the substrates to be conveyed not being semiconductor wafers or large planar substrates

Industry

CPC
H01L21/67721

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Parent Industries

HELECTRICITY H01Electric elements H01LSEMICONDUCTOR DEVICES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR H01L21/00Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof

Current Industry

H01L21/67721the substrates to be conveyed not being semiconductor wafers or large planar substrates

Industries

Patents Grantslast 30 patents

Information Patent Grant
Magnetic transfer apparatus and fabrication method of the same
- Patent number 11,961,750
- Issue date Apr 16, 2024
- Korea University Research and Business Foundation
- Tae-Yeon Seong
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Film for component manufacture and component manufacturing method
- Patent number 11,942,349
- Issue date Mar 26, 2024
- Mitsui Chemicals Tohcello, Inc.
- Eiji Hayashishita
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Transportation head for microchip transfer device, microchip transf...
- Patent number 11,939,173
- Issue date Mar 26, 2024
- LG Display Co., Ltd.
- Dahl-Young Khang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
System for a semiconductor fabrication facility and method for oper...
- Patent number 11,854,846
- Issue date Dec 26, 2023
- Taiwan Semiconductor Manufacturing Company Ltd.
- Fu-Hsien Li
- B66 - HOISTING LIFTING HAULING
Information Patent Grant
Reticle transportation container
- Patent number 11,837,486
- Issue date Dec 5, 2023
- Taiwan Semiconductor Manufacturing Co., Ltd
- Yu-Ching Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Laser bonding apparatus for three-dimensional molded sculptures
- Patent number 11,813,688
- Issue date Nov 14, 2023
- LASERSSEL CO., LTD.
- Jae Joon Choi
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Chip transferring method and the apparatus thereof
- Patent number 11,658,052
- Issue date May 23, 2023
- Epistar Corporation
- Min-Hsun Hsieh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method and system for mass assembly of thin-film materials
- Patent number 11,648,762
- Issue date May 16, 2023
- Palo Alto Research Center Incorporated
- JengPing Lu
- B32 - LAYERED PRODUCTS
Information Patent Grant
Systems and methods for tray cassette warehousing
- Patent number 11,527,425
- Issue date Dec 13, 2022
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Tsung-Sheng Kuo
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Adsorption device, transferring system having same, and transferrin...
- Patent number 11,521,878
- Issue date Dec 6, 2022
- Century Technology (Shenzhen) Corporation Limited
- Po-Liang Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of transferring micro device using micro device transfer head
- Patent number 11,495,485
- Issue date Nov 8, 2022
- Acer Incorporated
- Jui-Chieh Hsiang
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Method and system for mass assembly of thin-film materials
- Patent number 11,440,307
- Issue date Sep 13, 2022
- Palo Alto Research Center Incorporated
- JengPing Lu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Warpage control in the packaging of integrated circuits
- Patent number 11,432,372
- Issue date Aug 30, 2022
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Ming-Da Cheng
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
System for a semiconductor fabrication facility and method for oper...
- Patent number 11,380,566
- Issue date Jul 5, 2022
- Taiwan Semiconductor Manufacturing Company Ltd.
- Fu-Hsien Li
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Layout structure between substrate, micro-LED array and micro-vacuu...
- Patent number 11,295,972
- Issue date Apr 5, 2022
- Korea Advanced Institute of Science and Technology
- Keon Jae Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Film for component manufacture and component manufacturing method
- Patent number 11,276,600
- Issue date Mar 15, 2022
- Mitsui Chemicals Tohcello, Inc.
- Eiji Hayashishita
- B32 - LAYERED PRODUCTS
Information Patent Grant
Transfer method and transfer apparatus
- Patent number 11,222,801
- Issue date Jan 11, 2022
- Au Optronics Corporation
- Tzu-Ling Niu
- B65 - CONVEYING PACKING STORING HANDLING THIN OR FILAMENTARY MATERIAL
Information Patent Grant
Chip packaging apparatus and method thereof
- Patent number 11,189,507
- Issue date Nov 30, 2021
- CAPCON LIMITED
- Feng Yu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Bonding equipment
- Patent number 11,145,618
- Issue date Oct 12, 2021
- SHARP KABUSHIKI KAISHA
- Katsuji Iguchi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Direct transfer apparatus for electronic components
- Patent number 11,136,202
- Issue date Oct 5, 2021
- ASM Technology Singapore Pte. Ltd.
- Kui Kam Lam
- B65 - CONVEYING PACKING STORING HANDLING THIN OR FILAMENTARY MATERIAL
Information Patent Grant
Particle prevention method in lithography exposure apparatus
- Patent number 11,119,420
- Issue date Sep 14, 2021
- Taiwan Semiconductor Manufacturing Co., Ltd
- Yi-Wei Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method and device for transporting an arrangement of flexible circu...
- Patent number 11,107,943
- Issue date Aug 31, 2021
- MÜHLBAUER GMBH & CO. KG
- Volker Brod
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
End effector with slides for transferring trays
- Patent number 11,077,466
- Issue date Aug 3, 2021
- Brooks Automation, Inc.
- Anthony C. Bonora
- B07 - SEPARATING SOLIDS FROM SOLIDS SORTING
Information Patent Grant
Chip transferring method and the apparatus thereof
- Patent number 11,056,368
- Issue date Jul 6, 2021
- Epistar Corporation
- Min-Hsun Hsieh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Chip bonding device and bonding method thereof
- Patent number 11,037,900
- Issue date Jun 15, 2021
- SHANGHAI MICRO ELECTRONICS EQUIPMENT (GROUP) CO., LTD.
- Song Guo
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Micro-LED array transfer method, manufacturing method and display d...
- Patent number 11,024,611
- Issue date Jun 1, 2021
- GOERTEK, INC.
- Quanbo Zou
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Apparatus for sawing a semiconductor package
- Patent number 11,018,038
- Issue date May 25, 2021
- Samsung Electronics Co., Ltd.
- Yong Ki Kim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Micro device transfer head
- Patent number 11,004,721
- Issue date May 11, 2021
- Acer Incorporated
- Jui-Chieh Hsiang
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Reticle transportation container
- Patent number 10,998,213
- Issue date May 4, 2021
- Taiwan Semiconductor Manufacturing Co., Ltd
- Yu-Ching Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electronic component handler and electronic component tester
- Patent number 10,994,951
- Issue date May 4, 2021
- Seiko Epson Corporation
- Fuyumi Takata
- B65 - CONVEYING PACKING STORING HANDLING THIN OR FILAMENTARY MATERIAL

