DISPLAY APPARATUS AND METHOD OF MANUFACTURING THE SAME
- Publication number 20240213255
- Publication date Jun 27, 2024
- SAMSUNG DISPLAY CO., LTD.
- Wonkyu Kwak
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
TRANSISTORS WITH DIELECTRIC STACK ISOLATING BACKSIDE POWER RAIL
- Publication number 20240204005
- Publication date Jun 20, 2024
- International Business Machines Corporation
- Tao Li
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
STRUCTURE AND METHOD TO FORM VIA TO BACKSIDE POWER RAIL WITHOUT SHO...
- Publication number 20240204008
- Publication date Jun 20, 2024
- International Business Machines Corporation
- Chanro Park
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ENLARGED OVERLAP BETWEEN BACKSIDE POWER RAIL AND BACKSIDE CONTACT
- Publication number 20240194691
- Publication date Jun 13, 2024
- International Business Machines Corporation
- Ruilong Xie
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
GATE CONTROL FOR STAGGERED STACKED FIELD-EFFECT TRANSISTORS
- Publication number 20240194696
- Publication date Jun 13, 2024
- International Business Machines Corporation
- Genevieve Antoinette Kane
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHODS FOR PRODUCING A 3D SEMICONDUCTOR DEVICE AND STRUCTURE WITH...
- Publication number 20240178040
- Publication date May 30, 2024
- Monolithic 3D Inc.
- Zvi Or-Bach
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
3D SEMICONDUCTOR DEVICE AND STRUCTURE WITH MEMORY
- Publication number 20240170319
- Publication date May 23, 2024
- Monolithic 3D Inc.
- Zvi Or-Bach
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
LIQUID CRYSTAL DISPLAY DEVICE AND MANUFACTURING METHOD THEREOF
- Publication number 20240151997
- Publication date May 9, 2024
- Semiconductor Energy Laboratory Co., Ltd.
- Shunpei YAMAZAKI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
BACKSIDE CONTACT STRUCTURES AND FABRICATION FOR METAL ON BOTH SIDES...
- Publication number 20240154011
- Publication date May 9, 2024
- Intel Corporation
- Patrick MORROW
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Hybrid Power Rail Formation in Dielectric Isolation for Semiconduct...
- Publication number 20240136288
- Publication date Apr 25, 2024
- International Business Machines Corporation
- Nikhil Jain
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
LIGHT-EMITTING DEVICE AND METHOD FOR MANUFACTURING THE SAME
- Publication number 20240130157
- Publication date Apr 18, 2024
- Semiconductor Energy Laboratory Co., Ltd.
- Akihiro CHIDA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
LIGHT-EMITTING DEVICE AND ELECTRONIC DEVICE USING THE SAME
- Publication number 20240128272
- Publication date Apr 18, 2024
- Semiconductor Energy Laboratory Co., Ltd.
- Satoshi SEO
- H01 - BASIC ELECTRIC ELEMENTS

the substrate on which the devices are formed not being the final device substrate

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Thin film transistor including crystallized semiconductor, display...

Integrated logic and passive device structure

Display device

Stack for manufacturing flexible element and method for manufacturi...

Methods for producing a 3D semiconductor memory device and structure

Display device and method for manufacturing display device

Display device and tiled display device including the same

3D semiconductor device and structure with single-crystal layers

3D semiconductor device and structure with metal layers and memory...

Display device and method of manufacturing the same

Backside gate contact, backside gate etch stop layer, and methods o...

Semiconductor device and method for manufacturing the same

Methods for producing a 3D semiconductor device and structure with...

Flexible display device that suppresses peeling of a layered structure

Method of placing a micro device to a receiver substrate

3D semiconductor device and structure with bonding and DRAM memory...

Display device and method for manufacturing the same

Package having bonding layers

Methods for producing a 3D semiconductor device and structure with...

Display device and method of manufacturing the display device

Integrated circuit on flexible substrate manufacturing process

Substrate having dual edge connection line and method for manufactu...

Backside contact structures and fabrication for metal on both sides...

Flexible light-emitting device and EL module including transparent...

Display apparatus and method of manufacturing the same

3D semiconductor device and structure with bonding

Liquid crystal display device and manufacturing method thereof

3D semiconductor device and structure with memory

Polyimide, laminate, and electronic device including same

Display device

Patents Applicationslast 30 patents

3D SEMICONDUCTOR DEVICE AND STRUCTURE WITH METAL LAYERS AND MEMORY...

HEAT DISSIPATION IN SEMICONDUCTOR DEVICES

3D SEMICONDUCTOR DEVICE AND STRUCTURE WITH SINGLE-CRYSTAL LAYERS

INTEGRATED CIRCUIT DEVICE

3D SEMICONDUCTOR DEVICE AND STRUCTURE WITH MEMORY CELLS AND MULTIPL...

METHODS FOR PRODUCING A 3D SEMICONDUCTOR MEMORY DEVICE AND STRUCTURE

INTEGRATED LOGIC AND PASSIVE DEVICE STRUCTURE

3D SEMICONDUCTOR DEVICE AND STRUCTURE WITH METAL LAYERS AND MEMORY...

PACKAGE

FLEXIBLE LIGHT-EMITTING DEVICE, ELECTRONIC DEVICE, AND METHOD FOR M...

DISPLAY DEVICE AND METHOD OF MANUFACTURING THE DISPLAY DEVICE

METHOD FOR PREPARING DISPLAY PANEL, DISPLAY PANEL, AND ELECTRONIC D...

INTEGRATED CIRCUIT DEVICE

INTEGRATED CIRCUIT DEVICE

Hybrid Power Rail Formation in Dielectric Isolation for Semiconduct...

BACKSIDE-CONNECTING VIA WITH NANOSHEET SPACERS FOR TRANSISTORS

SEMICONDUCTOR DEVICE

3D SEMICONDUCTOR DEVICE AND STRUCTURE WITH BONDING AND DRAM MEMORY...

DISPLAY APPARATUS AND METHOD OF MANUFACTURING THE SAME

TRANSISTORS WITH DIELECTRIC STACK ISOLATING BACKSIDE POWER RAIL

STRUCTURE AND METHOD TO FORM VIA TO BACKSIDE POWER RAIL WITHOUT SHO...

ENLARGED OVERLAP BETWEEN BACKSIDE POWER RAIL AND BACKSIDE CONTACT

GATE CONTROL FOR STAGGERED STACKED FIELD-EFFECT TRANSISTORS

METHODS FOR PRODUCING A 3D SEMICONDUCTOR DEVICE AND STRUCTURE WITH...

3D SEMICONDUCTOR DEVICE AND STRUCTURE WITH MEMORY

LIQUID CRYSTAL DISPLAY DEVICE AND MANUFACTURING METHOD THEREOF

BACKSIDE CONTACT STRUCTURES AND FABRICATION FOR METAL ON BOTH SIDES...

Hybrid Power Rail Formation in Dielectric Isolation for Semiconduct...

LIGHT-EMITTING DEVICE AND METHOD FOR MANUFACTURING THE SAME

LIGHT-EMITTING DEVICE AND ELECTRONIC DEVICE USING THE SAME