Patents Applicationslast 30 patents

Information Patent Application
SUCTION DEVICE, SUCTION UNIT, SUCTION METHOD, AND COMPUTER-READABLE...
- Publication number 20240063049
- Publication date Feb 22, 2024
- SHINKAWA LTD.
- Yuji EGUCHI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
LASER BONDING APPARATUS FOR THREE-DIMENSIONAL MOLDED SCULPTURES
- Publication number 20240033840
- Publication date Feb 1, 2024
- LASERSSEL CO., LTD.
- Jae Joon CHOI
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
MAGNETIC COLLET
- Publication number 20230395413
- Publication date Dec 7, 2023
- OKINS ELECTRONICS CO., LTD
- Jin Kook JUN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SYSTEM AND METHOD FOR CONVEYING AND INSPECTING SEMICONDUCTOR PACKAGE
- Publication number 20230343620
- Publication date Oct 26, 2023
- Vitrox Technologies Sdn. Bhd.
- Juson Dun Lee KHAW
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
APPARATUS FOR TRANSFERRING SEMICONDUCTOR CIRCUITS
- Publication number 20230317487
- Publication date Oct 5, 2023
- NEXPERIA B.V.
- Ralph Huybers
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CHIP TRANSFERRING METHOD AND THE APPARATUS THEREOF
- Publication number 20230274962
- Publication date Aug 31, 2023
- EPISTAR CORPORATION
- Min-Hsun HSIEH
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CHIP DISPENSER FOR SELF-ASSEMBLY
- Publication number 20230163007
- Publication date May 25, 2023
- LG ELECTRONICS INC.
- Inbum YANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MANUFACTURING METHOD OF CHIP-ATTACHED SUBSTRATE AND SUBSTRATE PROCE...
- Publication number 20220406603
- Publication date Dec 22, 2022
- TOKYO ELECTRON LIMITED
- Hayato TANOUE
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD AND SYSTEM FOR MASS ASSEMBLY OF THIN-FILM MATERIALS
- Publication number 20220388295
- Publication date Dec 8, 2022
- Palo Alto Research Center Incorporated
- JengPing Lu
- B32 - LAYERED PRODUCTS
Information Patent Application
Warpage Control in the Packaging of Integrated Circuits
- Publication number 20220361293
- Publication date Nov 10, 2022
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Ming-Da Cheng
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
SYSTEM FOR A SEMICONDUCTOR FABRICATION FACILITY AND METHOD FOR OPER...
- Publication number 20220328331
- Publication date Oct 13, 2022
- Taiwan Semiconductor Manufacturing company Ltd.
- FU-HSIEN LI
- G03 - PHOTOGRAPHY CINEMATOGRAPHY ELECTROGRAPHY HOLOGRAPHY
Information Patent Application
COMPONENT CONVEYING INSTRUMENT WITH AN ADJUSTING UNIT AND METHOD OF...
- Publication number 20220270902
- Publication date Aug 25, 2022
- Muehlbauer GmbH & Co., KG
- Rainer Miehlich
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
MAGNETIC TRANSFER APPARATUS AND FABRICATION METHOD OF THE SAME
- Publication number 20220246458
- Publication date Aug 4, 2022
- Korea University Research and Business Foundation
- Tae-Yeon SEONG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
FILM FOR COMPONENT MANUFACTURE AND COMPONENT MANUFACTURING METHOD
- Publication number 20220157634
- Publication date May 19, 2022
- Mitsui Chemicals Tohcello, Inc.
- Eiji HAYASHISHITA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
APPARATUS FOR TRANSFERRING LED
- Publication number 20220139748
- Publication date May 5, 2022
- LG Display Co., Ltd.
- Seong Kyong Park
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Tray Engine and Methods for Transferring Trays to and From Tools an...
- Publication number 20210346915
- Publication date Nov 11, 2021
- Brooks Automation, Inc.
- Anthony C. Bonora
- B25 - HAND TOOLS PORTABLE POWER-DRIVEN TOOLS MANIPULATORS
Information Patent Application
TRANSPORTATION HEAD FOR MICROCHIP TRANSFER DEVICE, MICROCHIP TRANSF...
- Publication number 20210339964
- Publication date Nov 4, 2021
- LG Display Co., Ltd.
- Dahl-Young KHANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CHIP TRANSFERRING METHOD AND THE APPARATUS THEREOF
- Publication number 20210335641
- Publication date Oct 28, 2021
- EPISTAR CORPORATION
- Min-Hsun HSIEH
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Actuator for a Bonding Head
- Publication number 20210272925
- Publication date Sep 2, 2021
- BESI Switzerland AG
- Markus Aebischer
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Reticle Transportation Container
- Publication number 20210249283
- Publication date Aug 12, 2021
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Yu-Ching Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MAGNETIC COLLET
- Publication number 20210233789
- Publication date Jul 29, 2021
- OKINS ELECTRONICS CO., LTD
- Jin Kook JUN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD OF TRANSFERRING MICRO DEVICE USING MICRO DEVICE TRANSFER HEAD
- Publication number 20210225686
- Publication date Jul 22, 2021
- ACER INCORPORATED
- Jui-Chieh Hsiang
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
DIRECT TRANSFER APPARATUS FOR ELECTRONIC COMPONENTS
- Publication number 20210206585
- Publication date Jul 8, 2021
- ASM Technology Singapore Pte Ltd
- Kui Kam LAM
- B65 - CONVEYING PACKING STORING HANDLING THIN OR FILAMENTARY MATERIAL
Information Patent Application
PARTICLE PREVENTION METHOD IN LITHOGRAPHY EXPOSURE APPARATUS
- Publication number 20210191283
- Publication date Jun 24, 2021
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Yi-Wei LEE
- G03 - PHOTOGRAPHY CINEMATOGRAPHY ELECTROGRAPHY HOLOGRAPHY
Information Patent Application
METHOD AND SYSTEM FOR MASS ASSEMBLY OF THIN-FILM MATERIALS
- Publication number 20210162727
- Publication date Jun 3, 2021
- Palo Alto Research Center Incorporated
- JengPing Lu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MICRO-LED ARRAY TRANSFER METHOD, MANUFACTURING METHOD AND DISPLAY D...
- Publication number 20210151418
- Publication date May 20, 2021
- Goeriek, Inc.
- Quanbo Zou
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CARRIER TAPE SYSTEM AND METHODS OF MAKING AND USING THE SAME
- Publication number 20210134635
- Publication date May 6, 2021
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Chen-Ming Kuo
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SYSTEM FOR A SEMICONDUCTOR FABRICATION FACILITY AND METHOD FOR OPER...
- Publication number 20210118709
- Publication date Apr 22, 2021
- Taiwan Semiconductor Manufacturing company Ltd.
- FU-HSIEN LI
- B66 - HOISTING LIFTING HAULING
Information Patent Application
LASER BONDING APPARATUS FOR THREE-DIMENSIONAL STRUCTURES
- Publication number 20200335344
- Publication date Oct 22, 2020
- LASERSSEL CO., LTD.
- Jae Joon Choi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Reticle Transportation Container
- Publication number 20200279759
- Publication date Sep 3, 2020
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Yu-Ching Lee
- H01 - BASIC ELECTRIC ELEMENTS

the substrates to be conveyed not being semiconductor wafers or large planar substrates

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Magnetic transfer apparatus and fabrication method of the same

Film for component manufacture and component manufacturing method

Transportation head for microchip transfer device, microchip transf...

System for a semiconductor fabrication facility and method for oper...

Reticle transportation container

Laser bonding apparatus for three-dimensional molded sculptures

Chip transferring method and the apparatus thereof

Method and system for mass assembly of thin-film materials

Systems and methods for tray cassette warehousing

Adsorption device, transferring system having same, and transferrin...

Method of transferring micro device using micro device transfer head

Method and system for mass assembly of thin-film materials

Warpage control in the packaging of integrated circuits

System for a semiconductor fabrication facility and method for oper...

Layout structure between substrate, micro-LED array and micro-vacuu...

Film for component manufacture and component manufacturing method

Transfer method and transfer apparatus

Chip packaging apparatus and method thereof

Bonding equipment

Direct transfer apparatus for electronic components

Particle prevention method in lithography exposure apparatus

Method and device for transporting an arrangement of flexible circu...

End effector with slides for transferring trays

Chip transferring method and the apparatus thereof

Chip bonding device and bonding method thereof

Micro-LED array transfer method, manufacturing method and display d...

Apparatus for sawing a semiconductor package

Micro device transfer head

Reticle transportation container

Electronic component handler and electronic component tester

Patents Applicationslast 30 patents

SUCTION DEVICE, SUCTION UNIT, SUCTION METHOD, AND COMPUTER-READABLE...

LASER BONDING APPARATUS FOR THREE-DIMENSIONAL MOLDED SCULPTURES

MAGNETIC COLLET

SYSTEM AND METHOD FOR CONVEYING AND INSPECTING SEMICONDUCTOR PACKAGE

APPARATUS FOR TRANSFERRING SEMICONDUCTOR CIRCUITS

CHIP TRANSFERRING METHOD AND THE APPARATUS THEREOF

CHIP DISPENSER FOR SELF-ASSEMBLY

MANUFACTURING METHOD OF CHIP-ATTACHED SUBSTRATE AND SUBSTRATE PROCE...

METHOD AND SYSTEM FOR MASS ASSEMBLY OF THIN-FILM MATERIALS

Warpage Control in the Packaging of Integrated Circuits

SYSTEM FOR A SEMICONDUCTOR FABRICATION FACILITY AND METHOD FOR OPER...

COMPONENT CONVEYING INSTRUMENT WITH AN ADJUSTING UNIT AND METHOD OF...

MAGNETIC TRANSFER APPARATUS AND FABRICATION METHOD OF THE SAME

FILM FOR COMPONENT MANUFACTURE AND COMPONENT MANUFACTURING METHOD

APPARATUS FOR TRANSFERRING LED

Tray Engine and Methods for Transferring Trays to and From Tools an...

TRANSPORTATION HEAD FOR MICROCHIP TRANSFER DEVICE, MICROCHIP TRANSF...

CHIP TRANSFERRING METHOD AND THE APPARATUS THEREOF

Actuator for a Bonding Head

Reticle Transportation Container

MAGNETIC COLLET

METHOD OF TRANSFERRING MICRO DEVICE USING MICRO DEVICE TRANSFER HEAD

DIRECT TRANSFER APPARATUS FOR ELECTRONIC COMPONENTS

PARTICLE PREVENTION METHOD IN LITHOGRAPHY EXPOSURE APPARATUS

METHOD AND SYSTEM FOR MASS ASSEMBLY OF THIN-FILM MATERIALS

MICRO-LED ARRAY TRANSFER METHOD, MANUFACTURING METHOD AND DISPLAY D...

CARRIER TAPE SYSTEM AND METHODS OF MAKING AND USING THE SAME

SYSTEM FOR A SEMICONDUCTOR FABRICATION FACILITY AND METHOD FOR OPER...

LASER BONDING APPARATUS FOR THREE-DIMENSIONAL STRUCTURES

Reticle Transportation Container